EXCCET470U

Chip EMI Filters 

## **Chip EMI Filters** 

## Type: **EXCCET** 

## ■ Features 

- Rated current (2 A max.) 

- Eight capacitance values in a wide range, related to the noise frequency 

- Suitable for narrow pitch insertion 

- Suitable for applications requiring thin design 

## ■ Recommended Applications 

- Digital equipment such as PCs, word processors, printers, HDD, PPC, and communication equipment. 

- Digital audio and video equipment. 

- AC adapters, and switching power supplies. 

- Electronic musical instruments, and other digital equipment. 

## ■ Explanation of Part Numbers 

**==> picture [381 x 126] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 2 3 4 5 6 7 8 9 10<br>E X C C E T 1 0 3 U<br>Product Code Type Circuit Nominal Form<br>CapacitanceValue<br>Noise Filter Chip type T-circuit The first two digits are Code Packing<br>significant figures of<br>EMI filter capacitance value and the U Embossed Carrier Taping<br>third one denotes the number<br>of zeros following.<br>**----- End of picture text -----**<br>


## ■ Construction 

## ■ Dimensions in mm (not to scale) 

**==> picture [472 x 157] intentionally omitted <==**

**----- Start of picture text -----**<br>
Ferrite core incall<br>: oP ew al |<br>0.5±0.2 1.25±0.30 0.5±0.2<br>4.5±0.4 1.8±0.2<br>Adhesive<br>Chip capacitor Electrode<br>Size : 1807 inches<br>Mass (Weight) : 92.5 mg/pc.<br>0.3<br>±<br>0.2 2.7<br>±<br>1.0<br>**----- End of picture text -----**<br>


Design and specifi cations are each subject to change without notice.  Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

Feb. 2006 

Chip EMI Filters 

## ■ Ratings 

**==> picture [493 x 145] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||||||
|---|---|---|---|---|---|---|---|---|
|Rated|(1)|Tolerance|(2)|Rated|DC|25 dB Attenuate|15 dB Attenuate|
|Part Number|Voltage|Capacitance|Characteristics|Current|Resistance|Frequency|Frequency|
|(%)|
|(V DC)|(pF)|(A DC)|(m�)|(MHz)|(MHz)|
|EXCCET220U|50|22|±20|YB|2|50 max.|800 to 1000|600 to 1000|
|EXCCET470U|50|47|±20|YB|2|50 max.|450 to 550|350 to 1000|
|EXCCET101U|50|100|±20|YB|2|50 max.|300 to 450|200 to 900|
|EXCCET271U|50|270|±20|YB|2|50 max.|200 to 300|80 to 700|
|EXCCET471U|50|470|±20|YB|2|50 max.|100 to 220|50 to 700|
|EXCCET102U|50|1000|±20|YB|2|50 max.      65 to 200|30 to 700|
|EXCCET222U|50|2200|±20|YB|2|50 max.|35 to 180|15 to 700|
|EXCCET103U|50|10000|±20|YB|2|50 max.|15 to 120|15 to 700|

**----- End of picture text -----**<br>


(1) Please inquire to us about the particular capacitance value, on a range of 22 to 10000 pF. 

(2) Characteristics YB: Maximum capacitance is ±10 % over the temperature range of –25 °C to +85 °C in reference to +20 °C. 

## ■ Attenuation Characteristics  (Reference Data) 

**==> picture [491 x 151] intentionally omitted <==**

**----- Start of picture text -----**<br>
0<br>Measurement Circuit<br>10<br>20<br>50 �<br>30 Sample<br>470<br>40 471271 101<br>222 102 220 ~ 50 �<br>50<br>103<br>60<br>1M 10M 100M 1G<br>Frequency (Hz)<br>�<br>Attenuation(dB)<br>**----- End of picture text -----**<br>


## ■ Packaging Methods (Taping) 

● Standard Quantity 

**==> picture [493 x 41] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||||
|---|---|---|---|
|Part Number|Kind of Taping|Pitch (P1)|Quantity|
|EXCCET���U|Embossed Carrier Taping|4 mm|1000 pcs./reel|

**----- End of picture text -----**<br>


## ● Embossed Carrier Taping 

## ● Taping Reel 

**==> picture [493 x 226] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|T|
|(W=12 mm)|
|E|
|t1|Sprocket hole|Compartment|f C|
|fD0|
|A|
|f D|
|t2|P1|P2|P0|Tape running direction|
|Chip component|
|f A|W|t|
|A|B|W|F|E|P1|fA|fB|fC|fD|
|Dimensions|Dimensions|
|(mm)|2.2|[±0.2]|4.9|[±0.2]|12.0|[±0.2]|5.50|[±0.05]|1.75|[±0.10]|4.0|[±0.1]|(mm)|180.0–3.0|[ 0]|60.0±1.0|13.0±0.5|21.0±0.8|
|P2|P0|fD0|t1|t2|E|W|T|t|
|Dimensions|Dimensions|
|(mm)|2.0|[±0.1]|4.0|[±0.1]|1.5|[+0.1]|0|0.35|[±0.05]|3.5 max.|(mm)|2.0±0.5|13.0|[+0.5]|–1.0|16.5 max.|1.2±0.5|

**----- End of picture text -----**<br>


Design and specifi cations are each subject to change without notice.  Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

Feb. 2006 

Chip EMI Filters 

## ■ Recommended Land Pattern Design(mm) 

**==> picture [491 x 536] intentionally omitted <==**

**----- Start of picture text -----**<br>
● For Single Mounting ● For High Density Mounting<br>Resist 1.0 Copper foil<br>Resist<br>1.0 Copper foil<br>Resist<br>1.3 1.3<br>5.4<br>1.3 1.3<br>5.4<br>■ Recommended Soldering Conditions<br>Recommendations and precautions are described below.<br>● Please contact us for additional information when used in conditions other than those specifi ed.<br>● Please measure the temperature of the terminals and study every kind of solder and printed circuit board<br>for solderability before actual use.<br>The limit of resistance<br><Recommended reflow soldering temperature> to reflow soldering heat<br>270<br>260<br>Rising temperature I<br>250<br>Preheating<br>Gradual<br>240<br>cooling<br>Main 230<br>Rising temperature II<br>heating<br>220<br>210<br>200<br>0 10 20 30 40 50 60 70<br>Time (min.) Time (s)<br>Solder Rising temperature I Preheating Rising temperature II Main heating Gradual cooling<br>The normal time<br>For soldering 140 °C to 160 °C Preheating to 200 °C 235±10 °C 200 °C to 100 °C<br>(Sn-37Pb) for preheating30 s to 60 s 60 s to 120 s 20 s to 40 s Peak 1 °C to 4 °C/s<br>For lead-free The normal time +10<br>150 °C to 170 °C Preheating to 210 °C 250– 5  °C 210 °C to 100 °C<br>(Sn-3Ag-0.5Cu)soldering for preheating 30 s to 60 s 60 s to 120 s 20 s to 40 s Peak 1 °C to 4 °C/s<br>✽ Refl ow soldering shall be performed a maximum of two times.<br>0.2<br>0.2 1.15<br>1.4<br>1.15<br>1.4<br>2.54<br>1.4<br>C)<br>°<br>C)<br>°<br>Temperature (<br>Temperature of terminals (<br>**----- End of picture text -----**<br>


<Repair with hand soldering> 

- Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder each electrode for 3 seconds or less. 

- Never touch this product with the tip of a soldering iron. 

Design and specifi cations are each subject to change without notice.  Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

Feb. 2006 

Chip EMI Filters 

## Safety Precautions 

The following are precautions for individual products. Please also refer to the precautions common to EMI Filters, Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog. 

1. Chip EMI Filters (hereafter called the fi lters) cannot be mounted on a printed circuit board by fl ow soldering. Mount them by refl ow soldering. 

2. Use rosin-based fl ux or halogen-free fl ux. 

3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, con sult with our sales person in advance. 

4. Do not apply shock to the fi lters or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress may damage the filters. Handle with care. 

5. Avoid applying static electricity to the fi lters. 

6. The performance of the fi lters deteriorates in a circuit that is susceptible to surges or other abnormal voltages. Carefully check the circuit operations before use. 

7. Store the fi lters in a location with a temperature ranging from –5 °C to +40 °C and a relative humidity of 40 % to 60 %, where there are no rapid changes in temperature or humidity. 

8. Use the fi lters within a year after the date of the outgoing inspection indicated on the packages. 

Design and specifi cations are each subject to change without notice.  Ask factory for the current technical specifi cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

Feb. 2006 

Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements]) 

- When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject to change without prior notice. 

- Do not use the products beyond the specifi cations described in this catalog. 

- This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. 

- Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other signifi cant dam age, such as damage to vehicles (automobile, train, vessel), traffi c lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. 

- ✽ Systems equipped with a protection circuit and a protection device 

- ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault 

## (1) Precautions for use 

- These products are designed and manufactured for general and standard use in general elec tron ic equipment (e.g. AV equipment, home electric appliances, offi ce equipment, information and communication equipment) 

- These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 

2. In direct sunlight, outdoors, or in dust 

3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 

4. Electric Static Discharge (ESD) Environment 

   - These components are sensitive to static electricity and can be damaged under static shock (ESD). 

   - Please take measures to avoid any of these environments. 

   - Smaller components are more sensitive to ESD environment. 

5. Electromagnetic Environment 

   - Avoid any environment where strong electromagnetic waves exist. 

6. In an environment where these products cause dew condensation 

7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials 

- These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. 

- Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or infl ammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs). 

- Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the performance or reliability of the products. 

- Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. 

## (2) Precautions for storage 

The performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the date of arrival at your company) 

The performance of EMI Filters is guaranteed for 6 months or a year from the out go ing inspection date indicated on the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 % to 60 %. Check the guarantee period in the specifi cations. The performance of Thermal Cut offs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -10 °C to +40 °C and a relative humidity of 30 % to 75 %. 

Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 

1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight 

## <Package markings> 

Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. 

Feb. 2006 

– EX2 –