EXCCL3225U1

Chip Bead Cores 

## **Chip Bead Cores** 

## Type: **EXCCL EXCML EXC3B** 

## ■ Features 

- Effective noise suppression for power lines and high speed signal lines 

- Easy pattern layout on PC Board 

- For fl ow soldering and refl ow soldering 

## ■ Recommended Applications 

- Digital equipment such as PCs, word processors, print ers, HDD, PCC, CD-ROMs, DVD-ROMs. 

- Digital audio and video equipment such as VCRs, DVC, CD Players, DVD Players. 

- AC adapters, and switching power supplies. 

## Type: EXCCL, EXCML 

- Low DC Resistance 3 to 8 m typical: Rated current (3 and 4 Amperes) (type: EXCML) 

   - Electronic musical instruments, and other digital equipment. 

- Low impedance 

## Type: EXC3B 

- High impedance for high speed signal line noise 

- Increased attenuation 

- 60 -1 A, 120 -0.5 A are achieved by using 1608 size (type: EXC3BP) 

## ■ Type: EXCCL 

## ● Explanation of Part Numbers 

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**----- Start of picture text -----**<br>
1 2 3 4 5 6 7 8 9 10 11 12<br>E X C C L 3 2 1 6 U 1<br>NOoOoddooocddo<br>Product Code Type Part kind Size Form Suffix<br>Noise Filter Chip type Bead core Code Dimensions (mm) Code Packing<br>4532 4.5x3.2x1.8<br>3225 3.2x2.5x1.6 U Embossed Carrier Taping<br>Oo ge 3216 3.2x1.6x1.6  =<br>**----- End of picture text -----**<br>


Design and specifi cations are each subject to change without notice.  Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

Feb. 2006 

Chip Bead Cores 

## ■ Construction 

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**----- Start of picture text -----**<br>
Ferrite core<br>Electrode<br>**----- End of picture text -----**<br>


## ■ Dimensions in mm (not to scale) 

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**----- Start of picture text -----**<br>
A A<br>L<br>Type  Dimensions (mm) Mass<br>(Weight)<br>(inches) L W H A [mg/pc.]<br>EXCCL4532<br>4.5±0.4 3.2±0.3 1.8±0.2 0.5±0.2 125.8<br>(1812)<br>EXCCL3225<br>3.2±0.3 2.5±0.3 1.6±0.3 0.5±0.3 60.5<br>(1210)<br>EXCCL3216<br>3.2±0.3 1.6±0.3 1.6±0.3 0.5±0.3 37<br>(1206)<br>L<br>W<br>**----- End of picture text -----**<br>


## ■ Type: EXCML 

## ● Explanation of Part Numbers 

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**----- Start of picture text -----**<br>
1 2 3 4 5 6 7 8 9 10 11 12<br>E X C M L 2 0 A 3 9 0 U<br>Product Code Type Part kind Size Material Nominal Impedance Form<br>Noise Filter Multilayer Bead core Code Dimensions (mm) The first two digits are Code Packing<br>Chip type significant figure of<br>45 4.5x1.6 x1.1 impedance value and the U Embossed Carrier Taping<br>32 3.2x1.6 x0.9 third one denotes the (EXCML16 to 32)<br>20 2.0x1.25x0.9 number of zeros following H Embossed Carrier Taping<br>16 1.6x0.8 x0.8 (EXCML45)<br>**----- End of picture text -----**<br>


## ■ Construction 

## ■ Dimensions in mm (not to scale) 

|||||e|||||T||
|---|---|---|---|---|---|---|---|---|---|---|
||||||||W||||
||Ferrite core|||L|||||||
||||Type<br>(inches)|<br>L|Dimensions (mm)<br>W<br>T||||e|Mass<br>(Weight)<br>[mg/pc.]|
|Conductor<br>Electrode|||EXCML16<br>(0603)|1.6±0.2|0.8±0.2||0.8±0.2||(0.4)|4.5|
||||EXCML20<br>(0805)|2.0±0.2|1.25±0.20||0.9±0.2||(0.5)|10.5|
||||EXCML32<br>(1206)|3.2±0.3|1.6±0.3||0.9±0.2||(0.6)|21.5|
||||EXCML45<br>(1806)|4.5±0.3|1.6±0.3||1.1±0.2||(0.6)|36.0|
||||||||||||



Design and specifi cations are each subject to change without notice.  Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

Feb. 2006 

Chip Bead Cores 

## ■ Type: EXC3B 

## ● Explanation of Part Numbers 

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1 2 3 4 5 6 7 8 9 10 11 12<br>E X C 3 B B 2 2 1 H<br>Product Code Size Type Characteristics Nominal Impedance Form Suffix<br>Noise Filter Code Dimensions (mm) Chip typeMultilayer B High frequencyHigh attenuation The first two digits aresignificant figure of Code Packing<br>3 1.6x0.8x0.8 Bead Core for signal Lines impedance value and the H Embossed Carrier Taping<br>High frequency third one denotes the<br>P High attenuation number of zeros following<br>for Power Lines<br>**----- End of picture text -----**<br>


## ■ Construction 

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**----- Start of picture text -----**<br>
Ferrite core<br>Inner Conductor<br>Electrode<br>**----- End of picture text -----**<br>


## ■ Dimensions in mm (not to scale) 

||e<br>T<br>W<br>L<br>Dimensions (mm)<br>Mass<br>(Weight)<br>[mg/pc.]<br>L<br>W<br>T<br>e<br>1.6±0.2<br>0.8±0.2<br>0.8±0.2<br>0.30±0.15<br>4.5<br>1.6±0.2<br>0.8±0.2<br>0.8±0.2<br>0.30±0.15<br>4.5|e<br>T<br>W<br>L<br>Dimensions (mm)<br>Mass<br>(Weight)<br>[mg/pc.]<br>L<br>W<br>T<br>e<br>1.6±0.2<br>0.8±0.2<br>0.8±0.2<br>0.30±0.15<br>4.5<br>1.6±0.2<br>0.8±0.2<br>0.8±0.2<br>0.30±0.15<br>4.5|e<br>T<br>W<br>L<br>Dimensions (mm)<br>Mass<br>(Weight)<br>[mg/pc.]<br>L<br>W<br>T<br>e<br>1.6±0.2<br>0.8±0.2<br>0.8±0.2<br>0.30±0.15<br>4.5<br>1.6±0.2<br>0.8±0.2<br>0.8±0.2<br>0.30±0.15<br>4.5|e<br>T<br>W<br>L<br>Dimensions (mm)<br>Mass<br>(Weight)<br>[mg/pc.]<br>L<br>W<br>T<br>e<br>1.6±0.2<br>0.8±0.2<br>0.8±0.2<br>0.30±0.15<br>4.5<br>1.6±0.2<br>0.8±0.2<br>0.8±0.2<br>0.30±0.15<br>4.5|
|---|---|---|---|---|
|Type<br>(inches)|Dimensions (mm)||||
||L|W|T|e|
|EXC3BB<br>(0603)|1.6±0.2|0.8±0.2|0.8±0.2|0.30±0.15|
|EXC3BP<br>(0603)|1.6±0.2|0.8±0.2|0.8±0.2|0.30±0.15|
||||||



## ■ Ratings 

|■Ratings|||||||
|---|---|---|---|---|---|---|
|Type|Part Number|Impedance<br>(�) at 100 MHz||tol.(%)|Rated Current<br>(mA DC)|DC Resistance<br>(�) max.|
|4532|EXCCL4532U1|115|||2000|0.1|
|3225|EXCCL3225U1|45|||2000|0.05|
|3216|EXCCL3216U1|25|||2000|0.05|
|4516|EXCML45A910H|91|||3000|0.016|
|3216|EXCML32A680U|68|||3000|0.012|
|2012|EXCML20A390U|39|||4000|0.008|
|||||±25|||
|1608|EXCML16A270U|27|||4000|0.006|
||EXC3BP600H|60|||1000|0.07|
||EXC3BP121H|120|||500|0.1|
|1608|EXC3BB221H|220|||200|0.3|
||EXC3BB601H|600|||100|0.8|
||EXC3BB102H|1000|||50|1|



Design and specifi cations are each subject to change without notice.  Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

Feb. 2006 

Chip Bead Cores 

## ■ 

## 

�Z� : Impedance R : Resistance X : Reactance 

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●EXCCL4532U1 (4532)<br>140<br>120<br>100 Z<br>80<br>60 R<br>40 X<br>20<br>0<br>1 10 100 1000 10000<br>Frequency(MHz)<br>●EXCCL3225U1 (3225)<br>140<br>120<br>100<br>80<br>60 Z<br>40<br>R<br>20<br>X<br>0<br>1 10 100 1000 10000<br>Frequency(MHz)<br>●EXCCL3216U1 (3216)<br>140<br>120<br>100<br>80<br>60<br>40 Z<br>20 R<br>0 X<br>1 10 100 1000 10000<br>Frequency(MHz)<br>)�<br>, R, X(<br>�<br>Z<br>�<br>)�<br>, R, X(<br>�<br>Z<br>�<br>)�<br>, R, X(<br>�<br>Z<br>�<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
●EXCML16A270U (1608)<br>140<br>120<br>100<br>80<br>60<br>40 Z<br>R<br>20 X<br>0<br>1 10 100 1000 10000<br>Frequency(MHz)<br>●EXCML20A390U (2012)<br>140<br>120<br>100<br>80<br>60<br>Z<br>40 R<br>20 X<br>0<br>1 10 100 1000 10000<br>Frequency(MHz)<br>●EXCML32A680U (3216)<br>140<br>120<br>100<br>80 Z<br>R<br>60<br>40<br>X<br>20<br>0<br>1 10 100 1000 10000<br>Frequency(MHz)<br>●EXCML45A910H (4516)<br>180<br>160<br>140<br>120<br>Z<br>100<br>R<br>80<br>60<br>X<br>40<br>20<br>0<br>1 10 100 1000 10000<br>Frequency(MHz)<br>)�<br>, R, X(<br>�<br>Z<br>�<br>)�<br>, R, X(<br>�<br>Z<br>�<br>)�<br>, R, X(<br>�<br>Z<br>�<br>)�<br>, R, X(<br>�<br>Z<br>�<br>**----- End of picture text -----**<br>


Design and specifi cations are each subject to change without notice.  Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

Feb. 2006 

Chip Bead Cores 

## ■ 

�Z� : Impedance R : Resistance X : Reactance 

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**----- Start of picture text -----**<br>
●EXC3BB221H (1608) ●EXC3BP121H (1608)<br>1400 200<br>1200<br>Z<br>150<br>1000<br>R<br>800<br>100<br>600<br>400 Z 50 X<br>200<br>0 X R 0<br>1 10 100 1000 10000 1 10 100 1000 10000<br>Frequency(MHz) Frequency(MHz)<br>●EXC3BB601H (1608) ●EXC3BP600H (1608)<br>1400 200<br>1200<br>150<br>1000<br>800 Z<br>100<br>600 R<br>R Z<br>400<br>50<br>200<br>X X<br>0 0<br>1 10 100 1000 10000 1 10 100 1000 10000<br>Frequency(MHz) Frequency(MHz)<br>)� )�<br>, R, X( , R, X(<br>� �<br>Z Z<br>� �<br>)� )�<br>, R, X( , R, X(<br>� �<br>Z Z<br>� �<br>**----- End of picture text -----**<br>


- ●EXC3BB102H (1608) 

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**----- Start of picture text -----**<br>
1400<br>1200<br>1000 Z<br>R<br>800<br>600<br>X<br>400<br>200<br>0<br>1 10 100 1000 10000<br>Frequency(MHz)<br>)�<br>, R, X(<br>�<br>Z<br>�<br>**----- End of picture text -----**<br>


Design and specifi cations are each subject to change without notice.  Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

Feb. 2006 

Chip Bead Cores 

## ■ Packaging Methods (Taping) 

## ● Standard Quantity 

|●Standard Quantity||||
|---|---|---|---|
|Part Number|Kind of Taping|Pitch (P1)|Quantity|
|EXCCL4532U1||8 mm|1000 pcs./reel|
|EXCCL3225U1||||
|EXCCL3216U1|||2000 pcs./reel|
|EXCML45A910H||||
|EXCML32A680U|Embossed Carrier Taping|4 mm|3000 pcs./reel|
|EXCML20A390U||||
|EXCML16A270U|||4000 pcs./reel|
|EXC3B����H||||



## ● Embossed Carrier Taping 

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**----- Start of picture text -----**<br>
t1<br>Sprocket hole Compartment<br>fD0<br>A<br>t2 P1 P2 P0<br>Chip component Tape running direction<br>E<br>B F W<br>**----- End of picture text -----**<br>


## ● Taping Reel 

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**----- Start of picture text -----**<br>
T<br>f C<br>f D<br>E<br>f A W t<br>B<br>f<br>**----- End of picture text -----**<br>


## Embossed Carrier Dimensions (mm) 

|Part Number|A|B|W|F|E|P1|P2|P0|fD0|t1|t2|
|---|---|---|---|---|---|---|---|---|---|---|---|
|EXCCL4532U1|3.6±0.2|4.9±0.2|12.0±0.2|5.5±0.1||8.0±0.1|||||2.4 max.|
|EXCCL3225U1|2.9±0.2|3.6±0.2|8.0±0.2|3.5±0.1|||||||2.1 max.|
|EXCCL3216U1|2.0±0.2|3.6±0.2||||||||||
|EXCML45A910H|1.9±0.2|4.8±0.2|12.0±0.2|5.5±0.1|1.75±0.10|4.0±0.1|2.0±0.1|4.0±0.1|1.5±0.1|0.20±0.05|1.8 max.|
|EXCML32A680U|1.9±0.2|3.5±0.2||||||||||
|EXCML20A390U|1.5±0.2|2.3±0.2||||||||||
||||8.0±0.2|3.5±0.1|||||||1.6 max.|
|EXCML16A270U|1.1±0.2|2.1±0.2||||||||||
|EXC3B����H|1.0±0.1|1.8±0.1||||||||0.25±0.05||



## Standard Reel Dimensions (mm) 

|Part Number|fA||fB|fC|fD|E|W|W|T|t|
|---|---|---|---|---|---|---|---|---|---|---|
|EXCCL4532U1|||||||13.0<br>+0.5<br>–1.0||16.5 max.||
|EXCCL3225U1<br>EXCCL3216U1|||||||09.5|+0.5<br>–1.0|13 max.||
|EXCML45A910H|180.0<br>0<br>–3.0||60.0±1.0|13.0±0.5|21.0±0.8|2.0±0.5|13.0|+0.5<br>–1.0|16.5 max.|1.2±0.5|
|EXCML32A680U|||||||||||
|EXCML20A390U|||||||09.5|+0.5<br>–1.0|13 max.||
|EXCML16A270U|||||||||||
|EXC3B����H|||||||||||



Design and specifi cations are each subject to change without notice.  Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

Feb. 2006 

Chip Bead Cores 

## ■ Recommended Soldering Conditions 

Recommendations and precautions are described below. 

- Please contact us for additional information when used in conditions other than those specifi ed. 

**==> picture [460 x 266] intentionally omitted <==**

**----- Start of picture text -----**<br>
● Please measure the temperature of the terminals and study every kind of solder and printed circuit board<br>for solderability before actual use.<br>The limit of resistance<br><Recommended reflow soldering temperature> to reflow soldering heat<br>270<br>260<br>Rising temperature I<br>250<br>Preheating<br>Gradual<br>240<br>cooling<br>Main 230<br>Rising temperature II<br>heating<br>220<br>210<br>200<br>0 10 20 30 40 50 60 70<br>Time (min.) Time (s)<br>Solder Rising temperature I Preheating Rising temperature II Main heating Gradual cooling<br>The normal time<br>For soldering 140 °C to 160 °C Preheating to 200 °C 235±10 °C 200 °C to 100 °C<br>(Sn-37Pb) for preheating30 s to 60 s 60 s to 120 s 20 s to 40 s Peak 1 °C to 4 °C/s<br>For lead-free The normal time +10<br>150 °C to 170 °C Preheating to 210 °C 250– 5  °C 210 °C to 100 °C<br>(Sn-3Ag-0.5Cu)soldering for preheating 30 s to 60 s 60 s to 120 s 20 s to 40 s Peak 1 °C to 4 °C/s<br>✽ Refl ow soldering shall be performed a maximum of two times.<br>C)<br>°<br>C)<br>°<br>Temperature (<br>Temperature of terminals (<br>**----- End of picture text -----**<br>


<Repair with hand soldering> 

- Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder each electrode for 3 seconds or less. 

- Never touch this product with the tip of a soldering iron. 

## ■ Recommended Land Pattern Dimensions in mm (not to scale) 

||A<br>B|(mm)|(mm)|(mm)|
|---|---|---|---|---|
|||Part Number|A<br>B|C|
||A<br>B||||
|||EXCCL4532U1|3<br>5.|4<br>2.8|
|||EXCCL3225U1|1.7<br>4.|1<br>2.1|
||A||||
|||EXCCL3216U1|1.7<br>4.|1<br>1.2|
|||EXCML45A910H|2.6 to 3<br>5.5 to|6.5<br>1.2 to 1.6|
||||||
|||EXCML32A680U|1.6 to 2<br>4 to|5<br>1.2 to 1.6|
|||EXCML20A390U|0.8 to 1.2<br>3 to|4<br>1 to 1.2|
|C|||||
|||EXCML16A270U|0.6 to 1<br>2 to|3<br>0.8 to 1|
|||EXC3B����H|0.8 to 1<br>2 to|2.6<br>0.8 to 1|
||||||
||||||



## Safety Precautions 

The following are precautions for individual products. Please also refer to the precautions common to EMI Filters, Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog. 

1. With regard to fl ow soldering, consult with our sales person in advance. 

2. Use rosin-based fl ux or halogen-free fl ux. 

3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales per son in advance. 

4. Do not apply shock to Chip Bead Cores (hereafter called the bead cores) or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their per for mance. Excessive mechanical stress may damage the bead cores. Handle with care. 

5. Store the bead cores in a location with a temperature ranging from -5 °C to +40 °C and a rel a tive humidity of 40 % to 60 %, where there are no rapid changes in temperature or humidity. 

6. Use the bead cores within a year (EXC3B Type: within half a year) after the date of the out go ing in spec tion indicated on the packages. 

Design and specifi cations are each subject to change without notice.  Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

Feb. 2006 

Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements]) 

- When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice. 

- Do not use the products beyond the specifi cations described in this catalog. 

- This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. 

- Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other signifi cant dam age, such as damage to vehicles (automobile, train, vessel), traffi c lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. 

- ✽ Systems equipped with a protection circuit and a protection device 

- ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault 

## (1) Precautions for use 

- These products are designed and manufactured for general and standard use in general elec tron ic equipment (e.g. AV equipment, home electric appliances, offi ce equipment, information and communication equipment) 

- These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 

2. In direct sunlight, outdoors, or in dust 

3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 

4. Electric Static Discharge (ESD) Environment 

   - These components are sensitive to static electricity and can be damaged under static shock (ESD). 

   - Please take measures to avoid any of these environments. 

   - Smaller components are more sensitive to ESD environment. 

5. Electromagnetic Environment 

   - Avoid any environment where strong electromagnetic waves exist. 

6. In an environment where these products cause dew condensation 

7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials 

- These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. 

- Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or infl ammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs). 

- Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the performance or reliability of the products. 

- Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. 

## (2) Precautions for storage 

The performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the date of arrival at your company) 

The performance of EMI Filters is guaranteed for 6 months or a year from the out go ing inspection date indicated on the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 % to 60 %. Check the guarantee period in the specifi cations. The performance of Thermal Cut offs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -10 °C to +40 °C and a relative humidity of 30 % to 75 %. 

Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 

1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight 

## <Package markings> 

Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. 

Feb. 2006 

– EX2 –