FDMM016GMG-XK00

## **Industrial microSD 3.0 Xsign Series (MLC)** 

— ~~$$$~~ < **Version 1.0** 

Address: 28 Genting Ln, #09-03/04/05 Platinum 28, Singapore 349585 Tel: +65-6493 5035 Fax: +65-6493 5037 Website:  http://www.flexxon.com Email: flexxon@flexxon.com 

ALL RIGHTS ARE STRICTLY RESERVED. ANY PORTION OF THIS PAPER SHALL NOT BE REPRODUCED, COPIED, OR TRANSLATED TO ANY OTHER FORMS WITHOUT PERMISSION FROM FLEXXON PTE LTD. 

## **TABLE OF CONTENTS** 

||**1. Contents**|
|---|---|
|**1.**|**GENERAL DESCRIPTION ................................................................................ 1**|
||Introduction ...................................................................................................................1<br>11|
||Product Overview ..........................................................................................................2<br>12|
|**2.**|**PRODUCT SPECIFICATIONS ........................................................................... 3**|
||Performance ...................................................................................................................3<br>2.1|
||Power .............................................................................................................................3<br>2.2|
||MTBF ............................................................................................................................3<br>2.3|
|**3.**|**ENVIRONMENTAL SPECIFICATIONS ............................................................... 4**|
|**4.**|**ELECTRICAL SPECIFICATIONS ........................................................................ 5**|
||DC Characteristics .........................................................................................................5<br>4.1|
||4.1.1<br>Bus Operation Conditions for 3.3V Signaling ................................................... 5|
||4.1.2<br>Bus Signal Line Load ........................................................................................ 6|
||AC Characteristic ..........................................................................................................7<br>4.2|
||4.2.1<br>microSD Interface timing (Default) .................................................................. 7|
||4.2.2<br>microSD Interface Timing (High-Speed Mode) ................................................ 8|
|**5.**|4.2.3<br>microSD Interface timing (SDR12, SDR25, SDR50 and SDR104 Modes) .... 10<br>4.2.4<br>microSD Interface timing (DDR50 Modes) .................................................... 12<br>**PAD ASSIGNMENT ...................................................................................... 13**|
|**6.**|**REGISTERS .................................................................................................. 13**|
|**7.** <br>**8.**|**PHYSICAL DIMENSION ................................................................................ 13**<br>**ORDERING INFORMATION .......................................................................... 13**|



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## **1. GENERAL DESCRIPTION** 

## **Introduction** 

**FLEXXON Xsign microSD Card** is compliant with SD 3.0 specification and provides excellent performance, good reliability and wide compatibility. To safeguard confidential information, security data, and control systems, Xsign microSD Card supports a highly secure Digital Signature mechanism that can authenticate users' identities and access authority, ensuring a safe operational environment in IoT networks. 

The Key string for each specified device is managed by the Key Manager, encrypted using proprietary Crypto Codec (HDS) to ensure data security in the SD Bus. Additionally, the Xsign is scrambled and stored in the reserved Hidden area in the microSD card. This dual-layered protection mechanism, combining Crypto Codec and Scrambled Hidden Area, ensures the utmost security of the Key string in the application systems. 

**FLEXXON Xsign microSD Card** can be function as Digital ID in Digital Signature application. By utilizing the application processor located at the edge of IoT, the secure Key string stored in the microSD Card can be readily identified, and access authorization can be granted through the Security Key management system. 

**FLEXXON Xsign microSD Card** can be used in function control system. The Xsign can serve as a key to activate and regulate specified functions, such as a license key for a particular software or an authorized key to control appliances. 

**FLEXXON Xsign microSD Card** serves a dual purpose as both a Digital Signature in the Internet of Things and a licensed or authorized key in Function Control Systems. Its double layer data security protection, which includes the Crypto Codec and the Scrambled Hidden Area, enhances the security level and protects the Key string. 

The Security Key function is an additional feature, which will not affect the standard product specification. 

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## **Product Overview** 

- **Flash**  **Support SD System** MLC **Specification 3.0** 

- **Capacity** 4GB to 128GB 

      - **Support SD SPI Mode** 

      - **Support Auto Read Refreshment** 

- **Support Data Crypto** 

- **Read disturbance**  **Adaptive wear leveling** 

- **management** 

- **Support management of**  **SMART function support** 

- **sudden power fails** 

- **Temperature Range** 

   - Operation (Gold): -25°C ~ 85°C Operation (Diamond): -40°C ~ 85°C 

- Storage: -40°C ~ 85°C 

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## **2. PRODUCT SPECIFICATIONS** 

| 

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Performance  Capacity  Sequential<br>Read (MB/s)  Write (MB/s)<br>4GB  90  25<br>8GB  90  25<br>16GB  90  50<br>32GB  90  75<br>64GB  90  80<br>128GB  90  80<br>===<br>Table 2-1 Performance of Xsign microSD<br>**----- End of picture text -----**<br>


## **NOTES:** 

1. The performance is obtained from TestMetrix 

2. Performance may vary from flash configuration and platform. 

## **Power** 

|**Capacity**|**Read**<br>**(mA)**|**Write**<br>**(mA)**|**Standby**<br>**(uA)**|
|---|---|---|---|
|4GB|180|90|220|
|8GB|180|90|220|
|16GB|190|120|250|
|32GB|190|140|280|
|64GB|190|170|320|
|128GB|195|170|500|



**Table 2-2 Typical Power Consumption of Xsign microSD** 

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MTBF<br>**----- End of picture text -----**<br>


MTBF, an acronym for Mean Time Between Failures, is a measure of a device’s reliability. Its value represents the average time between a repair and the next failure. The higher the MTBF value, the higher the reliability of the device. The predicted result of Xsign microSD Card is more than 3,000,000 hours. 

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## **3. ENVIRONMENTAL SPECIFICATIONS** 

|**Test Items**|**Test Conditions**|
|---|---|
|Storage Temperature|-40°C ~ 85°C|
|Operating Temperature|Gold: -25°C ~ 85°C<br>Diamond: -40°C ~ 85°C|
|Storage Humidity|40°C, 93% RH|
|Operating Humidity|25°C, 95% RH|
|Shock|1500G, Half Sin Pulse Duration 0.5ms|
|Vibration|80Hz ~ 2000Hz/20G, 20Hz ~ 80Hz/1.52mm, 3<br>axis/30min|
|Drop|150cm free fall, 6 face of each unit|
|Bending|≥ 10N, Hold 1 min/5 times|
|Torque|0.1N-m or +/-2.5 deg, Hold 30 seconds/5 times|
|ESD|Contact: +/- 4KV each item 25 times<br>Air: +/- 8KV 10 times|



**Table 3-1 Environmental Specification** 

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## **4. ELECTRICAL SPECIFICATIONS** 

## **DC Characteristics** 

## **4.1.1 Bus Operation Conditions for 3.3V Signaling** 

|**Parameter**|**Symbol**|**Min.**|**Max**|**Unit**|**Condition**|
|---|---|---|---|---|---|
|SupplyVoltage|VDD|2.7|3.6|V||
|Output High Voltage|VOH|0.75*VDD||V|IOH=-2mA VDDMin|
|Output Low Voltage|VOL||0.125*VDD|V|IOL=2mA VDDMin|
|Input High Voltage|VIH|0.625*VDD|VDD+0.3|V||
|Input Low Voltage|VIL|VSS-0.3|0.25*VDD|V||
|Power Up Time|||250|ms|From 0V to VDDmin|



**Table 4-1 Threshold Level for High Voltage Range** 

|**Parameter**|**Symbol**|**Min.**|**Max**|**Unit**|**Condition**|
|---|---|---|---|---|---|
|Supply Voltage|VDD|2.7|3.6|V||
|Regulator Voltage|VDDIO|1.7|1.95|V|Generated by VDD|
|Output High Voltage|VOH|1.4|-|V|IOH=-2mA|
|Output Low Voltage|VOL|-|0.45|V|IOL=2mA|
|Input High Voltage|VIH|1.27|2.00|V||
|Input Low Voltage|VIL|Vss-0.3|0.58|V||



**Table 4-2 Threshold Level for 1.8V Signaling** 

|**Parameter**|**Symbol**|**Min**|**Max.**|**Unit**|**Remarks**|
|---|---|---|---|---|---|
|Input Leakage Current||-2|2|uA|DAT3 pull-up is<br>disconnected.|



**Table 4-3 Input Leakage Current for 1.8V Signaling** 

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|**Parameter**|**Symbol**|**Min**|**Max.**|**Unit**|**Remarks**|
|---|---|---|---|---|---|
|Peak voltage on all lines||-0.3|VDD+0.3|V||
|**All Inputs**||||||
|Input Leakage Current||-10|10|uA||
|**All Outputs**||||||
|Output Leakage Current||-10|10|uA||



## **Table 4-4 Peak Voltage and Leakage Current** 

## **4.1.2 Bus Signal Line Load** 

## **Bus Operation Conditions – Signal Line’s Load** 

Total Bus Capacitance = CHOST + CBUS + N CCARD 

|**Parameter**|**symbol**|**Min**|**Max**|**Unit**|**Remark**|
|---|---|---|---|---|---|
|Pull-up resistance|RCMD<br>RDAT|10|100|kΩ|to prevent bus floating|
|Total bus capacitance for each<br>signal line|CL||40|pF|1 card<br>CHOST+CBUSshall<br>not exceed 30pF|
|Card Capacitance for each signal<br>pin|CCARD||101|pF||
|Maximum signal line inductance|||16|nH||
|Pull-up resistance inside card<br>(pin1)|RDAT3|10|90|kΩ|May be used for card<br>detection|
|Capacity Connected to Power<br>Line|CC||5|uF|To prevent inrush current|



**Table 4-5 Peak Voltage and Leakage Current** 

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## **AC Characteristic** 

## **4.2.1 microSD Interface timing (Default)** 

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|**Parameter**|**Symbol**|**Min**|**Max**|**Unit**|**Remark**|
|---|---|---|---|---|---|
|**Clock CLK(All values are referred to min(VIH) and max(VIL)**||||||
|Clock frequency Data<br>Transfer Mode|fPP|0|25|MHz|Ccard≤ 10 pF<br>(1 card)|
|Clock frequency<br>Identification Mode|fOD|0(1)/100|400|KHz|Ccard≤ 10 pF<br> (1 card)|
|Clock low time|tWL|10||ns|Ccard≤ 10 pF<br> (1 card)|
|Clock high time|tWH|10||ns|Ccard≤ 10 pF<br> (1 card)|
|Clock rise time|tTLH||10|ns|Ccard≤ 10 pF<br> (1 card)|
|Clock fall time|tTHL||10|ns|Ccard≤ 10 pF<br> (1 card)|
|**Inputs CMD, DAT(referenced to CLK)**||||||
|Input set-up time|tISU|5||ns|Ccard≤ 10 pF<br> (1 card)|
|Input hold time|tIH|5||ns|Ccard≤ 10 pF<br> (1 card)|
|**Outputs CMD, DAT(referenced to CLK)**||||||
|Output Delay time during<br>Data Transfer Mode|tODLY|0|14|ns|CL≤ 40 pF<br>(1 card)|
|Output Delay time during<br>Identification Mode|tODLY|0|50|ns|CL≤ 40 pF<br>(1 card)|



- (1) 0Hz means to stop the clock. The given minimum frequency range is for cases where continues clock is required. 

## **4.2.2 microSD Interface Timing (High-Speed Mode)** 

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|**Parameter**|**Symbol**|**Min**|**Max**|**Unit**|**Remark**|
|---|---|---|---|---|---|
|**Clock CLK(All values are referred to min(VIH) and max(VIL)**||||||
|Clock frequency Data Transfer<br>Mode|fPP|0|50|MHz|Ccard≤ 10 pF<br>(1 card)|
|Clock low time|tWL|7||ns|Ccard≤ 10 pF<br> (1 card)|
|Clock high time|tWH|7||ns|Ccard≤ 10 pF<br> (1 card)|
|Clock rise time|tTLH||3|ns|Ccard≤ 10 pF<br> (1 card)|
|Clock fall time|tTHL||3|ns|Ccard≤ 10 pF<br> (1 card)|
|**Inputs CMD, DAT(referenced to CLK)**||||||
|Input set-up time|tISU|6||ns|Ccard≤ 10 pF<br> (1 card)|
|Input hold time|tIH|2||ns|Ccard≤ 10 pF<br> (1 card)|
|**Outputs CMD, DAT(referenced to CLK)**||||||
|Output Delay time during Data<br>Transfer Mode|tODLY||14|ns|CL≤ 40 pF<br>(1 card)|
|Output Hold time|TOH|2.5||ns|CL≤ 15 pF<br>(1 card)|
|Total System capacitance of<br>each line¹|CL||40|pF|CL ≤ 15 pF<br>(1 card)|



(1) In order to satisfy severe timing, the host shall drive only one card. 

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## **4.2.3 microSD Interface timing (SDR12, SDR25, SDR50 and SDR104 Modes)** 

## _**Input:**_ 

|**Symbol**|**Min**|**Max**|**Unit**|**Remark**|
|---|---|---|---|---|
|tCLK|4.80|-|ns|208MHz (Max.), Between rising edge, VCT=<br>0.975V|
|tCR, tCF|-|0.2* tCLK|ns|tCR, tCF< 0.96ns (max.) at 208MHz, CCARD=10pF<br>tCR, tCF< 2.00ns (max.) at 100MHz, CCARD=10pF<br>The absolute maximum value of tCR, tCFis 10ns<br>regardless of clock frequency|
|Clock Duty|30|70|%||



## **SDR50 and SDR104 Input Timing:** 

|**Symbol**|**Min**|**Max**|**Unit**|**SDR104 Mode**|
|---|---|---|---|---|
|tIS|1.40|-|ns|CCARD=10pF,VCT= 0.975V|
|tIH|0.8|-|ns|CCARD= 5pF,VCT= 0.975V|
|**Symbol**|**Min**|**Max**|**Unit**|**SDR50 Mode**|
|tIS|3.00|-|ns|CCARD=10pF,VCT= 0.975V|
|tIH|0.8|-|ns|CCARD= 5pF,VCT= 0.975V|



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## _**Output**_ **(SDR12, SDR25, SDR50)** _**:**_ 

|**Symbol**|**Min**|**Max**|**Unit**|**Remark**|
|---|---|---|---|---|
|tODLY|-|7.5|ns|tCLK>=10.0ns,CL=30pF,usingdriver Type B,for SDR50|
|tODLY|-|14|ns|tCLK>=20.0ns, CL=40pF, using driver Type B, for SDR25<br>and SDR12,|
|TOH|1.5|-|ns|Hold time at the tODLY (min.),CL=15pF|



## _**Output (SDR104 Mode):**_ 

|**Symbol**|**Min**|**Max**|**Unit**|**Remark**|
|---|---|---|---|---|
|tOP|0|2|Ul|Card Output Phase|
|△tOP|-350|+1550|ps|Delayvariable due to temperature change after tuning|
|tODW|0.60|-|Ul|tODW= 2.88ns at 208MHz|



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## **4.2.4 microSD Interface timing (DDR50 Modes)** 

|**Symbol**|**Min**|**Max**|**Unit**|**Remark**|
|---|---|---|---|---|
|tCLK|20|-|ns|50MHz(Max.),Between risingedge|
|tCR,tCF|-|0.2* tCLK|ns|tCR,tCF< 4.00ns(max.)at 50MHz,CCARD=10pF|
|Clock Duty|45|55|%||



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|**Parameter**<br>~~a~~|**Symbol**|**Min**|**Max**|**Unit**|**Remark**|
|---|---|---|---|---|---|
|**Input CMD**(referenced to CLK risingedge)<br>~~a~~<br>~~eeeeeeee~~<br>~~a~~||||||
|Input set-up time<br>~~a~~<br>~~a~~|tISU<br>~~ee~~<br>~~a~~|3<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>~~ee~~|ns<br>~~ee~~<br>~~ee~~|Ccard≤ 10 pF<br> (1 card)<br>~~ee~~|
|Input hold time<br>~~a ~~|tIH<br>~~ee ~~<br> ~~a~~|0.8<br> ~~ee~~<br>~~ee~~|-<br>~~ee ~~<br>~~ee~~|ns<br> ~~ee ~~<br>~~ee~~|Ccard≤ 10 pF<br> (1 card)<br> ~~ee~~|
|**Output CMD**(referenced to CLK risingedge)<br> ~~a~~<br>~~ee ee~~||||||
|Output Delay time<br>during Data Transfer<br>Mode<br>~~a~~|tODLY<br>~~ee~~|~~ee~~|13.7<br>~~ee~~|ns<br>~~ee~~|CL≤ 30 pF<br>(1 card)|
|Output Hold time<br>~~a~~|TOH<br>~~ee~~|1.5<br>~~ee~~|-<br>~~ee~~|ns<br>~~ee~~<br>~~NS~~|CL≥ 15 pF<br>(1 card)<br>~~NS~~|
|**Inputs DAT**(referenced to CLK risingand fallingedges)<br>~~a ee~~<br>~~ee~~<br>~~ee~~<br>~~NS~~<br>~~eeee~~<br>~~ee~~||||||
|Input set-up time<br>~~es~~|tISU2x<br>~~es~~<br>~~ee~~<br>~~ee~~|3<br>~~es~~<br>~~ee~~<br>~~ee~~|-<br>~~es~~<br>~~ee~~<br>~~ee~~|ns<br>~~NS~~<br>~~es~~<br>~~ee~~|Ccard≤ 10 pF<br> (1 card)<br>~~NS~~<br>~~es~~<br>~~ee~~|
|Input hold time<br>~~re~~|tIH2x<br>~~ee~~<br>~~re~~<br>~~ee~~|0.8<br>~~ee ~~<br>~~re~~<br>~~ee~~|-<br> ~~ee~~<br>~~re~~<br>~~ee~~|ns<br>~~ee~~<br>~~re~~|Ccard≤ 10 pF<br> (1 card)<br>~~ee~~<br>~~re~~|
|**Outputs DAT**(referenced to CLK risingand fallingedges)<br>~~re~~<br>~~ee ee~~||||||
|Output Delay time<br>during Data Transfer<br>Mode|tODLY2x|-|7.0|ns|CL≤ 25 pF<br>(1 card)<br>~~ee~~|
|Output Hold time<br>~~a ee~~|TOH2x<br>~~ee~~|1.5<br>~~ee~~|-<br>~~ee~~|ns<br>~~ee~~|CL≥ 15 pF<br>(1 card)<br>~~ee~~<br>~~ee~~|



**Table 4-6 Bus Timings – Parameters Values (DDR50 Mode)** 

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## **5. PAD ASSIGNMENT** pe 

**==> picture [441 x 189] intentionally omitted <==**

**----- Start of picture text -----**<br>
SD Mode SPI Mode<br>Pin #<br>Name  Type  [1] Description  Name  Type  Description<br>a 1  DAT2  I/O/PP  Data Line[bit2]  RSV<br>2  CD/DAT3  [2] I/O/PP  [3] Card Detect/ Data  CS  I  [3] Chip Select (neg<br>Line[bit3] true)<br>arr 3  CMD  aee PP  CO Command/Response  ee DI  I  eee Data In<br>a 4  VDD a S  Supply voltage  VDD S  Supply voltage<br>5  CLK  I  Clock  SCLK  I  Clock<br>aCO<br>6  VSS S  Supply voltage  VSS S  Supply voltage<br>ground  ground<br>Po}a 7  CO DAT0  I/O/PP  tS Data Line[bit0]  DO  O/PP  Data Out<br>a 8  DAT1  I/O/PP  Data Line[bit1]  RSV<br>**----- End of picture text -----**<br>


**Table 5-1 microSD Pad Assignment** 

## **NOTE:** 

- (1) S: power supply, I: input; O: output using push-pull drivers; PP: I/O using push-pull drivers 

- (2) The extended DAT lines (DAT1-DAT3) are input on power up. They start to operate as DAT lines after SET_BUS_WIDTH command. The Host shall keep its own DAT1-DAT3 lines in input mode, as well, while they are not used. It is defined so, in order to keep compatibility to MultiMedia Cards. 

- (3) At power up this line has a 50KOhm pull up enabled in the card. This resistor serves two functions: Card detection and Mode Selection. For Mode Selection, the host can drive the line high or let it be pulled high to select SD mode. If the host wants to select SPI mode it should drive the line low. For Card detection, the host detects that the line is pulled high. This pull-up should be disconnected by the user during regular data transfer period, with SET_CLR_CARD_DETECT (ACMD42) command. 

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## **6. REGISTERS** 

|**Name**|**Width**|**Description**|
|---|---|---|
|CID|128bit|Card identification number; card individual number for<br>identification.|
|RCA|16bit|Relative card address; local system address of a card,<br>dynamically suggested by the card and approved by the host<br>duringinitialization.|
|DSR|16bit|Driver Stage Register; to configure the card’s output drivers.|
|CSD|128bit|Card Specific Data; Information about the card operation<br>conditions.|
|SCR|64bit|SD Configuration Register; Information about the SD<br>MemoryCard's Special Features capabilities|
|OCR|32bit|Operation conditions register.|
|SSR|512bit|SD Status; Information about the card proprietary features.|
|OCR|32bit|Card Status; Information about the card status.|



**Table 6-1 microSD Registers** 

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## **7. PHYSICAL DIMENSION** 

## **Dimension: 15mm (L) x 11mm (W) x 1mm (H)** 

## Top View 

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**----- Start of picture text -----**<br>
Bottow View<br>Side View<br>**----- End of picture text -----**<br>


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## **8. ORDERING INFORMATION** 

|**Capacity**|**MPN(Diamond Grade)**|**MPN (Gold Grade)**|
|---|---|---|
|4GB|FDMM004GME-XK00|FDMM004GMG-XK00|
|8GB|FDMM008GME-XK00|FDMM008GMG-XK00|
|16GB|FDMM016GME-XK00|FDMM016GMG-XK00|
|32GB|FDMM032GME-XK00|FDMM032GMG-XK00|
|64GB|FDMM064GME-XK00|FDMM064GMG-XK00|
|128GB|FDMM128GME-XK00|FDMM128GMG-XK00|



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## **REVISION HISTORY** 

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**----- Start of picture text -----**<br>
Revision Date History<br>1.0  2023/05  First Release<br>**----- End of picture text -----**<br>


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