ICK BGA 14 X 14

Heat Sink, For Ball Grid Array, 30 °C/W, BGA, 14 mm, 6 mm, 14 mm

⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.

Manufacturer: FISCHER ELEKTRONIK
Product type: Natural Convection Heat Sinks
Thermal Resistance:30°C/W; Packages Cooled:BGA; External Width - Metric:14mm; External Height - Metric:6mm; External Length - Metric:14mm; External Diameter - Metric:-; Heat Sink Material:Aluminium;
SVHC: No SVHC (25-Jun-2025)
Product Range: -
Packages Cooled: BGA
Heat Sink Material: Aluminium
Thermal Resistance: 30°C/W
External Width - Metric: 14mm
External Height - Metric: 6mm
External Length - Metric: 14mm
External Width - Imperial: 0.55"
External Diameter - Metric: -
External Height - Imperial: 0.24"
External Length - Imperial: 0.55"
External Diameter - Imperial: -

Delivery and price
Units per pack	100
Price	1.29 €
Current stock	200+
Lead time	30 days

Datasheet

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H **Heatsinks for DIL-IC, PLCC and SMD** 

**B** 

**C** 

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## **Heatsinks for SMD** 

a **art. no.** [mm] Rth [K/W] **ICK SMD C 7 ...** 7 33 esMe **ICK SMD C 10 ...** 10 26 esRe **ICK SMD C 17 ...** 17 17 esMe | a] °LULULULLLLLL: **art. no.** [mm] Rth [K/W] **ICK SMD E 15 ...** 15.3 27 PF ~~E~~ E **ICK SMD E 22 ...** 22.3 21 ee **ICK SMD E 29 ...** 29.0 18 «ew ~~A~~ **art. no.** [mm] Rth [K/W] ~~i~~ **ICK SMD F 8 ...** 8 74 **ICK SMD F 10 ...** 10 71 ~~es~~ es **ICK SMD F 17 ...** 17 42 esRa **ICK SMD F 19 ...** 19 37 es **ICK SMD F 21 ...** 21 33 ~~a a~~ **ICK SMD F 26 ...** 26 26 

|Rth[K/W]<br>[mm]<br>**art. no.**<br>73<br>8<br>**ICK SMD G 8 ...**<br>70<br>10<br>**ICK SMD G 10 ...**<br>61<br>13<br>**ICK SMD G 13 ...**<br>41<br>17<br>**ICK SMD G 17 ...**<br>36<br>19<br>**ICK SMD G 19 ...**<br>32<br>21<br>**ICK SMD G 21 ...**<br>~~a~~<br>ee<br>ee<br>esRe<br>eea<br>~~ss~~<br>_WT<br>PF|
|---|
|**please indicate:**<br>**surface treatment**<br>**...**|
|**black anodised**<br>**=**<br>**SA**|
|**solderable surface**<br>**=**<br>**MI**|



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**Thermal conduct. foil WLFT 404/405** `➔` **E 5 Profiles for PCB mounting** `➔` **A 89 – 110 Thermal conductive glue** `➔` **E 15 U-shaped heatsink** `➔` **A 119 – 121 B 38 Thermal conductive paste** `➔` **E 13 Heatsinks for PCB** `➔` **A 89 – 91 Silicone wafers** `➔` **E 2 – 4 Pin heatsinks for IC** `➔` **B 20 – 27** 

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Updated at June 10, 2026

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