EYSKBNZWB
Bluetooth 5.0 Module, 1.7V to 5.5V Supply, 2Mbps
- Manufacturer: TAIYO YUDEN
- Product type: Bluetooth Modules & Adaptors
- Data Rate: 2Mbps
- Bluetooth Version: Bluetooth 5.0
- Supply Voltage Max: 5.5V
- Supply Voltage Min: 1.7V
- Operating Temperature Max: 85°C
- Operating Temperature Min: -40°C
| Delivery and price | |
|---|---|
| Units per pack | 1 |
| Price | 8.7 € |
| Current stock | 10+ |
| Lead time | 30 days |
## **Bluetooth[®] 5.0 low energy Module: EYSKBNZWB** ## **Features** - **Frequency: 2402 to 2480 MHz with +8dBm Output power** - **Single power supply: 1.7 – 5.5V** - **Single Mode Bluetooth 5.0 / 802.15.4 (e.g. Thread, Zigbee)** - **Bluetooth 5 data rate support: 2M / 1M / 500k / 125kbps** - **Chip: nRF52840 (Nordic)** - **Integrated System/Sleep Clock, 2 x LC for DC/DC** - **Integrated high performance PCB antenna** - **ARM® Cortex M4F 32bit processor and 1MB Flash & 256kB RAM** ## **Outline** **==> picture [228 x 141] intentionally omitted <==** **----- Start of picture text -----**<br> Unit: mm<br>10.0<br>|__|<br>” alee<br>2) i; = =<br>Cat = =<br>C Ee a<br>15.4<br>**----- End of picture text -----**<br> - **ARM® TrustZone® Cryptocell 310 cryptographic accelerator** - **Interface: USB, NFC-A, SPI, UART, I2C, I2S, PDM and 12bit ADC** - **Outline: 10.0 x 15.4 x 2.0 mm** - **Operating Temperature range: -40 to 85 deg-C** - **Bluetooth and Japan, FCC, IC qualified** **Bottom View** **Top View** - **ETSI EN 300 328 v2.1.1 Conducted Test Report Available** ## **Block Diagram** - **RoHS compliant / Complete Lead Free** ## **Applications** **==> picture [310 x 171] intentionally omitted <==** **----- Start of picture text -----**<br> DC/DC DC/DC VCC_NRF<br>VDDH<br>LC filter LC filter<br>VBUS<br>SWD (2)<br>Filter RF+BB<br>I/O I/O&Reset<br>ARM Cortex M4F<br>(46)<br>USB (2)<br>X’tal X’tal<br>(32MHz) (32KHz)<br>CL GND<br>**----- End of picture text -----**<br> - **Advanced wearables** - **Connected watches** - **Advanced personal fitness devices** - **Wearables with wireless payment** - **Connected health** - **Virtual/Augmented reality applications** - **Internet of Things** - **-Smart home sensors and controllers** - **Industrial IoT sensors and controllers** - **Interactive entertainment devices** **All specifications are subject to change without notice. The** _**Bluetooth®**_ **word mark and logos are owned by the** _**Bluetooth**_ **SIG, Inc. and any use of such marks by TAIYO YUDEN CO., LTD. is under license.** ## **Bluetooth** Bluetooth® Ⓡ S **low energy Module Sample, Evaluation Board / Kit** | low energy ModuleModule Sample,Sample, EvalEvaluationion B Boar d/ Kiit **EYSKBNZWB** (Module) **EBSKBNZWB** (EV-B) **EKSKBNZWB** (EV-K) **Module samples Evaluation board** ## **Evaluation kit** **==> picture [159 x 63] intentionally omitted <==** **----- Start of picture text -----**<br> or<br>(Se<br>Tray Tape<br>**----- End of picture text -----**<br> **==> picture [87 x 51] intentionally omitted <==** **----- Start of picture text -----**<br> SEGGER<br>J-Link LITE<br>Attached<br>**----- End of picture text -----**<br>
Updated at February 9, 2023
Founded in 1950, Taiyo Yuden is a globally recognized manufacturer of electronic components, renowned for a foundational approach to product creation that begins with raw material development. This dedication to advanced material science has positioned the company as a trusted leader in providing highly reliable components for modern smartphones, automotive systems, information infrastructure, and industrial equipment. The core of our Taiyo Yuden portfolio is built around their industry-leading inductive solutions. We feature a comprehensive selection of high-performance power inductors and RF inductors, engineered to deliver exceptional efficiency and precision in demanding power management and high-frequency communication circuits. Complementing this robust inductor offering, our range includes specialized Taiyo Yuden components designed for diverse engineering needs. This encompasses common mode chokes and filters for effective EMC and RFI suppression, compact Bluetooth modules for advanced wireless networking, single-band chip and RF antennas, as well as high-capacity supercapacitors for innovative energy storage.
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