FL77904MX

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## **FL77904** 

## **Phase-cut Dimmable Compact LED Direct AC Driver** 

## **Features** 

- The simplest Direct AC LED Driver with Only Two External RC Passive Components 

- Wide AC Input Range: 90~305 VAC 

- Four Integrated High-Voltage LED Constant Current Sinks of up to 75 mA RMS Input Current Capability 

- High Power Factor (above 0.98 in normal configuration) Low Harmonic Content (THD under 20% in normal configuration) 

- Low Flicker Index by Self Valley Fill with No Degradation of PF and THD 

- Adjustable LED Power with an External Current Sense Resistor 

- TRIAC Dimmable (Leading/Trailing Edge) 

- Rheostat Dimmable Flexible LED Forward Voltage Configuration 

- Power Scalability with Multiple Driver ICs 

- Over-Temperature Protection (OTP) 

- Compact SOIC 8-Lead Package 

## **Description** 

The FL77904 is a direct AC line LED driver with a minimal number of external RC passive components. In normal configuration, one resistor adjusts LED current for desired system luminance and another bypass capacitor provides a stable voltage to an internal biasing shunt regulator. 

The FL77904 provides phase-cut dimming with wide dimming range, smooth dimming control and good dimmer compatibility. Optimized levels of each LED strings’ current regulation achieve over 0.98 high PF and less than 20% low THD which makes the FL77904 suitable for high-efficiency LED lighting systems. The FL77904 can be also used with a simple rheostat dimmer switches which are suitable for desktop or indoor lamps. 

Flicker index is significantly improved by using proprietary self valley fill technique without degrading PF and THD. The cost effective solution brings low line ripple light quality with system compactness. 

Operation of FL77904 admits driving higher-wattage systems, such as street lights and down lights, by simply parallel connecting the driver ICs. 

## **Applications** 

- General LED Driving Solution for Residential, Commercial and Industrial Lighting 

## **Ordering Information** 

|**Part Number**|**Operating**<br>**Temperature Range**|**Package**|**Packing**<br>**Method**|
|---|---|---|---|
|FL77904MX|-40 to 125°C|8-Lead, Small Outline Integrated Circuit<br>(SOIC) JEDEC MS012 150” Narrow Body,<br>Exposed Pad|2,500 per Reel|



© 2016 Fairchild Semiconductor Corporation FL77904  •  Rev. 1.1 

www.fairchildsemi.com 

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Typical Application<br>2K<br>(Option)<br>Bridge  VIN<br>renee Rectifier LED1<br>VDD<br>Fuse LED2<br>LED3<br>CVDD LED4<br>0.1µF, 50V CS GND<br>RCS<br>1% Forward voltage (VF)<br>across each LED group is<br>adjustable as desired.<br>GND<br>Figure 1.  Typical Application Schematic<br>Block Diagram<br>VIN<br>1<br>2 LED1<br>Shunt  LED Current<br>VDD 8 Regulator Modulator 3 LED2<br>4 LED3<br>Over- LED<br>Temperature Current  5 LED4<br>Protection Feedback<br>6 7<br>pani<br>GND CS<br>Figure 2.  Simplified FL77904 Block Diagram<br>FL77904<br>M.O.V<br>**----- End of picture text -----**<br>


© 2016 Fairchild Semiconductor Corporation FL77904• Rev. 1.1 

www.fairchildsemi.com 

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## **Pin Configuration** 

|2<br>3<br>1<br>4<br>VIN<br>LED1<br>LED2<br>LED3|2<br>3<br>1<br>4<br>VIN<br>LED1<br>LED2<br>LED3|2<br>3<br>1<br>4<br>VIN<br>LED1<br>LED2<br>LED3|||8<br>6<br>7<br>5<br>VDD<br>CS<br>GND<br>LED4|8<br>6<br>7<br>5<br>VDD<br>CS<br>GND<br>LED4|
|---|---|---|---|---|---|---|
|||1|||8||
||||||||
|||2|||7||
||||||||
|||3|||6||
||||||||
|||4|||5||
||||||||



**Figure 3. Pin Configuration (Top View)** 

## **Thermal Characteristics[(1) (2)]** 

|**Component**|**Package**|**JA**<br>**(1S PCB)**|**JA**<br>**(2S2P PCB)**|**Units**|
|---|---|---|---|---|
|FL77904MX|8-Lead, Small Outline Integrated Circuit (SOIC)<br>JEDEC MS012 150” Narrow Body, Exposed Pad|156|37|°C/W|



## **Notes:** 

1. Θ JA: Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, and airflow. The value given is for natural convection with no heatsink using the 1S and  2S2P boards, as specified in JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate. 

2. Junction-to-ambient thermal resistance is highly dependent on application and PCB layout. In application where the device dissipates high levels of power during operation, special care of thermal dissipation issues in PCB design must be taken. 

## **Pin Definitions** 

|**Pin#**|**Name**|**Description**|
|---|---|---|
|1|VIN|**Rectified AC Input Voltage**. Connect this pin to rectified AC voltage after a bridge rectifier.|
|2|LED1|**LED String Cathodes**. Connect cathode(s) of each LED group to these pins.|
|3|LED2||
|4|LED3||
|5|LED4||
|6|GND|**Ground Reference Pin**. Tie this pin directly to local ground plane. This ground should not be<br>tied to earthground because it is not isolated from AC mains.|
|7|CS|**LED Current Sense**. Limits the LED current depending on voltage across sensing resistor.<br>The CSpin is used to set the LED current regulation target.|
|8|VDD|**Internal Biasing Shunt Regulator Output**. This pin supplies current to internal circuitry. A<br>17-V shunt regulator is internally connected to this pin. A bypassing capacitor is<br>recommended to be added to reduce noise from VIN.|
|0|EP|**Exposed Thermal Pad**. EP is not tied to GND inside the IC. It is recommended to tie it to<br>GND externally.|



© 2016 Fairchild Semiconductor Corporation FL77904  •  Rev. 1.1 

www.fairchildsemi.com 

3 

## **Absolute Maximum Ratings** 

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. 

|**Symbol**|**Parameter**|**Min.**|**Max.**|**Unit**|
|---|---|---|---|---|
|VIN|VIN Voltage|-0.3|500|V|
|VLED1|LED1 Pin Voltage|-0.3|500|V|
|VLED2|LED2 Pin Voltage|-0.3|500|V|
|VLED3|LED3 Pin Voltage|-0.3|500|V|
|VLED4|LED4 Pin Voltage|-0.3|200|V|
|VCS|CS Pin Voltage|-0.3|6|V|
|TJ|Junction Temperature|-55|+150|ºC|
|TSTG|Storage Temperature|-65|+150|ºC|
|ILED1|LED1 Current||60|mA|
|ILED2|LED2 Current||80|mA|
|ILED3|LED3 Current||100|mA|
|ILED4|LED4 Current||150|mA|



## **Notes:** 

3. Stress beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. 

4. All voltage values, except differential voltages, are given with respect to the GND pin. 

5. Human Body Model, ANSI/ESDA/JEDEC JS-001-2012: 0.8 kV at Pins 1~4, 0.4 kV at Pin 5, 1.5 kV at Pins 7~8. 

6. Charged Device Model, JESD22-C101: 1.0 kV at Pins 1~8. 

## **Recommended Operating Conditions** 

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. 

|**Symbol**|**Parameter**|**Min.**|**Max.**|**Unit**|
|---|---|---|---|---|
|Tj|Operating Junction Temperature|-40|+125|°C|



© 2016 Fairchild Semiconductor Corporation FL77904  •  Rev. 1.1 

www.fairchildsemi.com 

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## **Electrical Characteristics** 

Unless otherwise noted, RCS = 10 Ω, and TA = 25°C. Currents are defined as positive into the device and negative out of the device. 

|of the device.|||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|**VIN Supply**|||||||
|IQUIES.VIN|VINQuiescent Current|VIN= 500 V Maximum||0.75|1.20|mA|
|**VDD Output**|||||||
|VDD|VDD Voltage|VIN= 20.0 V|16|17|18|V|
|**LED Current**|||||||
|ILED1|LED1 Current|VIN= 20.0 V, VLED1= 20.0 V|17.4|23.0|28.6|mA|
|ILED2|LED2 Current|VIN= 20.0 V, VLED2= 20.0 V|40.4|47.0|53.6|mA|
|ILED3|LED3 Current|VIN= 20.0 V, VLED3= 35.0 V|78.2|86.0|93.8|mA|
|ILED4|LED4 Current|VIN= 20.0 V, VLED4= 20.0 V|87.8|96.0|104.2|mA|
|**Over-Temperature Protection**|||||||
|TOTP|OTP Temperature(7)|||170||°C|
|**Leakage Current**|||||||
|ILED1-LK|LED1 Leakage Current|VLED1= 500 V, VIN= 0 V|||1|µA|
|ILED2-LK|LED2 Leakage Current|VLED2= 500 V, VIN= 0 V|||1|µA|
|ILED3-LK|LED3 Leakage Current|VLED3= 500 V, VIN= 0 V|||1|µA|
|ILED4-LK|LED4 Leakage Current|VLED4= 200 V, VIN= 0 V|||1|µA|



## **Notes:** 

7. Not tested in production. Internal over-temperature protection circuitry protects the device from permanent damage. LEDs shut down at the junction temperature of TJ=170°C (typical.). 

© 2016 Fairchild Semiconductor Corporation FL77904  •  Rev. 1.1 

www.fairchildsemi.com 

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## **Typical Performance Characteristics** 

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1.1 1.03<br>1.02<br>1.05<br>1.01<br>1 1<br>0.99<br>0.95<br>0.98<br>0.9 0.97<br>-40 -20 0 25 40 60 80 100 120 140 -40 -20 0 25 40 60 80 100 120 140<br>Temperature (ºC) Temperature (ºC)<br>Figure 4.  IQUIES.VIN vs. Temperature  Figure 5.  VDD vs. Temperature<br>1.03 1.03<br>1.02 1.02<br>1.01 1.01<br>1 1<br>0.99 0.99<br>0.98 0.98<br>0.97 0.97<br>-40 -20 0 25 40 60 80 100 120 140 -40 -20 0 25 40 60 80 100 120 140<br>Temperature (ºC) Temperature (ºC)<br>Figure 6.  ILED1 vs. Temperature  Figure 7.  ILED2 vs. Temperature<br>1.03 1.03<br>1.02 1.02<br>1.01 1.01<br>1 1<br>0.99 0.99<br>0.98 0.98<br>0.97 0.97<br>-40 -20 0 25 40 60 80 100 120 140 -40 -20 0 25 40 60 80 100 120 140<br>Temperature (ºC) Temperature (ºC)<br>Figure 8.  ILED3 vs. Temperature  Figure 9.  ILED4 vs. Temperature<br>Normalized to 25 °C<br>Normalized to 25 °C<br>Normalized to 25 °C<br>Normalized to 25 °C<br>Normalized to 25 °C<br>Normalized to 25 °C<br>**----- End of picture text -----**<br>


© 2016 Fairchild Semiconductor Corporation FL77904  •  Rev. 1.1 

www.fairchildsemi.com 

6 

## **Functional Description** 

The FL77904 can drive LED strings attached directly to the rectified AC mains using only two external RC components (RCS and CVDD). With 4 integrated high voltage current sink, LED current in each string is precisely controlled with system compactness. High PF and low THD are obtained by the optimized current sink levels. Phase-cut dimming is easily obtained with wide dimming range and good dimmer compatibility. Flicker index in the direct AC drive topology can be improved by adopting proprietary self valley-fill solution. 

## **Operation** 

When the rectified AC line voltage, VIN, is higher than the forward voltage of the consecutive LED groups, each LED group turns on automatically as the corresponding current sink has enough voltage headroom across it. Each current sink increases up to the predefined current level and maintains the level until the following channel current sink gets enough voltage headroom across it. 

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AC Line<br>LED Current<br>Voltage (VIN)<br>(IF)<br>ILED4 VF1'''+VF2''+VF3'+VF4<br>ILED3 VF1''+VF2'+VF3<br>ILED2 VF1'+VF2<br>ILED1 VF1<br>tD1 tD2 tD3 tD4 tD3 tD2 tD1<br>**----- End of picture text -----**<br>


- tD1: Current is directed to LED1 pin through 1[st] LED group. 

- tD2: Current is directed to LED2 pin through 1[st] and 2[nd] LED groups. 

harmonic contents and improves power factor as well as Electromagnetic Interference (EMI) characteristics. 

By fully utilizing available headroom, the FL77904 offers high efficiency, power factor and low harmonic distortion. Typically, power factor is higher than 0.98 and THD is lower than 20%. The efficiency heavily depends on a LED configuration. 

## **LED Current and Power Setting** 

The LED current is managed by an external current sense resistor RCS. Regulation target of each channel's current sink is calculated as follows. 

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Root-mean-square (RMS) value of the input current can be calculated using the peak regulated current, ILED4, and crest factor. Since the LED current waveform is similar to the AC line voltage, the crest factor is close to the crest factor of a sine wave, √2=1.414. But the actual crest factor depends on the flattened time of the ILED4 and LED configuration. With FL77904, the typical crest factor is approximately 1.35. Thus, based on estimated input power, PIN, the RCS resistor value can be calculated as follows. 

**==> picture [210 x 28] intentionally omitted <==**

- tD3: Current is directed to LED3 pin through 1[st] , 2[nd] , and 3[rd] LED groups. 

- tD4: Current is directed to LED4 pin through 1[st] , 2[nd] , 3[rd] , and 4[th] LED groups. 

- VF1/VF1'/VF1''/VF1''': Forward voltage at forward current of ILED1/ILED2/ILED3/ILED4 in 1[st] LED group. 

- VF2/VF2'/VF2'': Forward voltage at forward current of ILED2/ILED3/ILED4 in 2[nd] LED group. 

- VF3/VF3': Forward voltage at forward current of ILED3/ILED4 in 3[rd] LED group. 

- VF4: Forward voltage at forward current of ILED4 in 4[th] LED group. 

## **Figure 10. FL77904 Operation** 

When VIN reaches the forward voltage across the 1st LED group (VF1) at forward current IF = ILED1, the current drawn from the VIN is directed to the LED1 through the 1st LED group. In sequence, when VIN reaches forward voltage across the 1st and 2nd LED groups (VF1'+VF2) at IF = ILED2, the current is directed to LED2 across the 1st and 2nd LED groups. Then, when VIN reaches VF1''+VF2'+VF3 at IF=ILED3, the LED current go through 1st, 2nd, and 3rd LED groups and sinks to the LED3. Finally, when VIN reaches VF1'''+VF2''+VF3'+VF4 at IF=ILED4, the current goes through all 4 LED groups and is directed to the LED4. 

Whenever the active channel (one that is sinking LED current) is changed from one channel to the adjacent channel with respect to the change in the VIN, the new active channel's current increases gradually while the existing active channel's current decreases gradually. This smooth current transition reduces frequency 

The actual RCS needs to be adjusted with respect to the LED configuration. 

## **LED Configuration** 

In the LED configuration, it is required to increase the total LED forward voltage to improve efficiency. For example, compared to using 4 LEDs with VF of 60 V (total VF = 60 V x 4 channels = 240 V) for each LED group, using 4 LEDs with VF equal to 65 V (total VF = 65 V x 4 channels = 260 V) will improve the efficiency simply due to the higher total VF. Each LED channel can have different VF. For example, if a design is implemented with 144 pieces of 3-V LEDs for replacement of 2-feet fluorescent lamp, designer can assign flexible numbers of LEDs for LED channels such as 25s2p-32s2p-6s2p-18s1p (“s” stands for LEDs in series and “p” stands for LEDs in parallel) or 18s2p18s2p-18s2p-36s1p. 

In any LED structure, VF of first LED group should be higher than VIN-pin turn-on voltage, which is 20 V. If the VF of the first LED group is configured to be lower than VIN-pin turn-on voltage, ILED1 will not have the correct regulation level when input voltage, VIN, is just exceeds the VF. 

© 2016 Fairchild Semiconductor Corporation FL77904  •  Rev. 1.1 

www.fairchildsemi.com 

7 

A good starting point for choosing a LED configuration is to have about 260 V~280 V of the total VF for 220 VAC mains and 130 V~140 V of the total VF for 120 VAC. 

## **Internal Shunt Regulator Output, VDD** 

The system implemented with FL77904 does not require a bulk capacitor after bridge-rectification diodes. As a result, the VDD, which supplies biasing voltage for the FL77904, has voltage ripple like the rectification voltage after the bridge diodes as shown in Figure 11. 

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VIN<br>VDD<br>VDD valley<br>Figure 11.  VDD Ripple without CVDD<br>**----- End of picture text -----**<br>


The VDD ripple can be reduced by a bypassing capacitor, CVDD. If the CVDD is not used, or its value is small, the VDD voltage fluctuates and goes even down to 0 V. It makes the FL77904 reset, but the FL77904 automatically restarts every cycle when the AC line voltage reaches a certain level. General design suggestion is to add CVDD for noise filtering. The recommended CVDD value is 1 µF with 50 V of voltage rating. 

## **Over-Temperature Protection (OTP)** 

The FL77904 provides over temperature protection (OTP) inherently. When the driver's junction temperature exceeds a specified threshold temperature (TJ = 170°C), the driver will shut down automatically and recover once the temperature drops lower enough than the internal threshold temperature. Without this protection, the lifetime of the FL77904 can be reduced and irreparable damage can occur. Good thermal management is required to achieve best performance and long life span of the FL77904. 

© 2016 Fairchild Semiconductor Corporation FL77904  •  Rev. 1.1 

www.fairchildsemi.com 

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[5.10] A<br>4.70<br>B  3.20<br>8 5<br> 1.75<br>[4.10] [6.20]  2.30   5.60<br>3.70 5.80<br>PIN #1<br>1 4<br>1.27 [0.51] 1.27  0.65<br>0.31<br>0.25 [M] C B A LAND PATTERN RECOMMENDATION<br>TOP VIEW [0.50]<br>0.25<br>[1.50] [0.70]<br>1.25 0.60 B<br>C<br>[8°]<br>0°<br>0.10 C<br> 1.75 MAX  [0.25] [0.25] [0.90]<br>0.05 0.10 0.40<br>FRONT VIEW SIDE VIEW 1.05 0.25<br>1 4 DETAIL B<br>SCALE 2:1<br>NOTES:<br>A. NO INDUSTRY STANDARD APPLIES TO THIS<br>[2.56]     PACKAGE<br>2.05 B. ALL DIMENSIONS ARE IN MILLIMETERS<br>C. DIMENSIONS DO NOT INCLUDE MOLD FLASH<br>     OR BURRS<br>D. DRAWING FILENAME: MKT-M08Frev2<br>8 5<br>[3.45]<br>2.09<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


ON Semiconductor and      are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

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