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IKQB160N75CP2AKSA1
IGBT, 200 A, 1.4 V, 750 W, 750 V, TO-247, 3 Pins
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: INFINEON
- Product type: Single IGBTs
- Available until stocks are exhausted
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 3Pins
- Product Range: -
- Power Dissipation: 750W
- Transistor Mounting: Through Hole
- Transistor Case Style: TO-247
- Operating Temperature Max: 175°C
- Continuous Collector Current: 200A
- Collector Emitter Voltage Max: 750V
- Collector Emitter Saturation Voltage: 1.4V
| Delivery and price | |
|---|---|
| Units per pack | 50 |
| Price | 4.67 € |
| Current stock | 50+ |
| Lead time | 30 days |
Datasheet
**IKQB160N75CP2 Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package** **Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package co-packed with soft and fast recovery diode** ## **Features** - VCE = 750 V - IC = 160 A - Low saturation voltage VCEsat = 1.4 V - Low switching losses - Short circuit ruggedness 3 µs - IGBT co-packed with full current, soft and fast recovery diode - Optimized for hard switching topologies up to 10 KHz - Package backside suitable for reflow soldering at 245°C, 3 times - Plating of pins further enable electrical resistance welding - Complete product spectrum and PSpice Models: http://www.infineon.com/igbt/ ## **Potential applications** - CAV Powertrain Control Modules - General purpose drives (GPD) ## **Product validation** - Qualified for industrial applications according to the relevant tests of JEDEC47/20/22 ## **Description** C G E **Type Package Marking** IKQB160N75CP2 PG-TO247-3-PLUS-NN8.5 K160GCP2 ~~OHH~~ Please read the sections "Important notice" and "Warnings" at the end of this document Datasheet www.infineon.com Revision 1.00 2022-11-23 **IKQB160N75CP2 Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package** **==> picture [105 x 47] intentionally omitted <==** **Table of contents** ## **Table of contents** ||**Description**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1| |---|---| ||**Features**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1| ||**Potential applications**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1| ||**Product validation**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1| ||**Table of contents**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2| |**1**|**Package**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3| |**2**|**IGBT**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3| |**3**|**Diode**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5| |**4**|**Characteristics diagrams**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7| |**5**|**Package outlines**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14| |**6**|**Testing conditions**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15| ||**Revision history**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16| ||**Disclaimer**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17| Datasheet Revision 1.00 2022-11-23 2 **IKQB160N75CP2 Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package** **==> picture [105 x 47] intentionally omitted <==** ## **1 Package** ## **1 Package** |**1**<br>**Package**|**1**<br>**Package**|**1**<br>**Package**||||| |---|---|---|---|---|---|---| |**Table 1**<br>**Characteristic values**||||||| |**Parameter**|**Symbol**|**Note or test condition**|**Values**|||**Unit**| ||||**Min.**|**Typ.**|**Max.**|| |Internal emitter<br>inductance measured 5<br>mm (0.197 in.) from case|_L_E|||13||nH| |Storage temperature|_T_stg||-55||150|°C| |Soldering temperature|_T_sold|reflow soldering (MSL1 according to JEDEC<br>J-STA-020)|||245|°C| |Thermal resistance,<br>junction-ambient|_R_th(j-a)||||40|K/W| |IGBT thermal resistance,<br>junction-case|_R_th(j-c)||||0.2|K/W| |Diode thermal resistance,<br>junction-case|_R_th(j-c)||||0.36|K/W| ## **2 IGBT** |**2**<br>**IGBT**|**2**<br>**IGBT**|**2**<br>**IGBT**|||| |---|---|---|---|---|---| |**Table 2**<br>**Maximum rated values**|||||| |**Parameter**|**Symbol**|**Note or test condition**||**Values**|**Unit**| |Collector-emitter voltage|_V_CE|_T_vj≥ 25 °C||750|V| |DC collector current,<br>limited by Tvjmax|_I_C|limited by bondwire|_T_c= 25 °C|200|A| ||||_T_c= 125 °C|160|| |Pulsed collector current, tp<br>limited by Tvjmax|_I_Cpulse|||480|A| |Turn-of safe operating<br>area||_V_CE≤ 750 V,_T_vj≤ 175 °C||480|A| |Gate-emitter voltage|_V_GE|||±20|V| |Transient gate-emitter<br>voltage|_V_GE|_t_p= 10 µs,_D_< 0.01||±30|V| |Short-circuit withstand<br>time|_t_SC|_V_CC≤ 450 V,_V_GE= 15 V, Allowed number of<br>short circuits < 1000, Time between short<br>circuits ≥ 1.0 s,_T_vj= 125 °C||3|µs| |Power dissipation|_P_tot||_T_c= 25 °C|750|W| ||||_T_c= 125 °C|250|| Datasheet Revision 1.00 2022-11-23 3 **IKQB160N75CP2 Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package** **==> picture [105 x 47] intentionally omitted <==** ## **2 IGBT** ## **Characteristic values** ||||||||| |---|---|---|---|---|---|---|---| |**Table 3**<br>**Characteristic values**|||||||| |**Parameter**|**Symbol**|**Note or test condition**||**Values**|||**Unit**| |||||**Min.**|**Typ.**|**Max.**|| |Collector-emitter<br>saturation voltage|_V_CEsat|_I_C= 160 A,_V_GE= 15 V|_T_vj= 25 °C||1.4|1.65|V| ||||_T_vj= 175 °C||1.7||| |Gate-emitter threshold<br>voltage|_V_GEth|_I_C= 2.15 mA, VCE= VGE||5|5.8|6.5|V| |Zero gate-voltage collector<br>current|_I_CES|_V_CE= 750 V,_V_GE= 0 V|_T_vj= 25 °C|||200|µA| ||||_T_vj= 175 °C||6000||| |Gate-emitter leakage<br>current|_I_GES|_V_CE= 0 V,_V_GE= 20 V||||100|nA| |Transconductance|_g_fs|_I_C= 160 A,_V_CE= 20 V|||118||S| |Input capacitance|_C_ies|_V_CE= 25 V,_V_GE= 0 V,_f_= 100 kHz|||16500||pF| |Output capacitance|_C_oes|_V_CE= 25 V,_V_GE= 0 V,_f_= 100 kHz|||435||pF| |Reverse transfer<br>capacitance|_C_res|_V_CE= 25 V,_V_GE= 0 V,_f_= 100 kHz|||75||pF| |Gate charge|_Q_G|_I_C= 160 A,_V_GE= 15 V,_V_CC=|600 V||610||nC| |Turn-on delay time|_t_d(on)|_V_CC= 450 V,_V_GE= 0/15 V,<br>_R_G(on)= 4.8 Ω,<br>_R_G(of)= 4.8 Ω,_L_σ= 30 nH,<br>_C_σ= 144 pF|_T_vj= 25 °C,<br>_I_C= 160 A||72||ns| ||||_T_vj= 175 °C,<br>_I_C= 160 A||69||| |Rise time (inductive load)|_t_r|_V_CC= 450 V,_V_GE= 0/15 V,<br>_R_G(on)= 4.8 Ω,<br>_R_G(of)= 4.8 Ω,_L_σ= 30 nH,<br>_C_σ= 144 pF|_T_vj= 25 °C,<br>_I_C= 160 A||73||ns| ||||_T_vj= 175 °C,<br>_I_C= 160 A||69||| |Turn-of delay time|_t_d(of)|_V_CC= 450 V,_V_GE= 0/15 V,<br>_R_G(on)= 4.8 Ω,<br>_R_G(of)= 4.8 Ω,_L_σ= 30 nH,<br>_C_σ= 144 pF|_T_vj= 25 °C,<br>_I_C= 160 A||324||ns| ||||_T_vj= 175 °C,<br>_I_C= 160 A||395||| |Fall time (inductive load)|_t_f|_V_CC= 450 V,_V_GE= 0/15 V,<br>_R_G(on)= 4.8 Ω,<br>_R_G(of)= 4.8 Ω,_L_σ= 30 nH,<br>_C_σ= 144 pF|_T_vj= 25 °C,<br>_I_C= 160 A||40||ns| ||||_T_vj= 175 °C,<br>_I_C= 160 A||53||| |Turn-on energy|_E_on|_V_CC= 450 V,_V_GE= 0/15 V,<br>_R_G(on)= 4.8 Ω,<br>_R_G(of)= 4.8 Ω,_L_σ= 30 nH,<br>_C_σ= 144 pF|_T_vj= 25 °C,<br>_I_C= 160 A||9.7||mJ| ||||_T_vj= 175 °C,<br>_I_C= 160 A||12.5||| **(table continues...)** Datasheet Revision 1.00 2022-11-23 4 **IKQB160N75CP2 Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package** **==> picture [105 x 47] intentionally omitted <==** ## **3 Diode** **Table 3 (continued) Characteristic values** |**Parameter**|**Symbol**|**Note or test condition**||**Values**|**Values**|**Values**|**Unit**| |---|---|---|---|---|---|---|---| |||||**Min.**|**Typ.**|**Max.**|| |Turn-of energy|_E_of|_V_CC= 450 V,_V_GE= 0/15 V,<br>_R_G(on)= 4.8 Ω,<br>_R_G(of)= 4.8 Ω,_L_σ= 30 nH,<br>_C_σ= 144 pF|_T_vj= 25 °C,<br>_I_C= 160 A||5.2||mJ| ||||_T_vj= 175 °C,<br>_I_C= 160 A||7.6||| |Total switching energy|_E_ts|_V_CC= 450 V,_V_GE= 0/15 V,<br>_R_G(on)= 4.8 Ω,<br>_R_G(of)= 4.8 Ω,_L_σ= 30 nH,<br>_C_σ= 144 pF|_T_vj= 25 °C,<br>_I_C= 160 A||14.9||mJ| ||||_T_vj= 175 °C,<br>_I_C= 160 A||20.1||| |Operating junction<br>temperature|_T_vj|||-40||175|°C| _Note: Electrical Characteristic, at T_ vj _= 25°C, unless otherwise specified._ ## **3 Diode** |**3**<br>**Diode**|**3**<br>**Diode**|**3**<br>**Diode**|||| |---|---|---|---|---|---| |**Table 4**<br>**Maximum rated values**|||||| |**Parameter**|**Symbol**|**Note or test condition**||**Values**|**Unit**| |Repetitive peak reverse<br>voltage|_V_RRM|_T_vj≤ 25 °C||750|V| |Diode forward current,<br>limited by Tvjmax|_I_F||_T_c= 25 °C|200|A| ||||_T_c= 65 °C|160|| |Diode pulsed current, tp<br>limited by Tvjmax|_I_Fpulse|||480|A| |Power dissipation|_P_tot||_T_c= 25 °C|417|W| ||||_T_c= 125 °C|139|| **Table 5 Characteristic values** |**Parameter**|**Symbol**|**Note or test condition**||**Values**|**Values**|**Values**|**Unit**| |---|---|---|---|---|---|---|---| |||||**Min.**|**Typ.**|**Max.**|| |Diode forward voltage|_V_F|_I_F= 160 A|_T_vj= 25 °C||1.8|2|V| ||||_T_vj= 175 °C||1.9||| |Diode reverse recovery<br>time|_t_rr|_V_R= 450 V|_T_vj= 25 °C,<br>_I_F= 160 A,<br>_-di_F_/dt_= 1000 A/µs||255||ns| ||||_T_vj= 175 °C,<br>_I_F= 160 A,<br>_-di_F_/dt_= 1000 A/µs||373||| ## **(table continues...)** Datasheet Revision 1.00 2022-11-23 5 **IKQB160N75CP2 Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package** **==> picture [105 x 47] intentionally omitted <==** ## **3 Diode** |**Table 5**<br>**(continued) Characteristic values**|**Table 5**<br>**(continued) Characteristic values**|**Table 5**<br>**(continued) Characteristic values**|||||| |---|---|---|---|---|---|---|---| |**Parameter**|**Symbol**|**Note or test condition**||**Values**|||**Unit**| |||||**Min.**|**Typ.**|**Max.**|| |Diode reverse recovery<br>charge|_Q_rr|_V_R= 450 V|_T_vj= 25 °C,<br>_I_F= 160 A,<br>_-di_F_/dt_= 1000 A/µs||4.2||µC| ||||_T_vj= 175 °C,<br>_I_F= 160 A,<br>_-di_F_/dt_= 1000 A/µs||12.3||| |Diode peak reverse<br>recovery current|_I_rrm|_V_R= 450 V|_T_vj= 25 °C,<br>_I_F= 160 A,<br>_-di_F_/dt_= 1000 A/µs||29.6||A| ||||_T_vj= 175 °C,<br>_I_F= 160 A,<br>_-di_F_/dt_= 1000 A/µs||56.7||| |Diode peak rate of fall of<br>reverse recovery current|_di_rr_/dt_|_V_R= 450 V|_T_vj= 25 °C,<br>_I_F= 160 A,<br>_-di_F_/dt_= 1000 A/µs||265||A/µs| ||||_T_vj= 175 °C,<br>_I_F= 160 A,<br>_-di_F_/dt_= 1000 A/µs||283||| |Operating junction<br>temperature|_T_vj|||-40||175|°C| _Note: For optimum lifetime and reliability, Infineon recommends operating conditions that do not exceed 80% of the maximum ratings stated in this datasheet._ Datasheet Revision 1.00 2022-11-23 6 **IKQB160N75CP2 Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package** **==> picture [105 x 47] intentionally omitted <==** ## **4 Characteristics diagrams** ## **4 Characteristics diagrams** **Collector current as a function of case temperature** IC = f(Tc) Tvj ≤ 175 °C, VGE ≥ 15 V **Power dissipation as a function of case temperature** Ptot = f(Tc) T ≤ 175 °C vj **==> picture [540 x 572] intentionally omitted <==** **----- Start of picture text -----**<br> 220 800<br>200<br>700<br>180<br>600<br>160<br>140 500<br>120<br>400<br>100<br>80 300<br>60<br>200<br>40<br>100<br>20<br>0 0<br>25 50 75 100 125 150 175 25 50 75 100 125 150 175<br>Typical output characteristic Typical output characteristic<br>IC = f(VCE) IC = f(VCE)<br>T = 25 °C T = 175 °C<br>vj vj<br>500 500<br>400 400<br>300 300<br>200 200<br>100 100<br>0 0<br>0 1 2 3 4 5 0 1 2 3 4 5<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2022-11-23 7 **IKQB160N75CP2 Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package** **==> picture [105 x 47] intentionally omitted <==** ## **4 Characteristics diagrams** ## **Typical transfer characteristic** IC = f(VGE) ## VCE = 20 V **==> picture [228 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 500<br>450<br>400<br>350<br>300<br>250<br>200<br>150<br>100<br>50<br>0<br>4 5 6 7 8 10 11 12 13 14<br>**----- End of picture text -----**<br> ## **Gate-emitter threshold voltage as a function of junction temperature** VGEth = f(Tvj) IC = 2.15 mA **==> picture [228 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 7<br>6<br>5<br>4<br>3<br>2<br>25 50 75 100 125 150<br>**----- End of picture text -----**<br> ## **Typical collector-emitter saturation voltage as a function of junction temperature** VCEsat = f(Tvj) VGE = 15 V **==> picture [229 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 2.5<br>2.0<br>1.5<br>1.0<br>0.5<br>0.0<br>25 50 75 100 125 150 175<br>**----- End of picture text -----**<br> ## **Typical switching times as a function of collector current** t = f(IC) VCC = 450 V, Tvj = 175 °C, VGE = 0/15 V, RG = 4.8 Ω **==> picture [229 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 10000<br>1000<br>100<br>10<br>1<br>0 50 100 150 200 250 300 350 400 450 500 550<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2022-11-23 8 **IKQB160N75CP2 Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package** **==> picture [105 x 47] intentionally omitted <==** ## **4 Characteristics diagrams** ## **Typical switching times as a function of gate resistor** t = f(RG) IC = 160 A, VCC = 450 V, Tvj = 175 °C, VGE = 0/15 V ## **Typical switching times as a function of junction temperature** t = f(Tvj) IC = 160 A, VCC = 450 V, VGE = 0/15 V, RG = 4.8 Ω **==> picture [228 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 10000<br>1000<br>100<br>10<br>1<br>0 10 20 30 40 50<br>**----- End of picture text -----**<br> ## **Typical switching energy losses as a function of collector current** E = f(IC) VCC = 450 V, Tvj = 175 °C, VGE = 0/15 V, RG = 4.8 Ω **==> picture [229 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 10000<br>1000<br>100<br>10<br>1<br>25 50 75 100 125 150 175<br>**----- End of picture text -----**<br> ## **Typical switching energy losses as a function of gate resistor** E = f(RG) IC = 160 A, VCC = 450 V, Tvj = 175 °C, VGE = 0/15 V **==> picture [540 x 262] intentionally omitted <==** **----- Start of picture text -----**<br> 120 60<br>100 50<br>80 40<br>60 30<br>40 20<br>20 10<br>0 0<br>0 50 100 150 200 250 300 350 400 450 500 550 0 10 20 30 40 50<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2022-11-23 9 **IKQB160N75CP2 Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package** **==> picture [105 x 47] intentionally omitted <==** ## **4 Characteristics diagrams** ## **Typical switching energy losses as a function of junction temperature** E = f(Tvj) IC = 160 A, VCC = 450 V, VGE = 0/15 V, RG = 4.8 Ω **==> picture [228 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 24<br>21<br>18<br>15<br>12<br>9<br>6<br>3<br>0<br>25 50 75 100 125 150 175<br>**----- End of picture text -----**<br> ## **Typical gate charge** VGE = f(QG) IC = 160 A **==> picture [228 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 16<br>14<br>12<br>10<br>8<br>6<br>4<br>2<br>0<br>0 100 200 300 400 500 600<br>**----- End of picture text -----**<br> ## **Typical switching energy losses as a function of collector emitter voltage** E = f(VCE) IC = 160 A, VGE = 0/15 V, Tvj = 175 °C, RG = 4.8 Ω **==> picture [229 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 24<br>21<br>18<br>15<br>12<br>9<br>6<br>3<br>0<br>200 250 300 350 400 450 500<br>**----- End of picture text -----**<br> **Typical capacitance as a function of collector-emitter voltage** C = f(VCE) f = 100 kHz, VGE = 0 V **==> picture [229 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 10000<br>1000<br>100<br>10<br>1<br>0 5 10 15 20 25 30<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2022-11-23 10 **IKQB160N75CP2 Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package** **==> picture [105 x 47] intentionally omitted <==** ## **4 Characteristics diagrams** ## **IGBT transient thermal impedance as a function of pulse width** **==> picture [250 x 23] intentionally omitted <==** **----- Start of picture text -----**<br> Diode transient thermal impedance as a function of<br>pulse width<br>**----- End of picture text -----**<br> **==> picture [540 x 598] intentionally omitted <==** **----- Start of picture text -----**<br> Zth(j-c) = f(tp)th(j-c) = f(tp) = f(tp)p)) Zth(j-c) = f(tp)th(j-c) = f(tp) = f(tp)p))<br>D = tp/Tp/T/T D = tp/Tp/T/T<br>1 1<br>0.1<br>0.1<br>0.01<br>0.001<br>0.01<br>0.0001<br>1E-5 0.001<br>1E-6 1E-5 0.0001 0.001 0.01 0.1 1E-5 0.0001 0.001 0.01 0.1<br>Typical diode forward current as a function of forward Typical diode forward voltage as a function of<br>voltage junction temperature<br>IF = f(VF)F = f(VF) = f(VF)F)) VF = f(Tvj)F = f(Tvj) = f(Tvj)vj))<br>500 2.5<br>450<br>400 2.0<br>350<br>300 1.5<br>250<br>200 1.0<br>150<br>100 0.5<br>50<br>0 0.0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 25 50 75 100 125 150 175<br>**----- End of picture text -----**<br> **==> picture [540 x 598] intentionally omitted <==** **----- Start of picture text -----**<br> Zth(j-c) = f(tp)th(j-c) = f(tp) = f(tp)p)) Zth(j-c) = f(tp)th(j-c) = f(tp) = f(tp)p))<br>D = tp/Tp/T/T D = tp/Tp/T/T<br>1 1<br>0.1<br>0.1<br>0.01<br>0.001<br>0.01<br>0.0001<br>1E-5 0.001<br>1E-6 1E-5 0.0001 0.001 0.01 0.1 1E-5 0.0001 0.001 0.01 0.1<br>Typical diode forward current as a function of forward Typical diode forward voltage as a function of<br>voltage junction temperature<br>IF = f(VF)F = f(VF) = f(VF)F)) VF = f(Tvj)F = f(Tvj) = f(Tvj)vj))<br>500 2.5<br>450<br>400 2.0<br>350<br>300 1.5<br>250<br>200 1.0<br>150<br>100 0.5<br>50<br>0 0.0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 25 50 75 100 125 150 175<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2022-11-23 11 **IKQB160N75CP2 Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package** **==> picture [105 x 47] intentionally omitted <==** ## **4 Characteristics diagrams** **==> picture [540 x 646] intentionally omitted <==** **----- Start of picture text -----**<br> Typical reverse recovery time as a function of diode Typical reverse recovery charge as a function of diode<br>current slope current slope<br>trr = f(diF/dt) Qrr = f(diF/dt)<br>VR = 450 V, IF = 160 A VR = 450 V, IF = 160 A<br>600 14<br>12<br>500<br>10<br>400<br>8<br>300<br>6<br>200<br>4<br>100<br>2<br>0 0<br>500 600 700 800 900 1000 1100 1200 500 600 700 800 900 1000 1100 1200<br>Typical reverse recovery current as a function of diode Typical diode peak rate of fall of reverse recovery<br>current slope current as a function of diode current slope<br>Irrm = f(diF/dt) dirr/dt = f(diF/dt)<br>VR = 450 V, IF = 160 A VR = 450 V, IF = 160 A<br>80 -180<br>70<br>-200<br>60<br>-220<br>50<br>40 -240<br>30<br>-260<br>20<br>-280<br>10<br>0 -300<br>500 600 700 800 900 1000 1100 1200 500 600 700 800 900 1000 1100 1200<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2022-11-23 12 **IKQB160N75CP2 Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package** **==> picture [105 x 47] intentionally omitted <==** ## **4 Characteristics diagrams** **==> picture [540 x 318] intentionally omitted <==** **----- Start of picture text -----**<br> Typical reverse energy losses as a function of diode<br>current slope<br>Erec = f(diF/dt)<br>VR = 450 V, IF = 160 A<br>4.0<br>3.5<br>3.0<br>2.5<br>2.0<br>1.5<br>1.0<br>0.5<br>0.0<br>500 600 700 800 900 1000 1100 1200<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2022-11-23 13 **IKQB160N75CP2 Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package** **5 Package outlines** **5 Package outlines** **==> picture [105 x 47] intentionally omitted <==** ## **PG-TO247-3-PLUS-NN8.5** |**DIMENSIONS**<br>PACKAGE - GRO<br>NUMBER:<br>**b**<br>**D**<br>**c**<br>**E**<br>**L**<br>**L1**<br>**D1**<br>**A**<br>**A1**<br>**b2**<br>**E1**<br>**b1**<br>**E2**<br>**b3**<br>**E3**<br>**E4**<br>**e**<br>**N**<br>**H**<br>**aaa**|**PG-TO247-3-U02**<br>UP|**PG-TO247-3-U02**<br>UP| |---|---|---| ||MIN.<br>MAX.<br>**MILLIMETERS**|| |||MAX.| ||4.70|4.90| ||2.16|2.66| ||1.10|1.30| ||1.80|| ||2.00|| ||0.00|0.15| ||0.50|0.70| ||22.70|22.90| ||14.69|14.89| ||15.70|15.90| ||0.76|0.96| ||3.08|3.28| ||3.84|4.04| ||12.28|12.48| ||5.44|| ||3|| ||1.30|1.50| ||18.01|18.21| ||2.34|2.54| ||0.25|| ## **Figure 1** Datasheet Revision 1.00 2022-11-23 14 **IKQB160N75CP2 Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package** **==> picture [105 x 47] intentionally omitted <==** ## **6 Testing conditions** **==> picture [185 x 14] intentionally omitted <==** **----- Start of picture text -----**<br> 6 Testing conditions<br>**----- End of picture text -----**<br> **==> picture [502 x 613] intentionally omitted <==** **----- Start of picture text -----**<br> V GE (t) I,V<br>90% V GE dI F /dt Qt rrrr== Qt aa++ tQ b b<br>10% V GE t a b<br>I C (t) Q a Q b<br>dI<br>90% I C 90% I C<br>10% I C 10% I C t Figure C. Definition of diode switching<br>characteristics<br>V CE (t)<br>t<br>t<br>t d(off) t f t d(on) t r<br>Figure A.<br>V GE (t)<br>90% V GE<br>Figure D.<br>10% V GE<br>t<br>I C (t)<br>CC<br>2% I C t<br>V CE (t) Figure E. Dynamic test circuit<br>Parasitic inductance Ls,<br>parasitic capacitor Cs,<br>relief capacitor C ,r<br>t 2 t 4 (only for ZVT switching)<br>E off [=] V CE x I C x d t E on [=] V CE x I C x d t<br>t 1 t 3 2% V C C<br>t<br>t 1 t 2 t 3 t 4<br>Figure B.<br>**----- End of picture text -----**<br> **Figure 2** Datasheet Revision 1.00 2022-11-23 15 **IKQB160N75CP2 Short circuit rugged 750 V EDT2 IGBT in reflow-solderable package** **==> picture [105 x 47] intentionally omitted <==** **Revision history** ## **Revision history** |**Revision history**||| |---|---|---| |**Document revision**|**Date of release**|**Description of changes**| |V0.1||Target Data Sheet| |n/a|2020-11-30|Datasheet migrated to a new system with a new layout and new revision<br>number schema: target or preliminary datasheet = 0.xy; final datasheet =<br>1.xy| |1.00|2022-11-23|Final datasheet| Datasheet Revision 1.00 2022-11-23 16 ## **Trademarks** All referenced product or service names and trademarks are the property of their respective owners. **Edition 2022-11-23 Important notice Published by** The information given in this document shall in no event be regarded as a guarantee of conditions or **Infineon Technologies AG** characteristics (“Beschaffenheitsgarantie”). **81726 Munich, Germany** With respect to any examples, hints or any typical values stated herein and/or any information regarding **© 2022 Infineon Technologies AG** the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities **All Rights Reserved.** of any kind, including without limitation warranties of non-infringement of intellectual property rights of any **Do you have a question about any** third party. **aspect of this document?** In addition, any information given in this document is **Email: erratum@infineon.com** subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning **Document reference** customer’s products and any use of the product of **IFX-AAL444-002** Infineon Technologies in customer’s applications. Please note that this product is not qualified according to the AEC Q100 or AEC Q101 documents of the Automotive Electronics Council. ## **Warnings** Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application.
Updated at June 9, 2026
Infineon Technologies is a globally recognized leader in semiconductor solutions, renowned for driving innovation in power management, energy efficiency, and modern mobility. With a strong legacy of engineering excellence, the company provides highly reliable components designed to meet the rigorous demands of industrial, automotive, and advanced commercial applications. The core of our Infineon portfolio is centered on their industry-leading discrete semiconductors. We offer an extensive selection of single and dual MOSFETs, alongside a robust range of single IGBTs and advanced IGBT modules. These flagship power transistors are essential for high-efficiency power conversion and motor control, providing engineers with superior thermal performance and minimized switching losses. Beyond advanced field-effect transistors, the selection includes a comprehensive array of diodes and rectifiers, heavily featuring Schottky diodes, as well as fast-recovery and RF/PIN diodes. This power foundation is further supported by bipolar transistors, intelligent power modules, and thyristor SCR modules, delivering the critical building blocks required for complex power system designs. To support broader system integration, the portfolio also encompasses specialized solutions such as solid-state relays, AC/DC LED driver ICs, and Bluetooth communications modules. From high-power industrial rectifiers to wireless connectivity adapters, Infineon equips designers with the precision components needed to build efficient, scalable, and fully connected electronic systems.
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