FS8K

**DATA SHEET www.onsemi.com** ~~oe~~ 

## 8 A Standard Recovery Surface Mount Rectifiers FS8G - FS8M 

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Anode 1<br>3<br>Surface Mount Rectifiers<br>Cathode<br>—{- Anode 2<br>FS8G - FS8M  Rectifier<br>Description<br>3<br>The FS8G to FS8M series offers breakthrough size and<br>yy,<br>performance. It sinks 8 A DC forward current and provides up to<br>230 A surge current capability with only 0.37 A reverse leakage<br>current. All this capability is packed into a small, flat−lead, TO−277 2<br>package, optimized for space−constrained applications.  D<Y 1<br>TO−277−3LD<br>CASE 340BQ<br>Features<br>• Very High forward Surge Capability: IFSMFSM = 230 A<br>• Low Leakage Current: 0.37 A at TAA = 25°C°CC MARKING DIAGRAM<br>• Very Low Profile: Typical Height of 1.1 mm<br>• Glass Passivated Junction $Y&Z&3<br>*<br>• HBM (JEDEC A114) > 8 KV; CDM (JEDEC C101C) > 2 KV<br>• Green Molding Compound as per IEC61249 Standard | |<br>• With DAP Option Only $Y =  onsemi  Logo<br>&Z = Assembly Plant Code<br>• These Devices are Pb−Free, Halogen Free Free and are RoHS &3 = Date Code (Year & Week)<br>Compliant * = Specific Device Code<br>  FS8G, FS8J, FS8K, FS8M<br>**----- End of picture text -----**<br>


## **Description** 

## **Features** 

- Very High forward Surge Capability: IFSMFSM = 230 A 

- Low Leakage Current: 0.37 A at TAA = 25°C°CC 

- Very Low Profile: Typical Height of 1.1 mm 

- Glass Passivated Junction 

- HBM (JEDEC A114) > 8 KV; CDM (JEDEC C101C) > 2 KV 

- Green Molding Compound as per IEC61249 Standard 

- With DAP Option Only 

- These Devices are Pb−Free, Halogen Free Free and are RoHS Compliant 

## **Applications** 

- General−Purpose Applications 

- Reverse Polarity Protection 

- Rectifications 

## **ORDERING INFORMATION** 

See detailed ordering and shipping information on page 3 of this data sheet. 

Publication Order Number: **FS8M/D** 

**1** 

© Semiconductor Components Industries, LLC, 2015 **May, 2023 − Rev. 6** 

**FS8G − FS8M** 

**ABSOLUTE MAXIMUM RATINGS** (TA = 25 ° C unless otherwise noted) 

|**ABSOLUT**|**E MAXIMUM RATINGS**(TA= 25°C unless otherwis|e noted)|e noted)|e noted)|e noted)||
|---|---|---|---|---|---|---|
|**Symbol**|**Rating**|**Value**||||**Unit**|
|||**FS8G**|**FS8J**|**FS8K**|**FS8M**||
|VRRM|Maximum Repetitive Peak Reverse Voltage|400|600|800|1000|V|
|VRMS|Maximum RMS Reverse Voltage|280|420|560|700|V|
|VDC|DC Blocking Voltage|400|600|800|1000|V|
|IF(AV)|Maximum Average Rectified Forward Current|8||||A|
|IFSM|Peak Forward Surge Current: 8.3 ms Single Half<br>Sine−Wave Superimposed on Rated Load|230||||A|
|TJ|Operating Junction Temperature Range|−55 to +150||||°C|
|TSTG|Storage Temperature Range|−55 to +150||||°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

**THERMAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) (Note 1) 

|**Symbol**|**Characteristic**|**Minimum**<br>**Land Pattern**|**Maximum**<br>**Land Pattern**|**Unit**|
|---|---|---|---|---|
|R�JA|Junction−to−Ambient Thermal Resistance|100|40|°C/W|
|ΨJL|Junction−to−Lead Thermal Characteristics, Thermocouple Soldered to Anode|20|12|°C/W|
||Junction−to−Lead Thermal Characteristics, Thermocouple Soldered to Cathode|6|5||



1. The thermal resistances (R � JA & Ψ JL) are characterized with device mounted on the following FR4 printed circuit boards, as shown in Figure 1 and Figure 2. PCB size: 76.2 x 114.3 mm. Minimum land pattern size: 4.9 x 4.8 mm (big pattern, x1), 1.4 x 1.52 mm (small pattern, x2). Maximum land pattern size: 30 x 30 mm (pattern, x2). Force line trace size = 55 mils, sense line trace size = 4 mils. 

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**Figure 1. Minimum Land Pattern of 2 oz Copper** 

**Figure 2. Maximum Land Pattern of 2 oz Copper** 

**ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRI**|**CAL CHARACTERISTICS**(TA= 25|°C unless otherwise noted)|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|VF|Forward Voltage|IF= 8 A|−|0.951|1.1|V|
|||IF= 8 A, TA= 125°C||0.845|||
|IR|DC Reverse Current|VR= VDC|−|0.37|5|�A|
|||VR= VDC,TA= 125°C||84|||
|Trr|Reverse Recovery Time|IF= 0.5 A, IR= 1 A, Irr= 0.25 A||3.37||�s|
|CJ|Junction Capacitance|VR= 0 V, f = 1 MHz||118||pF|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

**www.onsemi.com** 

**2** 

**FS8G − FS8M** 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**||||
|---|---|---|---|
|**Part Number**|**Top Mark**|**Package**|**Shipping**†|
|FS8G|FS8G|TO−277 3L<br>(DAP Option)<br>(Pb−Free/Halogen Free)|5000 / Tape & Reel|
|FS8J|FS8J|TO−277 3L<br>(DAP Option)<br>(Pb−Free/Halogen Free)|5000 / Tape & Reel|
|FS8K|FS8K|TO−277 3L<br>(DAP Option)<br>(Pb−Free/Halogen Free)|5000 / Tape & Reel|
|FS8M|FS8M|TO−277 3L<br>(DAP Option)<br>(Pb−Free/Halogen Free)|5000 / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

**www.onsemi.com** 

**3** 

**FS8G − FS8M** 

## **TYPICAL PERFORMANCE CHARACTERISTICS** 

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9<br>TL (Cathode, Min. Pad)<br>8<br>7<br>6<br>5<br>4 TA (3 cm x 3 cm Pad)<br>3<br>2 TA (Min. Pad)<br>1<br>0<br>0 25 50 75 100 125 150 175<br>, Average Forward Current (A)<br>IF<br>**----- End of picture text -----**<br>


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Ambient / Lead Temperature ( � C)<br>**----- End of picture text -----**<br>


**Figure 3. Forward Current Derating Curve** 

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1000 TA = 150 ° C<br>100<br>TA = 125 ° C<br>10<br>1 T A  = 75 ° C<br>0.1 TA = 25 ° C<br>0.01<br>TA = −55 ° C<br>1E−3<br>0 100 200 300 400 500 600 700 800 900 1000<br>VR, Reverse Voltage (V)<br>Figure 5. Typical Reverse Characteristics<br>300<br>250<br>200<br>150<br>100<br>50<br>0<br>1 10 100<br>Number of Cycles<br>A)<br>�<br>, Reverse Current (<br>IR<br>Peak Forward Surge Current (A)<br>**----- End of picture text -----**<br>


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1000<br>100<br>10<br>0.1 1 10 100<br>VR, Reverse Voltage (V)<br>Figure 4. Typical Junction Capacitance<br>TA = 75 ° C<br>10<br>TA = 125 ° C<br>TA = 150 ° C<br>TA = 25 ° C<br>TA = −55 ° C<br>1<br>0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2<br>VF, Forward Voltage (V)<br>, Junction Capacitance (pF)<br>J<br>C<br>, Forward Current (A)<br>IF<br>**----- End of picture text -----**<br>


**Figure 6. Typical Forward Characteristics** 

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10000<br>1000<br>100<br>10 100 1000 10000<br>Tp, Square Waveform Pulse Duration ( � s)<br> Surge Current (A)<br>IFSM, Non−Repetitive Forward<br>**----- End of picture text -----**<br>


NOTE: Typical performance bases on a limited sample size, not guarantee rating. 

**Figure 7. Maximum Non−Repetitive Peak Forward Surge Current** 

**Figure 8. Typical Non−Repetitive Forward Surge Current** 

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**4** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

## **TO−277−3 5.91x4.44x1.10, 2.10P** 

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CASE 340BQ<br>ISSUE A<br>**----- End of picture text -----**<br>


## DATE 16 APR 2026 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

**DOCUMENT NUMBER: 98AON13861G** 

**DESCRIPTION: TO−277−3 5.91x4.44x1.10, 2.10P** 

**PAGE 1 OF 1** 

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