HSF-55-24-Y-F

## Heat Sink Fan Combinations 

## HSF Series 

Wakefield-Vette’s Heat Sink Fan Series (HSF) are for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and many more. 

These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, Cloud Computing, and many more Industries. 

**Material:** AL 6063 

**Finish:** Black Anodize 

|**WKV Part Number**<br>~~ee~~|**Chip Size**<br>~~ee~~<br>~~ee~~|**Height (mm)**<br>~~ee~~|**C/W**<br>~~ee~~|**Chip Height**<br>~~ee~~|**Fan**<br>~~ee~~|
|---|---|---|---|---|---|
|HSF-48-19-B-F|47.5 x 47.5mm<br>~~ee~~|18.5|1.41|2.2-3.4mm|5.9CFM|
|HSF-48-19-Y-F|47.5 x 47.5mm|18.5|1.41|.9-2.1mm|5.9CFM|
|HSF-48-22-B-F|47.5 x 47.5mm|21.5|1.14|2.2-3.4mm|5.9CFM|
|HSF-48-22-Y-F|47.5 x 47.5mm|21.5|1.14|.9-2.1mm|5.9CFM|
|HSF-48-25-B-F|47.5 x 47.5mm|24.5|0.98|2.2-3.4mm|5.9CFM|
|HSF-48-25-Y-F|47.5 x 47.5mm|24.5|0.98|.9-2.1mm|5.9CFM|
|HSF-48-28-B-F|47.5x 47.5mm|27.5|0.88|2.2-3.4mm|5.9CFM|
|HSF-48-28-Y-F|47.5 x 47.5mm|27.5|0.88|.9-2.1mm|5.9CFM|
|HSF-48-30-B-F|47.5 x 47.5mm|29.5|0.83|2.2-3.4mm|5.9CFM|
|HSF-48-30-Y-F|47.5 x 47.5mm|29.5|0.83|.9-2.1mm|5.9CFM|
|HSF-48-35-B-F|47.5 x 47.5mm|34.5|0.77|2.2-3.4mm|5.9CFM|
|HSF-48-35-Y-F|47.5 x 47.5mm|34.5|0.77|.9-2.1mm|5.9CFM|
|HSF-48-40-B-F|47.5 x 47.5mm|39.5|0.72|2.2-3.4mm|5.9CFM|
|HSF-48-40-Y-F|47.5 x 47.5mm|39.5|0.72|.9-2.1mm|5.9CFM|
|HSF-50-19-B-F|50 x 50mm|18.5|1.31|2.2-3.4mm|5.9CFM|
|HSF-50-19-Y-F|50 x 50mm|18.5|1.31|.9-2.1mm|5.9CFM|
|HSF-50-22-B-F|50 x 50mm|21.5|1.06|2.2-3.4mm|5.9CFM|
|HSF-50-22-Y-F|50 x 50mm|21.5|1.06|.9-2.1mm|5.9CFM|
|HSF-50-25-B-F|50 x 50mm|24.5|0.91|2.2-3.4mm|5.9CFM|
|HSF-50-25-Y-F|50x50mm|24.5|0.91|.9-2.1mm|5.9CFM|
|HSF-50-28-B-F|50 x 50mm|27.5|0.82|2.2-3.4mm|5.9CFM|
|HSF-50-28-Y-F|50 x 50mm|27.5|0.82|.9-2.1mm|5.9CFM|
|HSF-50-30-B-F|50x50mm|29.5|0.77|2.2-3.4mm|5.9CFM|
|HSF-50-30-Y-F|50x50mm|29.5|0.77|.9-2.1mm|5.9CFM|
|HSF-50-35-B-F|50x50mm|34.5|0.71|2.2-3.4mm|5.9CFM|
|HSF-50-35-Y-F|50x50mm|34.5|0.71|.9-2.1mm|5.9CFM|
|HSF-50-40-B-F|50x50mm|39.5|0.67|2.2-3.4mm|5.9CFM|
|HSF-50-40-Y-F<br>~~es~~|50x50mm<br>~~GO~~|39.5<br>~~GO~~|0.67<br>~~GO~~|.9-2.1mm|5.9CFM|
|HSF-55-24-B-F<br>~~es~~<br>~~es~~|55x55mm<br>~~es~~<br>~~GO~~|24.1<br>~~es~~<br>~~GO~~|1<br>~~es~~<br>~~GO~~|2.2-3.4mm<br>~~es~~|13.8CFM<br>~~es~~|
|HSF-55-24-Y-F<br>~~es~~|55x55mm<br>~~GO~~<br>~~QS~~|24.1<br>~~GO~~<br>~~QS~~|1<br>~~GO~~<br>~~QS~~|.9-2.1mm|13.8CFM|
|HSF-55-27-B-F<br>~~es~~<br>~~ee~~|55x55mm<br>~~GO~~<br>~~ee~~<br>~~GO~~|27.1<br>~~GO~~<br>~~ee~~<br>~~GO~~|0.81<br>~~GO~~<br>~~ee~~<br>~~GO~~|2.2-3.4mm<br>~~ee~~|13.8CFM<br>~~ee~~|
|HSF-55-27-Y-F<br>~~es~~<br>~~es~~|55x55mm<br>~~es~~<br>~~GO~~<br>~~es~~|27.1<br>~~es~~<br>~~GO~~<br>~~Q~~|0.81<br>~~es~~<br>~~GO~~<br>~~Q~~|.9-2.1mm<br>~~es~~|13.8CFM<br>~~es~~|
|HSF-55-30-B-F<br>~~ee~~<br>~~es~~|55x55mm<br>~~GO~~<br>~~ee~~<br>~~es~~<br>~~QC~~|30.1<br>~~GO~~<br>~~ee~~<br>~~Q~~<br>~~QC~~|0.7<br>~~GO~~<br>~~ee~~<br>~~Q~~<br>~~QC~~|2.2-3.4mm<br>~~ee~~|13.8CFM<br>~~ee~~|
|HSF-55-30-Y-F<br>~~es~~<br>~~ee~~|55x55mm<br>~~es~~<br>~~QC~~<br>~~GO~~<br>|30.1<br>~~Q~~<br>~~QC~~<br>~~GO~~|0.7<br>~~Q~~<br>~~QC~~<br>~~GO~~|.9-2.1mm|13.8CFM|
|HSF-55-33-B-F<br>~~es~~<br>~~es~~<br>~~ee es~~<br>~~a~~|55x55mm<br>~~es~~<br>~~QC~~<br>~~es~~<br>~~GO~~<br>~~es~~|33.1<br>~~Q~~<br>~~QC~~<br>~~es~~<br>~~GO~~<br>~~Q~~|0.63<br>~~Q~~<br>~~QC~~<br>~~es~~<br>~~GO~~<br>~~Q~~|2.2-3.4mm<br>~~es~~|13.8CFM<br>~~es~~|
|HSF-55-33-Y-F<br>~~ee es~~<br>~~a~~|55x55mm<br>~~GO~~<br>~~es~~|33.1<br>~~GO~~<br>~~Q~~|0.63<br>~~GO~~<br>~~Q~~|.9-2.1mm<br>~~QO~~|13.8CFM|
|HSF-55-35-B-F<br>~~ee es~~<br>~~a~~|55x55mm<br>~~GO~~<br>~~es~~<br>~~QQ~~<br>~~QO~~|35.1<br>~~GO~~<br>~~Q~~<br>~~QQ~~<br>~~QO~~|0.59<br>~~GO~~<br>~~Q~~<br>~~QQ~~<br>~~QO~~|2.2-3.4mm<br>~~QQ~~<br>~~QO~~|13.8CFM<br>~~QQ~~|
|HSF-55-35-Y-F<br>~~es~~<br>~~es~~|55x55mm<br>~~es~~<br>~~QO~~<br>~~GO~~|35.1<br>~~es~~<br>~~QO~~<br>~~GO~~|0.59<br>~~es~~<br>~~QO~~<br>~~GO~~|.9-2.1mm<br>~~QO~~<br>~~es~~|13.8CFM<br>~~es~~|
|HSF-55-40-B-F<br>~~ee~~<br>~~es~~|55x55mm<br>~~QO~~<br>~~ee~~<br>~~GO~~<br>~~QQ~~|40.1<br>~~QO~~<br>~~ee~~<br>~~GO~~<br>~~QQ~~|0.55<br>~~QO~~<br>~~ee~~<br>~~GO~~<br>~~QQ~~|2.2-3.4mm<br>~~ee~~|13.8CFM<br>~~ee~~|
|HSF-55-40-Y-F<br>~~es~~|55x55mm<br>~~GO~~<br>~~QQ~~|40.1<br>~~GO~~<br>~~QQ~~|0.55<br>~~GO~~<br>~~QQ~~|.9-2.1mm|13.8CFM|
|HSF-55-45-B-F<br>~~es~~<br>~~(GO~~<br>~~a~~|55x55mm<br>~~GO~~<br>~~QQ~~<br>~~(GO~~<br>~~as es~~|45.1<br>~~GO~~<br>~~QQ~~<br>~~(GO~~<br>~~es es~~|0.51<br>~~GO~~<br>~~QQ~~<br>~~(GO~~<br>~~es~~|2.2-3.4mm<br>~~(GO~~|13.8CFM<br>~~(GO~~|
|HSF-55-45-Y-F<br>~~a~~|55x55mm<br>~~as es~~|45.1<br>~~es es~~|0.51<br>~~es~~|.9-2.1mm|13.8CFM|



Heat Sink Fan Combinations 

HSF Series 

## **Chip Size 47.5x 47.5mm** 

## **Chip Size 50 x 50mm** 

## **Chip Size 55 x 55mm** 

Heat Sink Fan Combinations HSF Series 

Wakefield-Vette’s heat sink assembles onto chip set using the space that is between the PCB and the substrate of the solder balls. The solder balls provide a minimal gap of .5mm to .7mm. Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage chip. Contact area is the edge of chip. 

## **ASSEMBLY INSTRUCTION:** 

**Step 1:** Hook the clip under one side of the BGA chip set. 

**Step 2:** Rotate assembly down until opposite side clip engages substrate edge of BGA chip set. 

**Step 3:** Make sure **Step 4:** Press firmly the sop rods are down to make sure clearing from edges clips fully engage of BGA chip set. edges of chip set. Heat Sink should not move around easily. 

## **Random Vibration Test** 

Frequency `：` 5 Hz to 500 Hz Acceleration `：` 3.13 grms P.S.D `：` 0.01 g2/HZ (5 Hz) 0.02 g2/HZ (20 Hz to 500 Hz) Test Axis `：` X, Y, Z axis Test Time `：` 10 mins (Each axis) Total Test Time `：` 30 mins 

## **SHOCK TEST SPECIFICATION** `：` 

Wave Form `：` Half sine wave Acceleration `：` 50 g Duration Time `：` 11 ms No. of Shock `：` Each axis 3 times Shock Direction `：` ±X, ±Y, ±Z axis Reliability & Communication Testing Instruments