IL3W-HX5F12.5-32.768 KHZ

Crystal, IL3W Series, 32.768 kHz, 20 ppm, 12.5 pF

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Manufacturer: ILSI AMERICA
Product type: Crystals
SVHC: No SVHC (25-Jun-2025)
Frequency Nom: 32.768kHz
Product Range: IL3W Series
Load Capacitance: 12.5pF
Crystal Frequency: 32.768kHz
Crystal Case / Package: SMD, 1.6mm x 1mm
Frequency Stability + / -: -
Frequency Tolerance + / -: 20ppm
Operating Temperature Max: 85°C
Operating Temperature Min: -40°C

Delivery and price
Units per pack	500
Price	0.456 €
Current stock	1000+
Lead time	30 days

Datasheet

**2 Pad Ceramic Base SMD Crystal, 1.6 mm x 1.0 mm** 

**IL3W Series** 

## **Product Features:** 

2 Pad SMD Package RoHS Compliant Compatible with Leadfree Processing Ultra Low Profile 

**Applications:** Real Time Clocks Metering Industrial Control Time Reference 

|**Frequency**||32.768kHz||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
|**ESR (Equivalent Series Resistance)**||90,000 Ohms Maximum|||1 .6 0 ± .1 0|||||||
|||||||||||||
|**Shunt Capacitance (C0)**||2.0pF Maximum||||M a rk in g|||1 .0 0 ± .1 0|||
|**Motional Capacitance (C1)**||6.5fF Typical||||||||||
|**Frequency Tolerance @ 25** **C ±5ºC**||20ppm Maximum||||||||||
||||||||||||0 .5 0|
|**Frequency Stability over**||Parabolic -0.045ppm/C2Typical Turnover point|||||||||m a x|
|**Temperature**||+25ºC±5ºC (See Graph Below)||||||||||
|**Crystal Cut**||X-Cut||||||||||
|**Load Capacitance**||12.5pF (See Table Below)||||||||||
|**Drive Level**||0.1µWatt Typical, 0.5µWatt Maximum|||||||0 .8 6|||
|**Aging**||3ppm/year Maximum||||||||||
|**Operating Temperature Range**||-40C to +85C|0 .4 0||||||0 .4 0|||
|**Storage Temperature Range**||-55C to +125C||||||||||
||||0 .5 0||||||0 .5 0|||
|-30|Typical XCutTem perature Coefficient||0 .6 0<br>1 .0 0<br>|<br>~~|~~<br>~~\~~<br>~~+b~~|||||||||
|-60<br>E<br>90<br>&<br>-120|||||S u g g e s te d<br>L a n d  P a tte rn s|||||||
|-150|||||D im e n s io n s : m m|D im e n s io n s : m m||||||



|**Part Number Guide**<br>**Sample Part Number:**<br>**IL3W-HX5F12.5- 32.768 KHz**|**Part Number Guide**<br>**Sample Part Number:**<br>**IL3W-HX5F12.5- 32.768 KHz**|**Part Number Guide**<br>**Sample Part Number:**<br>**IL3W-HX5F12.5- 32.768 KHz**|**Part Number Guide**<br>**Sample Part Number:**<br>**IL3W-HX5F12.5- 32.768 KHz**|**Part Number Guide**<br>**Sample Part Number:**<br>**IL3W-HX5F12.5- 32.768 KHz**|**Part Number Guide**<br>**Sample Part Number:**<br>**IL3W-HX5F12.5- 32.768 KHz**|**Part Number Guide**<br>**Sample Part Number:**<br>**IL3W-HX5F12.5- 32.768 KHz**|
|---|---|---|---|---|---|---|
|**Package**|**Stability**<br>**(ppm) at Room**<br>**Temperature**|**Stability**<br>**(ppm) over Operating**<br>**Temperature**|**Operating**<br>**Temperature Range**|**ode**<br>**(overtone)**|**Load Capacitance**<br>**(pF)**|**Frequency**|
|IL3W|H = ±20 ppm|X = X Cut|5 = -40°C to +85°C|F = Fundamental|12.5 = 12.5pF<br>9.0 = 9.0pF<br>7.0 = 7.0pF|32.768 KHz|



Rev:  12/08/17_D 

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ● ~~——_—__—_—_———~~ www.ilsiamerica.com Specifications subject to change without notice 

Page 1 of 2 

**2 Pad Ceramic Base SMD Crystal, 1.6 mm x 1.0 mm** 

**IL3W Series** 

## **Pb Free Solder Reflow Profile:** 

## **Typical Circuit:** 

|Ts max to TL(Ramp-upRate)|3ºC / second max|
|---|---|
|Preheat<br>Temperature min (Ts min)<br>Temperature typ (Ts typ)<br>Temperature max (Ts max)<br>Time(Ts)|150ºC<br>175ºC<br>200ºC<br>60 to180 seconds|
|Ramp-upTate(TLto Tp|3ºC / second max|
|Time Maintained Above<br>Temperature (TL)<br>Time(TL)|217ºC<br>60 to 150 seconds|
|Peak Temperature(Tp)|260ºC max for 10 seconds|
|Time within 5ºC to Peak<br>Temperature(Tp)|20 to 40 seconds|
|Ramp-down Rate|6ºC / second max|
|Tune 25ºC to Peak<br>Temperature|8 minutes max|



Units are backward compatible with +240ºC reflow processes 

## **Package Information:** 

MSL = 1 Termination = e4 (Au over Ni over W base metal) 

## **Tape and Reel Information:** 

|**Quantity per**<br>**Reel **|**5000**|
|---|---|
|**A**|8.0±0.3|
|**B**|4.0±0.2|
|**C**|3.5 ±0.02|
|**D**|9.0±1.0|
|**E**|60 / 80|
|**F**|180|



## **Environmental Specifications** 

|ThermalShock|MIL-STD-883,Method1011, Condition A|
|---|---|
|MoistureResistance|MIL-STD-883,Method1004|
|MechanicalShock|MIL-STD-883,Method2002, Condition B|
|Mechanical Vibration|MIL-STD-883,Method2007, Condition A|
|Resistance to SolderingHeat|J-STD-020C,Table 5-2 Pb-free devices (except2cyclesmax)|
|Hazardous Substance|Pb-Free/ RoHS|
|Solderability|JESD22-B102 Method2(PreconditioningE)|
|TerminalStrength|MIL-STD-883,Method2004,Test Condition D|
|GrossLeak|MIL-STD-883,Method1014, ConditionC|
|FineLeak|MIL-STD-883,Method1014, Condition A1|
|Solvent Resistance|MIL-STD-202, Method 215|



## **Marking** 

Line 1:   I, Date Code (YWW) 

Rev:  12/08/17_D 

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ● ~~a~~ www.ilsiamerica.com Specifications subject to change without notice 

Page 2 of 2

Updated at April 28, 2026

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