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FS1000R08A7P3BHPSA1
IGBT Module, Six Pack, 600 A, 1.08 V, 750 W, 175 °C, Module
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- Manufacturer: INFINEON
- Product type: IGBT Modules
- SVHC: No SVHC (25-Jun-2025)
- Product Range: HybridPACK G2 Series
- IGBT Technology: IGBT EDT3
- IGBT Termination: Press Fit
- Power Dissipation: 750W
- IGBT Configuration: Six Pack
- Transistor Mounting: Panel
- Transistor Case Style: Module
- Operating Temperature Max: 175°C
- Continuous Collector Current: 600A
- Collector Emitter Voltage Max: 750V
- Collector Emitter Saturation Voltage: 1.08V
| Delivery and price | |
|---|---|
| Units per pack | 5 |
| Price | 352.38 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
**FS1000R08A7P3B HybridPACK[™] Drive G2 module** ## **Final datasheet HybridPACK[™] Drive G2 module** ## **Features** - Electrical features - VCES = 750 V - ICN = 1000 A / ICRM = 2000 A - Low V CE,sat - Low switching losses - Low Qg and Crss - Low inductive design - T = 175°C vj,op - Integrated on-chip temperature sensor - Short-time extended operation temperature Tvj,op = 185 °C - Mechanical features - 4.25 kV DC 1 second insulation - High creepage and clearance distances - Direct-cooled PinFin base plate - Guiding elements for PCB and cooler assembly - PressFIT contact technology - RoHS compliant, lead-free - UL 94 V0 module frame - Al2O3 substrate with low thermal resistance ## **Potential applications** - Automotive applications - (Hybrid) electrical vehicles (H)EV ## **Product validation** - Qualified according to AQG 324, release no.: 03.1/2021 ## **Description** The HybridPACK[TM] Drive is a very compact six-pack module (750V/1000A) optimized for hybrid and electric vehicles. **==> picture [158 x 69] intentionally omitted <==** **----- Start of picture text -----**<br> D1 D3 D5<br>T1 T3 T5<br>D2 D4 D6<br>T2 T4 T6<br>**----- End of picture text -----**<br> Please read the sections "Important notice" and "Warnings" at the end of this document Datasheet www.infineon.com Revision 1.00 2025-07-01 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **Table of contents** **==> picture [105 x 47] intentionally omitted <==** ## **Table of contents** ||**Description**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1| |---|---| ||**Features**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1| ||**Potential applications**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1| ||**Product validation**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1| ||**Table of contents**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2| |**1**|**Package**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3| |**2**|**IGBT, Inverter**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4| |**3**|**Diode, Inverter**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6| |**4**|**Temperature sensor**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7| |**5**|**Characteristics diagrams**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8| |**6**|**Circuit diagram**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13| |**7**|**Package outlines**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14| |**8**|**Module label code**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17| ||**Revision history**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18| ||**Disclaimer**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19| Datasheet Revision 1.00 2025-07-01 2 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **==> picture [105 x 47] intentionally omitted <==** ## **1 Package** ## **1 Package** |**1**<br>**Package**|**1**<br>**Package**|**1**<br>**Package**|**1**<br>**Package**|**1**<br>**Package**||| |---|---|---|---|---|---|---| |**Table 1**<br>**Insulation coordination**||||||| |**Parameter**|**Symbol**|**Note or test condition**|||**Values**|**Unit**| |Isolation test voltage|_V_ISOL|RMS, f = 0 Hz, t = 1 sec|||4.25|kV| |Material of module<br>baseplate|||||Cu+Ni_1)_|| |Internal isolation||basic insulation (class 1, IEC 61140)|||Al2O3|| |Creepage distance|_d_creep|terminal to heatsink|||10.6|mm| |Creepage distance|_d_creep|terminal to terminal|||10.6|mm| |Clearance|_d_clear|terminal to heatsink|||4.5|mm| |Clearance|_d_clear|terminal to terminal|||4.5|mm| |Comparative tracking<br>index|_CTI_||||> 175|| |_1)_<br>Ni plated Cu baseplate.||||||| |**Table 2**<br>**Maximum rated values**|**Table 2**<br>**Maximum rated values**|**Table 2**<br>**Maximum rated values**|||||| |---|---|---|---|---|---|---|---| |**Parameter**|**Symbol**|**Note or test condition**|||**Values**||**Unit**| |||||**Min.**|**Typ.**|**Max.**|| |Maximum RMS module<br>terminal current|_I_t,rms|_T_Ct= 125 °C|||800||A| |Heat-staking dome<br>temperature_1)_|_T_HS|tstaking< 10s||||280|°C| _1)_ Heat-staking according to application note AN-G2-ASSEMBLY **Table 3 Characteristic values** |**Parameter**|**Symbol**|**Note or test condition**|**Note or test condition**||**Values**||**Unit**| |---|---|---|---|---|---|---|---| |||||**Min.**|**Typ.**|**Max.**|| |Pressure drop in cooling<br>circuit|Δ_p_|50% water / 50% ethylene glycol,<br>Δ_V/_Δ_t_= 10 dm³/min,_T_f= 65 °C|||76_1)_||mbar| |Maximum pressure in<br>cooling circuit|_p_|Tbaseplate< 40 °C (relative pressure)||||3.0|bar| |||Tbaseplate≥ 40 °C (relative pressure)||||2.5|| |Stray inductance module|_L_s,CE||||8.0||nH| |Module lead resistance,<br>terminals - chip|_R_CC'+EE'|_T_f= 25 °C, per switch|||0.73||mΩ| |Storage temperature|_T_stg|||-40||125|°C| |Mounting torque for<br>module mounting_2)_|_M_|Screw M4 baseplate to heatsink||1.8|2.0|2.2|Nm| |||Screw EJOT Delta PCB to frame||0.45|0.5|0.55|| |Weight|_G_||||760||g| _1)_ Cooler design and flow direction according to application note AN-G2-ASSEMBLY. Datasheet Revision 1.00 2025-07-01 3 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **==> picture [105 x 47] intentionally omitted <==** ## **2 IGBT, Inverter** - _2)_ Screw types and torque according to application note AN-G2-ASSEMBLY. ## **2 IGBT, Inverter** |**2**<br>**IGBT, Inverter**|**2**<br>**IGBT, Inverter**|**2**<br>**IGBT, Inverter**|**2**<br>**IGBT, Inverter**|**2**<br>**IGBT, Inverter**||| |---|---|---|---|---|---|---| |**Table 4**<br>**Maximum rated values**||||||| |**Parameter**|**Symbol**|**Note or test condition**|||**Values**|**Unit**| |Collector-emitter voltage|_V_CES||_T_vj= 25 °C||750|V| |Implemented collector<br>current|_I_CN||||1000|A| |Continuous DC collector<br>current|_I_C,nom|_T_f= 65 °C,_T_vj,max= 175 °C|||600_1)_|A| |Repetitive peak collector<br>current|_I_CRM|verified by design, tplimited by Tvj,max|||2000|A| |Total power dissipation|_P_tot|_T_f= 65 °C,_T_vj,max= 175 °C|||750|W| |Gate-emitter peak voltage|_V_GES||||±20|V| - _1)_ Verified by characterization / design, not by test. |**Table 5**<br>**Characteristic values**|**Table 5**<br>**Characteristic values**|**Table 5**<br>**Characteristic values**|||||| |---|---|---|---|---|---|---|---| |**Parameter**|**Symbol**|**Note or test condition**||**Values**|||**Unit**| |||||**Min.**|**Typ.**|**Max.**|| |Collector-emitter<br>saturation voltage|_V_CE,sat|_I_C= 600 A,_V_GE= 15 V|_T_vj= 25 °C||1.08|1.21|V| ||||_T_vj= 175 °C||1.09||| |Collector-emitter<br>saturation voltage|_V_CE,sat|_I_C= 1000 A,_V_GE= 15 V|_T_vj= 25 °C||1.22||V| ||||_T_vj= 175 °C||1.32||| |Gate threshold voltage|_V_GE,th|_I_C= 10.32 mA, VCE= VGE|_T_vj= 25 °C|4.9|5.8|6.65|V| ||||_T_vj= 175 °C||4||| |Gate charge|_Q_G|_V_CE= 400 V,_V_GE= -8...15 V|||2.65||µC| |Internal gate resistor|_R_G,int||_T_vj= 25 °C||1.0||Ω| |Input capacitance|_C_ies|_f_= 0.1 MHz,_V_CE= 50 V,<br>_V_GE= 0 V|_T_vj= 25 °C||60.8||nF| |Output capacitance|_C_oes|_f_= 0.1 MHz,_V_CE= 50 V,<br>_V_GE= 0 V|_T_vj= 25 °C||2.1||nF| |Reverse transfer<br>capacitance|_C_res|_f_= 0.1 MHz,_V_CE= 50 V,<br>_V_GE= 0 V|_T_vj= 25 °C||0.27||nF| |Collector-emitter cut-of<br>current|_I_CES|_V_CE= 750 V,_V_GE= 0 V|_T_vj= 25 °C|||1.0|mA| ||||_T_vj= 175 °C||15.0||| ||||_T_vj= 185 °C||28.0||| |Gate-emitter leakage<br>current|_I_GES|_V_CE= 0 V,_V_GE= 20 V|_T_vj= 25 °C|||400|nA| **(table continues...)** Datasheet Revision 1.00 2025-07-01 4 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **==> picture [105 x 47] intentionally omitted <==** ## **2 IGBT, Inverter** |**Table 5**<br>**(continued) Characteristic values**|**Table 5**<br>**(continued) Characteristic values**|**Table 5**<br>**(continued) Characteristic values**|||||| |---|---|---|---|---|---|---|---| |**Parameter**|**Symbol**|**Note or test condition**|||**Values**||**Unit**| |||||**Min.**|**Typ.**|**Max.**|| |Turn-on delay time,<br>inductive load|_t_d,on|_I_C= 600 A,_V_CE= 400 V,<br>_V_GE= -8/15 V,<br>_R_G,on= 2.4 Ω|_T_vj= 25 °C||222||ns| ||||_T_vj= 175 °C||255||| |Rise time, inductive load|_t_r|_I_C= 600 A,_V_CE= 400 V,<br>_V_GE= -8/15 V,<br>_R_G,on= 2.4 Ω|_T_vj= 25 °C||50.0||ns| ||||_T_vj= 175 °C||55.0||| |Turn-of delay time,<br>inductive load|_t_d,of|_I_C= 600 A,_V_CE= 400 V,<br>_V_GE= -8/15 V,<br>_R_G,of= 7.5 Ω|_T_vj= 25 °C||929||ns| ||||_T_vj= 175 °C||1060||| |Fall time, inductive load|_t_f|_I_C= 600 A,_V_CE= 400 V,<br>_V_GE= -8/15 V,<br>_R_G,of= 7.5 Ω|_T_vj= 25 °C||91.0||ns| ||||_T_vj= 175 °C||199||| |Turn-on energy loss per<br>pulse|_E_on|_I_C= 600 A,_V_CE= 400 V,<br>_L_σ= 7 nH,_V_GE= -8/15 V,<br>_R_G,on= 2.4 Ω|_T_vj= 25 °C,<br>_di/dt_= 9600 A/µs||4.5||mJ| ||||_T_vj= 175 °C,<br>_di/dt_= 8700 A/µs||10.7||| |Turn-of energy loss per<br>pulse|_E_of|_I_C= 600 A,_V_CE= 400 V,<br>_L_σ= 7 nH,_V_GE= -8/15 V,<br>_R_G,of= 7.5 Ω|_T_vj= 25 °C,<br>_dv/dt_= 4000 V/µs||31.1||mJ| ||||_T_vj= 175 °C,<br>_dv/dt_= 2700 V/µs||43.0||| |SC data|_I_SC|_V_CC= 400 V,_V_GE= 15 V,<br>VCEmax= VCES-Ls,CE·di/dt|_T_vj= 25 °C,<br>_t_P= 3.0 µs||8500||A| ||||_T_vj= 175 °C,<br>_t_P= 3.0 µs||6700||| ||||_T_vj= 185 °C,<br>_t_P= 2.5 µs||6600||| |Thermal resistance,<br>junction to cooling fluid_1)_|_R_th,j-f|50% water / 50% ethylene glycol,<br>Δ_V/_Δ_t_= 10 dm³/min,_T_f= 65 °C|||0.134||K/W| |Variance of thermal<br>resistance, junction to<br>cooling fluid_1)_|σRth,j-f|50% water / 50% ethylene glycol,<br>Δ_V/_Δ_t_= 10 dm³/min,_T_f= 65 °C|||0.002||K/W| |Temperature under<br>switching conditions|_T_vj,op||continuous<br>operation|-40||175|°C| ||||extended<br>operation|||185_2)_|| _1)_ Cooler design and flow direction according to application note AN-G2-ASSEMBLY. EoL criteria see AQG324, verified by characterization. _2)_ For limitation see QPAC documentation. Datasheet Revision 1.00 2025-07-01 5 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **==> picture [105 x 47] intentionally omitted <==** ## **3 Diode, Inverter** ## **3 Diode, Inverter** |**3**<br>**Diode, Inverter**|**3**<br>**Diode, Inverter**|**3**<br>**Diode, Inverter**|**3**<br>**Diode, Inverter**||||| |---|---|---|---|---|---|---|---| |**Table 6**<br>**Maximum rated values**|||||||| |**Parameter**|**Symbol**|**Note or test condition**|||**Values**||**Unit**| |Repetitive peak reverse<br>voltage|_V_RRM|_T_vj= 25 °C|||750||V| |Implemented forward<br>current|_I_FN||||1000||A| |Continuous DC forward<br>current|_I_F,nom||||600||A| |Repetitive peak forward<br>current|_I_FRM|verified by design, tplimited by Tvj,max|||2000||A| |I2t - value|_I_2_t_|_V_R= 0 V,_t_P= 10 ms|_T_vj= 175 °C||24500||A²s| |**Table 7**<br>**Characteristic values**|||||||| |**Parameter**|**Symbol**|**Note or test condition**|||**Values**||**Unit**| |||||**Min.**|**Typ.**|**Max.**|| |Forward voltage|_V_F|_I_F= 600 A|_T_vj= 25 °C||1.76|2.08|V| ||||_T_vj= 175 °C||1.57||| |Forward voltage|_V_F|_I_F= 1000 A|_T_vj= 25 °C||2.09||V| ||||_T_vj= 175 °C||1.95||| |Peak reverse recovery<br>current|_I_rm|_I_F= 600 A,_V_GE= -8 V,<br>_V_R= 400 V|_T_vj= 25 °C||351||A| ||||_T_vj= 175 °C||526||| |Recovered charge|_Q_r|_I_F= 600 A,_V_R= 400 V,<br>_V_GE= -8 V|_T_vj= 25 °C||14.4||µC| ||||_T_vj= 175 °C||43.1||| |Reverse recovery energy|_E_rec|_I_F= 600 A,_V_GE= -8 V,<br>_V_R= 400 V|_T_vj= 25 °C,<br>_-di_F_/dt_= 16.2 A/ns||4.90||mJ| ||||_T_vj= 175 °C,<br>_-di_F_/dt_= 13.4 A/ns||13.40||| |Thermal resistance,<br>junction to cooling fluid_1)_|_R_th,j-f|50% water / 50% ethylene glycol,<br>Δ_V/_Δ_t_= 10 dm³/min,_T_f= 65 °C|||0.173||K/W| |Variance of thermal<br>resistance, junction to<br>cooling fluid_1)_|σRth,j-f|50% water / 50% ethylene glycol,<br>Δ_V/_Δ_t_= 10 dm³/min,_T_f= 65 °C|||0.0027||K/W| |Temperature under<br>switching conditions|_T_vj,op||continuous<br>operation|-40||175|°C| ||||extended<br>operation|||185_2)_|| _1)_ Cooler design and flow direction according to application note AN-G2-ASSEMBLY. EoL criteria see AQG324, verified by characterization. _2)_ For limitation see QPAC documentation. Datasheet Revision 1.00 2025-07-01 6 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **==> picture [105 x 47] intentionally omitted <==** ## **4 Temperature sensor** ## **4 Temperature sensor** |**4**<br>**Temperature sensor**|**4**<br>**Temperature sensor**|**4**<br>**Temperature sensor**|||||| |---|---|---|---|---|---|---|---| |**Table 8**<br>**Characteristic values**|||||||| |**Parameter**|**Symbol**|**Note or test condition**|||**Values**||**Unit**| |||||**Min.**|**Typ.**|**Max.**|| |Transient sense current|_I_TS|||||10|mA| |Continuous sense current|_I_TS|||||1|mA| |Forward voltage|_V_TS||_I_TS= 0.2 mA,<br>_T_vj= 25 °C||2.280||V| |Temperature coeficient<br>(TCR)|_TC_TS|_I_TS= 0.2 mA|||-5.50||mV/K| Datasheet Revision 1.00 2025-07-01 7 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **==> picture [105 x 47] intentionally omitted <==** ## **5 Characteristics diagrams** ## **5 Characteristics diagrams** **Pressure drop in cooling circuit (typical), Package** Δp = f(ΔV/Δt) Tf = 65 °C, 50% water / 50% ethylene glycol **==> picture [228 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 120<br>110<br>100<br>90<br>80<br>70<br>60<br>50<br>40<br>30<br>20<br>10<br>0<br>4 5 6 7 8 9 10 11 12<br>**----- End of picture text -----**<br> **Output characteristic (typical), IGBT, Inverter** IC = f(VCE) VGE = 15 V **Maximum collector-emitter voltage, IGBT, Inverter** VCES = f(Tvj) Verified by characterization / design, not by test **==> picture [229 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 800<br>775<br>750<br>725<br>700<br>675<br>650<br>-50 -25 0 25 50 75 100 125 150 175 200<br>**----- End of picture text -----**<br> **Output characteristic (typical), IGBT, Inverter** IC = f(VCE) T = 175 °C vj **==> picture [540 x 262] intentionally omitted <==** **----- Start of picture text -----**<br> 2000 2000<br>1900 1900<br>1800 1800<br>1700 1700<br>1600 1600<br>1500 1500<br>1400 1400<br>1300 1300<br>1200 1200<br>1100 1100<br>1000 1000<br>900 900<br>800 800<br>700 700<br>600 600<br>500 500<br>400 400<br>300 300<br>200 200<br>100 100<br>0 0<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2025-07-01 8 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **==> picture [105 x 47] intentionally omitted <==** ## **5 Characteristics diagrams** **Transfer characteristic (typical), IGBT, Inverter** IC = f(VGE) VCE = 20 V **Gate charge characteristic (typical), IGBT, Inverter** VGE = f(QG) Tvj = 25 °C, VCE = 400 V, IC = 600 A **==> picture [540 x 572] intentionally omitted <==** **----- Start of picture text -----**<br> 2000 15<br>1900<br>1800<br>12<br>1700<br>1600<br>1500 9<br>1400<br>1300<br>6<br>1200<br>1100<br>1000 3<br>900<br>800<br>0<br>700<br>600<br>500 -3<br>400<br>300<br>-6<br>200<br>100<br>0 -9<br>5 6 7 8 9 10 11 12 0 1 2 3<br>Capacity characteristic (typical), IGBT, Inverter Switching losses (typical), IGBT, Inverter<br>C = f(VCE) E = f(IC)<br>VGE = 0 V, Tvj = 25 °C, f = 0.1 MHz VGE = -8/15 V, RG,off = 7.5 Ω, RG,on = 2.4 Ω, VCE = 400 V<br>100 100<br>90<br>80<br>10<br>70<br>60<br>1 50<br>40<br>30<br>0.1<br>20<br>10<br>0.01 0<br>0 50 100 150 200 250 300 350 400 450 500 0 200 400 600 800 1000 1200<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2025-07-01 9 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **5 Characteristics diagrams** **==> picture [105 x 47] intentionally omitted <==** ## **Switching losses (typical), IGBT, Inverter** ## E = f(RG) VGE = -8/15 V, VCE = 400 V, IC = 600 A ## **Reverse bias safe operating area (RBSOA), IGBT, Inverter** IC = f(VCE) Tvj = 175 °C, VGE = -8/15 V, RG,off = 7.5 Ω **==> picture [540 x 584] intentionally omitted <==** **----- Start of picture text -----**<br> 100 2200<br>2100<br>90 2000<br>1900<br>1800<br>80<br>1700<br>1600<br>70<br>1500<br>1400<br>60 1300<br>1200<br>50 1100<br>1000<br>40 900<br>800<br>700<br>30<br>600<br>500<br>20<br>400<br>300<br>10 200<br>100<br>0 0<br>0 2 4 6 8 10 12 14 16 18 20 0 100 200 300 400 500 600 700 800<br>Transient thermal impedance (typical), IGBT, Inverter Thermal impedance (typical), IGBT, Inverter<br>Zth = f(t) RthJF = f(ΔV/Δt)<br>ΔV/Δt = 10 dm³/min, 50% water / 50% ethylene glycol , Tf Tf = 65 °C, 50% water / 50% ethylene glycol<br>= 65 °C<br>1 0.150<br>0.148<br>0.146<br>0.144<br>0.142<br>0.1 0.140<br>0.138<br>0.136<br>0.134<br>0.132<br>0.01 0.130<br>0.128<br>0.126<br>0.124<br>0.122<br>0.001 0.120<br>0.001 0.01 0.1 1 10 4 5 6 7 8 9 10 11 12<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2025-07-01 10 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **5 Characteristics diagrams** **==> picture [105 x 47] intentionally omitted <==** **Forward characteristic (typical), Diode, Inverter** IF = f(VF) ## **Switching losses (typical), Diode, Inverter** Erec = f(IF) VCE = 400 V, VGE = -8 V, RG = 2.4 Ω **==> picture [540 x 596] intentionally omitted <==** **----- Start of picture text -----**<br> 2000 20<br>1900<br>1800 18<br>1700<br>1600 16<br>1500<br>1400 14<br>1300<br>1200 12<br>1100<br>1000 10<br>900<br>800 8<br>700<br>600 6<br>500<br>400 4<br>300<br>200 2<br>100<br>0 0<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 0 200 400 600 800 1000 1200<br>Switching losses (typical), Diode, Inverter Transient thermal impedance (typical), Diode,<br>Erec = f(RG) Inverter<br>VCE = 400 V, IF = 600 A Zth = f(t)<br>ΔV/Δt = 10 dm³/min, 50% water / 50% ethylene glycol , Tf<br>= 65 °C<br>20 1<br>18<br>16<br>14<br>0.1<br>12<br>10<br>8<br>0.01<br>6<br>4<br>2<br>0 0.001<br>0 2 4 6 8 10 12 14 16 18 20 0.001 0.01 0.1 1 10<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2025-07-01 11 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **==> picture [105 x 47] intentionally omitted <==** ## **5 Characteristics diagrams** **Thermal impedance (typical), Diode, Inverter Temperature characteristic (typical), Temperature** RthJF = f(ΔV/Δt) **sensor** Tf = 65 °C, 50% water / 50% ethylene glycol VTS = f(Tvj) **==> picture [228 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 0.188<br>0.186<br>0.184<br>0.182<br>0.180<br>0.178<br>0.176<br>0.174<br>0.172<br>0.170<br>0.168<br>4 5 6 7 8 9 10 11 12<br>**----- End of picture text -----**<br> **==> picture [229 x 252] intentionally omitted <==** **----- Start of picture text -----**<br> 3.00<br>2.90<br>2.80<br>2.70<br>2.60<br>2.50<br>2.40<br>2.30<br>2.20<br>2.10<br>2.00<br>1.90<br>1.80<br>1.70<br>1.60<br>1.50<br>1.40<br>1.30<br>1.20<br>1.10<br>1.00<br>-50 -25 0 25 50 75 100 125 150 175 200<br>**----- End of picture text -----**<br> Datasheet Revision 1.00 2025-07-01 12 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **==> picture [105 x 47] intentionally omitted <==** ## **6 Circuit diagram** ## **6 Circuit diagram** **==> picture [423 x 332] intentionally omitted <==** **----- Start of picture text -----**<br> P1 P2 P3<br>C1 C3 C5<br>G1 G3 G5<br>E1 E3 E5<br>TS1- TS3- TS5-<br>TS1+ TS3+ TS5+<br>U V W<br>C2 C4 C6<br>G2 G4 G6<br>E2 E4 E6<br>TS2+ TS4+ TS6+<br>N1 N2 N3<br>**----- End of picture text -----**<br> **Figure 1** Datasheet Revision 1.00 2025-07-01 13 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **==> picture [105 x 47] intentionally omitted <==** ## **7 Package outlines** ## **7 Package outlines** **==> picture [514 x 564] intentionally omitted <==** **----- Start of picture text -----**<br> Drawing: W00202300_08 Acc. to ISO 8015<br>B n 4,1 ` 0,1<br>6 +- 00,3 A1 HS1 A2 HS3 A3 HS4 A4<br>D2 D3<br>d 0,8 A B C D4<br>9,75 D1 H<br>5<br>0 0<br>2x 2,6<br>j 1,0 A B C 8<br>H<br>15,5<br>4x<br>4x 4 ` 0,3 j 1,0 A B C<br>2x<br>j 1,0 A B C<br>66,5<br>74,1<br>79,4<br>82<br>82,8 Y Y<br>90,75 87 L<br>d 0,8 A B C D8 D7 S D6 D5<br>6,35 HS8 HS7 HS5<br>A8 A7 A6 A5<br>H-H ( 2 : 1 )<br>6x (heatstaking dome) L ( 4 : 1 )<br>j 0,8 A B C<br>6x 4,9 ` 0,2 15,8<br>2x (HS4;HS8) A A1 to A8 j 0,4 A B C<br>j n 1,2 A B C<br>dimensioned for<br>EJOT Delta PT WN5451 30x10<br>(valid for PCB 1,6 ±0,16)<br>S ( 2 : 1 ) C<br>(22,44)<br>6x (15,7) 4 ` 0,1 Y-Y ( 2 : 1 )<br>j n 1,2 A B C principle view<br>6x 0,1 ` 0,175<br>Refered to nearest heatstaking dome<br>(D1;D3-D5;D7;D8 only).<br>Dome D2 and D6 without functionality.<br>Dome positions (6x) for PCB assembly<br>additionally checked by pin gauge<br>(6,4)<br>(15,17) (7,27)<br>4,1 ` 0,1<br>95,6639<br>(4,5)<br>59°<br>59,7 57,95 54,7 51,7 46,2 7,37 4,37 0 31,47 36,97 39,97 78,8 84,3 87,3 90,55 92,3<br>(8,5)<br>C<br>B<br>0,3 A<br>8,5 ` n 0,3<br>4x 8x j<br>0,15<br>`<br>4,5<br>n<br>8x<br>46,2 26 0 1,13 21 49,271 68 78,8<br>0,1<br>n 3 `<br>6x 2,5)<br>n (<br>(5,32)<br>(9,84) (7,6)<br>(4,52) (2,385) rotation bar to center of powertab<br>**----- End of picture text -----**<br> **Figure 2** Datasheet Revision 1.00 2025-07-01 14 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **==> picture [105 x 47] intentionally omitted <==** ## **7 Package outlines** **==> picture [494 x 419] intentionally omitted <==** **----- Start of picture text -----**<br> Drawing: W00215943_03 Acc. to ISO 8015<br>6x<br>6x 14 ` 0,2 B ( n 4,1) n 5,5 ` 0,1 j n 0,6 CZ A<br>3x 3x j n 1,2 A B C<br>j 1,0 A B C j 1,0 A B C<br>6x<br>j 1,0 A B C<br>6x 1 ` 0,1 N1-N3;P1-P3<br>22,25<br>16,25<br>A1 A2 A3 A4<br>N1 P1 N2 P2 N3 P3<br>A A1 to A8 0<br>2,6<br>79,4<br>82<br>A8 U V W A5<br>98,25 A7 A6<br>104,25<br>3x 1 ` 0,1<br>3x<br>3x j 1,0 A B C<br>j 1,0 A B C U;V;W<br>C<br>(4,1)<br>3x 14 ` 0,2 n 5,5 ` 0,1 3x j n 0,6 CZ A<br>j n 1,2 A B C<br>95,6639 59°<br>10,1 7,6 0<br>51,7 40,4 21,4 4,37 0 6,6 25,6 36,97 53,6 72,6 84,3<br>7,6 0 26,4 0 20,6 49,271 67,6<br>**----- End of picture text -----**<br> **Figure 3** Datasheet Revision 1.00 2025-07-01 15 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **==> picture [105 x 47] intentionally omitted <==** ## **7 Package outlines** **==> picture [481 x 440] intentionally omitted <==** **----- Start of picture text -----**<br> Drawing: W00205461_08 Acc. to ISO 8015<br>B n (4,1)<br>No pin higher than<br>heatstaking dome<br>0<br>A A1 to A8<br>L<br>18,85<br>45,35<br>C1 C3 C5<br>53,85 TS1+ TS3+ TS5+<br>65,75<br>69,85 E1 TS1- E3 TS3- E5 TS5-<br>82<br>C<br>(4,1)<br>L ( 4:1 )<br>All pin positions checked<br>with pin gauge according<br>to Application Note<br>95,6639 59°<br>46,9 34,75 26,65 14,5 0 0,1 12,25 20,35 32,5 47,1 59,25 67,35 79,5<br>C2 G2 E2 TS2+ C4 G4 E4 TS4+ C6 G6 E6 TS6+<br>G1 G3 G5<br>50,05 48,65 12,75 11,35 3,05 1,65 0 34,25 35,65 43,95 45,35 49,271 81,25 82,65<br>**----- End of picture text -----**<br> **Figure 4** Datasheet Revision 1.00 2025-07-01 16 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **8 Module label code** **==> picture [105 x 47] intentionally omitted <==** ## **8** ## **Module label code** |**Module label code**|**Module label code**|**Module label code**| |---|---|---| |Code format|Data Matrix|Barcode Code128| |Encoding|ASCII text|Code Set A| |Symbol size|16x16|23 digits| |Standard|IEC24720 and IEC16022|IEC8859-1| |||| |Code content|_Content_<br>Module serial number<br>Module material number<br>Production order number<br>Date code (production year)<br>Date code (production week)|_Digit_<br>1 – 5<br>6 - 11<br>12 - 19<br>20 – 21<br>22 – 23<br>_Example_<br>71549<br>142846<br>55054991<br>15<br>30| |Example|71549142846550549911530<br>71549142846550549911530|| |||| |**Packing label code**||| |Code format|Barcode Code128|| |Encoding|Code Set A|| |Symbol size|34 digits|| |Standard|IEC8859-1|| |||| |Code content|_Content_<br>Backend Construction Number<br>Production Lot Number<br>Serial Number<br>Date code<br>Box Quantity|_Identifier_<br>X<br>1T<br>S<br>9D<br>Q<br>_Digit_<br>2 – 9<br>12 – 19<br>21 – 25<br>28 – 31<br>33 – 34<br>_Example_<br>95056609<br>2X0003E0<br>754389<br>1139<br>15| |Example|X950566091T2X0003E0S754389D1139Q15|| ## **Figure 5** Datasheet Revision 1.00 2025-07-01 17 **FS1000R08A7P3B HybridPACK[™] Drive G2 module** **==> picture [105 x 47] intentionally omitted <==** **Revision history** ## **Revision history** |**Revision history**||| |---|---|---| |**Document revision**|**Date of release**|**Description of changes**| |0.10|2023-05-04|Initial version| |0.20|2025-02-26|Preliminary datasheet| |1.00|2025-07-01|Final datasheet| Datasheet Revision 1.00 2025-07-01 18 ## **Trademarks** All referenced product or service names and trademarks are the property of their respective owners. **Edition 2025-07-01 Important notice Published by** The information given in this document shall in no event be regarded as a guarantee of conditions or **Infineon Technologies AG** characteristics (“Beschaffenheitsgarantie”). **81726 Munich, Germany** With respect to any examples, hints or any typical values stated herein and/or any information regarding **© 2025 Infineon Technologies AG** the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities **All Rights Reserved.** of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. **Do you have a question about any aspect of this document?** In addition, any information given in this document is **Email: erratum@infineon.com** subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning **Document reference** customer’s products and any use of the product of **IFX-ABG372-003** Infineon Technologies in customer’s applications. ## 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Updated at April 28, 2026
Infineon Technologies is a globally recognized leader in semiconductor solutions, renowned for driving innovation in power management, energy efficiency, and modern mobility. With a strong legacy of engineering excellence, the company provides highly reliable components designed to meet the rigorous demands of industrial, automotive, and advanced commercial applications. The core of our Infineon portfolio is centered on their industry-leading discrete semiconductors. We offer an extensive selection of single and dual MOSFETs, alongside a robust range of single IGBTs and advanced IGBT modules. These flagship power transistors are essential for high-efficiency power conversion and motor control, providing engineers with superior thermal performance and minimized switching losses. Beyond advanced field-effect transistors, the selection includes a comprehensive array of diodes and rectifiers, heavily featuring Schottky diodes, as well as fast-recovery and RF/PIN diodes. This power foundation is further supported by bipolar transistors, intelligent power modules, and thyristor SCR modules, delivering the critical building blocks required for complex power system designs. To support broader system integration, the portfolio also encompasses specialized solutions such as solid-state relays, AC/DC LED driver ICs, and Bluetooth communications modules. From high-power industrial rectifiers to wireless connectivity adapters, Infineon equips designers with the precision components needed to build efficient, scalable, and fully connected electronic systems.
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