FERD30L60CTS

## **FERD30L60C** 

## 60 V field-effect rectifier diode 

Datasheet - production data 

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A1<br>K<br>A2<br><<br>K K<br>A2<br>A2 A1<br>K<br>A1<br>TO-220AB D²PAK<br>**----- End of picture text -----**<br>


## **Features** 

- ST advanced rectifier process 

- Stable leakage current over reverse voltage 

- Reduced leakage current 

## **Description** 

The device is based on a proprietary technology that achieves the best in class VF/IR trade-off for a given silicon surface. 

This 60 V rectifier has been optimized for use in confined applications where both efficiency and thermal performance are key. 

This device is suitable for use in adapters and chargers. 

**Table 1: Device summary** 

|**Symbol**|**Value**|
|---|---|
|IF(AV)|2 x 15 A|
|VRRM|60 V|
|VF(typ.)|0.37 V|
|Tj(max.)|150 °C|



- Low forward voltage drop 

- High frequency operation 

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This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**FERD30L60C** 

## **1 Characteristics** 

**Table 2: Absolute ratings (limiting values at 25 °C, per diode, unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**||**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM|Repetitivepeak reverse voltage|||60|V|
|IF(RMS)|Forward rms current|||60|A|
|IF(AV)|Average forward current δ = 0.5,<br>square wave|TC= 130 °C|Per diode|15|A|
||||Per device|30||
|IFSM|Surge non repetitive forward current|tp= 10 ms sinusoidal||250|A|
|Tstg|Storage temperature range|||-65 to +175|°C|
|Tj|Maximum operating junction temperature_(1)_|||+150|°C|



## **Notes:** 

(1)(dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. 

**Table 3: Thermal resistance parameters** 

|**Symbol**|**Parameter**||**Max. value**|**Unit**|
|---|---|---|---|---|
|Rth(j-c)|Junction to case|Per diode|1.5|°C/W|
|||Total|0.9||
|Rth(c)|Coupling||0.3||



**Table 4: Static electrical characteristics, per diode** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR_(1)_|Reverse leakage current|Tj= 25 °C|VR= VRRM|-||820|µA|
|||Tj= 125 °C||-|30|60|mA|
|||Tj= 125 °C|VR= 45 V|-|17|34||
|VF_(2)_|Forward voltage drop|Tj= 25 °C|IF= 3 A|-|0.32|0.36|V|
|||Tj= 125 °C||-|0.26|0.30||
|||Tj= 25 °C|IF= 7.5 A|-|0.39|0.435||
|||Tj= 125 °C||-|0.37|0.42||
|||Tj= 25 °C|IF= 15 A|-|0.49|0.545||
|||Tj= 125 °C||-|0.51|0.57||



## **Notes:** 

- (1)Pulse test: tp = 5 ms, δ < 2% 

- (2)Pulse test: tp = 380 µs, δ < 2% 

To evaluate the conduction losses use the following equation: 

P = 0.27 x IF(AV) + 0.02 x IF[2] (RMS) 

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**Characteristics** 

## **1.1 Characteristics (curves)** 

**Figure 1: Average forward current versus ambient Figure 2: Relative variation of thermal impedance temperature (δ = 0.5, per diode) junction to case versus pulse duration** 

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50 IF(AV)(A) 1.0 Zth(j-c) /Rth(j-c)<br>R th(j-a) = R th(j-c) 0.9<br>40 0.8<br>0.7<br>30 0.6<br>0.5<br>20 0.4<br>0.3 Single pulse<br>T<br>10 0.2<br>δ [=tp/T] tp T amb (°C) 0.1 t p (s)<br>0 0.0<br>0 25 50 75 100 125 150 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00<br>**----- End of picture text -----**<br>


**Figure 3: Reverse leakage current versus reverse Figure 4: Junction capacitance versus reverse voltage applied (typical values, per diode) voltage applied (typical values, per diode)** 

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1.E+02 IR(mA) 10000 C(pF)<br>TTjj = 125 °C = 150 °C VoscF = 1 MHzT= 30 mVj = 25 °CRMS<br>1.E+01 Tj = 100 °C<br>T j = 75 °C<br>1.E+00 1000<br>Tj = 50 °C<br>Tj = 25 °C<br>1.E-01<br>V R (V) VR(V)<br>1.E-02 100<br>0 10 20 30 40 50 60 1 10 100<br>**----- End of picture text -----**<br>


**Figure 5: Forward voltage drop versus forward current (typical values, per diode)** 

**Figure 6: Forward voltage drop versus forward current (typical values, per diode)** 

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**Characteristics** 

**FERD30L60C** 

**Figure 7: Thermal resistance junction to ambient versus copper surface under tab for D²PAK (typical values)** 

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Rth(j-a) (°C/W)<br>80<br>D²PAK<br>70 Epoxy printed board FR4, copper thickness = 35 µm<br>60<br>50<br>40<br>30<br>20<br>10<br>SCu(cm²)<br>0<br>0 5 10 15 20 25 30 35 40<br>**----- End of picture text -----**<br>


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**Package** information 

## **2 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _**www.st.com**_ . ECOPACK[®] is an ST trademark. 

- Cooling method: by conduction (C) 

- Epoxy meets UL94,V0 

- Recommended torque value: 0.55 N·m (for TO-220AB) 

- Maximum torque value: 0.6 N·m (for TO-220AB) 

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**Package** information 

## **2.1 TO-220AB package information** 

**Figure 8: TO-220AB package outline** 

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**Table 5: TO-220AB package mechanical data** 

|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|
||**Millimeters**||**Inches**||
||**Min.**|**Max.**|**Min.**|**Max.**|
|A|4.40|4.60|0.173|0.181|
|b|0.61|0.88|0.024|0.035|
|b1|1.14|1.70|0.045|0.067|
|c|0.48|0.70|0.019|0.028|
|D|15.25|15.75|0.600|0.620|
|E|10.00|10.40|0.394|0.409|
|e|2.40|2.70|0.094|0.106|
|e1|4.95|5.15|0.195|0.203|
|F|0.51|0.60|0.020|0.024|
|J1|2.40|2.72|0.094|0.107|
|H1|6.20|6.60|0.244|0.256|
|L|13.00|14.00|0.512|0.551|
|L1|3.50|3.93|0.138|0.155|
|L20|16.40 typ.||0.646 typ.||
|L30|28.90 typ.||1.138||
|Ø P|3.75|3.85|0.148|0.156|
|Q|2.65|2.95|0.104|0.116|



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**Package** information 

## **2.2 D²PAK package information** 

**Figure 9: D²PAK package outline** 

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**Table 6: D²PAK package mechanical data** 

|**Ref.**||**Dimensions**|**Dimensions**|**Dimensions**|||
|---|---|---|---|---|---|---|
|||**Millimeters**|||**Inches**||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|4.40||4.60|0.173||0.181|
|A1|0.03||0.23|0.001||0.009|
|b|0.70||0.93|0.028||0.037|
|b2|1.14||1.70|0.045||0.067|
|c|0.45||0.60|0.018||0.024|
|c2|1.23||1.36|0.048||0.053|
|D|8.95||9.35|0.352||0.368|
|D1|7.50|7.75|8.00|0.295|0.305|0.315|
|D2|1.10|1.30|1.50|0.043|0.051|0.060|
|E|10||10.40|0.394||0.409|
|E1|8.50|8.70|8.90|0.335|0.343|0.346|
|E2|6.85|7.05|7.25|0.266|0.278|0.282|
|e||2.54|||0.100||
|e1|4.88||5.28|0.190||0.205|
|H|15||15.85|0.591||0.624|
|J1|2.49||2.69|0.097||0.106|
|L|2.29||2.79|0.090||0.110|
|L1|1.27||1.40|0.049||0.055|
|L2|1.30||1.75|0.050||0.069|
|R||0.4|||0.015||
|V2|0°||8°|0°||8°|



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**Package** information 

**Figure 10: D²PAK recommended footprint (dimensions are in mm)** 

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**Ordering** information 

## **3 Ordering information** 

**Table 7: Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|FERD30L60CTS|FD30L60CTS|TO-220AB|1.38g|50|Tube|
|FERD30L60CG-TR|FD30L60CG|D²PAK|1.43g|1000|Tape and reel|



## **4 Revision history** 

**Table 8: Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|01-Sep-2017|1|Initial release.|



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