ERTJ0EA220J

## **Multilayer NTC Thermistors** 

**ERTJ** series 

## **Features** 

- ●Surface Mount Device (0201・0402・0603) 

- ●Highly reliable multilayer / monolithic structure 

- ●Wide temperature operating range (-40 to 125 ℃) 

- ●Environmentally-friendly lead-free 

- ●RoHS compliant 

## **Recommended applications** 

- ●Mobile Phone 

   - ・Temperature compensation for crystal oscillator 

   - ・Temperature compensation for semiconductor devices 

- ●Personal Computer and Peripheral Device 

   - ・Temperature detection for CPU and memory device 

   - ・Temperature compensation for ink-viscosity (Inkjet Printer) 

- ●Battery Pack (secondary battery) 

   - ・Temperature detection of battery cells 

- ●Liquid Crystal Display 

   - ・Temperature compensation of display contrast 

   - ・Temperature compensation of display backlighting (CCFL) 

**==> picture [517 x 209] intentionally omitted <==**

**----- Start of picture text -----**<br>
 Explanation of part numbers<br>1 2 3 4 5 6 7 8 9 10 11 12<br>E R T J 0 E G 1 0 3 J A<br>Example<br>PILI LILI LIL LI LILI EI Ld<br>aee<br>Common code Size code Packaging B Value class code Nominal resistance Resistance tolerance Special<br>Product code Type code (inch size) style code A 2701 to 2800 R25 (Ω) code specification<br>Chip type Z 0201 G 3301 to 3400 The first two digits are F ±1 ％ Narrow<br>ERT Thermistors NTC J Multilayer(SMD) 0 0402 E 0201,0402Pressed carriertaping punched M 3801 to 3900 significant figures ofresistance and the G ±2 ％ tolerancetype<br>type 1 0603 carrier taping P 4001 to 4100 third one denotes the H ±3 ％ Standard<br>(Pitch : 2 mm) R 4201 to 4300 number of zerosfollowing them. J ±5 ％ type<br>0603 S 4301 to 4400<br>Punched carrier<br>V T  4401 to 4500<br>taping<br>(Pitch : 4 mm) V 4601 to 4700<br>**----- End of picture text -----**<br>


## **Construction** 

**==> picture [200 x 57] intentionally omitted <==**

**----- Start of picture text -----**<br>
③<br>④<br>➄<br>②<br>①<br>**----- End of picture text -----**<br>


|No.|Name|Name|
|---|---|---|
|①|Semiconductive ceramics||
|②<br>③|Substrate electrode<br>Internal electrode||
|④|Terminal electrode|Intermediate electrode|
|➄||External electrode|



Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. 

Should a safety concern arise regarding this product, please be sure to contact us immediately. 

1-Mar-20 

**Multilayer NTC Thermistors** 

## **Ratings** 

|Size code (inch size)|Z(0201)|0(0402)|1(0603)|
|---|---|---|---|
|Operating temperature range|–40 to 125℃|||
|Rated maximum power dissipation*1|33 mW|66 mW|100 mW|
|Dissipation factor*2|Approximately 1 mW /℃|Approximately 2 mW /℃|Approximately 3 mW /℃|



- *1: Rated Maximum Power Dissipation : The maximum power that can be continuously applied at the rated ambient temperature. 

   - ・The maximum value of power, and rated power is same under the condition of ambient temperature 25 ℃ or less. If the temperature exceeds 25 ℃, rated power depends on the decreased power dissipation curve. 

   - ・Please see “Operating Power” for details. 

- *2: Dissipation factor : The constant amount power required to raise the temperature of the Thermistor 1 ℃ through self heat generation under stable temperatures. 

   - ・Dissipation factor is the reference value when mounted on a glass epoxy board (1.6 mmT). 

## **Part number list of narrow tolerance type (Resistance tolerance : ±2 %, ±1 %)** 

## ● 0201 inch size 

|Part number|Nominal resistance<br>at 25℃(Ω)|Resistance tolerance|B Value<br>at 25/50 (K)|B Value<br>at 25/85 (K)|
|---|---|---|---|---|
|ERTJZEG103□A|10 kΩ|±1 %(F)<br>or<br>±2 %(G)|(3380 K)|3435 K±1 %|
|ERTJZEP473□|47 kΩ||4050 K±1 %|(4100 K)|
|ERTJZEP683□|68 kΩ||4050 K±1 %|(4100 K)|
|ERTJZER683□|68 kΩ||4250 K±1 %|(4300 K)|
|ERTJZER104□|100 kΩ||4250 K±1 %|(4300 K)|
|ERTJZET104□|100 kΩ||4500 K±1 %|(4550 K)|
|ERTJZEV104□|100 kΩ||4700 K±1 %|(4750 K)|



## ● 0402 inch size 

|Part number|Nominal resistance<br>at 25℃(Ω)|Resistance tolerance|B Value<br>at 25/50 (K)|B Value<br>at 25/85 (K)|
|---|---|---|---|---|
|ERTJ0EG103□A|10 kΩ|±1 %(F)<br>or<br>±2 %(G)|(3380 K)|3435 K±1 %|
|ERTJ0EP333□|33 kΩ||4050 K±1 %|(4100 K)|
|ERTJ0EP473□|47 kΩ||4050 K±1 %|(4100 K)|
|ERTJ0EP683□|68 kΩ||4050 K±1 %|(4100 K)|
|ERTJ0ER104□|100 kΩ||4250 K±1 %|(4300 K)|
|ERTJ0ES104□|100 kΩ||4330 K±1 %|(4390 K)|
|ERTJ0EV104□|100 kΩ||4700 K±1 %|(4750 K)|
|ERTJ0EV224□|220 kΩ||4700 K±1 %|(4750 K)|



## ● 0603 inch size 

|Part number|Nominal resistance<br>at 25℃(Ω)|Resistance tolerance|B Value<br>at 25/50 (K)|B Value<br>at 25/85 (K)|
|---|---|---|---|---|
|ERTJ1VG103□A|10 kΩ|±1 %(F)<br>or ±2 %(G)|(3380 K)|3435 K±1 %|
|ERTJ1VS104□A|100 kΩ||(4330 K)|4390 K±1 %|



□  : Resistance tolerance code 

## **Part number list of standard type (Resistance tolerance : ±5 %, ±3 %)** 

## ● 0201 inch size 

|Part number|Nominal resistance<br>at 25℃(Ω)|Resistance tolerance|B Value<br>at 25/50 (K)|B Value<br>at 25/85 (K)|
|---|---|---|---|---|
|ERTJZET202□|2.0 kΩ|±3 %(H)<br>or<br>±5 %(J)|4500 K±2 %|(4450 K)|
|ERTJZET302□|3.0 kΩ||4500 K±2 %|(4450 K)|
|ERTJZET472□|4.7 kΩ||4500 K±2 %|(4450 K)|
|ERTJZEG103□A|10 kΩ||(3380 K)|3435 K±1 %|
|ERTJZEP473□|47 kΩ||4050 K±2 %|(4100 K)|
|ERTJZEP683□|68 kΩ||4050 K±2 %|(4100 K)|
|ERTJZER683□|68 kΩ||4250 K±2 %|(4300 K)|
|ERTJZER104□|100 kΩ||4250 K±2 %|(4300 K)|
|ERTJZET104□|100 kΩ||4500 K±2 %|(4550 K)|
|ERTJZEV104□|100 kΩ||4700 K±2 %|(4750 K)|
|ERTJZET154□|150 kΩ||4500 K±2 %|(4750 K)|
|ERTJZET224□|220 kΩ||4500 K±2 %|(4750 K)|
|□: Resistance tolerance code|||||



Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. 

Should a safety concern arise regarding this product, please be sure to contact us immediately. 

1-Mar-20 

**Multilayer NTC Thermistors** 

## **Part number list of standard type (Resistance tolerance : ±5 %, ±3 %)** 

## ● 0402 inch size 

|Part number|Nominal resistance<br>at 25℃(Ω)|Resistance tolerance|B Value<br>at 25/50 (K)|B Value<br>at 25/85 (K)|
|---|---|---|---|---|
|ERTJ0EA220□|22 Ω|±3 %(H)<br>or<br>±5 %(J)|2750 K±3 %|(2700 K)|
|ERTJ0EA330□|33 Ω||2750 K±3 %|(2700 K)|
|ERTJ0EA400□|40 Ω||2750 K±3 %|(2700 K)|
|ERTJ0EA470□|47 Ω||2750 K±3 %|(2700 K)|
|ERTJ0EA680□|68 Ω||2800 K±3 %|(2750 K)|
|ERTJ0EA101□|100 Ω||2800 K±3 %|(2750 K)|
|ERTJ0EA151□|150 Ω||2800 K±3 %|(2750 K)|
|ERTJ0ET102□|1.0 kΩ||4500 K±2 %|(4450 K)|
|ERTJ0ET152□|1.5 kΩ||4500 K±2 %|(4450 K)|
|ERTJ0ET202□|2.0 kΩ||4500 K±2 %|(4450 K)|
|ERTJ0ET222□|2.2 kΩ||4500 K±2 %|(4450 K)|
|ERTJ0ET302□|3.0 kΩ||4500 K±2 %|(4450 K)|
|ERTJ0ER332□|3.3 kΩ||4250 K±2 %|(4300 K)|
|ERTJ0ET332□|3.3 kΩ||4500 K±2 %|(4450 K)|
|ERTJ0ET472□|4.7 kΩ||4500 K±2 %|(4450 K)|
|ERTJ0ER472□|4.7 kΩ||4250 K±2 %|(4300 K)|
|ERTJ0ER682□|6.8 kΩ||4250 K±2 %|(4300 K)|
|ERTJ0EG103□A|10 kΩ||(3380 K)|3435 K±1 %|
|ERTJ0EM103□|10 kΩ||3900 K±2 %|(3970 K)|
|ERTJ0ER103□|10 kΩ||4250 K±2 %|(4300 K)|
|ERTJ0ER153□|15 kΩ||4250 K±2 %|(4300 K)|
|ERTJ0ER223□|22 kΩ||4250 K±2 %|(4300 K)|
|ERTJ0EP333□|33 kΩ||4050 K±2 %|(4100 K)|
|ERTJ0ER333□|33 kΩ||4250 K±2 %|(4300 K)|
|ERTJ0ET333□|33 kΩ||4500 K±2 %|(4580 K)|
|ERTJ0EP473□|47 kΩ||4050 K±2 %|(4100 K)|
|ERTJ0ET473□|47 kΩ||4500 K±2 %|(4550 K)|
|ERTJ0EV473□|47 kΩ||4700 K±2 %|(4750 K)|
|ERTJ0EP683□|68 kΩ||4050 K±2 %|(4100 K)|
|ERTJ0ER683□|68 kΩ||4250 K±2 %|(4300 K)|
|ERTJ0EV683□|68 kΩ||4700 K±2 %|(4750 K)|
|ERTJ0EP104□|100 kΩ||4050 K±2 %|(4100 K)|
|ERTJ0ER104□|100 kΩ||4250 K±2 %|(4300 K)|
|ERTJ0ES104□|100 kΩ||4330 K±2 %|(4390 K)|
|ERTJ0ET104□|100 kΩ||4500 K±2 %|(4580 K)|
|ERTJ0EV104□|100 kΩ||4700 K±2 %|(4750 K)|
|ERTJ0ET154□|150 kΩ||4500 K±2 %|(4580 K)|
|ERTJ0EV154□|150 kΩ||4700 K±2 %|(4750 K)|
|ERTJ0EV224□|220 kΩ||4700 K±2 %|(4750 K)|
|ERTJ0EV334□|330 kΩ||4700 K±2 %|(4750 K)|
|ERTJ0EV474□|470 kΩ||4700 K±2 %|(4750 K)|



□  : Resistance tolerance code 

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

1-Mar-20 

**Multilayer NTC Thermistors** 

## **Part number list of standard type (Resistance tolerance : ±5 %, ±3 %)** 

## ● 0603 inch size 

|Part number|Nominal resistance<br>at 25℃(Ω)|Resistance tolerance|B Value<br>at 25/50 (K)|B Value<br>at 25/85 (K)|
|---|---|---|---|---|
|ERTJ1VA220□|22 Ω|±3 %(H)<br>or<br>±5 %(J)|2750 K±3 %|(2700 K)|
|ERTJ1VA330□|33 Ω||2750 K±3 %|(2700 K)|
|ERTJ1VA400□|40 Ω||2800 K±3 %|(2750 K)|
|ERTJ1VA470□|47 Ω||2800 K±3 %|(2750 K)|
|ERTJ1VA680□|68 Ω||2800 K±3 %|(2750 K)|
|ERTJ1VA101□|100 Ω||2800 K±3 %|(2750 K)|
|ERTJ1VT102□|1.0 kΩ||4500 K±2 %|(4450 K)|
|ERTJ1VT152□|1.5 kΩ||4500 K±2 %|(4450 K)|
|ERTJ1VT202□|2.0 kΩ||4500 K±2 %|(4450 K)|
|ERTJ1VT222□|2.2 kΩ||4500 K±2 %|(4450 K)|
|ERTJ1VT302□|3.0 kΩ||4500 K±2 %|(4450 K)|
|ERTJ1VT332□|3.3 kΩ||4500 K±2 %|(4450 K)|
|ERTJ1VR332□|3.3 kΩ||4250 K±2 %|(4300 K)|
|ERTJ1VR472□|4.7 kΩ||4250 K±2 %|(4300 K)|
|ERTJ1VT472□|4.7 kΩ||4500 K±2 %|(4450 K)|
|ERTJ1VR682□|6.8 kΩ||4250 K±2 %|(4300 K)|
|ERTJ1VG103□A|10 kΩ||(3380 K)|3435 K±1 %|
|ERTJ1VR103□|10 kΩ||4250 K±2 %|(4300 K)|
|ERTJ1VR153□|15 kΩ||4250 K±2 %|(4300 K)|
|ERTJ1VR223□|22 kΩ||4250 K±2 %|(4300 K)|
|ERTJ1VR333□|33 kΩ||4250 K±2 %|(4300 K)|
|ERTJ1VP473□|47 kΩ||4100 K±2 %|(4150 K)|
|ERTJ1VR473□|47 kΩ||4250 K±2 %|(4300 K)|
|ERTJ1VV473□|47 kΩ||4700 K±2 %|(4750 K)|
|ERTJ1VR683□|68 kΩ||4250 K±2 %|(4300 K)|
|ERTJ1VV683□|68 kΩ||4700 K±2 %|(4750 K)|
|ERTJ1VS104□A|100 kΩ||(4330 K)|4390 K±1 %|
|ERTJ1VV104□|100 kΩ||4700 K±2 %|(4750 K)|
|ERTJ1VV154□|150 kΩ||4700 K±2 %|(4750 K)|
|ERTJ1VT224□|220 kΩ||4500 K±2 %|(4580 K)|



□  : Resistance tolerance code 

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

1-Mar-20 

**Multilayer NTC Thermistors** 

## **Part number list of standard type (Resistance tolerance : ±5 %, ±3 %)** 

- Temperature and Resistance value (the resistance value at 25 ℃ is set to 1)/ Reference values 

||ERTJ□□A to|ERTJ□□A to|ERTJ□□G to|ERTJ□□M to|ERTJ□□P to|ERTJ□□R to|ERTJ0ES to|ERTJ1VS to|ERTJ□□T to|ERTJ□□T to|ERTJ□□V to|
|---|---|---|---|---|---|---|---|---|---|---|---|
|B25/50|2750 K|2800 K|(3375 K)|3900 K|4050 K|4250 K|4330 K|(4330 K)|4500 K|4500 K|4700 K|
|B25/85|(2700 K)|(2750 K)|3435 K|(3970 K)|(4100 K)|(4300 K)|(4390 K)|4390 K|(4450 K)|(4580 K)|(4750 K)|
|T(℃)|||||||||*1|*2||
|-40|13.05|13.28|20.52|32.11|33.10|43.10|45.67|45.53|63.30|47.07|59.76|
|-35|10.21|10.40|15.48|23.29|24.03|30.45|32.08|31.99|42.92|33.31|41.10|
|-30|8.061|8.214|11.79|17.08|17.63|21.76|22.80|22.74|29.50|23.80|28.61|
|-25|6.427|6.547|9.069|12.65|13.06|15.73|16.39|16.35|20.53|17.16|20.14|
|-20|5.168|5.261|7.037|9.465|9.761|11.48|11.91|11.89|14.46|12.49|14.33|
|-15|4.191|4.261|5.507|7.147|7.362|8.466|8.743|8.727|10.30|9.159|10.31|
|-10|3.424|3.476|4.344|5.444|5.599|6.300|6.479|6.469|7.407|6.772|7.482|
|-5|2.819|2.856|3.453|4.181|4.291|4.730|4.845|4.839|5.388|5.046|5.481|
|0|2.336|2.362|2.764|3.237|3.312|3.582|3.654|3.650|3.966|3.789|4.050|
|5|1.948|1.966|2.227|2.524|2.574|2.734|2.778|2.776|2.953|2.864|3.015|
|10|1.635|1.646|1.806|1.981|2.013|2.102|2.128|2.126|2.221|2.179|2.262|
|15|1.38|1.386|1.474|1.567|1.584|1.629|1.642|1.641|1.687|1.669|1.710|
|20|1.171|1.174|1.211|1.247|1.255|1.272|1.277|1.276|1.293|1.287|1.303|
|25|1|1|1|1|1|1|1|1|1|1|1|
|30|0.8585|0.8565|0.8309|0.8072|0.8016|0.7921|0.7888|0.7890|0.7799|0.7823|0.7734|
|35|0.7407|0.7372|0.6941|0.6556|0.6461|0.6315|0.6263|0.6266|0.6131|0.6158|0.6023|
|40|0.6422|0.6376|0.5828|0.5356|0.5235|0.5067|0.5004|0.5007|0.4856|0.4876|0.4721|
|45|0.5595|0.5541|0.4916|0.4401|0.4266|0.4090|0.4022|0.4025|0.3874|0.3884|0.3723|
|50|0.4899|0.4836|0.4165|0.3635|0.3496|0.3319|0.3251|0.3254|0.3111|0.3111|0.2954|
|55|0.4309|0.4238|0.3543|0.3018|0.2881|0.2709|0.2642|0.2645|0.2513|0.2504|0.2356|
|60|0.3806|0.3730|0.3027|0.2518|0.2386|0.2222|0.2158|0.2161|0.2042|0.2026|0.1889|
|65|0.3376|0.3295|0.2595|0.2111|0.1985|0.1832|0.1772|0.1774|0.1670|0.1648|0.1523|
|70|0.3008|0.2922|0.2233|0.1777|0.1659|0.1518|0.1463|0.1465|0.1377|0.1348|0.1236|
|75|0.2691|0.2600|0.1929|0.1504|0.1393|0.1264|0.1213|0.1215|0.1144|0.1108|0.1009|
|80|0.2417|0.2322|0.1672|0.1278|0.1174|0.1057|0.1011|0.1013|0.09560|0.09162|0.08284|
|85|0.2180|0.2081|0.1451|0.1090|0.09937|0.08873|0.08469|0.08486|0.08033|0.07609|0.06834|
|90|0.1974|0.1871|0.1261|0.09310|0.08442|0.07468|0.07122|0.07138|0.06782|0.06345|0.05662|
|95|0.1793|0.1688|0.1097|0.07980|0.07200|0.06307|0.06014|0.06028|0.05753|0.05314|0.04712|
|100|0.1636|0.1528|0.09563|0.06871|0.06166|0.05353|0.05099|0.05112|0.04903|0.04472|0.03939|
|105|0.1498|0.1387|0.08357|0.05947|0.05306|0.04568|0.04340|0.04351|0.04198|0.03784|0.03308|
|110|0.1377|0.1263|0.07317|0.05170|0.04587|0.03918|0.03708|0.03718|0.03609|0.03218|0.02791|
|115|0.1270|0.1153|0.06421|0.04512|0.03979|0.03374|0.03179|0.03188|0.03117|0.02748|0.02364|
|120|0.1175|0.1056|0.0565|0.03951|0.03460|0.02916|0.02734|0.02742|0.02702|0.02352|0.02009|
|125|0.1091|0.09695|0.04986|0.03470|0.03013|0.02527|0.02359|0.02367|0.02351|0.02017|0.01712|



- *1: Apply to products with a B25/50 constant of 4500 K and a resistance value of 25 ℃ less than 10 kΩ. 

- *2: Apply to products with a B25/50 constant of 4500 K and a resistance value of 25 ℃ of 10 kΩ or more. 

- Applied only to ERTJ0ET104□ 

**==> picture [189 x 14] intentionally omitted <==**

R25=Resistance at 25.0±0.1 ℃ R50=Resistance at 50.0±0.1 ℃ R85=Resistance at 85.0±0.1 ℃ 

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

1-Mar-20 

**Multilayer NTC Thermistors** 

## **Specification and test method** 

|Item|Specifications|Testing method|Testing method|Testing method|Testing method|Testing method|Testing method|Testing method|Testing method|Testing method|Testing method|Testing method|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|Rated Zero-power<br>Resistance (R25)|Within the specified tolerance.|The value is measured at a power that the influence of self-<br>heat generation can be negligible(0.1 mW or<br>less), at the rated ambient temperature of 25.0 ± 0.1℃.|||||||||||
|B Value|Shown in each Individual Specification.<br>※Individual Specification shall specify<br>B25/50or B25/85.|ln(R1)- ln(R2)<br>1/(T1+273.15)–1/(T2+273.15)<br>BT1/T2=<br>The Zero-power resistances; R1and R2, shall be  measured<br>respectively at T1(deg.C) T2(deg.C) .<br>The B value is calculated by the following equation.|||||||||||
|||||||||T1||||T2|
|||B25/50||||||25.0 ±0.1℃||||50.0 ±0.1℃|
|||B25/85||||||25.0 ±0.1℃||||85.0 ±0.1℃|
||||||||||||||
|Adhesion|The terminal electrode shall be free from<br>peeling or signs of peeling.|Applied force :<br> Size 0201<br>:  2 N<br> Size 0402，0603<br>:  5 N<br>Duration<br>：10 s<br>Size : 0201, 0402<br>Size : 0603<br>1.0<br>0.3/0201<br>0.5/0402<br>R0.5<br>Test Sample<br>Board<br>1.0<br>Unit：mm<br>Test<br>Sample|||||||||||
||||||||||||||
||||||||||||||
||||||||||||||
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||||||||||||||
|Bending Strength|There shall be no cracks and other<br>mechanical damage.<br>R25 change：within ±5 %|Bending distance<br>Bending speed<br>2.0<br>45±2|||||||：1  mm<br>：1  mm/ s<br>Unit：mm<br>R340<br>Bending<br>distance<br>45±2||||
||||||||||||||
||||||||||||||
|||||45±2|||||||||
||||||||||||||
||||||||||45±2||||
||||||||||||||
|Resistance to<br>Soldering Heat|（Nallow Tol. type）<br>R25 change：within ±2 %<br>B Value change：within ±1 %<br>（Standard type）<br>R25 change：within ±3 %<br>B Value change：within ±2 %<br>There shall be no cracks and other<br>mechanical damage.|Solder temperature<br>：270  ±5℃<br>Dipping period<br>：3.0  ±0.5 s<br>Preheat condition<br>Soldering bath method|||||||||||
|||Step||||||Temp（℃）||||Period(s)|
|||1||||||80 to 100||||120 to 180|
|||2||||||150 to 200||||120 to 180|
||||||||||||||
|Solderability|More than 95 % of the soldered area of<br>both terminal electrodes shall be<br>covered with fresh solder.|Solder temperature<br>：230 ±5℃<br>Dipping period<br>：4 ±1 s<br>Solder<br>：Sn-3.0Ag-0.5Cu<br>Soldering bath method|||||||||||



Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

1-Mar-20 

**Multilayer NTC Thermistors** 

## **Specification and test method** 

|Item|Specifications|Testing method|
|---|---|---|
|Temperature<br>cycling|（Nallow Tol. type）<br>R25 change：within ±2 %<br>B Value change：within ±1 %<br>（Standard type）<br>R25 change：within ±3 %<br>B Value change：within ±2 %|Conditions of one cycle<br>Step 1：‒40℃, 30±3 min<br>Step 2：Room temp., 3 min max.<br>Step 3：125℃,  30±3 min<br>Step 4：Room temp., 3 min max.<br>Number of cycles：100 cycles|
|Humidity||<br>Temperature<br>：85 ±2℃<br>Relative humidity<br>：85 ±5 %<br>Testperiod<br>：1000+48/0 h|
|Biased humidity||Temperature<br>：85 ±2℃<br>Relative humidity<br>：85 ±5 %<br>Applied power<br>：10 mW(D.C.)<br>Testperiod<br>：500+48/0 h|
|Low temperature<br>exposure||Temperature<br>：-40 ±3℃<br>Testperiod<br>：1000+48/0 h|
|High temperature<br>exposure||Temperature<br>：125 ±3℃<br>Testperiod<br>：1000+48/0 h|



## **Typical application** 

- Temperature detection 

**==> picture [95 x 177] intentionally omitted <==**

**----- Start of picture text -----**<br>
GMR Head<br>R L<br>Interface<br>**----- End of picture text -----**<br>


Writing current control of HDD 

**==> picture [193 x 124] intentionally omitted <==**

**----- Start of picture text -----**<br>
Vcc<br>R<br>AD<br>converter<br>Rth<br>CPU<br>NTC<br>**----- End of picture text -----**<br>


- Temperature compensation 

(Pseudo-linearization) Contrast level control of LCD 

- Temperature compensation (RF circuit) Temperature compensation of TCXO 

**==> picture [156 x 122] intentionally omitted <==**

**----- Start of picture text -----**<br>
Vcc<br>R<br>R<br>LCD<br>Rth R<br>**----- End of picture text -----**<br>


**==> picture [139 x 148] intentionally omitted <==**

**----- Start of picture text -----**<br>
PMIC<br>NTC<br>Rth<br>ADC<br>**----- End of picture text -----**<br>


Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. 

Should a safety concern arise regarding this product, please be sure to contact us immediately. 

1-Mar-20 

**Multilayer NTC Thermistors** 

## **Dimensions in mm (not to scale)** 

**==> picture [111 x 73] intentionally omitted <==**

**----- Start of picture text -----**<br>
L<br>W<br>T<br>L1 L2<br>**----- End of picture text -----**<br>


||||||
|---|---|---|---|---|
|Unit : mm<br>|||||
|code (inch size)|L|W|T|L1L2|
|Ｚ(0201)|0.60±0.03|0.30±0.03|0.30±0.03|0.15±0.05|
|0(0402)|1.0±0.1|0.50±0.05|0.50±0.05|0.25±0.15|
|1(0603)|1.60±0.15|0.8±0.1|0.8±0.1|0.3±0.2|



## **Packaging methods (Taping)** 

## ● Standard packing quantities 

Unit : mm 

|Size code(inch size)|Thicknes|Kind of taping<br>s|Quantity (pcs/reel)<br>Pitch|
|---|---|---|---|
|Ｚ(0201)|0.3|Pressed Carrier Taping|2<br>15,000|
|0(0402)|0.5|Punched Carrier Taping|10,000<br>4,000<br>2<br>4|
|1(0603)|0.8|||



## ● 2 mm Pitch (Pressed carrier taping) Size 0201 

|K0<br>t1|K0<br>t1|K0<br>t1|K0<br>t1|_φ_D0<br>A<br><br>Feeding hole<br>Chip pocket|_φ_D0<br>A<br><br>Feeding hole<br>Chip pocket|_φ_D0<br>A<br><br>Feeding hole<br>Chip pocket|_φ_D0<br>A<br><br>Feeding hole<br>Chip pocket|_φ_D0<br>A<br><br>Feeding hole<br>Chip pocket|_φ_D0<br>A<br><br>Feeding hole<br>Chip pocket|_φ_D0<br>A<br><br>Feeding hole<br>Chip pocket|_φ_D0<br>A<br><br>Feeding hole<br>Chip pocket|_φ_D0<br>A<br><br>Feeding hole<br>Chip pocket|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||E|||||
|||||||A<br>||F|||||
|||||Chip component||B|||||||
|||||||P2<br>P1<br>P0|||||||
||||||||||||||
||||||||||||||
|Symbol|A|B|Ｗ||F|E<br>P1|P2||P0|_ø_D0|t1|K0|
|Unit<br>(mm)|0.36<br>±0.03|0.66<br>±0.03|8.0<br>±0.2||1<br>±<br>3.50<br>±0.05|.75<br>0.10<br>2.00<br>±0.05|2.00<br>±0.05||4.0<br>±0.1|1.5<br>+0.1/0|0.55<br>max.|0.36<br>±0.03|



## ● 2 mm Pitch (Punched carrier taping) Size 0402 

|t2|t2|t2|t1|_φ_D0<br>Feeding hole<br>Chip pocket|_φ_D0<br>Feeding hole<br>Chip pocket|_φ_D0<br>Feeding hole<br>Chip pocket|_φ_D0<br>Feeding hole<br>Chip pocket|E<br>W<br>F<br>Tape running direction|E<br>W<br>F<br>Tape running direction|E<br>W<br>F<br>Tape running direction|E<br>W<br>F<br>Tape running direction|E<br>W<br>F<br>Tape running direction|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|||||||||E|||||
|||||||A|||||||
|||||||B|||||||
|||||Chip component|||||||||
||||||||P2<br>P1<br>P0<br>||||||
||||||||||||||
|Symbol|A|B||Ｗ||F|E<br>P1|P2|P0|_ø_D0|t1|t2|
|Unit<br>(mm)|0.62<br>±0.05|1.12<br>±0.05|8.0<br>±0.2|||3.50<br>±0.05<br>1<br>±|.75<br>0.10<br>2.00<br>±0.05|2.00<br>±0.05|4.0<br>±0.1|1.5<br>+0.1/0|0.7<br>max.|1.0<br>max.|



## ● 4 mm Pitch (Punched Carrier Taping) Size 0603 

|t2|t2|t2|t1<br>_φ_D0<br><br>Feeding hole|t1<br>_φ_D0<br><br>Feeding hole|t1<br>_φ_D0<br><br>Feeding hole|Chip pocket|Chip pocket|Chip pocket|Chip pocket|Chip pocket|Chip pocket|Chip pocket|Chip pocket|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||||E|||||
|||||~~A~~<br>|||||F|||||
|||||||||||||||
||||B<br>Chip component||B|||||||||
|||||||||||||||
|||||||||||||||
|Symbol|A|B|Ｗ||F|E<br>P1|P2|||P0|_ø_D0|t1|t2|
|Unit<br>(mm)|1.0<br>±0.1|1.8<br>±0.1|8.0<br>±0.2||3.50<br>±0.05<br>1<br>±|.75<br>0.10<br>4.0<br>±0.1|2.00<br>±0.05|||4.0<br>±0.1|1.5<br>+0.1/0|1.1<br>max.|1.4<br>max.|



Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

1-Mar-20 

**Multilayer NTC Thermistors** 

## **Packaging methods (Taping)** 

- Reel for taping 

**==> picture [163 x 119] intentionally omitted <==**

**----- Start of picture text -----**<br>
W1<br>E<br>C<br>D<br>W2<br>φ A<br>B<br>φ<br>**----- End of picture text -----**<br>


|Symbol|_ø_A|_ø_B|C|D|
|---|---|---|---|---|
|Unit<br>(mm)|180+0/-3|60.0+1.0/0|13.0±0.5||
||E|W1|||
||2.0±0.5|9.0+1.0/0|||



- Leader part and taped end Leader part 

**==> picture [478 x 90] intentionally omitted <==**

**----- Start of picture text -----**<br>
 Leader part Taped end<br>Top cover tape<br>100 min.<br>Vacant position 160 min.<br>400 min. Vacant position (Unit : mm)<br>**----- End of picture text -----**<br>


## **Minimum quantity / Packing unit** 

|Part number<br>(inch size)|Minimum quantity<br>/ Packingunit|Packing quantity<br>in carton|Carton L×W×H (mm)|
|---|---|---|---|
|ERTJZ (0201)|15,000|300,000|250×200×200|
|ERTJ0 (0402)|10,000|200,000|250×200×200|
|ERTJ1 (0603)|4,000|80,000|250×200×200|



Part No., quantity and country of origin are designated on outer packages in English. 

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 

1-Mar-20 

**Safety and Legal Matters to Be Observed** 

## **Safety and Legal Matters to Be Observed** 

## **Product specifications and applications** 

- Please be advised that this product and product specifications are subject to change without notice for improvement purposes. Therefore, please request and confirm the latest delivery specifications that explain the specifications in detail before the final design, or purchase or use of the product, regardless of the application. In addition, do not use this product in any way that deviates from the contents of the company's delivery specifications. 

- Unless otherwise specified in this catalog or the product specifications, this product is intended for use in general electronic equipment (AV products, home appliances, commercial equipment, office equipment, information and communication equipment, etc.). 

   - When this product is used for the following special cases, the specification document suited to each application shall be signed/sealed (with Panasonic Industry and the user) in advance..These include applications requiring special quality and reliability, wherein their failures or malfunctions may directly threaten human life or cause harm to the human body (e.g.: space/aircraft equipment, transportation/traffic equipment, combustion equipment, medical equipment, disaster prevention/crime prevention equipment, safety equipment, etc.). 

## **Safety design and product evaluation** 

- Please ensure safety through protection circuits, redundant circuits, etc., in the customer's system design so that a defect in our company's product will not endanger human life or cause other serious damage. 

- This catalog shows the quality and performance of individual parts. The durability of parts varies depending on the usage environment and conditions. Therefore, please ensure to evaluate and confirm the state of each part after it has been mounted in your product in the actual operating environment before use. 

   - If you have any doubts about the safety of this product, then please notify us immediately, and be sure to conduct a technical review including the above protection circuits and redundant circuits at your company. 

## **Laws / Regulations / Intellectual property** 

- The transportation of dangerous goods as designated by UN numbers, UN classifications, etc., does not apply to this product. In addition, when exporting products, product specifications, and technical information described in this catalog, please comply with the laws and regulations of the countries to which the products are exported, especially those concerning security export control. 

- Each model of this product complies with the RoHS Directive (Restriction of the use of hazardous substances in electrical and electronic equipment) (2011/65/EU and (EU) 2015/863). The date of compliance with the RoHS Directive and REACH Regulation varies depending on the product model. 

   - Further, if you are using product models in stock and are not sure whether or not they comply with the RoHS Directive or REACH Regulation, please contact us by selecting "Sales Inquiry" from the inquiry form. 

- During the manufacturing process of this product and any of its components and materials to be used, Panasonic Industry does not intentionally use ozone-depleting substances stipulated in the Montreal Protocol and specific bromine-based flame retardants such as PBBs (Poly-Brominated Biphenyls) / PBDEs (Poly-Brominated Diphenyl Ethers). In addition, the materials used in this product are all listed as existing chemical substances based on the Act on the Regulation of Manufacture and Evaluation of Chemical Substances. 

- With regard to the disposal of this product, please confirm the disposal method in each country and region where it is incorporated into your company's product and used. 

- The technical information contained in this catalog is intended to show only typical operation and application circuit examples of this product. This catalog does not guarantee that such information does not infringe upon the intellectual property rights of Panasonic Industry or any third party, nor imply that the license of such rights has been granted. 

- Design, materials, or process related to technical owned by Panasonic Industry are subject to change without notice. 

**Panasonic Industry will assume no liability whatsoever if the use of our company's products deviates from the contents of this catalog or does not comply with the precautions. Please be advised of these restrictions.** 

10-May-24 

**Matters to Be Observed When Using This Product** 

## **Matters to Be Observed When Using This Product** 

(NTC thermistor / Chip-type) 

**Safety measures** ~~a~~ 

- An NTC thermistor (chip-type) (hereinafter "the product" or "the thermistor") is intended for use in general-purpose and standard applications, such as temperature detection and temperature compensation in general electronic equipment. The thermistor may deteriorate in performance or fail (short or open modes) when used improperly. 

- If the thermistor in short mode is used, applied voltage may cause a large current to flow through the thermistor. Consequently, the thermistor heats up and may burn the circuit board. An abnormal state of the thermistor that results from a problem with its service conditions (use environment, design conditions, mounting conditions, etc.) may lead to, in a worst case scenario, burnout of the circuit board, serious accident, etc. Sufficiently check for what is described below before using the thermistor. 

~~a~~ **Use environments and cleaning conditions** 

- This product (thermistor) is not designed for use in the specific environments described below. Using the product in such specific environments or service conditions, therefore, may affect the performance of the product. Please check the performance and reliability of the product first and then use the product. 

   - (1) Used in liquid, such as water, oil, chemicals, and organic solvents. 

   - (2) Used in a place exposed to direct sunlight, an outdoor place with no shielding, or a dusty place. 

   - (3) Used in a place where the product is heavily exposed to sea breeze or a corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX. 

   - (4) Used in an environment where electromagnetic waves and radiation are strong. 

   - (5) Located close to a heating component or a flammable material, such as a vinyl cable. 

   - (6) Sealed or coated with a resin, etc. 

   - (7) Solder flux of the soldered product is cleansed with a solvent, water, and a water-soluble cleaner (be careful with solder flux soluble to water). 

   - (8) Used in a place where dew concentrates on the product. 

   - (9) Used in a contaminated state. (Example) Touching a thermistor (with uncovered skin) mounted on a printed board leaves sebum on the thermistor. Do not handle the thermistor in this manner. 

   - (10) Used in a place where excessive vibration or impact is applied to the product. 

- Use the thermistor within the range of its specified ratings/capabilities. Using the thermistor under severe service conditions that are beyond the specified ratings/capabilities causes degraded performance or destruction of the thermistor, which may lead to scattering of thermistor fragments, smoke generation, ignition, etc. Do not use the thermistor at a working temperature or maximum allowable circuit voltage that exceeds the specified working temperature or maximum allowable circuit voltage. Do not locate the thermistor close to combustible materials. 

- In an improper cleaning solution, with which the thermistor is cleaned, flux residues or other foreign matter may stick to the surface of the thermistor, which degrades the performance (insulation resistance, etc.) of the thermistor. In a polluted cleaning solution, the concentration of free halogen, etc., is high, and may result in poor/insufficient cleaning. 

■ Improper cleaning conditions (insufficient cleaning or excessive cleaning) may impair the performance of the thermistor. 

- (1) Insufficient cleaning 

   - (a) A halogenous substance in flux residues may corrode a metal element, such as a terminal electrode. 

   - (b) A halogenous substance in flux residues may stick to the surface of the thermistor and lower its insulation resistance. 

   - (c) Tendencies described in (a) and (b) may be more notable with water-soluble flux than with rosin-based flux. 

      - Be careful about insufficient cleaning. 

- (2) Excessive cleaning 

Ultrasonic waves that are too powerful from an ultrasonic cleaner cause the board to resonate, in which case the vibration of the board may cause the thermistor or a soldered part to crack or reduce the strength of the terminal electrode. Keep power output from the ultrasonic cleaner at 20 W/L or lower, its ultrasonic frequency at 40 kHz or lower, and an ultrasonic cleaning time at 5 minutes or less. 

30-Jun-23 

**Matters to Be Observed When Using This Product** 

## **Response to anomalies and handling conditions** 

- Do not apply excessive mechanical impact to the thermistor. Because the thermistor body is made of ceramic, drop impact to the thermistor readily damages or cracks the thermistor. Once dropped on the floor, etc., the thermistor may have lost its sound quality and become failure-prone. Do not use said thermistor. 

- When handling the board carrying the thermistor, be careful not to let the thermistor hit against another board. Take extra caution when handling or storing a stack of boards carrying thermistors. There are cases where a corner of a board will hit against a thermistor and damage or crack it, which may result in a failure of the thermistor, such as a drop in its insulation resistance. Do not reuse a thermistor that has been used on and removed from a board. 

**==> picture [158 x 64] intentionally omitted <==**

**----- Start of picture text -----**<br>
Mounting<br>Crack board<br>Crack<br>Floor<br>**----- End of picture text -----**<br>


## **Circuit design and circuit board design** 

- A working temperature at which a thermistor works in the circuit must be within the working temperature range specified in the specification sheet. A temperature at which a thermistor incorporated in the circuit is kept in storage without operating must be within the storage temperature range specified in the specification sheet. Do not use the thermistor at a higher temperature than the maximum working temperature. 

- Ensure that a voltage applied across the terminals of the thermistor in use is equal to or lower than the maximum voltage (maximum power). When the thermistor is used in a condition where the thermistor is supplied with power exceeding the maximum power, self-heating by the thermistor becomes so intensive that the thermistor with high temperature may fail or burn out. Discuss safety measures, such as a protective circuit against an abnormal voltage, etc. The thermistor in use generates heat by itself even when supplied with power equal to or lower than the maximum power. This self-heating may make the thermistor incapable of exactly detecting the ambient temperature. 

   - When using the thermistor, ensure that a voltage applied across the terminals of the thermistor is equal to or lower than the maximum voltage (maximum power) and take the heat dissipation constant of the thermistor into consideration. 

## ・Maximum power 

It refers to the maximum of power that can be suppled consecutively to the thermistor in still air with a certain ambient temperature. Note that the maximum power when the ambient temperature is 25 ℃ or lower is equal to the rated power, and that the maximum power when the ambient temperature is higher than 25 ℃ follows a derating curve shown in a graph on the right. 

- ・Heat dissipation constant 

A heat dissipation constant represents power that the thermistor needs to raise its temperature by 1 ℃ by self-heating in a temperature steady state. Dividing power consumption by the thermistor by a temperature increment of the thermistor yields the heat dissipation constant. 

**==> picture [160 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
Derating curve<br>100<br>50<br>25 75 125<br>Ambient temperature (℃)<br>Maximum power/rated power ratio (%)<br>**----- End of picture text -----**<br>


The heat dissipation constant is expressed in units of (mW/ ℃ ). 

- The resistance of the thermistor changes with changes of the ambient temperature or by its self-heating. When measuring the resistance value of the thermistor in a circuit examination, acceptance inspection, etc., heed the following items. ① Measurement : Measurement temperature shall be 25 ±0.1 ℃. We recommend measurement of the temperature thermistor in a liquid (silicone oil, etc.) in which a measurement temperature is kept stable. 

- ② Power : Power supplied to the thermistor shall be 0.10 mW or less. We recommend resistance value measurement by a four-terminal measurement method, using a constant-current power supply. 

■ Using the thermistor on an alumina board has an expectation of performance degradation due to thermal impact (temperature cycle). Before using the thermistor, sufficiently confirm that the board does not affect the quality of the thermistor. 

30-Jun-23 

**Matters to Be Observed When Using This Product** 

- ~~|~~ **Mounting conditions** 

■ The more solder deposited on the thermistor, the greater the stress to the thermistor, which leads to cracking of the thermistor. When designing a land on the board, determine the shape and dimensions of the land so that a proper volume of solder is applied in the land. Design the land such that its left and right sides are equal in size. In a case where solder volumes are different between the left and right sides of the land, a greater volume of solder takes more time to cool and solidify. As a result, stress acts on one side which may crack the thermistor. 

## <Recommended solder volume> 

- (a) Too much solder  (b) Proper volume of solder  (c) Too little solder 

<Recommended land dimensions (example)> 

**==> picture [488 x 89] intentionally omitted <==**

**----- Start of picture text -----**<br>
Shape symbol Component dimensions<br>Surface-mounted component a b c<br>(JIS size) L W T<br>Land<br>Z (0603) 0.6 0.3 0.3 0.2 to 0.3 0.25 to 0.30 0.2 to 0.3<br>Solder<br>0 (1005) 1.0 0.5 0.5 0.4 to 0.5 0.4 to 0.5 0.4 to 0.5<br>resist<br>1 (1608) 1.6 0.8 0.8 0.8 to 1.0 0.6 to 0.8 0.6 to 0.8<br>eco<br>Unit: mm<br>b a<br>|_|<br>c<br>**----- End of picture text -----**<br>


## <Using solder resist> 

- ・ Use solder resist to evenly distribute solder volumes on the left and right sides. 

- ・ When a component is located close to the thermistor, the thermistor is mounted together with a lead-attached component, or a chassis is located close to the thermistor, separate solder patterns from each other using the solder resist. 

- Refer to cases to avoid and recommended examples shown on the right table. 

**==> picture [269 x 268] intentionally omitted <==**

**----- Start of picture text -----**<br>
Case recommended<br>Items Case to avoid (Example of improving soldering<br>by separating solder patterns)<br>Mounting the Lead of a lead- Solder resist<br>thermistor attached component<br>together with<br>a lead-<br>attached<br>component +<br>Chassis<br>Solder resist<br>Soldering in / Solder (earth solder)<br>the vicinity of<br>the chassis<br>Electrode pattern<br>a<br>Lead of a component<br>Soldering a mounted later Solder resist<br>lead-attached Solder iron<br>component<br>later<br>Part where too much<br>—_ solder is applied = Solder resist<br>Placing the<br>products side Land<br>by side<br>“as<br>**----- End of picture text -----**<br>


<Thermistor placement that avoids stress caused by warp in the board> 

- ・ When the board warps during or after soldering of the thermistor to the board, the warping of the board may cause the thermistor to crack. Place th thermistor so that stress caused by the warp is negligible to the thermistor. 

- Refer to the case to avoid and a case 

   - recommended example shown on the right table. 

Case to avoid 

Case recommended Set the thermistor sidewise relative to the direction in which 

30-Jun-23 

**Matters to Be Observed When Using This Product** 

<Mechanical stress near a breaking line of the board> 

- Stress size 

- ・ Mechanical stresses to the thermistor near a breaking A>B=C>D>E E 

- line of the board vary depending on the mounting D 

- position of the thermistor. Refer to the figure on the Perforated ~~CE~~ 

- right. line C 

- ・ The thermistor receives mechanical stresses different ot600 ~~=~~ ecoo°o in size when the board is broken by different methods. The size of the stress the thermistor A Slit B receives is smaller in the following order: pushing ~~aren~~ back<breaking along a slit<breaking along a V groove<breaking along a perforated line. In addition 

to thermistor placement, consider the board breaking method as well. 

   - ・ When the thermistor is located near a heating element, such as a heater, if the thermistor is soldered directly to the heating element or is mounted together with the heating element on the same land, the thermistor exposed to a heat stress may crack. If you consider adopting such a layout, contact us first for consultation. 

- <Mounting density and space between components> 

   - ・ When space between components is too narrow, solder bridges or solder balls have negative effects on the components. Be careful to provide proper space between the components. 

## <Mounting on the board> 

- ・ When the thermistor is mounted on the board, an excessive impact load, such as pressure from a suction nozzle for mounting the thermistor and mechanical impact/stress caused by a positional shift or positioning, may be applied to the thermistor. Prevent application of such an excessive impact load to the thermistor. 

- ・ A mounter needs to be checked and maintained regularly. 

- ・ When the bottom dead center of the suction nozzle is too low, an excessively large force is applied to the thermistor when it is mounted, which may crack the thermistor. Heed the following instructions when using the suction nozzle. (1) Set the bottom dead center of the suction nozzle at the upper surface of the straightened board. 

   - (2) Set the pressure of the suction nozzle equal to a static load between 1 N to 3 N. 

   - (3) In the case of double-face mounting, put a backup pin on the lower surface (back) of the board to prevent the board from warping. This keeps the impact of the suction nozzle as small as possible. Typical examples of using the backup pin are shown in the following table. 

**==> picture [302 x 152] intentionally omitted <==**

**----- Start of picture text -----**<br>
Items Po Case to avoid Case recommended<br>The backup pin does not always need<br>to be underneath the thermistor.<br>Crack<br>Single-face<br>mounting<br>_ a lle we<br>Backup pin —_<br>Double-face<br>mounting<br>Solder  Crack Backup pin<br>separation<br>**----- End of picture text -----**<br>


   - (4) Adjust the suction nozzle so that its bottom dead center is not too low. 

- ・ When positioning grippers wear out, they apply mechanical impact to part of the thermistor when positioning it, thus chipping or cracking the thermistor in some cases. Maintain the proper dimensions of the positioning grippers in their closed state and regularly carry out maintenance, check, or replacement of the positioning grippers. 

- ・ A thermistor mounted on a heavily warped printed board, may crack or break. Put a backup pin on the back of the board to reduce the warp of the board to 0.5 mm or less with 90 mm span width. 

## <Selecting flux> 

- ・ Flux may have a great effect on the performance of the thermistor. Before using the thermistor, check whether the flux has any effect on the performance of the thermistor. 

   - (1) Use flux containing a halogen-based substance of 0.1 wt% (in terms of chlorine) or less. Do not use highly acidic flux. 

   - (2) Water-soluble flux remaining on the thermistor surface may impair its insulation resistance when cleaning work is insufficient. When using the water-soluble flux, clean the soldered part sufficiently to eliminate flux residues. 

30-Jun-23 

**Matters to Be Observed When Using This Product** 

## ・ Reflow soldering 

**==> picture [513 x 399] intentionally omitted <==**

**----- Start of picture text -----**<br>
A temperature condition under which reflow soldering is performed is represented by a temperature curve<br>consisting of a preheating part, a temperature-rising part, a main heating part, and a gradual cooling part. Heating<br>the thermistor rapidly creates excessive heat stress therein due to a large temperature difference and, because of this<br>heat stress, the thermistor may thermally crack. Be sufficiently careful with a temperature difference resulting from<br>rapid heating. The preheating part is a temperature area that is important for preventing a tombstone<br>(chip rising) phenomenon. Be sufficiently careful with temperature control.<br>Items Temperature condition Time, heating rate<br>Recommended reflow soldering profile (example)<br>(1) Preheating part 140 ℃ to 180 ℃ 60 to 120 seconds<br>(4) Peak<br>260220 (2) Temperature-rising  (3) Gradualcooling part (2) Temperature-     rising part Preheating temperatureto peak temperature 2 to 5 ℃ per second<br>180<br>(3) Main heating<br>140 220 ℃ or higher 60 seconds or less<br>     part<br>(4) Peak 260 ℃ or less 10 seconds or less<br>(1) Preheating part (3) Main heating part<br>(5) Gradual cooling Peak temperature<br>1 to 4 ℃ per second<br>     part to 140 ℃<br>Time<br>60 seconds to  60 seconds<br>120 seconds or less<br>∆T: allowable temperature difference ∆T≤150 ℃<br>Aa<br>Avoid performing rapid cooling (forced cooling) during the gradual cooling part. Rapidly cooling the thermistor<br>may result in thermal cracking of the thermistor. When dipping the thermistor in the cleaning solution right after<br>soldering the thermistor, confirm that the surface temperature of the thermistor is 100 ℃ or lower. There is no<br>problem with two cycles of reflow soldering under the recommended reflow soldering profile (example)<br>conditions shown in the above diagram. Be sufficiently careful with deflection or warping of the board.<br>Note that the recommended soldering conditions indicate conditions under which the degradation of the<br>product characteristics does not occur but do not indicate conditions under which stable soldering can be<br>performed. Check and set conditions under which stable soldering can be performed, on a case-by-case<br>basis.<br>T<br>) ∆<br>℃<br>Temperature (<br>**----- End of picture text -----**<br>


thermistor temperatures vary depending on the mounted state of the thermistor. Make sure to confirm that the surface temperature of the thermistor is within the specified temperature when the thermistor is mounted and then use the thermistor. 

- ・ Soldering-iron-used soldering 

In soldering-iron soldering, stress created by a rapid temperature change is applied directly to the thermistor. Be sufficiently careful in controlling the temperature of the soldering iron tip. Be careful not to let the soldering iron tip come in direct contact with the thermistor or its terminal electrode. The thermistor is particularly vulnerable to rapid heating and rapid cooling. When heated or cooled rapidly, the thermistor develops excessive heat stress therein resulting from the large temperature difference and because of this heat stress, may thermally crack. Observe the following instructions on preheating, gradual cooling, etc. 

Once a thermistor soldered with a soldering iron is removed from the board, it cannot be used again. 

- (1) Condition 1 (preheating included) 

   - (a) Solder: ：Use wire solder (with less chloride 

content) that is meant for soldering precision electronic equipment. 

   - (Wire diameter: 1.0 mm or less) 

- (b) Preheating: ：Preheat the thermistor sufficiently so that the difference between the solder temperature and the surface temperature of the thermistor is 150°C or less. 

- (c) Temperature ：300°C or lower (a required volume of of the soldering solder is melted on the soldering iron tip iron tip in advance). 

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Recommended soldering-iron-used soldering<br>profile (example)<br>Gradual<br>cooling<br>Preheating<br>60 seconds to 120  3 seconds or less<br>seconds<br>∆T<br>**----- End of picture text -----**<br>


∆T: allowable temperature difference ∆T≤150 ℃ 

- (d) Gradual coolin ：After soldering the thermistor, leave it in 

normal temperature conditions to let it cool gradually. 

30-Jun-23 

**Matters to Be Observed When Using This Product** 

- (2) Condition 2 (preheating not included) 

If soldering iron tip conditions listed in the table on the right are met, the thermistor can be soldered with the soldering iron without preheating the thermistor. 

- (a) Make sure that the soldering iron tip does not come in direct contact with the thermistor or its terminal electrode. 

- (b) After preheating the land sufficiently with the soldering-iron tip, slide the soldering-iron tip toward the 

|Items|Condition|
|---|---|
|Temperature of the soldering<br>iron tip|270℃or lower|
|Wattage|20 W or less|
|Shape of the soldering iron tip|ø3 mm or less|
|Soldering-iron applyingtime|3 seconds or less|



terminal electrode of the thermistor to solder the thermistor. 

## <Inspection> 

- ・ When the printed board is inspected with measurement terminal pins after the thermistor is mounted on the board, the measurement terminal pins pressed against the printed board cause the board to warp, which may cause a crack to form on the thermistor. 

   - (1) Put the backup pin on the back of the printed board to reduce the warp of the board to 0.5 mm or less with a 90 mm span width. 

   - (2) Check whether the shape of the front ends of the measurement terminal pins poses no problem, whether the pins are equal in length, whether the pressure of the pins are not excessively high, and whether the set position of the pins is correct. 

|Items|Case to avoid|Case recommended|
|---|---|---|
|Warp in the<br>board|Measurement<br>terminal pin<br>Peeling, cracking|Measurement<br>terminal pin<br>Backup pin|



## <Protective coat> 

- ・ When the thermistor is coated with or embedded in a resin to improve the thermistor’s resistance to humidity and gas or to set the thermistor stationary, it is expected that the following problems will arise. In such cases, confirm the performance and reliability of the thermistor in advance. 

   - (1) A solvent included in the resin infiltrates the thermistor and impairs its characteristics. 

   - (2) Heat from chemical reaction (curing heat) generated by the resin when it cures exerts a negative effect on the thermistor. 

   - (3) Expansion/shrinkage of the resin applies stress to the soldering part and causes it to crack. 

<Splitting a multiple formation printed board> 

- ・ When splitting the board having components, including a mounted thermistor into multiple pieces, be careful not to apply bending stress or torsional stress to the board. If bending stress or torsional stress, shown in the following diagram, is applied to the board when it is split, the thermistor may develop a crack. Avoid, as much as possible, applying stress to the board. 

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Bend Torsion<br>L e a N,<br>**----- End of picture text -----**<br>


- ・ Avoid manually splitting the board so as to keep mechanical stress to the board as small as possible. When splitting the board, use a splitting jig or a board splitter. 

30-Jun-23 

**Matters to Be Observed When Using This Product** 

## ・ Example of a board splitting jig 

An example of a board splitting jig is shown in the following diagram. Holding the part of the board that is far from the jig and applying a load bend the board excessively. Holding the part of the board that is closer to the jig and applying a load allow you to split the board with less bending. 

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Case to avoid Case recommended<br>Overall view of a jig<br>Part to  Direction in which  Direction in which<br>Circuit  V groove which load is applied load acts Circuit  V groove load acts<br>board board Component<br>Circuit<br>board Component<br>Part to which<br>V groove load is applied<br>Board<br>dep splitting jig iA, ted<br>Storage conditions<br>■Avoid a high-temperature/high-humidity storage place and keep the thermistor in a storage place where temperature ranges<br>from 5 ℃ to 40 ℃ and relative humidity ranges from 20% to 70%.<br>**----- End of picture text -----**<br>


## **Storage conditions** 

- ■Do not store the thermistor in a place where moisture, dust, or corrosive gas (hydrogen chloride, hydrogen sulfide, sulfur dioxide, ammonia, etc.) is present. It may impair the solderability of the terminal electrode. Also, in places where the thermistor package is exposed to heat, direct sunlight, etc., packaging tape may deform or stick to the thermistor which causes a problem when the thermistor is mounted. Be careful in such cases. 

- ■A thermistor storage period shall be 12 months or less. When using a thermistor kept in storage for more than 12 months, confirm its solderability before using it. 

30-Jun-23