FS3L40R12W2H7PB11BPSA1
IGBT Module, 25 A, 1.7 V, 20 mW, 175 °C, Module
- Manufacturer: INFINEON
- Product type: IGBT Modules
- SVHC: No SVHC (25-Jun-2025)
- Product Range: EasyPACK 2B Series
- IGBT Technology: -
- IGBT Termination: Press Fit
- Power Dissipation: 20mW
- IGBT Configuration: -
- Transistor Mounting: Panel
- Transistor Case Style: Module
- Operating Temperature Max: 175°C
- Continuous Collector Current: 25A
- Collector Emitter Voltage Max: 1.2kV
- Collector Emitter Saturation Voltage: 1.7V
| Delivery and price | |
|---|---|
| Units per pack | 50 |
| Price | 51.81 € |
| Current stock | 10+ |
| Lead time | 30 days |
**FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** _— ## **Final datasheet EasyPACK[™] 2B module and PressFIT / pre-applied thermal interface material / NTC** ## **Features** - Electrical features - VCES = 1200 V - IC nom = 40 A / ICRM = 80 A - Ultra fast IGBT chips - Overload operation up to 175°C - Low switching losses - Low V CE,sat - Suitable Infineon gate drivers can be found under https://www.infineon.com/gdfinder - Mechanical features - 3 kV AC 1 minute insulation - Al2O3 substrate with low thermal resistance - Compact design - PressFIT contact technology - Rugged mounting due to integrated mounting clamps - Pre-applied thermal interface material ## ~~**P**~~ **otential applications** - Three-level applications - Solar applications ## **Product validation** - Qualified for industrial applications according to the relevant tests of IEC 60747, 60749 and 60068 ## **Description** **==> picture [6 x 6] intentionally omitted <==** **----- Start of picture text -----**<br> J<br>**----- End of picture text -----**<br> Please read the sections "Important notice" and "Warnings" at the end of this document Datasheet www.infineon.com Revision 1.00 2023-12-12 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **Table of contents** **==> picture [105 x 47] intentionally omitted <==** ## **Table of contents** ||**Description**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1| |---|---| ||**Features**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1| ||**Potential applications**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1| ||**Product validation**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1| ||**Table of contents**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2| |**1**|**Package**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3| |**2**|**IGBT, T1-T2 / T5-T6 / T9-T10**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3| |**3**|**Diode, D1-D2 / D5-D6 / D9-D10**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5| |**4**|**IGBT, T3-T4 / T7-T8 / T11-T12**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6| |**5**|**Diode, D3-D4 / D7-D8 / D11-D12**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7| |**6**|**NTC-Thermistor**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8| |**7**|**Characteristics diagrams**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9| |**8**|**Circuit diagram**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17| |**9**|**Package outlines**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18| |**10**|**Module label code**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19| ||**Revision history**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20| ||**Disclaimer**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21| Datasheet Revision 1.00 2023-12-12 2 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **==> picture [105 x 47] intentionally omitted <==** ## **1 Package** ## **1 Package** |**1**<br>**Package**|**1**<br>**Package**|**1**<br>**Package**|**1**<br>**Package**|**1**<br>**Package**||| |---|---|---|---|---|---|---| |**Table 1**<br>**Insulation coordination**||||||| |**Parameter**|**Symbol**|**Note or test condition**|||**Values**|**Unit**| |Isolation test voltage|_V_ISOL|RMS, f = 50 Hz,_t_= 1 min|||3.0|kV| |Isolation test voltage NTC|_V_ISOL(NTC)|RMS, f = 50 Hz,_t_= 1 min|||3.0|kV| |Internal isolation||basic insulation (class 1, IEC 61140)|||Al2O3|| |Comparative tracking<br>index|_CTI_||||> 225|| |Relative thermal index<br>(electrical)|_RTI_|housing|||140|°C| **Table 2 Characteristic values** |**Parameter**|**Symbol**|**Note or test condition**|||**Values**||**Unit**| |---|---|---|---|---|---|---|---| |||||**Min.**|**Typ.**|**Max.**|| |Stray inductance module|_L_sCE||||30||nH| |Module lead resistance,<br>terminals - chip|_R_CC'+EE'|TH= 25 °C, per switch|||7||mΩ| |Storage temperature|_T_stg|||-40||125|°C| |Maximum baseplate<br>operation temperature|_T_BPmax|||||125|°C| |Mounting force per clamp|_F_|||40||80|N| |Weight|_G_||||39||g| _**Note** : Storage and shipment of modules with TIM => see AN2012-07_ _The current under continuous operation is limited to 25 A rms per connector pin._ ## **2 IGBT, T1-T2 / T5-T6 / T9-T10** ## **Table 3 Maximum rated values** |**Parameter**|**Symbol**|**Note or test condition**|**Note or test condition**|**Values**|**Unit**| |---|---|---|---|---|---| |Collector-emitter voltage|_V_CES||_T_vj= 25 °C|1200|V| |Implemented collector<br>current|_I_CN|||40|A| |Continuous DC collector<br>current|_I_CDC|_T_vj max= 175 °C|_T_H= 65 °C|25|A| |Repetitive peak collector<br>current|_I_CRM|tplimited by Tvj op||80|A| |Gate-emitter peak voltage|_V_GES|||±20|V| Datasheet Revision 1.00 2023-12-12 3 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **==> picture [105 x 47] intentionally omitted <==** ## **2 IGBT, T1-T2 / T5-T6 / T9-T10** |**Table 4**<br>**Characteristic values**|**Table 4**<br>**Characteristic values**|**Table 4**<br>**Characteristic values**|||||| |---|---|---|---|---|---|---|---| |**Parameter**|**Symbol**|**Note or test condition**|||**Values**||**Unit**| |||||**Min.**|**Typ.**|**Max.**|| |Collector-emitter<br>saturation voltage|_V_CE sat|_I_C= 40 A,_V_GE= 15 V|_T_vj= 25 °C||1.70|2.25|V| ||||_T_vj= 125 °C||1.90||| ||||_T_vj= 175 °C||2.00||| |Gate threshold voltage|_V_GEth|_I_C= 8.16 mA, VCE= VGE,_T_vj= 25 °C||4.85|5.5|6.15|V| |Gate charge|_Q_G|_V_GE= ±15 V,_V_CC= 600 V|||0.59||µC| |Input capacitance|_C_ies|_f_= 100 kHz,_T_vj= 25 °C,_V_CE= 25 V,_V_GE= 0 V|||4.54||nF| |Reverse transfer<br>capacitance|_C_res|_f_= 100 kHz,_T_vj= 25 °C,_V_CE= 25 V,_V_GE= 0 V|||0.086||nF| |Collector-emitter cut-of<br>current|_I_CES|_V_CE= 1200 V,_V_GE= 0 V|_T_vj= 25 °C|||3.5|µA| |Gate-emitter leakage<br>current|_I_GES|_V_CE= 0 V,_V_GE= 20 V,_T_vj= 25 °C||||100|nA| |Turn-on delay time<br>(inductive load)|_t_don|_I_C= 40 A,_V_CC= 350 V,<br>_V_GE= ±15 V,_R_Gon= 0.51 Ω|_T_vj= 25 °C||0.021||µs| ||||_T_vj= 125 °C||0.025||| ||||_T_vj= 175 °C||0.026||| |Rise time (inductive load)|_t_r|_I_C= 40 A,_V_CC= 350 V,<br>_V_GE= ±15 V,_R_Gon= 0.51 Ω|_T_vj= 25 °C||0.017||µs| ||||_T_vj= 125 °C||0.020||| ||||_T_vj= 175 °C||0.022||| |Turn-of delay time<br>(inductive load)|_t_dof|_I_C= 40 A,_V_CC= 350 V,<br>_V_GE= ±15 V,_R_Gof= 0.62 Ω|_T_vj= 25 °C||0.110||µs| ||||_T_vj= 125 °C||0.140||| ||||_T_vj= 175 °C||0.160||| |Fall time (inductive load)|_t_f|_I_C= 40 A,_V_CC= 350 V,<br>_V_GE= ±15 V,_R_Gof= 0.62 Ω|_T_vj= 25 °C||0.080||µs| ||||_T_vj= 125 °C||0.150||| ||||_T_vj= 175 °C||0.180||| |Turn-on energy loss per<br>pulse|_E_on|_I_C= 40 A,_V_CC= 350 V,<br>_L_σ= 7 nH,_V_GE= ±15 V,<br>_R_Gon= 0.51 Ω, di/dt =<br>1130 A/ns (Tvj= 175 °C)|_T_vj= 25 °C||0.36||mJ| ||||_T_vj= 125 °C||0.51||| ||||_T_vj= 175 °C||0.58||| |Turn-of energy loss per<br>pulse|_E_of|_I_C= 40 A,_V_CC= 350 V,<br>_L_σ= 7 nH,_V_GE= ±15 V,<br>_R_Gof= 0.62 Ω, dv/dt =<br>5300 V/µs (Tvj= 175 °C)|_T_vj= 25 °C||0.81||mJ| ||||_T_vj= 125 °C||1.22||| ||||_T_vj= 175 °C||1.45||| |Thermal resistance,<br>junction to heat sink|_R_thJH|per IGBT, Valid with IFX pre-applied Thermal<br>Interface Material||||1.68|K/W| |Temperature under<br>switching conditions|_T_vj op|||-40||175|°C| Datasheet Revision 1.00 2023-12-12 4 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **==> picture [105 x 47] intentionally omitted <==** ## **3 Diode, D1-D2 / D5-D6 / D9-D10** _**Note** : Tvj op > 150 °C is only allowed for operation at overload conditions. For detailed specifications please refer to AN 2018-14._ ## **3 Diode, D1-D2 / D5-D6 / D9-D10** |**3**<br>**Diode, D1-D2 / D5-D6 / D9-D10**|**3**<br>**Diode, D1-D2 / D5-D6 / D9-D10**|**3**<br>**Diode, D1-D2 / D5-D6 / D9-D10**||||| |---|---|---|---|---|---|---| |**Table 5**<br>**Maximum rated values**||||||| |**Parameter**|**Symbol**|**Note or test condition**|||**Values**|**Unit**| |Repetitive peak reverse<br>voltage|_V_RRM||_T_vj= 25 °C||1200|V| |Implemented forward<br>current|_I_FN||||40|A| |Continuous DC forward<br>current|_I_F||||25|A| |Repetitive peak forward<br>current|_I_FRM|_t_P= 1 ms|||80|A| |I2t - value|_I_2_t_|_t_P= 10 ms,_V_R= 0 V|_T_vj= 125 °C||61|A²s| ||||_T_vj= 175 °C||35|| |**Table 6**<br>**Characteristic values**|**Table 6**<br>**Characteristic values**|**Table 6**<br>**Characteristic values**|||||| |---|---|---|---|---|---|---|---| |**Parameter**|**Symbol**|**Note or test condition**|||**Values**||**Unit**| |||||**Min.**|**Typ.**|**Max.**|| |Forward voltage|_V_F|_I_F= 40 A,_V_GE= 0 V|_T_vj= 25 °C||2.50|3.05|V| ||||_T_vj= 125 °C||2.18||| ||||_T_vj= 175 °C||1.98||| |Peak reverse recovery<br>current|_I_RM|_V_CC= 350 V,_I_F= 40 A,<br>_V_GE= -15 V, -diF/dt = 2.1<br>kA/µs (Tvj= 175 °C)|_T_vj= 25 °C||36.4||A| ||||_T_vj= 125 °C||52.2||| ||||_T_vj= 175 °C||58.6||| |Recovered charge|_Q_r|_V_CC= 350 V,_I_F= 40 A,<br>_V_GE= -15 V, -diF/dt = 2.1<br>kA/µs (Tvj= 175 °C)|_T_vj= 25 °C||0.68||µC| ||||_T_vj= 125 °C||1.61||| ||||_T_vj= 175 °C||2.22||| |Reverse recovery energy|_E_rec|_V_CC= 350 V,_I_F= 40 A,<br>_V_GE= -15 V, -diF/dt = 2.1<br>kA/µs (Tvj= 175 °C)|_T_vj= 25 °C||0.214||mJ| ||||_T_vj= 125 °C||0.503||| ||||_T_vj= 175 °C||0.647||| |Thermal resistance,<br>junction to heat sink|_R_thJH|per diode, Valid with IFX pre-applied<br>Thermal Interface Material||||2.07|K/W| |Temperature under<br>switching conditions|_T_vj op|||-40||175|°C| _**Note** : Tvj op > 150 °C is only allowed for operation at overload conditions. For detailed specifications please refer to AN 2018-14._ Datasheet Revision 1.00 2023-12-12 5 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **==> picture [105 x 47] intentionally omitted <==** **4 IGBT, T3-T4 / T7-T8 / T11-T12** ## **4 IGBT, T3-T4 / T7-T8 / T11-T12** |**4**<br>**IGBT, T3-T4 / T7-T8 / T11-T12**|**4**<br>**IGBT, T3-T4 / T7-T8 / T11-T12**|**4**<br>**IGBT, T3-T4 / T7-T8 / T11-T12**||||| |---|---|---|---|---|---|---| |**Table 7**<br>**Maximum rated values**||||||| |**Parameter**|**Symbol**|**Note or test condition**|||**Values**|**Unit**| |Collector-emitter voltage|_V_CES||_T_vj= 25 °C||650|V| |Implemented collector<br>current|_I_CN||||35|A| |Continuous DC collector<br>current|_I_CDC|_T_vj max= 175 °C|_T_H= 65 °C||20|A| |Repetitive peak collector<br>current|_I_CRM|tplimited by Tvj op|||70|A| |Gate-emitter peak voltage|_V_GES||||±20|V| **Table 8 Characteristic values** |**Parameter**|**Symbol**|**Note or test condition**||**Values**|**Values**|**Values**|**Unit**| |---|---|---|---|---|---|---|---| |||||**Min.**|**Typ.**|**Max.**|| |Collector-emitter<br>saturation voltage|_V_CE sat|_I_C= 35 A,_V_GE= 15 V|_T_vj= 25 °C||1.42|1.90|V| ||||_T_vj= 125 °C||1.53||| ||||_T_vj= 175 °C||1.62||| |Gate threshold voltage|_V_GEth|_I_C= 6.5 mA, VCE= VGE,_T_vj=|25 °C|3.25|4|4.75|V| |Gate charge|_Q_G|_V_GE= ±15 V,_V_CC= 400 V|||0.143||µC| |Input capacitance|_C_ies|_f_= 100 kHz,_T_vj= 25 °C,_V_CE= 25 V,_V_GE= 0 V|||25.2||nF| |Reverse transfer<br>capacitance|_C_res|_f_= 100 kHz,_T_vj= 25 °C,_V_CE= 25 V,_V_GE= 0 V|||0.078||nF| |Collector-emitter cut-of<br>current|_I_CES|_V_CE= 650 V,_V_GE= 0 V|_T_vj= 25 °C|||24|µA| |Gate-emitter leakage<br>current|_I_GES|_V_CE= 0 V,_V_GE= 20 V,_T_vj= 25 °C||||100|nA| |Turn-on delay time<br>(inductive load)|_t_don|_I_C= 35 A,_V_CC= 350 V,<br>_V_GE= ±15 V,_R_Gon= 1.5 Ω|_T_vj= 25 °C||0.010||µs| ||||_T_vj= 125 °C||0.011||| ||||_T_vj= 175 °C||0.012||| |Rise time (inductive load)|_t_r|_I_C= 35 A,_V_CC= 350 V,<br>_V_GE= ±15 V,_R_Gon= 1.5 Ω|_T_vj= 25 °C||0.013||µs| ||||_T_vj= 125 °C||0.015||| ||||_T_vj= 150 °C||0.015||| |Turn-of delay time<br>(inductive load)|_t_dof|_I_C= 35 A,_V_CC= 350 V,<br>_V_GE= ±15 V,_R_Gof= 1.5 Ω|_T_vj= 25 °C||0.075||µs| ||||_T_vj= 125 °C||0.092||| ||||_T_vj= 175 °C||0.099||| **(table continues...)** Datasheet Revision 1.00 2023-12-12 6 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **==> picture [105 x 47] intentionally omitted <==** ## **5 Diode, D3-D4 / D7-D8 / D11-D12** |**Table 8**<br>**(continued) Characteristic values**|**Table 8**<br>**(continued) Characteristic values**|**Table 8**<br>**(continued) Characteristic values**|||||| |---|---|---|---|---|---|---|---| |**Parameter**|**Symbol**|**Note or test condition**||**Values**|||**Unit**| |||||**Min.**|**Typ.**|**Max.**|| |Fall time (inductive load)|_t_f|_I_C= 35 A,_V_CC= 350 V,<br>_V_GE= ±15 V,_R_Gof= 1.5 Ω|_T_vj= 25 °C||0.036||µs| ||||_T_vj= 125 °C||0.051||| ||||_T_vj= 175 °C||0.071||| |Turn-on energy loss per<br>pulse|_E_on|_I_C= 35 A,_V_CC= 350 V,<br>_L_σ= 7 nH,_V_GE= ±15 V,<br>_R_Gon= 1.5 Ω, di/dt =<br>1790 A/µs (Tvj= 175 °C)|_T_vj= 25 °C||0.13||mJ| ||||_T_vj= 125 °C||0.2||| ||||_T_vj= 175 °C||0.26||| |Turn-of energy loss per<br>pulse|_E_of|_I_C= 35 A,_V_CC= 350 V,<br>_L_σ= 7 nH,_V_GE= ±15 V,<br>_R_Gof= 1.5 Ω, dv/dt =<br>7570 V/µs (Tvj= 175 °C)|_T_vj= 25 °C||0.432||mJ| ||||_T_vj= 125 °C||0.625||| ||||_T_vj= 175 °C||0.737||| |Thermal resistance,<br>junction to heat sink|_R_thJH|per IGBT, Valid with IFX pre-applied Thermal<br>Interface Material||||2.59|K/W| |Temperature under<br>switching conditions|_T_vj op|||-40||175|°C| ## **5 Diode, D3-D4 / D7-D8 / D11-D12** **Table 9 Maximum rated values** |**Parameter**|**Symbol**|**Note or test condition**||**Values**|**Unit**| |---|---|---|---|---|---| |Repetitive peak reverse<br>voltage|_V_RRM||_T_vj= 25 °C|650|V| |Implemented forward<br>current|_I_FN|||50|A| |Continuous DC forward<br>current|_I_F|||25|A| |Repetitive peak forward<br>current|_I_FRM|_t_P= 1 ms||100|A| |I2t - value|_I_2_t_|_t_P= 10 ms,_V_R= 0 V|_T_vj= 125 °C|87|A²s| ||||_T_vj= 175 °C|69.7|| |**Table 10**<br>**Characteristic values**|**Table 10**<br>**Characteristic values**|**Table 10**<br>**Characteristic values**|||||| |---|---|---|---|---|---|---|---| |**Parameter**|**Symbol**|**Note or test condition**||**Values**|||**Unit**| |||||**Min.**|**Typ.**|**Max.**|| |Forward voltage|_V_F|_I_F= 50 A,_V_GE= 0 V|_T_vj= 25 °C||1.65|2.15|V| ||||_T_vj= 125 °C||1.55||| ||||_T_vj= 175 °C||1.45||| ## **(table continues...)** Datasheet Revision 1.00 2023-12-12 7 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **==> picture [105 x 47] intentionally omitted <==** ## **6 NTC-Thermistor** |**Table 10**<br>**(continued) Characteristic values**|**Table 10**<br>**(continued) Characteristic values**|**Table 10**<br>**(continued) Characteristic values**|||||| |---|---|---|---|---|---|---|---| |**Parameter**|**Symbol**|**Note or test condition**|||**Values**||**Unit**| |||||**Min.**|**Typ.**|**Max.**|| |Peak reverse recovery<br>current|_I_RM|_V_CC= 350 V,_I_F= 50 A,<br>-diF/dt = 1430 A/µs<br>(Tvj= 175 °C)|_T_vj= 25 °C||25.4||A| ||||_T_vj= 125 °C||33.3||| ||||_T_vj= 175 °C||37.8||| |Recovered charge|_Q_r|_V_CC= 350 V,_I_F= 50 A,<br>-diF/dt = 1430 A/µs<br>(Tvj= 175 °C)|_T_vj= 25 °C||0.9||µC| ||||_T_vj= 125 °C||1.71||| ||||_T_vj= 175 °C||2.22||| |Reverse recovery energy|_E_rec|_V_CC= 350 V,_I_F= 50 A,<br>-diF/dt = 1430 A/µs<br>(Tvj= 175 °C)|_T_vj= 25 °C||0.223||mJ| ||||_T_vj= 125 °C||0.428||| ||||_T_vj= 175 °C||0.555||| |Thermal resistance,<br>junction to heat sink|_R_thJH|per diode, Valid with IFX pre-applied<br>Thermal Interface Material||||1.83|K/W| |Temperature under<br>switching conditions|_T_vj op|||-40||175|°C| ## **6 NTC-Thermistor** |**6**<br>**NTC-Thermistor**|**6**<br>**NTC-Thermistor**|**6**<br>**NTC-Thermistor**||||| |---|---|---|---|---|---|---| |**Table 11**<br>**Characteristic values**||||||| |**Parameter**|**Symbol**|**Note or test condition**||**Values**||**Unit**| ||||**Min.**|**Typ.**|**Max.**|| |Rated resistance|_R_25|_T_NTC= 25 °C||5||kΩ| |Deviation of R100|Δ_R/R_|_T_NTC= 100 °C,_R_100= 493 Ω|-5||5|%| |Power dissipation|_P_25|_T_NTC= 25 °C|||20|mW| |B-value|_B_25/50|R2= R25exp[B25/50(1/T2-1/(298,15 K))]||3375||K| |B-value|_B_25/80|R2= R25exp[B25/80(1/T2-1/(298,15 K))]||3411||K| |B-value|_B_25/100|R2= R25exp[B25/100(1/T2-1/(298,15 K))]||3433||K| _**Note** : For an analytical description of the NTC characteristics please refer to AN2009-10, chapter 4_ Datasheet Revision 1.00 2023-12-12 8 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **7 Characteristics diagrams** **==> picture [105 x 47] intentionally omitted <==** ## **7 Characteristics diagrams** **Output characteristic (typical), IGBT, T1-T2 / T5-T6 / T9-T10** IC = f(VCE) VGE = 15 V **Output characteristic field (typical), IGBT, T1-T2 / T5T6 / T9-T10** IC = f(VCE) T = 175 °C vj **==> picture [540 x 584] intentionally omitted <==** **----- Start of picture text -----**<br> 80 80<br>70 70<br>60 60<br>50 50<br>40 40<br>30 30<br>20 20<br>10 10<br>0 0<br>0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0<br>Transfer characteristic (typical), IGBT, T1-T2 / T5-T6 / Gate charge characteristic (typical), IGBT, T1-T2 / T5-<br>T9-T10 T6 / T9-T10<br>IC = f(VGE) VGE = f(QG)<br>VCE = 20 V IC = 40 A, Tvj = 25 °C<br>80 15<br>70<br>10<br>60<br>5<br>50<br>40 0<br>30<br>-5<br>20<br>-10<br>10<br>0 -15<br>5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 0.00 0.10 0.20 0.30 0.40 0.50 0.60<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2023-12-12 9 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **==> picture [105 x 47] intentionally omitted <==** ## **7 Characteristics diagrams** **Capacity characteristic (typical), IGBT, T1-T2 / T5-T6 / T9-T10** C = f(VCE) f = 100 kHz, VGE = 0 V, Tvj = 25 °C **==> picture [228 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 10<br>1<br>0.1<br>0.01<br>0 10 20 30 40 50 60 70 80 90 100<br>**----- End of picture text -----**<br> **Switching times (typical), IGBT, T1-T2 / T5-T6 / T9-T10** t = f(RG) VGE = ±15 V, IC = 40 A, VCC = 350 V, Tvj = 175 °C **==> picture [228 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 1<br>0.1<br>0.01<br>0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0<br>**----- End of picture text -----**<br> ## **Switching times (typical), IGBT, T1-T2 / T5-T6 / T9-T10** t = f(IC) VCC = 350 V, RGoff = 0.62 Ω, RGon = 0.51 Ω, VGE = ±15 V, Tvj = 175 °C **==> picture [229 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 1<br>0.1<br>0.01<br>0 10 20 30 40 50 60 70 80<br>**----- End of picture text -----**<br> **Switching losses (typical), IGBT, T1-T2 / T5-T6 / T9-T10** E = f(IC) RGoff = 0.62 Ω, RGon = 0.51 Ω, VCC = 350 V, VGE = ± 15 V **==> picture [229 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 3.00<br>2.75<br>2.50<br>2.25<br>2.00<br>1.75<br>1.50<br>1.25<br>1.00<br>0.75<br>0.50<br>0.25<br>0.00<br>0 10 20 30 40 50 60 70 80<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2023-12-12 10 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **7 Characteristics diagrams** **==> picture [105 x 47] intentionally omitted <==** ## **Switching losses (typical), IGBT, T1-T2 / T5-T6 / T9-T10** E = f(RG) ## IC = 40 A, VCC = 350 V, VGE = ± 15 V **Reverse bias safe operating area (RBSOA), IGBT, T1T2 / T5-T6 / T9-T10** IC = f(VCE) RGoff = 0.62 Ω, VGE = ±15 V, Tvj = 175 °C **==> picture [540 x 569] intentionally omitted <==** **----- Start of picture text -----**<br> 3.00 90<br>2.75<br>80<br>2.50<br>70<br>2.25<br>2.00 60<br>1.75<br>50<br>1.50<br>40<br>1.25<br>1.00 30<br>0.75<br>20<br>0.50<br>10<br>0.25<br>0.00 0<br>0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 0 200 400 600 800 1000 1200 1400<br>Transient thermal impedance, IGBT, T1-T2 / T5-T6 / T9- Forward characteristic (typical), Diode, D1-D2 / D5-<br>T10 D6 / D9-D10<br>Zth = f(t) IF = f(VF)<br>10 80<br>70<br>60<br>50<br>1 40<br>30<br>20<br>10<br>0.1 0<br>0.001 0.01 0.1 1 10 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2023-12-12 11 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **==> picture [105 x 47] intentionally omitted <==** ## **7 Characteristics diagrams** **==> picture [540 x 646] intentionally omitted <==** **----- Start of picture text -----**<br> Switching losses (typical), Diode, D1-D2 / D5-D6 / D9- Switching losses (typical), Diode, D1-D2 / D5-D6 / D9-<br>D10 D10<br>Erec = f(IF) Erec = f(RG)<br>VCE = 350 V, RG = 1.5 Ω VCE = 350 V, IF = 40 A<br>0.80 0.80<br>0.75 0.75<br>0.70 0.70<br>0.65 0.65<br>0.60 0.60<br>0.55 0.55<br>0.50 0.50<br>0.45 0.45<br>0.40 0.40<br>0.35 0.35<br>0 10 20 30 40 50 60 70 80 0.0 1.5 3.0 4.5 6.0 7.5 9.0 10.5 12.0 13.5 15.0<br>Transient thermal impedance, Diode, D1-D2 / D5-D6 / Output characteristic (typical), IGBT, T3-T4 / T7-T8 /<br>D9-D10 T11-T12<br>Zth = f(t) IC = f(VCE)<br>VGE = 15 V<br>10 70<br>60<br>50<br>40<br>1<br>30<br>20<br>10<br>0.1 0<br>0.001 0.01 0.1 1 10 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2023-12-12 12 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **==> picture [105 x 47] intentionally omitted <==** ## **7 Characteristics diagrams** ## **Output characteristic field (typical), IGBT, T3-T4 / T7T8 / T11-T12** IC = f(VCE) ## T = 175 °C vj ## **Transfer characteristic (typical), IGBT, T3-T4 / T7-T8 / T11-T12** IC = f(VGE) VCE = 20 V **==> picture [540 x 584] intentionally omitted <==** **----- Start of picture text -----**<br> 70 70<br>60 60<br>50 50<br>40 40<br>30 30<br>20 20<br>10 10<br>0 0<br>0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5<br>Gate charge characteristic (typical), IGBT, T3-T4 / T7- Capacity characteristic (typical), IGBT, T3-T4 / T7-T8 /<br>T8 / T11-T12 T11-T12<br>VGE = f(QG) C = f(VCE)<br>IC = 35 A, Tvj = 25 °C f = 100 kHz, VGE = 0 V, Tvj = 25 °C<br>15 100<br>10<br>10<br>5<br>0 1<br>-5<br>0.1<br>-10<br>-15 0.01<br>0.000 0.030 0.060 0.090 0.120 0.150 0 10 20 30 40 50 60 70 80 90 100<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2023-12-12 13 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **7 Characteristics diagrams** **==> picture [105 x 47] intentionally omitted <==** **==> picture [248 x 21] intentionally omitted <==** **----- Start of picture text -----**<br> Switching times (typical), IGBT, T3-T4 / T7-T8 / T11-<br>T12<br>**----- End of picture text -----**<br> **==> picture [32 x 11] intentionally omitted <==** **----- Start of picture text -----**<br> t = f(IC)<br>**----- End of picture text -----**<br> RGoff = 1.5 Ω, RGon = 1.5 Ω, VGE = ±15 V, VCC = 350 V **==> picture [228 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 1<br>0.1<br>0.01<br>0.001<br>0 10 20 30 40 50 60 70<br>**----- End of picture text -----**<br> ## **Switching losses (typical), IGBT, T3-T4 / T7-T8 / T11T12** E = f(IC) RGoff = 1.5 Ω, RGon = 1.5 Ω, VCC = 350 V, VGE = ± 15 V **==> picture [228 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 1.80<br>1.60<br>1.40<br>1.20<br>1.00<br>0.80<br>0.60<br>0.40<br>0.20<br>0.00<br>0 10 20 30 40 50 60 70<br>**----- End of picture text -----**<br> **==> picture [248 x 21] intentionally omitted <==** **----- Start of picture text -----**<br> Switching times (typical), IGBT, T3-T4 / T7-T8 / T11-<br>T12<br>**----- End of picture text -----**<br> t = f(RG) VGE = ±15 V, IC = 35 A, VCC = 350 V **==> picture [229 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 1<br>0.1<br>0.01<br>0.001<br>0.0 1.5 3.0 4.5 6.0 7.5 9.0 10.5 12.0 13.5 15.0<br>**----- End of picture text -----**<br> **Switching losses (typical), IGBT, T3-T4 / T7-T8 / T11T12** E = f(RG) IC = 35 A, VCC = 350 V, VGE = ± 15 V **==> picture [229 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 1.80<br>1.60<br>1.40<br>1.20<br>1.00<br>0.80<br>0.60<br>0.40<br>0.20<br>0.00<br>0.0 1.5 3.0 4.5 6.0 7.5 9.0 10.5 12.0 13.5 15.0<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2023-12-12 14 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **==> picture [105 x 47] intentionally omitted <==** ## **7 Characteristics diagrams** ## **Reverse bias safe operating area (RBSOA), IGBT, T3T4 / T7-T8 / T11-T12** IC = f(VCE) **Transient thermal impedance, IGBT, T3-T4 / T7-T8 / T11-T12** Zth = f(t) RGoff = 1.5 Ω, VGE = ±15 V, Tvj = 175 °C **==> picture [228 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 80<br>70<br>60<br>50<br>40<br>30<br>20<br>10<br>0<br>0 100 200 300 400 500 600 700<br>**----- End of picture text -----**<br> ## **Forward characteristic (typical), Diode, D3-D4 / D7D8 / D11-D12** IF = f(VF) **==> picture [228 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 100<br>90<br>80<br>70<br>60<br>50<br>40<br>30<br>20<br>10<br>0<br>0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00 2.20<br>**----- End of picture text -----**<br> **==> picture [229 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 10<br>1<br>0.1<br>0.001 0.01 0.1 1 10<br>**----- End of picture text -----**<br> **Switching losses (typical), Diode, D3-D4 / D7-D8 / D11D12** Erec = f(IF) VCE = 350 V, RG = 0.51 Ω **==> picture [229 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 1.00<br>0.90<br>0.80<br>0.70<br>0.60<br>0.50<br>0.40<br>0.30<br>0.20<br>0.10<br>0.00<br>0 10 20 30 40 50 60 70 80<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2023-12-12 15 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **==> picture [105 x 47] intentionally omitted <==** ## **7 Characteristics diagrams** **==> picture [540 x 613] intentionally omitted <==** **----- Start of picture text -----**<br> Switching losses (typical), Diode, D3-D4 / D7-D8 / D11- Transient thermal impedance, Diode, D3-D4 / D7-D8 /<br>D12 D11-D12<br>Erec = f(RG)rec = f(RG) = f(RG)G)) Zth = f(t)th = f(t) = f(t)<br>VCE = 350 V, IF = 50 ACE = 350 V, IF = 50 A = 350 V, IF = 50 AF = 50 A = 50 A<br>1.00 10<br>0.90<br>0.80<br>0.70<br>0.60<br>0.50 1<br>0.40<br>0.30<br>0.20<br>0.10<br>0.00 0.1<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.001 0.01 0.1 1 10<br>Temperature characteristic (typical), NTC-Thermistor<br>R = f(TNTC)NTC))<br>100000<br>10000<br>1000<br>100<br>10<br>0 25 50 75 100 125 150 175<br>**----- End of picture text -----**<br> **==> picture [540 x 613] intentionally omitted <==** **----- Start of picture text -----**<br> Switching losses (typical), Diode, D3-D4 / D7-D8 / D11- Transient thermal impedance, Diode, D3-D4 / D7-D8 /<br>D12 D11-D12<br>Erec = f(RG)rec = f(RG) = f(RG)G)) Zth = f(t)th = f(t) = f(t)<br>VCE = 350 V, IF = 50 ACE = 350 V, IF = 50 A = 350 V, IF = 50 AF = 50 A = 50 A<br>1.00 10<br>0.90<br>0.80<br>0.70<br>0.60<br>0.50 1<br>0.40<br>0.30<br>0.20<br>0.10<br>0.00 0.1<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.001 0.01 0.1 1 10<br>Temperature characteristic (typical), NTC-Thermistor<br>R = f(TNTC)NTC))<br>100000<br>10000<br>1000<br>100<br>10<br>0 25 50 75 100 125 150 175<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2023-12-12 16 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **==> picture [105 x 47] intentionally omitted <==** ## **8 Circuit diagram** ## **8 Circuit diagram** **==> picture [523 x 106] intentionally omitted <==** **----- Start of picture text -----**<br> P1<br>D4 E3 G3T3 T1 D1 D8 E7 G7T7 T5 D5 D12 E11 G11T11 T9 D9<br>G1 G5 G9<br>X7<br>E1 E5 E9<br>X2 X1 X4 X3 X6 X5 J NTC<br>X8<br>T2 T6 T10<br>T4 G4 E4 D3 G2 D2 T8 G8 E8 D7 G6 D6 T12G12 E12 D11 G10 D10<br>E2 E6<br>N1<br>**----- End of picture text -----**<br> ## **Figure 1** Datasheet Revision 1.00 2023-12-12 17 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **==> picture [105 x 47] intentionally omitted <==** ## **9 Package outlines** **==> picture [541 x 622] intentionally omitted <==** **----- Start of picture text -----**<br> 9 Package outlines<br>26,5<br>21,25 21,25<br>G3 E3 E1 G1 G7 E7 G5 E5 G9 E9 E11<br>16<br>12,8 G11<br>P1 P1<br>9,6<br>X8 X7<br>6,4<br>Y 3,2 X1 X3 X5<br>X<br>0 0<br>X2 X4 X6<br>6,4<br>4x ( n 2,3) E2 N1 E6<br>12,8<br>j n 0,4 A<br>16<br>G4 E4 G2 G8 E8 N1 G6G10 E12 G12<br>21,25 B 21,25<br>26,5<br>56,7 ` 0,3<br>A j 0,7CZ A<br>j 1 A<br>(47,5)<br>Restricted area for Thermal Interface Material<br>25,5 0 25,5 25,5 24 20,8 17,6 14,4 11,2 8 4,8 1,6 0 1,6 4,8 8 11,2 14,4 17,6 20,8 24 25,5<br>0,3<br> `<br>48<br>12<br>16,4<br>(33)<br>W00215113.05<br>**----- End of picture text -----**<br> **Figure 2** Datasheet Revision 1.00 2023-12-12 18 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **==> picture [105 x 47] intentionally omitted <==** ## **10 Module label code** ## **10 Module label code** |**Module label code**|**Module label code**|**Module label code**|**Module label code**|**Module label code**| |---|---|---|---|---| |Code format|Data Matrix||Barcode Code128|| |Encoding|ASCII text||Code Set A|| |Symbol size|16x16||23 digits|| |Standard|IEC24720 and IEC16022||IEC8859-1|| |||||| |Code content|_Content_<br>Module serial number<br>Module material number<br>Production order number<br>Date code (production year)<br>Date code (production week)|_Digit_<br>1 – 5<br>6 - 11<br>12 - 19<br>20 – 21<br>22 – 23||_Example_<br>71549<br>142846<br>55054991<br>15<br>30| |Example|71549142846550549911530<br>71549142846550549911530|||| ## **Figure 3** Datasheet Revision 1.00 2023-12-12 19 **FS3L40R12W2H7P_B11 EasyPACK[™] 2B module** **Revision history** **==> picture [105 x 47] intentionally omitted <==** ## **Revision history** |**Revision history**||| |---|---|---| |**Document revision**|**Date of release**|**Description of changes**| |0.10|2023-01-26|Initial version| |1.00|2023-12-12|Final datasheet| Datasheet Revision 1.00 2023-12-12 20 ## **Trademarks** All referenced product or service names and trademarks are the property of their respective owners. **Edition 2023-12-12 Important notice Published by** The information given in this document shall in no event be regarded as a guarantee of conditions or **Infineon Technologies AG** characteristics (“Beschaffenheitsgarantie”). **81726 Munich, Germany** With respect to any examples, hints or any typical values stated herein and/or any information regarding **© 2023 Infineon Technologies AG** the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities **All Rights Reserved.** of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. **Do you have a question about any aspect of this document?** In addition, any information given in this document is **Email: erratum@infineon.com** subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning **Document reference** customer’s products and any use of the product of **IFX-ABF403-002** Infineon Technologies in customer’s applications. ## **Warnings** Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application.
Updated at April 28, 2026
Infineon Technologies is a globally recognized leader in semiconductor solutions, renowned for driving innovation in power management, energy efficiency, and modern mobility. With a strong legacy of engineering excellence, the company provides highly reliable components designed to meet the rigorous demands of industrial, automotive, and advanced commercial applications. The core of our Infineon portfolio is centered on their industry-leading discrete semiconductors. We offer an extensive selection of single and dual MOSFETs, alongside a robust range of single IGBTs and advanced IGBT modules. These flagship power transistors are essential for high-efficiency power conversion and motor control, providing engineers with superior thermal performance and minimized switching losses. Beyond advanced field-effect transistors, the selection includes a comprehensive array of diodes and rectifiers, heavily featuring Schottky diodes, as well as fast-recovery and RF/PIN diodes. This power foundation is further supported by bipolar transistors, intelligent power modules, and thyristor SCR modules, delivering the critical building blocks required for complex power system designs. To support broader system integration, the portfolio also encompasses specialized solutions such as solid-state relays, AC/DC LED driver ICs, and Bluetooth communications modules. From high-power industrial rectifiers to wireless connectivity adapters, Infineon equips designers with the precision components needed to build efficient, scalable, and fully connected electronic systems.
About Novapart
Novapart is a B2B electronic component broker specialising in stock shortages and cost reduction. We source hard-to-find parts and identify compliant alternatives across a catalogue of 410,000+ components from 500+ manufacturers.
Learn more →Stock Shortage Specialist
When a component is unavailable, discontinued or has an unacceptable lead time, we tap into our network of vetted European and Asian distributors to source what you need — without compromising on quality or traceability.
Request a quote →Compliant Alternatives
We identify pin-to-pin, electrically equivalent substitutes that meet the same certifications (RoHS, AEC-Q100, REACH) as your original specification — validated against datasheets, not just part numbers. Often at a lower cost.
BOM Analysis service →