FS50R07W1E3B11ABOMA1
IGBT Module, Six Pack [Full Bridge], 70 A, 1.45 V, 205 W, 150 °C, Module
- Manufacturer: INFINEON
- Product type: IGBT Modules
- SVHC: No SVHC (25-Jun-2025)
- Product Range: EasyPACK
- IGBT Technology: IGBT 3 [Trench/Field Stop]
- IGBT Termination: Press Fit
- Power Dissipation: 205W
- IGBT Configuration: Six Pack [Full Bridge]
- Transistor Mounting: Panel
- DC Collector Current: 70A
- Power Dissipation Pd: 205W
- Transistor Case Style: Module
- Operating Temperature Max: 150°C
- Junction Temperature Tj Max: 150°C
- Continuous Collector Current: 70A
- Collector Emitter Voltage Max: 650V
- Collector Emitter Voltage V(br)ceo: 650V
- Collector Emitter Saturation Voltage: 1.45V
- Collector Emitter Saturation Voltage Vce(on): 1.45V
| Delivery and price | |
|---|---|
| Units per pack | 100 |
| Price | 33.83 € |
| Current stock | 10+ |
| Lead time | 30 days |
Technische Information / technical information IGBT-Module IGBT-modules FS50R07W1E3_B11A EasyPACK Modul mit Trench/Feldstopp IGBT3 und Emitter Controlled 3 Diode und PressFIT / NTC EasyPACK module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode and PressFIT / NTC **==> picture [6 x 6] intentionally omitted <==** **----- Start of picture text -----**<br> ϑ<br>**----- End of picture text -----**<br> ## **V†Š» = 650V** **I† ÒÓÑ = 50A / I†ç¢ = 100A** ## **Typische Anwendungen** - Hybrid-Elektrofahrzeuge (H)EV - Klimaanlagen - Motorantriebe ## **Typical Applications** - Hybrid Electrical Vehicles (H)EV - Air Conditioning - Motor Drives ## **Elektrische Eigenschaften** - Erhöhte Sperrspannungsfestigkeit auf 650V - Niedrige Schaltverluste - Niedriges V†ŠÙÈÚ - Trench IGBT 3 ## **Electrical Features** - Increased blocking voltage capability to 650V - Low Switching Losses - Low V†ŠÙÈÚ - • Trench IGBT 3 ## **Mechanische Eigenschaften** - AlèOé Substrat mit kleinem thermischen Widerstand - Hohe Leistungsdichte - Integrierter NTC Temperatur Sensor - Kompaktes Design - PressFIT Verbindungstechnik - RoHS konform - Robuste Montage durch integrierte Befestigungsklammern ## **Mechanical Features** • AlèOé Substrate with Low Thermal Resistance - High Power Density - Integrated NTC temperature sensor - Compact design - PressFIT Contact Technology - RoHS compliant - Rugged mounting due to integrated mounting clamps ## **Module Label Code** **Barcode Code 128 Content of the Code Digit** Module Serial Number 1 - 5 Module Material Number 6 - 11 SL Production Order Number 12 - 19 **DMX - Code** Datecode (Production Year) 20 - 21 Datecode (Production Week) 22 - 23 prepared by: SS date of publication: 2012-01-12 material no: 35374 ~~ee~~ approved by: TR revision: 3.0 1 Technische Information / technical information IGBT-Module IGBT-modules FS50R07W1E3_B11A ## IGBT-Wechselrichter / IGBT-inverter ## Höchstzulässige Werte / Maximum Rated Values |Technische Information / technical information<br>FS50R07W1E3_B11A<br>IGBT-Module<br>IGBT-modules|| |---|---| |prepared by: SS<br>approved by: TR<br>date ofpublication: 2012-01-12<br>revision: 3.0<br>IGBT-Wechselrichter / IGBT-inverter<br>Höchstzulässige Werte / Maximum Rated Values<br>Kollektor-Emitter-Sperrspannung<br>Collector-emitter voltage<br>TÝÎ = 25°C<br>V†Š»<br>650<br>V<br>Kollektor-Dauergleichstrom<br>Continuous DC collector current<br>T† = 90°C, TÝÎ = 175°C<br>T† = 25°C, TÝÎ = 175°C<br>I† ÒÓÑ<br>I†<br>50<br>70<br>A<br>A<br>Periodischer Kollektor-Spitzenstrom<br>Repetitive peak collector current<br>t« = 1 ms<br>I†ç¢<br>100<br>A<br>Gesamt-Verlustleistung<br>Total power dissipation<br>T† = 25°C, TÝÎ = 175°C<br>PÚÓÚ<br>205<br>W<br>Gate-Emitter-Spitzenspannung<br>Gate-emitter peak voltage<br>V•Š»<br>+/-20<br>V<br>Charakteristische Werte / Characteristic Values<br>min.<br>typ.<br>max.<br>Kollektor-Emitter-Sättigungsspannung<br>Collector-emitter saturation voltage<br>I† = 50 A, V•Š = 15 V<br>I† = 50 A, V•Š = 15 V<br>I† = 50 A, V•Š = 15 V<br>V†Š ÙÈÚ<br>1,45<br>1,60<br>1,70<br>1,90<br>V<br>V<br>V<br>TÝÎ = 25°C<br>TÝÎ = 125°C<br>TÝÎ = 150°C<br>Gate-Schwellenspannung<br>Gate threshold voltage<br>I† = 0,80 mA, V†Š = V•Š, TÝÎ = 25°C<br>V•ŠÚÌ<br>4,9<br>5,8<br>6,5<br>V<br>Gateladung<br>Gate charge<br>V•Š = -15 V ... +15 V<br>Q•<br>0,50<br>µC<br>Interner Gatewiderstand<br>Internal gate resistor<br>TÝÎ = 25°C<br>R•ÍÒÚ<br>0,0<br>Â<br>Eingangskapazität<br>Input capacitance<br>f = 1 MHz, TÝÎ = 25°C, V†Š = 25 V, V•Š = 0 V<br>CÍþÙ<br>3,10<br>nF<br>Rückwirkungskapazität<br>Reverse transfer capacitance<br>f = 1 MHz, TÝÎ = 25°C, V†Š = 25 V, V•Š = 0 V<br>CØþÙ<br>0,095<br>nF<br>Kollektor-Emitter-Reststrom<br>Collector-emitter cut-off current<br>V†Š = 650 V, V•Š = 0 V, TÝÎ = 25°C<br>I†Š»<br>0,05<br>mA<br>Gate-Emitter-Reststrom<br>Gate-emitter leakage current<br>V†Š = 0 V, V•Š = 20 V, TÝÎ = 25°C<br>I•Š»<br>400<br>nA<br>Einschaltverzögerungszeit, induktive Last<br>Turn-on delay time, inductive load<br>I† = 50 A, V†Š = 300 V<br>V•Š = ±15 V<br>R•ÓÒ = 6,8 Â<br>tÁ ÓÒ<br>0,023<br>0,023<br>0,023<br>µs<br>µs<br>µs<br>TÝÎ = 25°C<br>TÝÎ = 125°C<br>TÝÎ = 150°C<br>Anstiegszeit, induktive Last<br>Rise time, inductive load<br>I† = 50 A, V†Š = 300 V<br>V•Š = ±15 V<br>R•ÓÒ = 6,8 Â<br>tØ<br>0,019<br>0,022<br>0,022<br>µs<br>µs<br>µs<br>TÝÎ = 25°C<br>TÝÎ = 125°C<br>TÝÎ = 150°C<br>Abschaltverzögerungszeit, induktive Last<br>Turn-off delay time, inductive load<br>I† = 50 A, V†Š = 300 V<br>V•Š = ±15 V<br>R•ÓËË = 6,8 Â<br>tÁ ÓËË<br>0,17<br>0,19<br>0,20<br>µs<br>µs<br>µs<br>TÝÎ = 25°C<br>TÝÎ = 125°C<br>TÝÎ = 150°C<br>Fallzeit, induktive Last<br>Fall time, inductive load<br>I† = 50 A, V†Š = 300 V<br>V•Š = ±15 V<br>R•ÓËË = 6,8 Â<br>tË<br>0,03<br>0,04<br>0,05<br>µs<br>µs<br>µs<br>TÝÎ = 25°C<br>TÝÎ = 125°C<br>TÝÎ = 150°C<br>Einschaltverlustenergie pro Puls<br>Turn-on energy loss per pulse<br>I† = 50 A, V†Š = 300 V, L» = 50 nH<br>V•Š = ±15 V, di/dt = 2200 A/µs (TÝÎ=150°C)<br>R•ÓÒ = 6,8 Â<br>EÓÒ<br>0,40<br>0,57<br>0,64<br>mJ<br>mJ<br>mJ<br>TÝÎ = 25°C<br>TÝÎ = 125°C<br>TÝÎ = 150°C<br>Abschaltverlustenergie pro Puls<br>Turn-off energy loss per pulse<br>I† = 50 A, V†Š = 300 V, L» = 50 nH<br>V•Š = ±15 V, du/dt = 4000 V/µs (TÝÎ=150°C)<br>R•ÓËË = 6,8 Â<br>EÓËË<br>1,20<br>1,60<br>1,70<br>mJ<br>mJ<br>mJ<br>TÝÎ = 25°C<br>TÝÎ = 125°C<br>TÝÎ = 150°C<br>Kurzschlußverhalten<br>SC data<br>V•Š ù 15 V, V†† = 360 V<br>V†ŠÑÈà = V†Š» -LÙ†Š ·di/dt<br>I»†<br>350<br>250<br>A<br>A<br>TÝÎ = 25°C<br>TÝÎ = 150°C<br>t« ù 8 µs,<br>t« ù 6 µs,<br>Wärmewiderstand, Chip bis Gehäuse<br>Thermal resistance, junction to case<br>pro IGBT / per IGBT<br>RÚÌœ†<br>0,65<br>0,73<br>K/W<br>Wärmewiderstand, Gehäuse bis Kühlkörper<br>Thermal resistance, case to heatsink<br>pro IGBT / per IGBT<br>ð«ÈÙÚþ = 1 W/(m·K) / ðÃØþÈÙþ = 1 W/(m·K)<br>RÚ̆™<br>0,80<br>K/W|| prepared by: SS date of publication: 2012-01-12 approved by: TR revision: 3.0 2 Technische Information / technical information IGBT-Module IGBT-modules FS50R07W1E3_B11A ## Diode-Wechselrichter / Diode-inverter ## Höchstzulässige Werte / Maximum Rated Values |Periodische Spitzensperrspannung<br>Repetitive peak reverse voltage|TÝÎ = 25°C|Vçç¢||650||V| |---|---|---|---|---|---|---| |Dauergleichstrom<br>Continuous DC forward current||IŒ||50||A| |Periodischer Spitzenstrom<br>Repetitive peak forward current|t« = 1 ms|IŒç¢||100||A| |Grenzlastintegral<br>I²t - value|Vç = 0 V, t« = 10 ms, TÝÎ = 125°C<br>Vç = 0 V, t« = 10 ms, TÝÎ = 150°C|I²t||370<br>330||A²s<br>A²s| |Charakteristische Werte / Characteristic Values|||min.|typ.|max.|| |Durchlassspannung<br>Forward voltage|IŒ = 50 A, V•Š = 0 V<br>IŒ = 50 A, V•Š = 0 V<br>IŒ = 50 A, V•Š = 0 V<br>TÝÎ = 25°C<br>TÝÎ = 125°C<br>TÝÎ = 150°C|VŒ||1,55<br>1,50<br>1,45|2,00|V<br>V<br>V| |Rückstromspitze<br>Peak reverse recovery current|IŒ = 50 A, - diŒ/dt = 2200 A/µs (TÝÎ=150°C)<br>Vç = 300 V<br>V•Š = -15 V<br>TÝÎ = 25°C<br>TÝÎ = 125°C<br>TÝÎ = 150°C|Iç¢||50,0<br>60,0<br>65,0||A<br>A<br>A| |Sperrverzögerungsladung<br>Recovered charge|IŒ = 50 A, - diŒ/dt = 2200 A/µs (TÝÎ=150°C)<br>Vç = 300 V<br>V•Š = -15 V<br>TÝÎ = 25°C<br>TÝÎ = 125°C<br>TÝÎ = 150°C|QØ||2,00<br>3,90<br>4,40||µC<br>µC<br>µC| |Abschaltenergie pro Puls<br>Reverse recovery energy|IŒ = 50 A, - diŒ/dt = 2200 A/µs (TÝÎ=150°C)<br>Vç = 300 V<br>V•Š = -15 V<br>TÝÎ = 25°C<br>TÝÎ = 125°C<br>TÝÎ = 150°C|EØþÊ||0,50<br>1,00<br>1,15||mJ<br>mJ<br>mJ| |Wärmewiderstand, Chip bis Gehäuse<br>Thermal resistance, junction to case|pro Diode / per diode|RÚÌœ†||1,00|1,10|K/W| |Wärmewiderstand, Gehäuse bis Kühlkörper<br>Thermal resistance, case to heatsink|pro Diode / per diode<br>ð«ÈÙÚþ = 1 W/(m·K) / ðÃØþÈÙþ = 1 W/(m·K)|RÚ̆™||0,85||K/W| ## NTC-Widerstand / NTC-thermistor ## Charakteristische Werte / Characteristic Values |Charakteristische Werte / Charac|teristic Values||min.|typ.|max.|| |---|---|---|---|---|---|---| |Nennwiderstand<br>Rated resistance|T† = 25°C|Rèë||5,00||kÂ| |Abweichung von R100<br>Deviation of R100|T† = 100°C, Ræåå = 493 Â|ÆR/R|-5||5|%| |Verlustleistung<br>Power dissipation|T† = 25°C|Pèë|||20,0|mW| |B-Wert<br>B-value|Rè = Rèë exp [Bèëõëå(1/Tè - 1/(298,15 K))]|Bèëõëå||3375||K| |B-Wert<br>B-value|Rè = Rèë exp [Bèëõîå(1/Tè - 1/(298,15 K))]|Bèëõîå||3411||K| |B-Wert<br>B-value|Rè = Rèë exp [Bèëõæåå(1/Tè - 1/(298,15 K))]|Bèëõæåå||3433||K| Angaben gemäß gültiger Application Note. Specification according to the valid application note. prepared by: SS date of publication: 2012-01-12 approved by: TR revision: 3.0 3 ## Technische Information / technical information ## IGBT-Module IGBT-modules FS50R07W1E3_B11A ## Modul / Module |Modul / Module||||||| |---|---|---|---|---|---|---| |Isolations-Prüfspannung<br>Isolation test voltage|RMS, f = 50 Hz, t = 1 min.|V𻥡|2,5|||kV| |Innere Isolation<br>Internal isolation|||impr.AlèOé|||| |Kriechstrecke<br>Creepage distance|Kontakt - Kühlkörper / terminal to heatsink<br>Kontakt - Kontakt / terminal to terminal|||11,5<br>6,3||mm| |Luftstrecke<br>Clearance|Kontakt - Kühlkörper / terminal to heatsink<br>Kontakt - Kontakt / terminal to terminal|||10,0<br>5,0||mm| |Vergleichszahl der Kriechwegbildung<br>Comperative tracking index||CTI||> 200||| ||||min.|typ.|max.|| |Modulstreuinduktivität<br>Stray inductance module||LÙ†Š||25||nH| |Modulleitungswiderstand, Anschlüsse - Chip<br>Module lead resistance, terminals - chip|T† = 25°C, pro Schalter / per switch|R††óôŠŠó||3,50||mÂ| |Höchstzulässige Sperrschichttemperatur<br>Maximum junction temperature|Wechselrichter, Brems-Chopper / Inverter, Brake-Chopper|TÝÎ ÑÈà|||175|°C| |Temperatur im Schaltbetrieb<br>Temperature under switching conditions|Wechselrichter, Brems-Chopper / Inverter, Brake-Chopper|TÝÎ ÓÔ|-40||150|°C| |Lagertemperatur<br>Storage temperature||TÙÚÃ|-40||125|°C| |Anpresskraft für mech. Bef. pro Feder<br>mountig force per clamp||F|20|-|50|N| |Gewicht<br>Weight||G||24||g| prepared by: SS approved by: TR date of publication: 2012-01-12 revision: 3.0 4 ## Technische Information / technical information IGBT-Module IGBT-modules FS50R07W1E3_B11A **==> picture [485 x 294] intentionally omitted <==** **----- Start of picture text -----**<br> Ausgangskennlinie IGBT-Wechselr. (typisch) Ausgangskennlinienfeld IGBT-Wechselr. (typisch)<br>output characteristic IGBT-inverter (typical) output characteristic IGBT-inverter (typical)<br>I† = f (V†Š) I† = f (V†Š)<br>V•Š = 15 V TÝÎ = 150°C<br>100 100<br>TÝÎ = 25°C V•Š = 19 V<br>90 TÝÎ = 125 ° C 90 V•Š = 17 V<br>TÝÎ = 150°C V•Š = 15 V<br>V•Š = 13 V<br>80 80 V•Š = 11 V<br>V•Š = 9 V<br>70 70<br>60 60<br>50 50<br>40 40<br>30 30<br>20 20<br>10 10<br>0 0<br>0,0 0,5 1,0 1,5 2,0 2,5 3,0 0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5 4,0 4,5 5,0<br>V†Š [V] V†Š [V]<br>I† [A] I† [A]<br>**----- End of picture text -----**<br> **Übertragungscharakteristik IGBT-Wechselr. (typisch) transfer characteristic IGBT-inverter (typical) I† = f (V•Š) V†Š = 20 V** **Schaltverluste IGBT-Wechselr. (typisch) switching losses IGBT-inverter (typical) EÓÒ = f (I†), EÓËË = f (I†) V•Š = ±15 V, R•ÓÒ = 6.8 Â, R•ÓËË = 6.8 Â, V†Š = 300 V** **==> picture [487 x 286] intentionally omitted <==** **----- Start of picture text -----**<br> 100 3,5<br>TÝÎ = 25°C EÓÒ, TÝÎ = 125°C<br>90 TÝÎ = 125 TÝÎ = 150°C° C 3,0 EÓËË, TÝÎ = 125°C EÓÒ, TÝÎ = 150 ° C<br>EÓËË, TÝÎ = 150°C<br>80<br>70 2,5<br>60<br>2,0<br>50<br>1,5<br>40<br>30 1,0<br>20<br>0,5<br>10<br>0 0,0<br>5 6 7 8 9 10 11 12 0 10 20 30 40 50 60 70 80 90 100<br>V•Š [V] I† [A]<br>prepared by: SS date of publication: 2012-01-12<br>approved by: TR revision: 3.0<br>I† [A] E [mJ]<br>**----- End of picture text -----**<br> 5 ## Technische Information / technical information IGBT-Module IGBT-modules FS50R07W1E3_B11A **Schaltverluste IGBT-Wechselr. (typisch) switching losses IGBT-Inverter (typical) EÓÒ = f (R•), EÓËË = f (R•) V•Š = ±15 V, I† = 50 A, V†Š = 300 V** **Transienter Wärmewiderstand IGBT-Wechselr. transient thermal impedance IGBT-inverter ZÚÌœ™ = f (t)** **==> picture [483 x 238] intentionally omitted <==** **----- Start of picture text -----**<br> 6,0 10<br>EÓÒ, TÝÎ = 125°C ZÚÌœ™ : IGBT<br>EÓËË, TÝÎ = 125°C<br>EÓÒ, TÝÎ = 150°C<br>5,0 EÓËË, TÝÎ = 150°C<br>4,0<br>3,0 1<br>2,0<br>1,0 i: 1 2 3 4<br>rÍ[K/W]: 0,083 0,193 0,586 0,588<br>τ Í[s]: 0,0005 0,005 0,05 0,2<br>0,0 0,1<br>0 10 20 30 40 50 60 70 0,001 0,01 0,1 1 10<br>R• [Â] t [s]<br>E [mJ]<br>ZÚÌœ™ [K/W]<br>**----- End of picture text -----**<br> **Sicherer Rückwärts-Arbeitsbereich IGBT-Wr. (RBSOA) reverse bias safe operating area IGBT-inv. (RBSOA) I† = f (V†Š) V•Š = ±15 V, R•ÓËË = 6.8 Â, TÝÎ = 150°C** **Durchlasskennlinie der Diode-Wechselr. (typisch) forward characteristic of diode-inverter (typical) IŒ = f (VŒ)** **==> picture [486 x 286] intentionally omitted <==** **----- Start of picture text -----**<br> 110 100<br>I†, Modul TÝÎ = 25°C<br>100 I†, Chip 90 TÝÎ = 125 ° C<br>TÝÎ = 150°C<br>90<br>80<br>80<br>70<br>70<br>60<br>60<br>50<br>50<br>40<br>40<br>30<br>30<br>20<br>20<br>10 10<br>0 0<br>0 100 200 300 400 500 600 700 0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0<br>V†Š [V] VŒ [V]<br>prepared by: SS date of publication: 2012-01-12<br>approved by: TR revision: 3.0<br>I† [A] IŒ [A]<br>**----- End of picture text -----**<br> 6 ## Technische Information / technical information ## IGBT-Module IGBT-modules FS50R07W1E3_B11A **Schaltverluste Diode-Wechselr. (typisch) switching losses diode-inverter (typical) EØþÊ = f (IŒ) R•ÓÒ = 6.8 Â, V†Š = 300 V** **Schaltverluste Diode-Wechselr. (typisch) switching losses diode-inverter (typical) EØþÊ = f (R•) IŒ = 50 A, V†Š = 300 V** **==> picture [483 x 238] intentionally omitted <==** **----- Start of picture text -----**<br> 1,8 1,4<br>EØþÊ, TÝÎ = 125°C EØþÊ, TÝÎ = 125°C<br>EØþÊ, TÝÎ = 150°C EØþÊ, TÝÎ = 150°C<br>1,6<br>1,2<br>1,4<br>1,0<br>1,2<br>0,8<br>1,0<br>0,8<br>0,6<br>0,6<br>0,4<br>0,4<br>0,2<br>0,2<br>0,0 0,0<br>0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70<br>IŒ [A] R• [Â]<br>E [mJ] E [mJ]<br>**----- End of picture text -----**<br> **Transienter Wärmewiderstand Diode-Wechselr. transient thermal impedance diode-inverter ZÚÌœ™ = f (t)** **NTC-Temperaturkennlinie (typisch) NTC-temperature characteristic (typical) R = f (T)** **==> picture [487 x 286] intentionally omitted <==** **----- Start of picture text -----**<br> 10 100000<br>ZÚÌœ™ : Diode RÚáÔ<br>10000<br>1<br>1000<br>i: 1 2 3 4<br>rÍ[K/W]: 0,157 0,337 0,758 0,598<br>τ Í[s]: 0,0005 0,005 0,05 0,2<br>0,1 100<br>0,001 0,01 0,1 1 10 0 20 40 60 80 100 120 140 160<br>t [s] T† [°C]<br>prepared by: SS date of publication: 2012-01-12<br>approved by: TR revision: 3.0<br>R[Â]<br>ZÚÌœ™ [K/W]<br>**----- End of picture text -----**<br> 7 ## Technische Information / technical information IGBT-Module IGBT-modules FS50R07W1E3_B11A ## Schaltplan / circuit diagram **==> picture [246 x 150] intentionally omitted <==** **----- Start of picture text -----**<br> ϑ<br>**----- End of picture text -----**<br> ## Gehäuseabmessungen / package outlines **==> picture [86 x 123] intentionally omitted <==** **==> picture [178 x 82] intentionally omitted <==** prepared by: SS approved by: TR date of publication: 2012-01-12 revision: 3.0 8 ## Technische Information / technical information IGBT-Module IGBT-modules FS50R07W1E3_B11A ## Nutzungsbedingungen Die in diesem Produktdatenblatt enthaltenen Daten sind ausschließlich für technisch geschultes Fachpersonal bestimmt. Die Beurteilung der Eignung dieses Produktes für Ihre Anwendung sowie die Beurteilung der Vollständigkeit der bereitgestellten Produktdaten für diese Anwendung obliegt Ihnen bzw. Ihren technischen Abteilungen. In diesem Produktdatenblatt werden diejenigen Merkmale beschrieben, für die wir eine liefervertragliche Gewährleistung übernehmen. Eine solche Gewährleistung richtet sich ausschließlich nach Maßgabe der im jeweiligen Liefervertrag enthaltenen Bestimmungen. Garantien jeglicher Art werden für das Produkt und dessen Eigenschaften keinesfalls übernommen. Sollten Sie von uns Produktinformationen benötigen, die über den Inhalt dieses Produktdatenblatts hinausgehen und insbesondere eine spezifische Verwendung und den Einsatz dieses Produktes betreffen, setzen Sie sich bitte mit dem für Sie zuständigen Vertriebsbüro in Verbindung (siehe www.infineon.com, Vertrieb&Kontakt). Für Interessenten halten wir Application Notes bereit. Aufgrund der technischen Anforderungen könnte unser Produkt gesundheitsgefährdende Substanzen enthalten. Bei Rückfragen zu den in diesem Produkt jeweils enthaltenen Substanzen setzen Sie sich bitte ebenfalls mit dem für Sie zuständigen Vertriebsbüro in Verbindung. Sollten Sie beabsichtigen, das Produkt in Anwendungen der Luftfahrt, in gesundheits- oder lebensgefährdenden oder lebenserhaltenden Anwendungsbereichen einzusetzen, bitten wir um Mitteilung. Wir weisen darauf hin, dass wir für diese Fälle - die gemeinsame Durchführung eines Risiko- und Qualitätsassessments; - den Abschluss von speziellen Qualitätssicherungsvereinbarungen; - die gemeinsame Einführung von Maßnahmen zu einer laufenden Produktbeobachtung dringend empfehlen und gegebenenfalls die Belieferung von der Umsetzung solcher Maßnahmen abhängig machen. Soweit erforderlich, bitten wir Sie, entsprechende Hinweise an Ihre Kunden zu geben. Inhaltliche Änderungen dieses Produktdatenblatts bleiben vorbehalten. ## Terms & Conditions of usage The data contained in this product data sheet is exclusively intended for technically trained staff. You and your technical departments will have to evaluate the suitability of the product for the intended application and the completeness of the product data with respect to such application. This product data sheet is describing the characteristics of this product for which a warranty is granted. Any such warranty is granted exclusively pursuant the terms and conditions of the supply agreement. There will be no guarantee of any kind for the product and its characteristics. Should you require product information in excess of the data given in this product data sheet or which concerns the specific application of our product, please contact the sales office, which is responsible for you (see www.infineon.com, sales&contact). For those that are specifically interested we may provide application notes. Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact the sales office, which is responsible for you. Should you intend to use the Product in aviation applications, in health or live endangering or life support applications, please notify. Please note, that for any such applications we urgently recommend - to perform joint Risk and Quality Assessments; - the conclusion of Quality Agreements; - to establish joint measures of an ongoing product survey, and that we may make delivery depended on the realization of any such measures. If and to the extent necessary, please forward equivalent notices to your customers. Changes of this product data sheet are reserved. |prepared by: SS|date ofpublication: 2012-01-12| |---|---| |approved by: TR|revision: 3.0| 9
Updated at April 28, 2026
Infineon Technologies is a globally recognized leader in semiconductor solutions, renowned for driving innovation in power management, energy efficiency, and modern mobility. With a strong legacy of engineering excellence, the company provides highly reliable components designed to meet the rigorous demands of industrial, automotive, and advanced commercial applications. The core of our Infineon portfolio is centered on their industry-leading discrete semiconductors. We offer an extensive selection of single and dual MOSFETs, alongside a robust range of single IGBTs and advanced IGBT modules. These flagship power transistors are essential for high-efficiency power conversion and motor control, providing engineers with superior thermal performance and minimized switching losses. Beyond advanced field-effect transistors, the selection includes a comprehensive array of diodes and rectifiers, heavily featuring Schottky diodes, as well as fast-recovery and RF/PIN diodes. This power foundation is further supported by bipolar transistors, intelligent power modules, and thyristor SCR modules, delivering the critical building blocks required for complex power system designs. To support broader system integration, the portfolio also encompasses specialized solutions such as solid-state relays, AC/DC LED driver ICs, and Bluetooth communications modules. From high-power industrial rectifiers to wireless connectivity adapters, Infineon equips designers with the precision components needed to build efficient, scalable, and fully connected electronic systems.
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