ICK BGA 35 X 35 X 10.

Heat Sink, For Ball Grid Array, 15.7 °C/W, BGA, 35 mm, 10 mm, 35 mm

⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.

Manufacturer: FISCHER ELEKTRONIK
Product type: Natural Convection Heat Sinks
Thermal Resistance:15.7°C/W; Packages Cooled:BGA; External Width - Metric:35mm; External Height - Metric:10mm; External Length - Metric:35mm; External Diameter - Metric; Available until stocks are exhausted
SVHC: No SVHC (25-Jun-2025)
Product Range: -
Packages Cooled: BGA
Heat Sink Material: Aluminium
Thermal Resistance: 15.7°C/W
External Width - Metric: 35mm
External Height - Metric: 10mm
External Length - Metric: 35mm
External Width - Imperial: 1.38"
External Diameter - Metric: -
External Height - Imperial: 0.39"
External Length - Imperial: 1.38"
External Diameter - Imperial: -

Delivery and price
Units per pack	100
Price	1.8 €
Current stock	100+
Lead time	30 days

Datasheet

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**ICK BGA 35 x 35 x 10** WLF ... 35 x 35 **Art. Nr.** Po 

**ICK BGA 37 x 37 x 6** WLF ... 37 x 37 **Art. Nr.** ee 

**ICK BGA 37 x 37 x 10** WLF ... 37 x 37 

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|H|Wärmeleitfolie|WLFT|404/405|➔|E|5|SMD-Kühlkörper|➔|B|38|–|40|
|Wärmeleitkleber|➔|E|15|Montagematerial|für|Halbleiter|➔|E|37|–|41|
|Wärmeleitpaste|➔|E|13|Lochbilder|➔|A|21|
|Prozessorübersicht|➔|B|2|-|7|Technische|Erläuterungen|➔|A|2|-|7|

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Updated at June 10, 2026

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