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FDMS008GMG-N200
Flash Memory Card, SDHC Card, 8 GB, Class 10
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: FLEXXON
- Product type: Flash Memory Cards
- SVHC: No SVHC (25-Jun-2025)
- App Rating: -
- UHS Standard: -
- Product Range: FxPrem II Series
- Memory Capacity: 8GB
- Video Speed Class: -
- Supply Voltage Nom: -
- Standard Speed Class: Class 10
- Flash Memory Card Type: SDHC Card
- Operating Temperature Max: 85°C
- Operating Temperature Min: -25°C
| Delivery and price | |
|---|---|
| Units per pack | 100 |
| Price | 13.44 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
-* == a Ra 7, Feo ib BS RS a \ Get, me WS be 3 = y AUTOMOTINE **M** ## **About Us** **FLEXXON** , the world’s leader in designs, manufactures and markets Industrial NAND Flash Storage Solution products with 100% focus on niche market. We apply our profound knowledge to serve and support tailored specifically for Industrial, Medical and Automotive (IMA) applications and customers globally who desire the highest level of reliability, endurance and wide operating temperature ranges. At **FLEXXON** , our mission is to be your preferred & reliable partner for Flash Storage and Memory Solution provider. We guarantee the highest standard of quality and product reliability. **==> picture [133 x 14] intentionally omitted <==** **----- Start of picture text -----**<br> WHY FLEXXON<br>**----- End of picture text -----**<br> ## **Industrial Applications** **==> picture [259 x 332] intentionally omitted <==** **----- Start of picture text -----**<br> ATM MACHINE EMBEDDED SYSTEM<br>AGRICULTURAL<br>MACHINERY AUTOMOTIVE GAMING<br>MEDICAL MUSICAL<br>DEVICES INSTRUMENTS<br>HANDHELD POS<br>MILITARY<br>DEVICES TERMINAL<br>SECURITY TEST &<br>SYSTEM MEASUREMENT<br>RUGGED SOLUTION VENDING<br>COMPUTER PRINTER MACHINE<br>**----- End of picture text -----**<br> **==> picture [353 x 161] intentionally omitted <==** **----- Start of picture text -----**<br> ||| |---|---| |Industrial Grade| |Industrial Grade|Temperature| |Automotive AEC – Q100 Grade 2 -40° C ~ +105° C| |Automotive AEC – Q100 Grade 3|-40° C ~ +85° C| |Diamond|-40° C ~ +85° C| |Gold|-25° C ~ +85° C| |Silver|0° C ~ 70° C| |Commercial|0° C ~ 70° C| **----- End of picture text -----**<br> ## **FLEXXON Product Feature** |**Interface**<br>Industrial Wide Temperature|**SATA**<br>|**PATA**<br>|**PCIe**<br>|**USB**<br>|**eMMC**<br>|**SD/microSD**<br>| |---|---|---|---|---|---|---| |Vibration & Shock Resistance||||||| |EMI & ESD Safe||||||| |S.M.A.R.T<br>£||||||| |AES Security||||||| |Power Loss Protection||||||| |Pseudo SLC||||||| |<br><br>z<br>Standard<br>NotAvailable|OFirmware|FirmwareAlgorithm|Algorithm(Optional)|(Optional)|(Optional)|| ## **Customization Services** We are open to all other customization services which are not listed in here. **Bill of Materials Customization** **==> picture [29 x 28] intentionally omitted <==** **----- Start of picture text -----**<br> A +5030<br>BOM G + 3533R +1619<br>N +1127<br>O +3522<br>P +3758<br>**----- End of picture text -----**<br> **==> picture [54 x 9] intentionally omitted <==** **----- Start of picture text -----**<br> PCB Re-layout<br>**----- End of picture text -----**<br> **Firmware Customization** & _ iit, ae @ | y **BGA Underfill** > **Conformal Coating** > iy Product ID / Parameters Pre-loaded Content Format Load Packaging Label Printing A | ## **SATA SERIES** |Feature<br>**SATA Series**|**INSPIRE**<br>High Endurance & Wide Compatibility with 3D<br>NAND Suitable for Multi-Tasking<br>Applications Support Hardware PLP||**ACHIEVER**<br>High Performance & High Density<br>Suitable for Main Storage<br>Applications|**XTREME**<br>High Performance & DRAM-less design<br>Perfect for Embedded<br>Applications| |---|---|---|---|---| |Interface|SATA III||SATA III|SATA III| |Form Factor|2.5", M.2<br>2242/2260/2280, mSATA||2.5", Half Slim, mSATA, M.2<br>2242/2260/2280, CFast, SATA DOM|2.5", Half Slim, mSATA, mSATA mini, M.2<br>2242/2260/2280, CFast, uSSD, SATA DOM| |Flash Type|3D TLC, 3D pSLC||SLC, MLC, pSLC|SLC, MLC, pSLC, 3D TLC, 3D pSLC| |Capacity|3D TLC: 64GB ~ 2TB<br>3D pSLC: 16GB~256GB||SLC: 4GB ~ 128GB<br>MLC: 8GB ~ 1TB<br>pSLC: 4GB~256GB|SLC: 8GB ~ 128GB<br>MLC: 4GB ~ 512GB<br>pSLC: 2GB ~ 256GB<br>3D TLC: 16GB ~ 1TB<br>3D pSLC: 32GB ~ 128GB| |Max. Performance|Read: 550 MB/s<br>Write: 530 MB/s||Read: 510 MB/s<br>Write: 430 MB/s|Read: 550 MB/s<br>Write: 500 MB/s| |Grade|Industrial||Industrial|Industrial / Commercial| |Feature<br>**SATA Series**|Ultra High Density & Ultimate Performance<br>Competent for Enterprise Applications<br>**XCEL**||Enchanced Reliability & Security<br>Design for Military Application<br>**GALAXY**|Low Cost & Low Density Ideal for Module<br>and Embedded Applications<br>**VALUE**| |Interface|SATA III||SATA III|SATA II| |Form Factor|2.5", M.2 2280||2.5"|2.5", mSATA| |Flash Type|3D TLC||SLC, MLC|SLC| |Capacity|3D TLC: 128GB ~ 8TB||SLC: 32GB ~ 512GB<br>MLC: 64GB ~ 1TB|SLC: 2GB ~ 64GB| |Max. Performance|Read: 550 MB/s<br>Write: 530 MB/s||Read: 520 MB/s<br>Write: 440 MB/s|Write: 200 MB/s<br>Read: 230 MB/s| |Grade|Industrial / Commercial||Military|Industrial| ## **PCIe SERIES** |**PCIe Series**|**DEX**|**HIX**|**VELOX-T**| |---|---|---|---| |Feature|High Speed & Compatibility<br>Suitable for Main Storage & Client<br>Applications|Ultimate Performance & Density<br>Perfect for Enterprise<br>Applications|DRAM-Less design<br>Best for Embedded Applications| |Interface|PCIe Gen 3×4, NVMe 1.3|PCIe Gen 3x4, NVMe 1.3|PCIe Gen 3x2, NVMe 1.3| |Form Factor|M.2 2280|U.2, M.2 2280, AIC|M.2 2242/2280, uSSD, CFX| |Flash Type|3D NAND|3D NAND|3D NAND| |Capacity|128GB ~ 1TB|128GB ~ 8TB|32GB ~ 512GB| |Max. Performance|Read: 2400 MB/s<br>Write: 1700 MB/s|Read: 3200 MB/s<br>Write: 3000 MB/s|Read: 1500 MB/s<br>Write: 950 MB/s| |Grade|Industrial|Industrial / Commercial|Industrial / Commercial| ## **PATA SERIES** |Feature<br>**PATA Series**|**LEGACY II**<br>High Compatibility & High<br>Reliability Best for Rigorous<br>Applications|**LEGACY III**<br>High Compatibility &<br>High Performance Support<br>Power Loss Protection|**CLASSIC**<br>Wide Compatibility & High<br>Reliability Suitable for<br>Embedded Applications|**CLASSIC II**<br>High IOPS Performance<br>High Capacity & High Reliability<br>Support AES Encryption|**PRESTO**<br>Ultra Performance<br>Fit for DSLR with VPG 65| |---|---|---|---|---|---| |Compliance|CF Spec Ver. 4.1<br>Ultra DMA Mode 6|CF Spec Ver. 6.x<br>Ultra DMA Mode 7|Ultra DMA Mode 4|Ultra DMA Mode 6<br>CF Spec Ver. 6.1<br>Ultra DMA Mode 6|CF Spec Ver. 6.x<br>Ultra DMA Mode 7| |Form Factor|CF Card|CF Card|PATA DOM|CF Card<br>2.5” PATA SSD|CF Card| |Flash Type|SLC,|SLC, MLC, pSLC|SLC|SLC, MLC, pSLC|3D NAND| |Capacity|SLC: 128MB ~ 16GB|SLC: 4GB ~ 32GB<br>MLC: 8GB ~ 128GB<br>pSLC: 4GB ~ 64GB|128MB ~ 4GB|SLC: 1GB ~ 128GB<br>MLC: 4GB ~ 1TB<br>pSLC: 8GB ~ 128GB<br>SLC: 1GB ~ 64GB<br>MLC: 4GB ~ 512GB<br>pSLC: 8GB ~ 128GB|16GB ~ 256GB| |Max. Performance|Read: 51MB/s<br>Write: 40MB/s|Read: 106MB/s<br>Write: 80MB/s|Read: 43MB/s<br>Write: 28MB/s|Read: 106MB/s<br>Write: 80MB/s<br>Read: 86 MB/s<br>Write: 75 MB/s|Read: 160MB/s<br>Write: 145MB/s| |Grade|Industrial|Industrial|Industrial|Industrial<br>Industrial|Commercial| ## **USB SERIES** |Feature<br>**USB Series**|**FxU2 I**<br>Standard<br>Performance|**FxU2 III**<br>Standard Performance<br>Support 3D NAND|**FxU3 I**<br>High Performance<br>Enhanced Reliability Solution|**FxUA**<br>High Reliability Solution with<br>3D NAND High IOPS Solution| |---|---|---|---|---| |Interface|USB 2.0|USB 2.0|USB 3.1 GEN 1|USB 3.1 GEN 1<br>USB 2.0| |Form Factor|Pen Drive|Pen Drive|Pen Drive|Pen Drive<br>USB DOM (10- pin)| |Flash Type|SLC, MLC|3D TLC|SLC, pSLC, MLC|3D TLC, 3D pSLC| |Capacity|SLC: 128MB ~ 32GB<br>MLC: 4GB ~ 64GB|3D TLC:<br>16GB ~ 128GB|SLC: 1GB ~ 16GB<br>MLC: 4GB ~ 128GB<br>pSLC: 2GB ~ 64GB|3D TLC: 16GB ~ 512GB<br>3D pSLC: 4GB ~ 64GB<br>3D TLC: 16GB ~ 256GB<br>3D pSLC: 4GB ~ 64GB| |Max. Performance|Read: 30 MB/s<br>Write: 20 MB/s|Read: 30 MB/s<br>Write: 20 MB/s|Read: 190 MB/s<br>Write: 95 MB/s|Read: 220 MB/s<br>Write: 100 MB/s<br>Read: 30 MB/s<br>Write: 24 MB/s| |Grade|Commercial|Commercial|Industrial|Industrial<br>Industrial / Commercial| |**USB Series**|**FxUH**|**FxUS**|**FxLocker**|**FxFP**| |---|---|---|---|---| |Feature|High Compatibility & Reliability<br>Support High IOPS & AES|Wide Compatibility Solution<br>with 3D NAND|AES Security & High Performance<br>Solution with 3D NAND|Biometric Fingerprint Identification<br>& AES Security Solution| |Interface|USB 2.0 & USB 3.1 Gen 1|USB 2.0 & USB 3.1 Gen 1|USB 3.1 GEN 1|USB 3.1 GEN 1| |Form Factor|USB DOM (10-pin & 20-pin)|USB DOM (10-pin & 20-pin)|Pen Drive|Pen Drive| |Flash Type|SLC, MLC|MLC, 3D TLC|3D TLC|3D TLC| |Capacity|SLC: 1GB ~ 32GB<br>MLC: 4GB ~ 128GB|MLC: 16GB - 256GB<br>3D TLC: 64GB ~ 512GB|16GB ~ 64GB|16GB ~ 512GB| |Max. Performance|Read: 200 MB/s<br>Read: 150 MB/s|Read: 102 MB/s<br>Write: 86 MB/s|Read: 160 MB/s<br>Write: 120 MB/s|Read: 80 MB/s<br>Write: 60 MB/s| |Grade|Industrial|Industrial|Commercial|Commercial| ## **MEMORY CARD SERIES** |Feature<br>**Memory Card Series**|**FxPro I**<br>High<br>Performance|**FxPro I**<br>**HighIOPS**<br>High IOPS<br>Solution|**FxPro III**<br>Extreme<br>Performance|**FxPrem II**<br>Embedded<br>System Solution| |---|---|---|---|---| |Interface|SD 3.0/6.1|SD 6.1|SD 6.1|SD 3.0| |Speed Class|up to Class 10|up to Class 10|up to Class 10|up to Class 10| |UHS mode|UHS-I|UHS-I|UHS-II|UHS-I| |Flash Type|SLC, MLC, pSLC|SLC, MLC, pSLC|3D TLC, 3D pSLC|SLC, MLC, pSLC| |Capacity|SLC: 128MB ~ 32GB<br>MLC: 1GB ~ 128GB<br>pSLC: 2GB ~ 64GB|SLC: 512MB ~ 16GB<br>MLC: 4GB ~ 32GB<br>pSLC: 2GB ~ 16GB|3D TLC: 64GB ~ 256GB<br>3D pSLC: 32GB~ 256GB|SLC: 4GB ~ 32GB<br>MLC: 8GB ~ 256GB<br>pSLC: 4GB ~ 128GB| |Max. Performance|Read: 95 MB/s<br>Write: 90 MB/s|Read: 95 MB/s<br>Write: 90 MB/s|Read: 280 MB/s<br>Write: 245 MB/s|Read: 95 MB/s<br>Write: 80 MB/s| |Grade|Industrial / Commercial|Industrial / Commercial|Commercial|Industrial| ||**Industrial Grade**|||| |Function|Support SMART Tool (SD Life Monitor Tool)<br>Support Auto-Read Refreshment|||| Support SMART Tool (SD Life Monitor Tool) Support Auto-Read Refreshment Support Power Loss Management |**Feature**<br>**Memory Card Series**|**WORM**<br>Write Once Read Many<br>Solution|**FxStd**<br>High Compatibility|**FxAdv**<br>High IOPS Solution with<br>3D NAND|**FxMav**<br>Advance High IOPS Solution<br>High Capacity| |---|---|---|---|---| |**Interface**|SD 6.1|SD 3.0|SD 6.1|SD 6.x| |**Speed Class**|up to Class 10|up to Class 10|up to Class 10|up to Class 10| |**UHS mode**|UHS-I|UHS-I|UHS-I|UHS-I| |**Flash Type**|MLC|MLC, pSLC|3D TLC, 3D pSLC|3D TLC, QLC| |**Capacity**|4GB ~ 256GB|MLC: 4GB ~ 64GB<br>pSLC: 4GB ~ 32GB|3D TLC: 8GB ~ 256GB<br>3D pSLC: 4GB ~ 64GB|16GB ~ 1TB| |**Max. Performance**|Read: 72 MB/s<br>Write: 15 MB/s|Read: 80 MB/s<br>Write: 55 MB/s|Read: 95 MB/s<br>Write: 90 MB/s|Read: 100 MB/s<br>Write: 90 MB/s| |**Grade**|Industrial|Industrial|Industrial / Commercial|Industrial / Commercial| ||**Industrial Grade**|||| |**Function**|Support SMART Tool (SD Life Monitor Tool)<br>Support Auto-Read Refreshment<br>Support Power Loss Management|||| ## **eMMC SERIES** |**eMMC Series**|**XTRA III**|**XTRA IV**|**XTRA V**| |---|---|---|---| |Interface|eMMC 5.0/4.x|eMMC 5.0/ 4.x|eMMC 5.1/4.x| |Flash Type|MLC, pSLC|MLC, pSLC|3D TLC, 3D pMLC, 3D pSLC| |Pin Count|153-ball/ 100-ball|153-ball/ 100-ball|153-ball| |Capacity|MLC: 4GB ~ 64GB<br>pSLC: 2GB ~ 32GB|MLC: 4GB ~ 64GB<br>pSLC: 2GB ~ 32GB|3D TLC: 16GB ~ 128GB<br>3D pMLC: 8GB ~ 16GB<br>3D pSLC: 4GB ~ 32GB| |Max. Performance|Read: 270 MB/s<br>Write: 150 MB/s|Read: 270 MB/s<br>Write: 150 MB/s|Read: 270 MB/s<br>Write: 150 MB/s| |Grade|Industrial|Automotive|Industrial/Automotive| ## **FLEXXON INDUSTRIAL QUALITY SOLUTIONS** **==> picture [87 x 39] intentionally omitted <==** **----- Start of picture text -----**<br> Advanced Flash Management<br>Endurance Life Test<br>Industrial PCB/Substrate<br>Layout ComplianceDesign<br>**----- End of picture text -----**<br> **==> picture [40 x 35] intentionally omitted <==** **----- Start of picture text -----**<br> Flash<br>PCB<br>Substrate<br>**----- End of picture text -----**<br> **==> picture [96 x 52] intentionally omitted <==** **----- Start of picture text -----**<br> Endurance and Stability of Wear<br>Leveling<br>Data Integrity<br>Performance Gradation and<br>Latency<br>**----- End of picture text -----**<br> **==> picture [102 x 40] intentionally omitted <==** **----- Start of picture text -----**<br> BIOS/Chipset Compatibility<br>Performance & Power<br>Consumption Optimization<br>Mechanical Test/Environment Test<br>**----- End of picture text -----**<br> **==> picture [176 x 83] intentionally omitted <==** **----- Start of picture text -----**<br> Protocol<br>Interface<br>Protocol & Signal Integrity and<br>Reliability<br>Electrical Noise &InterfaceTest<br>Temperature Sensitiveness<br>**----- End of picture text -----**<br> ## **FLEXXON SSD DATA SECURITY TECHNOLOGY** **==> picture [116 x 96] intentionally omitted <==** **----- Start of picture text -----**<br> AES<br>Encryption<br>Erase<br>DATA<br>SECURITY<br>Write<br>Protect Physical<br>Destruction<br>**----- End of picture text -----**<br> ## **FLEXXON SSD DATA PROTECTION TECHNOLOGY** **==> picture [229 x 100] intentionally omitted <==** **----- Start of picture text -----**<br> 01 Avoid data loss at SPOR 02<br>Power Loss Protection<br>03 With super cap/tantalum cap 04<br>SRAM SEC<br>05 Single bit error correct in SRAM. 06<br>**----- End of picture text -----**<br> **==> picture [18 x 12] intentionally omitted <==** **----- Start of picture text -----**<br> 07<br>**----- End of picture text -----**<br> ## **FLEXXON SD/microSD DATA RELIABILITY TECHNOLOGY** ## **Auto-Read Refresh Management** Reduce the chances of uncorrectable errors, resulting from repeated read. ## **Power Loss Management** UECC may occur during power interrupted writes, due to pair page issue of MLC. FW moves the valid data before UECC page to new block, minimizing data loss. ## **Advanced Wear Leveling** For special or customized OS, it could optimize wear leveling, and extend the life span. ## **FLEXXON eMMC INTELLIGENT TECHNOLOGY** **==> picture [159 x 96] intentionally omitted <==** **----- Start of picture text -----**<br> 11 10 00 01<br>1 1<br>-3.0V 0.0V 1.5V 3.0V 4.5V<br>Threshold Voltage<br>Cell Distribution<br>**----- End of picture text -----**<br> ## Leverage strong pages from NAND flash, and prevent data loss in reflow process. **==> picture [167 x 96] intentionally omitted <==** **----- Start of picture text -----**<br> Dynamic Wear Leveling<br>Red : Static data such as system data.<br>Blue : Dynamic data such as user data<br>0 1 2 3 4 5 6 7 8 9 10 11 12 . . N<br>Physical Block Address<br>Write/Erase Count<br>**----- End of picture text -----**<br> ## **Dynamic Wear Leveling** To keep important data without moving, dynamic wear leveling could concentrate the write/erase only on the dynamic block. **==> picture [172 x 93] intentionally omitted <==** **----- Start of picture text -----**<br> Auto Read Refresh<br>SSS<br>PT<br>iii<br>a) Lelolotele!<br>Block with correctable ECC<br>Error Erased Block<br>**----- End of picture text -----**<br> ## **Auto Read Refresh** Good for read intensive applications. Firmware will auto-refresh the bit errors when they are approaching the pre-set threshold level. ## **Write Reliability** After sudden power loss and next power on, eMMC will scan buffer block until last programmed page. If ECC Uncorrectable or higher ECC error bit occurs, FW will stop scanning and discard these pages, then copy valid data to new buffer block in order to save the data. **==> picture [168 x 106] intentionally omitted <==** **----- Start of picture text -----**<br> Write Reliability<br>Next Power On:<br>Paired Page Issue<br>New Buffer Block<br>Step 1 :<br>Host Write<br>Step 3 :<br>Power Loss<br>occurs on<br>MLC page<br>Step 2 :<br>Backup SLC Step 4 :<br>Page Block SLCBackup Block SLCBackup Merge data tonew Buffer<br>Mode Mode Block<br>**----- End of picture text -----**<br> **==> picture [167 x 105] intentionally omitted <==** **----- Start of picture text -----**<br> System Block Protection<br>System Block New System Block<br>Next Power On<br>Step 1 : Power Loss Step 2 : Discard UECC<br>occurs on programmingSLC page data to a new SLC block.pages. Move other valid<br>**----- End of picture text -----**<br> ## **System Block Protection** eMMC system information is stored in SLC area for better robustness. When FW finds UECC pages caused by sudden power loss, those pages would be discarded and move other valid data to a healthy block. ## **CONTACT US** ## **Singapore** ## **FLEXXON Pte Ltd.** 28 Genting Lane, #09-03/04/05 Platinum 28, Singapore 349585 +65-6493 5035 +65-6493 5037 flexxon@flexxon.com ## **Malaysia** ## **FLEXXON Pte Ltd.** Suite 12.1, 12th Floor, Menara Penang Garden, Jalan Sultan Ahmad Shah, 10500 Penang, Malaysia +6012-408 9590 +65-6493 5037 flexxon@flexxon.com ## **Hong Kong** ## **FLEXXON Global Ltd.** 13-08, 13/F, Block E, Wah Lok Industrial Centre Nos. 31-35 Shan Mei Street, Fotan, Shatin Hong Kong. +852-2711 5886 0 is +852-3011 3058 Mi flexxon@flexxon.com ## **USA** ## **FLEXXON USA** 13575 58[th] St. North, Suite 210, Clearwater, FL 33760 +1-(727)-429-4665 ## **China** ## **FLEXXON Global Ltd.** +86-755-8230 8012 +86-755-6160 5039 flexxon@flexxon.com
Updated at June 3, 2026
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