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HI FLOW THF 1600P
Thermal Insulator, Hi-Flow 300P .001", 4" x 4" Sheet, 1.6 W/m.K, 5 kV, 0.025 mm, 1000000 Mohm-m
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: BERGQUIST
- Product type: Thermal Insulators
- Insulator Body Material:-; Thermal Conductivity:1.6W/m.K; Breakdown Voltage Vbr:5kV; Thickness:0.025mm; Volume Resistivity:1000000Mohm-m; Thermal Impedance:-; Dielectric Strength:-; Prod
- SVHC: No SVHC (25-Jun-2025)
- Thickness: 0.025mm
- Product Range: -
- Thermal Impedance: -
- Volume Resistivity: 1000000Mohm-m
- Dielectric Strength: -
- Thermal Conductivity: 1.6W/m.K
- Breakdown Voltage Vbr: 5kV
- Insulator Body Material: -
| Delivery and price | |
|---|---|
| Units per pack | 50 |
| Price | 17.37 € |
| Current stock | 100+ |
| Lead time | 7 days |
**Hi-Flow® 300P** Electrically Insulating,Thermally Conductive Phase Change Material ## **Features and Benefits** |**TYPICAL PROPERTIES OF HI-FLOW 300P**|**TYPICAL PROPERTIES OF HI-FLOW 300P**|**TYPICAL PROPERTIES OF HI-FLOW 300P**|**TYPICAL PROPERTIES OF HI-FLOW 300P**|**TYPICAL PROPERTIES OF HI-FLOW 300P**|| |---|---|---|---|---|---| |PROPERTY<br>IMPERIAL VALUE||METRIC VALUE|||TEST METHOD| |Color<br>Green||Green|||Visual| |Reinforcement Carrier<br>Polyimide<br>Thickness (inch) / (mm)<br>0.004 - 0.005<br>Film Thickness (inch) / (mm)<br>0.001 - 0.002<br>Elongation (%45° to Warp and Fill)<br>40<br>Tensile Strength (psi) / (MPa)<br>7000<br>Continuous Use Temp (°F) / (°C)<br>302||Polyimide<br>0.102 - 0.127<br>0.025 - 0.050<br>40<br>48<br>150|||—<br>ASTM D374<br>ASTM D374<br>ASTM D882A<br>ASTM D882A<br>—| |Phase Change Temp (°F) / (°C)<br>131||55|||ASTM D3418| |ELECTRICAL|||||| |Dielectric Breakdown Voltage (Vac)<br>5000||5000|||ASTM D149| |Dielectric Constant (1000 Hz)<br>4.5||4.5|||ASTM D150| |Volume Resistivity (Ohm-meter)<br>10<br>12||10<br>12|||ASTM D257| |Flame Rating<br>V-O||V-O|||U.L. 94| |THERMAL|||||| |Thermal Conductivity (W/m-K) (1)<br>1.6||1.6|||ASTM D5470| |THERMAL PERFORMANCE vs PRESSURE|||||| |Pressure (psi)|10|25||50|100<br>200| |TO-220 Thermal Performance (°C/W) 0.0010"|0.95|0.94||0.92|0.91<br>0.90| |TO-220 Thermal Performance (°C/W) 0.0015"|1.19|1.17||1.16|1.14<br>1.12| |TO-220 Thermal Performance (°C/W) 0.0020"|1.38|1.37||1.35|1.33<br>1.32| |Thermal Impedance (°C-in2/W) 0.0010" (2)|0.13|0.13||0.12|0.12<br>0.12| |Thermal Impedance (°C-in2/W) 0.0015" (2)|0.17|0.16||0.16|0.16<br>0.15| |Thermal Impedance (°C-in2/W) 0.0020" (2)|0.19|0.19||0.19|0.18<br>0.18| - Thermal impedance: 0.13°C-in[2] /W (@25 psi) - Field-proven polyimide film - excellent dielectric performance - excellent cut-through resistance - Outstanding thermal performance in an insulated pad Hi-Flow 300P consists of a thermally conductive 55°C phase change compound coated on a thermally conductive polyimide film.The polyimide reinforcement makes the material easy to handle and the 55°C phase change temperature minimizes shipping and handling problems. 1) This is the measured thermal conductivity of the Hi-Flow coating. It represents one conducting layer in a three-layer laminate.The Hi-Flow coatings are phase change compounds.These layers will respond to heat and pressure induced stresses.The overall conductivity of the material in post-phase change, thin film products is highly dependent upon the heat and pressure applied.This characteristic is not accounted for in ASTM D5470. Please contact Bergquist Product Management if additional specifications are required. 2) The ASTM D5470 test fixture was used and the test sample was conditioned at 70°C prior to test.The recorded value includes interfacial thermal resistance.These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. Hi-Flow 300P achieves superior values in voltage breakdown and thermal performance when compared to its competition. The product is supplied on an easy release liner for exceptional handling in high volume manual assemblies. Hi-Flow 300P is designed for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink. ## **Typical Applications Include:** - Spring / clip mounted - Discrete power semiconductors and modules ## **Configurations Available:** - Roll form, die-cut parts and sheet form, with or without pressure sensitive adhesive Bergquist suggests the use of spring clips to assure constant pressure with the interface and power source. Please refer to thermal performance data to determine nominal spring pressure for your application. ## **Standard Options** **==> picture [329 x 134] intentionally omitted <==** **----- Start of picture text -----**<br> Building a Part Number Standard Options<br>HF300P – 0.001 – _ 00 – 00 – ACME10256 Rev a «example<br>NA = Selected standard option. If not selecting a standard<br>option, insert company name, drawing number, and<br>revision level.<br>_ _ _ = Standard configuration dash number,<br>1112 = 11" x 12" sheets, 11/250 = 11" x 250' rolls, or<br>00 = custom configuration<br>AC = Adhesive, one side<br>pL 00 = No adhesive<br>Standard polyimide thicknesses available: 0.001", 0.0015",<br>0.002"<br>HF300P = Hi-Flow 300P Phase Change Material<br>Note: To build a part number, visit our website at www.bergquistcompany.com.<br>Section A Section B Section C Section D Section E<br>**----- End of picture text -----**<br> We produce thousands of specials. Tooling charges vary depending on tolerances and complexity of the part. ## Hi- Flow[®] : U.S. Patent 6,197,859 and others All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT, INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer. PDS_HF_300P_12.08 ## **www.bergquistcompany.com** The Bergquist Company - The Bergquist Company - The Bergquist Company - Asia North American Headquarters European Headquarters Room 15, 8/F Wah Wai Industrial Centre 18930 West 78th Street Bramenberg 9a, 3755 BT Eemnes No. 38-40, Au Pui Wan Street Chanhassen, MN 55317 Netherlands Fotan, Shatin, N.T. Hong Kong Phone: 800-347-4572 Phone: 31-35-5380684 Ph: 852.2690.9296 Fax: 952-835-0430 Fax: 31-35-5380295 Fax: 852.2690.2344
Updated at March 15, 2026
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