FF150R12KE3GB2HOSA1
IGBT Module, Dual, 225 A, 1.7 V, 780 W, 125 °C, Module
- Manufacturer: INFINEON
- Product type: IGBT Modules
- SVHC: No SVHC (25-Jun-2025)
- Product Range: C Series
- IGBT Technology: IGBT 3 [Trench/Field Stop]
- IGBT Termination: Stud
- Power Dissipation: 780W
- IGBT Configuration: Dual
- Transistor Mounting: Panel
- DC Collector Current: 225A
- Power Dissipation Pd: 780W
- Transistor Case Style: Module
- Operating Temperature Max: 125°C
- Junction Temperature Tj Max: 125°C
- Continuous Collector Current: 225A
- Collector Emitter Voltage Max: 1.2kV
- Collector Emitter Voltage V(br)ceo: 1.2kV
- Collector Emitter Saturation Voltage: 1.7V
- Collector Emitter Saturation Voltage Vce(on): 1.7V
| Delivery and price | |
|---|---|
| Units per pack | 50 |
| Price | 77.5 € |
| Current stock | 10+ |
| Lead time | 30 days |
## Technische�Information�/�Technical�Information > IGBT-ModuleIGBT-modules FF150R12KE3G **==> picture [86 x 38] intentionally omitted <==** 62mm�C-Serien�Modul�mit�Trench/Feldstop�IGBT3�und�Emitter�Controlled�High�Efficiency�Diode� 62mm�C-series�module�with�the�trench/fieldstop�IGBT3�and�Emitter�Controlled�High�Efficiency�diode� ## **IGBT,Wechselrichter�/�IGBT,Inverter** ## **Höchstzulässige�Werte�/�Maximum�Rated�Values** |TechnischeInformation/TechnicalInformation<br>FF150R12KE3G<br>IGBT-Module<br>IGBT-modules|| |---|---| |62mmC-SerienModulmitTrench/FeldstopIGBT3undEmitterControlledHighEfficiencyDiode<br>62mmC-seriesmodulewiththetrench/fieldstopIGBT3andEmitterControlledHighEfficiencydiode<br>preparedby:MM<br>approvedby:WR<br>dateofpublication:2013-10-02<br>revision:3.2<br>**IGBT,Wechselrichter/IGBT,Inverter**<br>**HöchstzulässigeWerte/MaximumRatedValues**<br>Kollektor-Emitter-Sperrspannung<br>Collector-emittervoltage<br>Tvj= 25°C<br>VCES<br>1200<br>V<br>Kollektor-Dauergleichstrom<br>ContinuousDCcollectorcurrent<br>TC= 80°C, Tvj max= 150°C<br>TC= 25°C, Tvj max= 150°C<br>IC nom<br>IC<br>150<br>225<br>A<br>A<br>PeriodischerKollektor-Spitzenstrom<br>Repetitivepeakcollectorcurrent<br>tP= 1 ms<br>ICRM<br>300<br>A<br>Gesamt-Verlustleistung<br>Totalpowerdissipation<br>TC= 25°C, Tvj max= 150<br>Ptot<br>780<br>W<br>Gate-Emitter-Spitzenspannung<br>Gate-emitterpeakvoltage<br>VGES<br>+/-20<br>V<br>**CharakteristischeWerte/CharacteristicValues**<br>min.<br>typ.<br>max.<br>Kollektor-Emitter-Sättigungsspannung<br>Collector-emittersaturationvoltage<br>IC= 150 A, VGE= 15 V<br>IC= 150 A, VGE= 15 V<br>VCE sat<br>1,70<br>2,00<br>2,15<br>V<br>V<br>Tvj= 25°C<br>Tvj= 125°C<br>Gate-Schwellenspannung<br>Gatethresholdvoltage<br>IC= 6,00 mA, VCE= VGE, Tvj= 25°C<br>VGEth<br>5,0<br>5,8<br>6,5<br>V<br>Gateladung<br>Gatecharge<br>VGE= -15 V ... +15 V<br>QG<br>1,40<br>µC<br>InternerGatewiderstand<br>Internalgateresistor<br>Tvj= 25°C<br>RGint<br>5,0<br>Ω<br>Eingangskapazität<br>Inputcapacitance<br>f = 1 MHz, Tvj= 25°C, VCE= 25 V, VGE= 0 V<br>Cies<br>11,0<br>nF<br>Rückwirkungskapazität<br>Reversetransfercapacitance<br>f = 1 MHz, Tvj= 25°C, VCE= 25 V, VGE= 0 V<br>Cres<br>0,50<br>nF<br>Kollektor-Emitter-Reststrom<br>Collector-emittercut-offcurrent<br>VCE= 1200 V, VGE= 0 V, Tvj= 25°C<br>ICES<br>5,0<br>mA<br>Gate-Emitter-Reststrom<br>Gate-emitterleakagecurrent<br>VCE= 0 V, VGE= 20 V, Tvj= 25°C<br>IGES<br>400<br>nA<br>Einschaltverzögerungszeit,induktiveLast<br>Turn-ondelaytime,inductiveload<br>IC= 150 A, VCE= 600 V<br>VGE= ±15 V<br>RGon= 4,8Ω<br>td on<br>0,25<br>0,30<br>µs<br>µs<br>Tvj= 25°C<br>Tvj= 125°C<br>Anstiegszeit,induktiveLast<br>Risetime,inductiveload<br>IC= 150 A, VCE= 600 V<br>VGE= ±15 V<br>RGon= 4,8Ω<br>tr<br>0,09<br>0,10<br>µs<br>µs<br>Tvj= 25°C<br>Tvj= 125°C<br>Abschaltverzögerungszeit,induktiveLast<br>Turn-offdelaytime,inductiveload<br>IC= 150 A, VCE= 600 V<br>VGE= ±15 V<br>RGoff= 4,8Ω<br>td off<br>0,55<br>0,65<br>µs<br>µs<br>Tvj= 25°C<br>Tvj= 125°C<br>Fallzeit,induktiveLast<br>Falltime,inductiveload<br>IC= 150 A, VCE= 600 V<br>VGE= ±15 V<br>RGoff= 4,8Ω<br>tf<br>0,13<br>0,18<br>µs<br>µs<br>Tvj= 25°C<br>Tvj= 125°C<br>EinschaltverlustenergieproPuls<br>Turn-onenergylossperpulse<br>IC= 150 A, VCE= 600 V, LS= 80 nH<br>VGE= ±15 V<br>RGon= 4,8Ω<br>Eon<br>11,0<br>mJ<br>mJ<br>Tvj= 25°C<br>Tvj= 125°C<br>AbschaltverlustenergieproPuls<br>Turn-offenergylossperpulse<br>IC= 150 A, VCE= 600 V, LS= 80 nH<br>VGE= ±15 V<br>RGoff= 4,8Ω<br>Eoff<br>26,0<br>mJ<br>mJ<br>Tvj= 25°C<br>Tvj= 125°C<br>Kurzschlußverhalten<br>SCdata<br>VGE ≤15 V, VCC= 900 V<br>VCEmax= VCES-LsCE·di/dt<br>ISC<br>600<br>A<br>Tvj= 125°C<br>tP ≤10 µs,<br>Wärmewiderstand,ChipbisGehäuse<br>Thermalresistance,junctiontocase<br>proIGBT/perIGBT<br>RthJC<br>0,16<br>K/W<br>Wärmewiderstand,GehäusebisKühlkörper<br>Thermalresistance,casetoheatsink<br>proIGBT/perIGBT<br>λPaste=1W/(m·K)/λgrease=1W/(m·K)<br>RthCH<br>0,03<br>K/W<br>TemperaturimSchaltbetrieb<br>Temperatureunderswitchingconditions<br>Tvj op<br>-40<br>125<br>°C|| 1 > IGBT-ModuleIGBT-modules FF150R12KE3G ## Technische�Information�/�Technical�Information **==> picture [86 x 38] intentionally omitted <==** ## **Diode,�Wechselrichter�/�Diode,�Inverter Höchstzulässige�Werte�/�Maximum�Rated�Values** |PeriodischeSpitzensperrspannung<br>Repetitivepeakreversevoltage|Tvj= 25°C|VRRM|1200|1200||V| |---|---|---|---|---|---|---| |Dauergleichstrom<br>ContinuousDCforwardcurrent||IF|150|||A| |PeriodischerSpitzenstrom<br>Repetitivepeakforwardcurrent|tP= 1 ms|IFRM|300|||A| |Grenzlastintegral<br>I²t-value|VR= 0 V, tP= 10 ms, Tvj= 125°C|I²t|4600|||A²s| |**CharakteristischeWerte/CharacteristicValues**|||min.|typ.|max.|| |Durchlassspannung<br>Forwardvoltage|IF= 150 A, VGE= 0 V<br>IF= 150 A, VGE= 0 V<br>Tvj= 25°C<br>Tvj= 125°C|VF||1,65<br>1,65|2,15|V<br>V| |Rückstromspitze<br>Peakreverserecoverycurrent|IF= 150 A, - diF/dt = 1500 A/µs (Tvj=125°C)<br>VR= 600 V<br>VGE= -15 V<br>Tvj= 25°C<br>Tvj= 125°C|IRM||105<br>135||A<br>A| |Sperrverzögerungsladung<br>Recoveredcharge|IF= 150 A, - diF/dt = 1500 A/µs (Tvj=125°C)<br>VR= 600 V<br>VGE= -15 V<br>Tvj= 25°C<br>Tvj= 125°C|Qr||15,0<br>28,0||µC<br>µC| |AbschaltenergieproPuls<br>Reverserecoveryenergy|IF= 150 A, - diF/dt = 1500 A/µs (Tvj=125°C)<br>VR= 600 V<br>VGE= -15 V<br>Tvj= 25°C<br>Tvj= 125°C|Erec||7,00<br>12,0||mJ<br>mJ| |Wärmewiderstand,ChipbisGehäuse<br>Thermalresistance,junctiontocase|proDiode/perdiode|RthJC|||0,30|K/W| |Wärmewiderstand,GehäusebisKühlkörper<br>Thermalresistance,casetoheatsink|proDiode/perdiode<br>λPaste=1W/(m·K)/λgrease=1W/(m·K)|RthCH||0,06||K/W| |TemperaturimSchaltbetrieb<br>Temperatureunderswitchingconditions||Tvj op|-40||125|°C| prepared�by:�MM approved�by:�WR date�of�publication:�2013-10-02 revision:�3.2 2 IGBT-Module IGBT-modules ## FF150R12KE3G |Modul / Module||||||| |---|---|---|---|---|---|---| |Isolations-Prüfspannung<br>~~Isolation test voltage~~<br>Material Modulgrundplatte<br>Material of module baseplate|RMS, f = 50 Hz, t = 1 min.<br>~~ee ~~|VISOL<br> ~~ee~~||2,5<br>Cu||kV| |Innere Isolation<br>Internal isolation|Basisisolierung (Schutzklasse 1, EN61140)<br>basic insulation (class 1, IEC 61140)|||Al2O3||| |Kriechstrecke<br>Creepage distance|Kontakt - Kuhlkorper / terminal to heatsink<br>Kontakt - Kontakt / terminal to terminal|||20,0||mm| |Luftstrecke<br>Clearance|Kontakt - Kuhlkorper / terminal to heatsink<br>Kontakt - Kontakt / terminal to terminal|||11,0||mm| |Vergleichszahl der Kriechwegbildung<br>Comperative tracking index||CTI||> 425||| ||||min.|typ.|max.|| |Warmewiderstand, Gehause bis Kuhlkérper| <br>Thermal resistance, case to heatsink|Paste<br>grease<br> pro Modul / per module<br>= 1 W/(m-k)/<br>= 1 W/(m-k)|RthCH||0,01||K/W| |Modulstreuinduktivität<br>~~Stray inductance module~~<br>Modulleitungswiderstand, Anschlusse -|~~ee ~~|LsCE<br> ~~ee ee~~|20<br>~~ee~~|||nH| |Chip|TC<br>= 25°C, pro Schalter / per switch|RCC'+EE'||0,70||mΩ| |Module lead resistance, terminals - chip||||||| |Lagertemperatur<br>~~Storage temperature~~<br>Anzugsdrehmoment f. Modulmontage<br>Mounting torque for modul mounting|~~ee ~~<br>Schraube M6<br>- Montage gem. giltiger Applikationsschrift<br>Screw M6<br>- Mounting according to valid application note|Tstg<br>M<br> ~~ee ee~~|-40<br>125<br>3,00<br>-<br>6,00<br>~~ee~~|||°C<br>Nm| |Anzugsdrehmoment f. elektr. Anschllsse<br>Terminal connection torque||Schraube M6<br>- Montage gem. gultiger Applikationsschrift<br>Screw M6<br>- Mounting according to valid application note|M|2,5|-|5,0|Nm| |Gewicht<br>Weight||G||340||g| 3 IGBT-Module IGBT-modules ## FF150R12KE3G **==> picture [487 x 596] intentionally omitted <==** **----- Start of picture text -----**<br> IC =f(V CE) IC =f(V CE)<br>VGE =15V Tvj = 125°C<br>300 a | 7 300 es | ’<br>Tvj = 25°C VGE = 19V<br>270 Tvj = 125°C 270 VGE = 17V<br>FJ Ae) ’ E VGE = 15V ee jr: =<br>VGE = 13V<br>240 ne 240 VGE = 11V<br>e e ee | ivaean<br>VGE = 9V<br>210 210<br>ee eee e ee<br>|PA e a<br>180 180<br>Pt / 7 a [ls<br>/ vi] J<br>150 150<br>120 120<br>ee eee eee) a e<br>90 ee ee ee 90 2WA | |<br>es ee<br>60 60<br>30 30<br>Pt AEe<br>0 0<br>0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5 0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5 4,0 4,5 5,0<br>VCE [V] VCE [V]<br>Ubertragungscharakteristik IGBT,Wechselrichter (typisch) SchaltverlustelGBT,Wechselrichter (typisch)<br>transfer characteristic IGBT,Inverter(typical) switching losses IGBT,Inverter (typical)<br>IC =f(V GE) Eon =f(l),E C off =f(I C)<br>VCE =20V VGE =415V,R Gon =48 Ω ,R Goff =48 Ω ,V CE =600V<br>300 60<br>Tvj = 25°C Eon, Tvj = 125°C<br>270 Tvj = 125°C Eoff, Tvj = 125°C<br>50<br>240<br>HTT | | Ve _ :<br>210<br>40<br>180<br>150 30<br>pt | ere<br>120<br>20<br>ae Petia ly<br>90<br>60 pt | ify < 7<br>10 oe 2 Ss oa<br>30<br>0 0<br>p oe | | | - =<br>5 6 7 8 9 10 11 12 0 50 100 150 200 250 300<br>VGE [V] IC [A]<br> [A] [A]<br>IC IC<br> [A]<br>IC E [mJ]<br>**----- End of picture text -----**<br> 4 IGBT-Module IGBT-modules ## FF150R12KE3G **==> picture [519 x 596] intentionally omitted <==** **----- Start of picture text -----**<br> Eon =f(R),E G off =f(R G) ZthJC = f(t)<br>VGE =+15V,1 C =150A,V CE =600V<br>80 a 1 a<br>|eee<br>Eon, Tvj = 125°C ZthJC : IGBT<br>Eoff, Tvj = 125°C<br>7060 Ee) Pt Tt |) Ji | | Lae7 a AaCerra ee e Coe a e eee|oo |<br>50 TTTPE TryVA} EAMEaL e TS|<br>40 0,1<br>30 Pt} | VaPyZL ffi P t aPeetbeatALLE<br>ZL. ) YT TTT ZT TTTTT<br>nae | | |<br>20 Lo 1)<br>ya<br>10 TAY TY. yt) Gei i: ri[K/W]: 1 0,00304 2 0,00911 | 3 0,0806 r 4 0,06725 I<br>τ i[s]: 0,00001187 0,002364 0,02601 0,06499<br> ELE J poo<br>0 PPL [LE] 0,01 ar r r<br>0 5 10 15 20 25 30 35 40 45 50 0,001 0,01 0,1 1 10<br>RG [ Ω ] t [s]<br>Sicherer Ruckwarts-Arbeitsbereich IGBT,Wechselrichter Durchlasskennlinie der Diode, Wechselrichter (typisch)<br>(RBSOA) forward characteristic of Diode, Inverter (typical)<br>reverse bias safe operating area IGBT,Inverter (RBSOA) IF =f(V F)<br>IC =f(V CE)<br>VGE Aen V,R Goff =48 Ω ,T vj =125°C<br>350 300<br>IC, Modul Tvj = 25°C<br>IC, Chip 270 Tvj = 125°C E<br>ee (ee De<br>300<br>240<br>ee eeeeeeensan<br>250<br>210<br>Saeeeeeeeeee<br>180<br>200<br>150<br>et COCOA<br>150<br>EE ER) 120 Geeppepeeere<br>ee 90 ee<br>100<br>60<br>50<br>SRRERe Sane eneeee<br>30<br>EERE AREER<br>0 0<br>0 Pt 200 400 tt 600 800 1000 N 1200 S 1400 0,0 0,2 0,4 0,6 0,8 1,0 Z 1,2 1,4 1,6 1,8 2,0 2,2 2,4<br>VCE [V] VF [V]<br> [K/W]<br>E [mJ]<br>thJC<br>Z<br> [A] [A]<br>IC IF<br>**----- End of picture text -----**<br> 5 IGBT-Module IGBT-modules ## FF150R12KE3G **==> picture [485 x 596] intentionally omitted <==** **----- Start of picture text -----**<br> Erec =f(I F) Erec =f(R G)<br>RGon “43 Ω ,V CE =600V IF = 180A, V CE = 600 V<br>20 15<br>Erec, Tvj = 125°C Erec, Tvj = 125°C<br>12 - —-<br>15<br>9<br>10<br>PN<br>6<br>5<br>3<br>0 0<br>0 50 100 150 200 250 300 0 5 10 15 20 25 30 35 40 45 50<br>IF [A] RG [ Ω ]<br>Transienter Warmewiderstand Diode, Wechselrichter<br>transient thermal impedance Diode, Inverter<br>ZthJC =f (t)<br>1<br>Le<br>ZthJC : Diode<br>H— ccc<br>a|Foo<br>e l<br>| | el<br>a<br>TIN|e ET IE I TTT<br>0,1<br>HHP<br>YtPT TTTTTTT<br>a<br>0| |<br>PVA TET ETI ET<br>7A Y P i: EEE 1 2 3 4 ET I<br>ri[K/W]: 0,00567 0,01704 0,15132 0,12597<br>τ i[s]: 0,00001187 0,002364 0,02601 0,06499<br>pool<br>0,01<br>0,001 0,01 0,1 1 10<br>t [s]<br>E [mJ] E [mJ]<br> [K/W]<br>thJC<br>Z<br>**----- End of picture text -----**<br> 6 **==> picture [313 x 43] intentionally omitted <==** **----- Start of picture text -----**<br> Technische�Information�/�Technical�Information<br>IGBT-ModuleIGBT-modules FF150R12KE3G<br>**----- End of picture text -----**<br> **==> picture [86 x 38] intentionally omitted <==** **==> picture [370 x 173] intentionally omitted <==** **----- Start of picture text -----**<br> Schaltplan�/�circuit_diagram_headline<br>Gehäuseabmessungen�/�package�outlines<br>**----- End of picture text -----**<br> **==> picture [461 x 285] intentionally omitted <==** **----- Start of picture text -----**<br> j n<br>j n<br>i<br>i<br>prepared�by:�MM date�of�publication:�2013-10-02<br>approved�by:�WR revision:�3.2<br>**----- End of picture text -----**<br> 7 **==> picture [66 x 19] intentionally omitted <==** **----- Start of picture text -----**<br> IGBT-Module<br>IGBT-modules<br>**----- End of picture text -----**<br> ## FF150R12KE3G ## **Nutzungsbedingungen** application. 8
Updated at April 28, 2026
Infineon Technologies is a globally recognized leader in semiconductor solutions, renowned for driving innovation in power management, energy efficiency, and modern mobility. With a strong legacy of engineering excellence, the company provides highly reliable components designed to meet the rigorous demands of industrial, automotive, and advanced commercial applications. The core of our Infineon portfolio is centered on their industry-leading discrete semiconductors. We offer an extensive selection of single and dual MOSFETs, alongside a robust range of single IGBTs and advanced IGBT modules. These flagship power transistors are essential for high-efficiency power conversion and motor control, providing engineers with superior thermal performance and minimized switching losses. Beyond advanced field-effect transistors, the selection includes a comprehensive array of diodes and rectifiers, heavily featuring Schottky diodes, as well as fast-recovery and RF/PIN diodes. This power foundation is further supported by bipolar transistors, intelligent power modules, and thyristor SCR modules, delivering the critical building blocks required for complex power system designs. To support broader system integration, the portfolio also encompasses specialized solutions such as solid-state relays, AC/DC LED driver ICs, and Bluetooth communications modules. From high-power industrial rectifiers to wireless connectivity adapters, Infineon equips designers with the precision components needed to build efficient, scalable, and fully connected electronic systems.
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