IL3T-HX5F12.5-32.768 KHZ

2 Pad Ceramic Base SMD Crystal, 2.0 mm x 1.2 mm 

IL3T Series 

**Product Features:** Low Cost SMD Package RoHS Compliant Compatible with Leadfree Processing Ultra Low Profile 

**Applications:** Real Time Clocks Metering Industrial Control Time Reference 

|**Frequency**|32.768 KHz|
|---|---|
|**ESR (Equivalent Series Resistance)**|Less than 90 kΩ|
|**Shunt Capacitance (C0)**|1.3 pF Typ.|
|**Motional Capacitance (Cl)**|6.5 fF Typ.|
|**Frequency Tolerance @ 25** **C ±5ºC**|20 ppm Standard|
|**Frequency Stability over**<br>**Temperature**|Parabolic -0.034 ppm /C<br>2Typ.  Turnover point  +25º<br>±5ºC See Graph Below|
|**Crystal Cut**|X-Cut|
|**Load Capacitance**|12.5 pF Standard|
|**Drive Level**|0.1 µW Typ., 0.5 µW Max.|
|**Aging**|5 ppm Max. / Year Standard|
|**Temperature**||
|**Operating**|-40C to +85C Standard|
|**Storage**<br>-55C to +125C Standard||
|**Typical X Cut Temperature Coefficient**<br>-180<br>-150<br>-120<br>-90<br>-60<br>-30<br>0<br>-40<br>-30<br>-20<br>-10<br>0<br>10<br>20<br>30<br>40<br>50<br>60<br>70<br>80<br>**Temperature**<br>**ppm**||



|**Package**|**Stability**<br>**(ppm) at Room**<br>**Temperature**|**Stability**<br>**(ppm) over Operating**<br>**Temperature**|**Operating**<br>**Temperature Range**|**ode**<br>**(overtone)**|**Load Capacitance**<br>**(pF)**|**Frequency**|
|---|---|---|---|---|---|---|
|IL3T -|H = ±20 ppm|X = X Cut|5 = -40°C to +85°C|F = Fundamental|F = Fundamental<br>12.5 pF Standard|- 32.768 KHz|



Rev:  04/05/15_B 

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail.ilsiamerica@com ● www.ilsiamerica.com ~~ee~~ 

Specifications subject to change without notice 

Page 1 of 2 

2 Pad Ceramic Base SMD Crystal, 2.0 mm x 1.2 mm 

IL3T Series 

## **Pb Free Solder Reflow Profile:** 

## **Typical Circuit:** 

*Units are backward compatible with 240C reflow processes 

## **Package Information:** 

MSL = 2 Termination = e1 (Sn/Cu/Ag over Ni over Kovar base metal) 

## **Tape and Reel Information:** 

|**Quantity per**<br>**Reel **<br>**A**|**3000**<br>8.0 ±0.2|
|---|---|
|**B**<br>**C**|4.0±0.1<br>3.5 ±0.05|
|**D**|9.0±0.3|
|**E**|60 / 80|
|**F**|180 / 250|



## **Environmental Specifications** 

|Thermal Shock|MIL-STD-883,Method 1011,Condition A|
|---|---|
|MoistureResistance|MIL-STD-883,Method1004|
|MechanicalShock|MIL-STD-883,Method2002, Condition B|
|Mechanical Vibration|MIL-STD-883,Method 2007,Condition A|
|Resistance to SolderingHeat|eat<br>J-STD-020C,Table 5-2 Pb-free devices (except2cyclesmax)|
|Hazardous Substance|Pb-Free /RoHS / GreenCompliant|
|Solderability|JESD22-B102-D Method 2(PreconditioningE)|
|TerminalStrength|MIL-STD-883,Method2004,Test Condition D|
|GrossLeak|MIL-STD-883,Method1014, ConditionC|
|Fine Leak|MIL-STD-883,Method 1014,Condition A2,R1=2x10-8 atm cc/s|
|Solvent Resistance|MIL-STD-202,Method 215|



## **Marking** 

Line 1:   Frequency, Date Code 

## **PROPRIETARY AND CONFIDENTIAL** 

THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION, AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY PURPOSE NOR USED FOR MANUFACTURING PURPOSES WITHOUT WRITTEN PERMISSION FROM ILSI America. 

Rev:  04/05/15_B 

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail.ilsiamerica@com ● 

> www.ilsiamerica.com ~~a~~ 

Specifications subject to change without notice 

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