FFSB0665B-F085
Silicon Carbide Schottky Diode, EliteSiC, EliteSiC Series, Single, 650 V, 6 A, 16 nC
- Manufacturer: ONSEMI
- Product type: Silicon Carbide Schottky Diodes
- SVHC: Lead (25-Jun-2025)
- No. of Pins: 3 Pin
- Product Range: EliteSiC Series
- Qualification: AEC-Q101
- Diode Mounting: Surface Mount
- Diode Case Style: TO-263 (D2PAK)
- Diode Configuration: Single
- Average Forward Current: 6A
- Total Capacitive Charge: 16nC
- Operating Temperature Max: 175°C
- Repetitive Peak Reverse Voltage: 650V
| Delivery and price | |
|---|---|
| Units per pack | 800 |
| Price | 1.18 € |
| Current stock | 10+ |
| Lead time | 30 days |
**DATA SHEET www.onsemi.com** ## Silicon Carbide (SiC) Schottky Diode – EliteSiC, 6 A, 650 V, D2, D2PAK-2L ## FFSB0665B-F085 Silicon Carbide (SiC) Schottky Diodes use a completely new technology that provides superior switching performance and higher reliability compared to Silicon. No reverse recovery current, temperature independent switching characteristics, and excellent thermal performance sets Silicon Carbide as the next generation of power semiconductor. System benefits include highest efficiency, faster operating frequency, increased power density, reduced EMI, and reduced system size and cost. ## **Features** - Max Junction Temperature 175 C **==> picture [192 x 211] intentionally omitted <==** **----- Start of picture text -----**<br> VRRM IF<br>650 V 6.0 A<br>Cathode Anode<br>Schottky Diode<br>Cathode<br>Cathode<br>Anode<br>D [2] PAK2 (TO−263−2L)<br>CASE 418BK<br>**----- End of picture text -----**<br> - Avalanche Rated 24.5 mJ - High Surge Current Capacity ## **MARKING DIAGRAM** - Positive Temperature Coefficient - Ease of Paralleling - No Reverse Recovery / No Forward Recovery - AEC−Q101 Qualified and PPAP Capable - These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant ## **Applications** - Automotive HEV−EV Onboard Chargers - Automotive HEV−EV DC−DC Converters ## **MAXIMUM RATINGS** (TJ = 25C unless otherwise noted) |**MAXIMUM RATINGS**(TJ= 25C unless otherw|**MAXIMUM RATINGS**(TJ= 25C unless otherw|ise noted)||| |---|---|---|---|---| |**Parameter**||**Symbol**|**Value**|**Unit**| |Peak Repetitive Reverse Voltage||VRRM|650|V| |Single Pulse Avalanche Energy (TJ= 25C,<br>IL(pk)= 9.9 A, L = 0.5 mH, V = 50 V)||EAS|24.5|mJ| |Continuous Rectified Forward<br>Current|@ TC< 150|IF|6.0|A| ||@ TC< 135||8.0|| |Non−Repetitive Peak Forward<br>Surge Current|TC= 25C<br>tP= 10�s|IFM|523|A| ||TC= 150C<br>tP= 10�s||467|| |Non−Repetitive Forward Surge<br>Current (Half−Sine Pulse)|TC= 25C<br>tP= 8.3 ms|IFSM|45|A| |Power Dissipation|TC= 25C|Ptot|61|W| ||TC= 150C||10|| |Operating Junction and Storage Temperature<br>Range||TJ, Tstg|−55 to<br>+175|C| **==> picture [155 x 135] intentionally omitted <==** **----- Start of picture text -----**<br> AYWWZZ<br>FFSB<br>0665B<br>A = Assembly Plant Code<br>YWW = Date Code (Year & Week)<br>ZZ = Lot Code<br>FFSB0665B = Specific Device Code<br>**----- End of picture text -----**<br> ## **ORDERING INFORMATION** See detailed ordering and shipping information on page 2 of this data sheet. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Publication Order Number: **FFSB0665B−F085/D** **1** Semiconductor Components Industries, LLC, 2019 **February, 2023 − Rev. 3** **FFSB0665B−F085** ## **THERMAL CHARACTERISTICS** |**THERMAL CHARACTERISTICS**|||| |---|---|---|---| |**Parameter**|**Symbol**|**Value**|**Unit**| |Thermal Resistance, Junction−to−Case, Max.|R�JC|2.46|C/W| ## **ELECTRICAL CHARACTERISTICS** (TJ = 25C unless otherwise noted) |**ELECTRICAL CHARACTERISTIC**|**S**(TJ= 25C un|less otherwise noted)||||| |---|---|---|---|---|---|---| |**Parameter**|**Symbol**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**| |**ON CHARACTERISTICS**||||||| |Forward Voltage|VF|IF= 6.0 A, TJ= 25C||1.38|1.7|V| |||IF= 6.0 A, TJ= 125C||1.53|2.0|| |||IF= 6.0 A, TJ= 175C||1.67|2.4|| |Reverse Current|IR|VR= 650 V, TJ= 25C||0.5|40|�A| |||VR= 650 V, TJ= 125C||1.0|80|| |||VR= 650 V, TJ= 175C||2.0|160|| |**CHARGES, CAPACITANCES & GATE**|**RESISTANCE**|||||| |Total Capacitive Charge|QC|VC= 400 V||16||nC| ||Ctot|VR= 1 V, f = 100 kHz||259||pF| |||VR= 200 V, f = 100 kHz||29||| |||VR= 400 V, f = 100 kHz||22||| Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. ## **PACKAGE MARKING AND ORDERING INFORMATION** |**Part Number**|**Top Marking**|**Package**|**Packing Method**|**Reel Size**|**Tape Width**|**Quantity**| |---|---|---|---|---|---|---| |FFSB0665B−F085|FFSB0665B|D2PAK2<br>(TO−263−2L)|Tape & Reel†|330 mm|24 mm|800 Units| †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. **www.onsemi.com** **2** **FFSB0665B−F085** ## **TYPICAL CHARACTERISTICS** **==> picture [235 x 375] intentionally omitted <==** **----- Start of picture text -----**<br> 12<br>TJ = −55 [o] C<br>TJ = 25 [o] C<br>9<br>TJ = 75 [o] C<br>TJ = 175 [o] C<br>TJ = 125 [o] C<br>6<br>3<br>0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0<br>VF, FORWARD VOLTAGE (V)<br>Figure 1. Forward Characteristics<br>80<br>D = 0.1<br>60<br>D = 0.2<br>40<br>D = 0.3<br>D = 0.5<br>20<br>D = 0.7 D = 1<br>0<br>25 50 75 100 125 150 175<br>TC , CASE TEMPERATURE ( [o] C )<br>, FORWARD CURRENT (A)<br>IF<br>, PEAK FORWARD CURRENT (A)<br>IF<br>**----- End of picture text -----**<br> **==> picture [240 x 177] intentionally omitted <==** **----- Start of picture text -----**<br> 10 −6<br>10 −7<br>T J = 175 [o] C<br>10 −8 TJ = 125 [o] C<br>TJ = 75 [o] C<br>T J = 25 [o] C<br>TJ = −55 [o] C<br>10 −9<br>0 100 200 300 400 500 600 650<br>V R , REVERSE VOLTAGE (V)<br>, REVERSE CURRENT (A)<br>IR<br>**----- End of picture text -----**<br> **Figure 2. Reverse Characteristics** **==> picture [232 x 174] intentionally omitted <==** **----- Start of picture text -----**<br> 80<br>60<br>40<br>20<br>0<br>25 50 75 100 125 150 175<br>TC , CASE TEMPERATURE ( [o] C )<br>, POWER DISSIPATION (W)<br>TOT<br>P<br>**----- End of picture text -----**<br> **Figure 3. Current Derating** **Figure 4. Power Derating** **==> picture [487 x 176] intentionally omitted <==** **----- Start of picture text -----**<br> 25 1000<br>20<br>15<br>100<br>10<br>5<br>0 10<br>0 100 200 300 400 500 600 650 0.1 1 10 100 650<br>VR, REVERSE VOLTAGE (V) V R , REVERSE VOLTAGE (V)<br>CAPACITANCE (pF)<br>, CAPACITIVE CHARGE (nC)<br>C<br>Q<br>**----- End of picture text -----**<br> **Figure 5. Capacitive Charge vs. Reverse Voltage** **Figure 6. Capacitance vs. Reverse Voltage** **www.onsemi.com** **3** **FFSB0665B−F085** ## **TYPICAL CHARACTERISTICS** **==> picture [490 x 393] intentionally omitted <==** **----- Start of picture text -----**<br> 6<br>4<br>2<br>0<br>0 100 200 300 400 500 600 650<br>V R , REVERSE VOLTAGE (V)<br>Figure 7. Capacitance Stored Energy<br>2<br>DUTY CYCLE−DESCENDING ORDER<br>1<br>D=0.5<br>0.1<br>D=0.2<br>D=0.1<br>D=0.05<br>0.01 D=0.02<br>D=0.01<br>SINGLE PULSE<br>0.001<br>10 −6 10 −5 10 −4 10 −3 10 −2 10 −1 1<br>t, RECTANGULAR PULSE DURATION (sec)<br>J)<br> �<br>, CAPACITIVE ENERGY (<br>C<br>E<br>THERMAL RESISTANCE<br>r(t), NORMALIZED EFFECTIVE TRANSIENT<br>**----- End of picture text -----**<br> **Figure 8. Junction−to−Case Transient Thermal Response** **www.onsemi.com** **4** MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** **==> picture [55 x 38] intentionally omitted <==** **D[2] PAK2 (TO−263−2L)** CASE 418BK ISSUE O **==> picture [81 x 8] intentionally omitted <==** **----- Start of picture text -----**<br> DATE 02 AUG 2018<br>**----- End of picture text -----**<br> **==> picture [93 x 19] intentionally omitted <==** **----- Start of picture text -----**<br> GENERIC<br>MARKING DIAGRAM*<br>**----- End of picture text -----**<br> **==> picture [101 x 140] intentionally omitted <==** **----- Start of picture text -----**<br> XXXXXXXXG<br>AYWW<br>XXX = Specific Device Code<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>G = Pb−Free Package<br>**----- End of picture text -----**<br> **==> picture [101 x 89] intentionally omitted <==** *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ � ”, may or may not be present. Some products may not follow the Generic Marking. Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98AON93788G** Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. **DESCRIPTION: D[2] PAK2 (TO−263−2L) PAGE 1 OF 1** **onsemi** and are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. www.onsemi.com © Semiconductor Components Industries, LLC, 2018 **onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. ## **ADDITIONAL INFORMATION** **TECHNICAL PUBLICATIONS** : **ONLINE SUPPORT** : www.onsemi.com/support **Technical Library:** www.onsemi.com/design/resources/technical−documentation **For additional information, please contact your local Sales Representative at onsemi Website:** www.onsemi.com www.onsemi.com/support/sales **==> picture [232 x 43] intentionally omitted <==**
Updated at April 28, 2026
onsemi is a premier global supplier of intelligent power and sensing technologies, driving disruptive innovations across the automotive, industrial, and cloud infrastructure markets. Recognized for their commitment to sustainability and reliable supply chains, the company accelerates advancements in vehicle electrification, industrial automation, and 5G networks by solving the industry's most complex design challenges. At the core of their portfolio is an industry-leading selection of discrete semiconductors. This extensive range features thousands of high-performance bipolar transistors, single and dual MOSFETs, and a comprehensive array of diodes, including Zener, Schottky, and fast-recovery rectifiers. Engineered for superior thermal performance and energy efficiency, these foundational components are critical for demanding power conversion, switching, and signal conditioning applications. Beyond essential discretes, onsemi provides a robust suite of advanced power management and circuit protection solutions. Their lineup includes intelligent power modules, single IGBTs, and transient voltage suppression (TVS) diodes designed to safeguard sensitive circuitry. Complimented by integrated passive filters, AC/DC LED driver ICs, and specialized sub-2.4GHz RF transceivers, onsemi equips engineers with the scalable, high-quality technologies needed to build a cleaner, smarter, and more connected world.
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