ES3G

## Power Diodes 

## Ultra-Fast Recover y 

## **Features:** 

- Glass passivated junction chip 

- For surface mounted application 

- Low profile package 

- Built-in strain relief 

- Ideal for automated placement 

- Easy pick and place 

- Superfast recovery time for high efficiency 

- High temperature soldering : 250°C / 10 seconds at terminals 

## **Mechanical Data:** 

Cases : Moulded plastic Terminals : Solder plated Polarity : Indicated by cathode band 

## **SMC/DO-214AB** 

Dimensions : Inches (Millimetres) 

## **Foot Print** 

## **Dimensions** 

|**Length**|**Width**|**Depth**|**X**|**Y**|**Z**|
|---|---|---|---|---|---|
|8.13|6.22|2.62|6.5|3.2|1.8|



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## Power Diodes 

## Ultra-Fast Recover y 

## **Maximum Ratings and Electrical Characteristics** 

Rating at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% 

|**Type Number**|**ES3B**|**ES3C**|**ES3D**|**ES3G**|**Unit**|
|---|---|---|---|---|---|
|Maximum Recurrent Peak Reverse Voltage|100|150|200|400|V|
|Maximum RMS Voltage|70<br>a<br>ee|105<br>ee<br>ee|140<br>ee<br>ee|280||
|Maximum DC Blocking Voltage|100<br>a <br>ee|150<br> ee<br>ee|200<br>ee<br>ee|400||
|Maximum Average Forward Rectified Current (See Figure 1)|3<br>ee ee||||A|
|Peak Forward Surge Current, 8.3 ms Single Half Sine-Wave<br>Superimposed on Rated Load (JEDEC Method) at TL= 100°C|100|||||
|Maximum Instantaneous Forward Voltage at 3 A|0.95<br>||||1.3|V|
|Maximum DC Reverse Current at TA= 25°C<br>at Rated DC Blocking Voltage at TA = 100°C|10<br>500<br>|||||µA|
|Maximum Reverse Recovery Time (Note 1)|35||||µS|
|Typical Junction Capacitance (Note 2)|45<br>Po|||30|pF|
|Typical Thermal Resistance (Note 3) RθJA<br>RθJL|47<br>12<br>Po||||°C / W|
|Operating Temperature Range TJ|-55 to +150||||°C|
|Storage Temperature Range TSTG||||||



## **Notes :** 

1. Reverse recovery test conditions : IF = 0.5 A, IR = 1 A, IRR = 0.25 A 

2. Measured at 1 MHz and applied VR = 4 V 

3. Units mounted on PCB with 0.31 × 0.31 inches (8 × 8 mm) copper pad areas 

## **Ratings and Characteristic Curves** 

**Figure 1 Maximum Forward Current Derating Curve** 

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Figure 2 Maximum Non-Repetitive Forward Surge Current<br>3 aN ™ _ TT]lM lesresetsne<br>tt |KEEEf 1258 eriiy (JEDEC Method at TL 120°C<br>N eT lll<br>p— aN.<br>SN) esto<br>pe I N CS CUMFaShi. SelTeel<br>NPIL<br>ao—Osté‘“‘i!OCOOC«dSst=‘<iKSCaSSC«SS a a ao<br>Lead Temperature (°C)<br>Number of Cycles at 60 Hz<br>Average Forward Current (A)<br>Peak Forward Surge Current (A)<br>**----- End of picture text -----**<br>


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## Power Diodes 

## Ultra-Fast Recover y 

**Figure 3 Typical Instantaneous Forward Characteristics** 

**Figure 4 Typical Reverse Characteristics** 

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10 -1% Duty cycle " ae we<br>Ljp_YY| | | |<br>wef AL | ff<br>Bae-—— SS SSS SS SSE<br>OOVE DE Da aa Te<br>Forward Voltage (V)<br>Figure 5 Typical Junction Capacitance<br>105 mE<br>90 ez<br>pfaaSLL| sesf=1 MHz<br>60<br>hs, Sn<br>of |Peet<br>pL<br>i<br>Instantaneous Forward Current (A)<br>F)<br>Junction Capacitance (P<br>**----- End of picture text -----**<br>


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Instantaneous Reverse Current (A)<br>**----- End of picture text -----**<br>


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Percent of Rated Peak Reverse Voltage (V)<br>**----- End of picture text -----**<br>


## **Reverse Voltage (V) Specification  Table** 

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|||||||||
|---|---|---|---|---|---|---|---|
|IF|(AV)|VRRM|IFSM|Maximumtrr|(V)VF|Package|Part Number|
|(A)|(V)|(A)|(nS)|at IF|= 3 A|
|100|ES3B|
|150|0.95|ES3C|
|DO-214AB|
|3|100|35|
|200|(SMC)|ES3D|
|400|1.3|ES3G|

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|Important Notice :|This data sheet and its contents (the "Information") belong to the members of the Premier Farnell group of companies (the "Group") or are licensed to it. No licence is granted for the use of|
|it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change without notice and replaces|
|all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any error in or omission from it or for any use|
|made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any assumptions based on information included or omitted.|
|Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the Group was aware of the possibility of such loss or damage arising)|
|is excluded. This will not operate to limit or restrict the Group's liability for death or personal injury resulting from its negligence. Multicomp is the registered trademark of the Group. © Premier Farnell plc 2012.|

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