FS820R08A6P2BBPSA1
IGBT Module, AEC-Q101, Six Pack [Full Bridge], 450 A, 1.1 V, 714 W, 175 °C, Module
- Manufacturer: INFINEON
- Product type: IGBT Modules
- Transistor Polarity:Six N Channel; DC Collector Current:450A; Collector Emitter Saturation Voltage Vce(on):1.1V; Power Dissipation Pd:714W; Collector Emitter Voltage V(br)ceo:750
- SVHC: No SVHC (25-Jun-2025)
- Product Range: HybridPACK
- IGBT Technology: IGBT EDT2
- IGBT Termination: Press Fit
- Power Dissipation: 714W
- IGBT Configuration: Six Pack [Full Bridge]
- Transistor Mounting: Panel
- DC Collector Current: 450A
- Power Dissipation Pd: 714W
- Transistor Case Style: Module
- Operating Temperature Max: 175°C
- Junction Temperature Tj Max: 175°C
- Continuous Collector Current: 450A
- Collector Emitter Voltage Max: 750V
- Collector Emitter Voltage V(br)ceo: 750V
- Collector Emitter Saturation Voltage: 1.1V
- Collector Emitter Saturation Voltage Vce(on): 1.1V
| Delivery and price | |
|---|---|
| Units per pack | 5 |
| Price | 284.62 € |
| Current stock | 10+ |
| Lead time | 30 days |
## Product Brief ## HybridPACK™ Drive ## FS820R08A6P2B (lead type with PinFin baseplate) The HybridPACK™ Drive is a very compact power module optimized for hybrid and electric vehicle main inverter applications (xEV). The lead type FS820R08A6P2B (820 A/750 V) is a six-pack module optimized for 150 kW inverters. The power module implements the new EDT2 IGBT chip generation, which is an automotive Micro-Pattern Trench-Field-Stop cell design. The chipset has benchmark current density combined with short circuit ruggedness and increased blocking voltage for reliable inverter operation under harsh environmental conditions. The EDT2 IGBTs also show excellent light load power losses, which helps to improve significantly the system efficiency over a real driving cycle. The chipset was optimized for switching frequencies in the range of 10 kHz. The new power module family HybridPACK™ Drive comes with mechanical guiding elements supporting easy assembly processes for customers. Furthermore, the press-fit pins for the signal terminals avoids time consuming selective solder processes, which provides cost savings on system level and increases system reliability. ## Key features - ›[Benchmark current density and ] improved light load power losses for extended EV driving ranges - ›750 V EDT2 IGBT and diodes chipset for up to Tvj = 175°C switching operation - ›Extreme low conduction losses - ›Single digit stray inductance and smooth, efficient switching behavior - ›Short circuit ruggedness up to Tvj = 175°C for reliable inverter operation under extreme conditions - ›Press-fit signal pins The lead type FS820R08A6P2B has a PinFin baseplate for an optimized direct water cooling and thus highest current density. A product derivate with a flat baseplate FS660R08A6P2FB enables cost savings in case lower inverter performances are suitable. - ›Mechanical guiding elements for efficient and cost-saving inverter assembly - ›Lead type with PinFin baseplate The HybridPACK™ Drive power module comes with high clearance and creepage distances and makes this new module family also well suited for increased system working voltages. Furthermore, the flexible signal pin and power tab concept allows further product variants in the future and thus support best modular inverter approaches. - (direct fluid cooling) - ›Flat baseplate module derivate for optimized cost at lower inverter performance **==> picture [297 x 128] intentionally omitted <==** **----- Start of picture text -----**<br> P3 P2 P1 T11<br>C5 C3 C1<br>T<br>T12<br>G5 G3 G1<br>ot ot o “fh<br>T21<br>E5 E3 E1<br>3 2 1 T<br>C6 C4 C2<br>i T22<br>G6 G4 G2 T31<br>T<br>E6 E4 E2<br>ot N3 ot N2 ot N1 if T32<br>**----- End of picture text -----**<br> www.infineon.com/hybrid Product Brief ## HybridPACK™ Drive ## FS820R08A6P2B (lead type with PinFin baseplate) Type designation tree Evaluation tools for lab testing purpose **Fx xxx R xx A6 xx yyy** seeeees Le aM, Jo **yyy: package derivate** - - -: short power tabs without holes B - -: short power tabs with holes L B -: long AC power tabs with holes F B -: flat baseplate and short power tabs with holes **xx: technology** P2: 750 V automotive EDT2 IGBT/diode T4: 1200 V automotive IGBT4 / emitter controlled diode 4 **A6: HybridPACK™ Drive package xx: blocking voltage x10 (rounded)** 08: 750 V e 12: 1200 V **R: reverse conducting (antiparallel diodes) xxx: implemented DC collector current** 820: 820 Ampere (Icrm = 1640 A repetitive peak current) 660: 660 Ampere (Icrm = 1320 A repetitive peak current) **Fx: topology of the power module** FS: B6 bridge (six-pack) ry " ‘; Lead type FS820R08A6P2B (PinFin) side view Evaluation tools (Not regular products. Designed for laboratory testing only.) |**Type**|**Description**|**Ordering code**| |---|---|---| |HPDRIVE TO HP2 PCB|Adapter PCB HybridPACK™ Drive to HybridPACK™ 2 gate driver boards|SP001292068| |EVAL-6ED100HPDRIVE-AS|Gate driver evaluation board for FSxxxR08A6P2xx with EiceDriver Sense/Lite/Boost|SP001386654| |HYBRID KIT DRIVE|Inverter evaluation kit with HybridPACK™ Drive FS820R08A6P2B, EiceDriver Sense/Boost, AURIX™ µController, TDK capacitor|SP001464622| |HYBRID KIT DRIVE SENSE|Hybrid kit drive with FS820R08A6P2LB (long AC tabs) and LEM current sensor|SP001464626| ## Product summary |**Type**|**Description**|**Ordering code**|**Product status**| |---|---|---|---| |FS820R08A6P2B|(Lead type) HybridPACK™ Drive 820 A/750 V with PinFin baseplate|SP001499708|In development| |FS820R08A6P2|HybridPACK™ Drive 820 A/750 V with PinFin baseplate, power tabs without hole|SP001499702|In development| |FS660R08A6P2FB|HybridPACK™ Drive 660 A/750 V with flat baseplate (derivate for lower inverter power)|Coming soon|In development| Published by Infineon Technologies AG 85579 Neubiberg, Germany © 2016 Infineon Technologies AG. All Rights Reserved. ## **Please note!** THIS DOCUMENT IS FOR INFORMATION PURPOSES ONLY AND ANY INFORMATION GIVEN HEREIN SHALL IN NO EVENT BE REGARDED AS A WARRANTY, GUARANTEE OR DESCRIPTION OF ANY FUNCTIONALITY, CONDITIONS AND/OR QUALITY OF OUR PRODUCTS OR ANY SUITABILITY FOR A PARTICULAR PURPOSE. WITH REGARD TO THE TECHNICAL SPECIFICATIONS OF OUR PRODUCTS, WE KINDLY ASK YOU TO REFER TO THE RELEVANT PRODUCT DATA SHEETS PROVIDED BY US. OUR CUSTOMERS AND THEIR TECHNICAL DEPARTMENTS ARE REQUIRED TO EVALUATE THE SUITABILITY OF OUR PRODUCTS FOR THE INTENDED APPLICATION. WE RESERVE THE RIGHT TO CHANGE THIS DOCUMENT AND/OR THE INFORMATION GIVEN HEREIN AT ANY TIME. ## **Additional information** For further information on technologies, our products, the application of our products, delivery terms and conditions and/or prices, please contact your nearest Infineon Technologies office (www.infineon.com). **Warnings** Due to technical requirements, our products may contain dangerous substances. For information on the types in question, please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by us in a written document signed by authorized representatives of Infineon Technologies, our products may not be used in any lifeendangering applications, including but not limited to medical, nuclear, military, life-critical or any other applications where a failure of the product or any consequences of the use thereof can result in personal injury. Order Number: B136-I0279-V1-7600-EU-EC-P Date: 04 / 2016
Updated at April 28, 2026
Infineon Technologies is a globally recognized leader in semiconductor solutions, renowned for driving innovation in power management, energy efficiency, and modern mobility. With a strong legacy of engineering excellence, the company provides highly reliable components designed to meet the rigorous demands of industrial, automotive, and advanced commercial applications. The core of our Infineon portfolio is centered on their industry-leading discrete semiconductors. We offer an extensive selection of single and dual MOSFETs, alongside a robust range of single IGBTs and advanced IGBT modules. These flagship power transistors are essential for high-efficiency power conversion and motor control, providing engineers with superior thermal performance and minimized switching losses. Beyond advanced field-effect transistors, the selection includes a comprehensive array of diodes and rectifiers, heavily featuring Schottky diodes, as well as fast-recovery and RF/PIN diodes. This power foundation is further supported by bipolar transistors, intelligent power modules, and thyristor SCR modules, delivering the critical building blocks required for complex power system designs. To support broader system integration, the portfolio also encompasses specialized solutions such as solid-state relays, AC/DC LED driver ICs, and Bluetooth communications modules. From high-power industrial rectifiers to wireless connectivity adapters, Infineon equips designers with the precision components needed to build efficient, scalable, and fully connected electronic systems.
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