ICK BGA 10 X 10 X 10

Heat Sink, Square, PCB, For Ball Grid Arrays, 28.5 °C/W, BGA, 10 mm, 10 mm, 10 mm

⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.

Manufacturer: FISCHER ELEKTRONIK
Product type: Natural Convection Heat Sinks
Thermal Resistance:28.5°C/W; Packages Cooled:BGA; External Width - Metric:10mm; External Height - Metric:10mm; External Length - Metric:10mm; External Diameter - Metric:-; Heat Sink Mater
SVHC: No SVHC (25-Jun-2025)
Product Range: -
Packages Cooled: BGA
Heat Sink Material: Aluminium
Thermal Resistance: 28.5°C/W
External Width - Metric: 10mm
External Height - Metric: 10mm
External Length - Metric: 10mm
External Width - Imperial: 0.39"
External Diameter - Metric: -
External Height - Imperial: 0.39"
External Length - Imperial: 0.39"
External Diameter - Imperial: -

Delivery and price
Units per pack	100
Price	1.22 €
Current stock	1000+
Lead time	30 days

Datasheet

## fiscinesA elektronike == 

heatsinks for IC processor 

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> fiseiner eleKktronik@ == Heatsinks for BGAs 

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Updated at June 10, 2026

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