ERBRG0R75V
Fuse, Surface Mount, 750 mA, Fast Acting, 63 VDC, 1206 [3216 Metric], ERBRG Series
- Manufacturer: PANASONIC
- Product type: SMD Fuses
- SVHC: No SVHC (25-Jun-2025)
- Fuse Current: 750mA
- Product Range: ERBRG Series
- Fuse Case Style: 1206 [3216 Metric]
- Voltage Rating VAC: -
- Voltage Rating VDC: 63VDC
- Blow Characteristic: Fast Acting
- Breaking Capacity Current AC: -
- Breaking Capacity Current DC: 50A
| Delivery and price | |
|---|---|
| Units per pack | 5000 |
| Price | 0.21 € |
| Current stock | 10+ |
| Lead time | 30 days |
**Micro Chip Fuse** ## **Micro Chip Fuse** ## Type: **ERBRD ERBRE ERBRG** ## **Features** - Small size - Fast-acting and withstanding in-rush current characteristics - RoHS compliant ## **Approved Safety Standards** UL248-14 : File No.E194052 **==> picture [515 x 481] intentionally omitted <==** **----- Start of picture text -----**<br> c-UL C22.2 No.248-14 : File No.E194052<br>Explanation of Part Numbers<br>1 2 3 4 5 6 7 8 9 10<br>E R B R D 1 R 0 0 X<br>Product Code Structure Product shape Rated Current (A) Code Packaging Part No.<br>Micro Chip Fuse R Rectangular type D (1.0 mm0402 inch size×0.5 mm) 0R250R31 0.315 A0.25 A 1R401R50 1.4 A1.5 A X Pressed Carrier Taping2 mm pitch, 10,000 pcs. [ERBRD]<br>E (1.6 mm0603 inch size×0.8 mm) 0R370R50 0.375 A0.50 A 2R002R50 2.0 A2.5 A V Punched Carrier Taping4 mm pitch, 5,000 pcs. ERBREERBRG<br>1206 inch size 0R63 0.63 A 3R00 3.0 A<br>G<br>(3.2 mm×1.6 mm) 0R75 0.75 A 3R15 3.15 A<br>1R00 1.0 A 4R00 4.0 A<br>Sea 1R25 1.25 A 5R00 5.0 A<br>Construction Dimensions in mm (not to scale)<br>L<br>a<br>W<br>Protective Coating Electrode (Base)<br>t<br>a<br>b<br>Fusing Element Electrode(Outer) Part No. Dimensions (mm) (Weight)Mass<br>Almina Substrate (inch size) L W a b t (g/1000 pcs.)<br>ERBRD(0402) 1.00±0.10 0.50+0.10–0.05 0.15±0.10 0.25±0.10 0.39 ±0.10 0.7<br>ERBRE(0603) 1.60±0.15 0.80+0.15–0.05 0.24±0.15 0.30±0.15 0.54 ±0.10 2.2<br>ERBRG 3.20±0.20 1.60±0.15 0.30±0.20 0.55±0.20 0.65±0.10 10<br>= (1206)<br>**----- End of picture text -----**<br> Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 06 Jan. 2019 **Micro Chip Fuse** ## **Ratings** - 0402 inch /1005 mm size : Type ERBRD |● 0402 inch /1005 mm siz|e : Typ|e ERBRD|e ERBRD|e ERBRD|e ERBRD|e ERBRD|e ERBRD|e ERBRD|e ERBRD|e ERBRD|e ERBRD|e ERBRD|e ERBRD|e ERBRD| |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| |Part No.||ERBRD□R□□X||||||||||||| ||0R25|0R31|0R37|0R50|0R63|0R75|1R00|1R25|1R50|2R00|2R50|3R00|4R00|5R00| |Rated Current (A)|0.25|0.315|0.375|0.5|0.63|0.75|1.0|1.25|1.5|2.0|2.5|3.0|4.0|5.0| |Marking Code|V|X|Y|F|6|G|H|J|K|N|O|P|S|T| |Internal R (mΩ) at 25 °C max.|700|520|440|310|220|190|125|82|70|53|42|37|24|19.5| |Fusing Current/Fusing Time<br>(at 25 °C)||Rated Current×100 % / 4 hours min.||||||||||||| |||Rated Current×200 % / 5 seconds max.||||||||||||| |||Rated Current×300 % / 0.2 seconds max.||||||||||||| |Rated Voltage<br>(Open Circuit Voltage)<br>(V) DC||32||||||||||||| |Interrupting Rating<br>at Rated Voltage (A)||35||||||||||||| |Category Temp. Range<br>(°C)||−40 to +125||||||||||||| ## ● 0603 inch / 1608 mm size : Type ERBRE |● 0603 inch / 1608 mm siz|e : Type ERBR|e : Type ERBR|E|E|E|E|E|E|E|E|E|E| |---|---|---|---|---|---|---|---|---|---|---|---|---| |Part No.|||ERBRE□R□□V|||||||||| ||0R50|0R75|1R00|1R25|1R40|1R50|2R00|2R50|3R00|3R15|4R00|5R00| |Rated Current(A)|0.5|0.75|1.0|1.25|1.4|1.5|2.0|2.5|3.0|3.15|4.0|5.0| |MarkingCode|F|G|H|J|14|K|N|O|P|31|S|T| |Internal R (mΩ) at 25 °C max.|330|190|125|94|85|72|51|40|33|32|22|19| |Fusing Current/Fusing Time<br>(at 25 °C)|||Rated Current×100 % / 4 hours min.|||||||||| ||||Rated Current×200 % / 5 seconds max.|||||||||| ||||Rated Current×300 % / 0.2 seconds max.|||||||||| |Rated Voltage<br>(Open Circuit Voltage)<br>(V)DC|||32|||||||||| |Interrupting Rating<br>at Rated Voltage(A)|||50|||||||||| |Category Temp. Range<br>(°C)|||−40 to +125|||||||||| ## ● 1206 inch / 3216 mm size : Type ERBRG |● 1206 inch / 3216 mm siz|e : Type|ERBRG|ERBRG|ERBRG|ERBRG|ERBRG|ERBRG||| |---|---|---|---|---|---|---|---|---|---| |Part No.||ERBRG□R□□V|||||||| ||0R50|0R75|1R00|1R25|1R50|2R00|2R50|3R00|4R00| |Rated Current (A)|0.5|0.75|1.0|1.25|1.5|2.0|2.5|3.0|4.0| |Marking Code|F|G|H|J|K|N|O|P|S| |Internal R (mΩ) at 25 °C max.|560|340|210|175|115|85|65|45|35| |Fusing Current/Fusing Time<br>(at 25 °C)||Rated Current×100 % / 4 hours min.|||||||| |||Rated Current×200 % / 5 seconds max.|||||||| |||Rated Current×300 % / 0.2 seconds max.|||||||| |Rated Voltage<br>(Open Circuit Voltage)<br>(V) DC||63||||||32|| |Interrupting Rating<br>at Rated Voltage (A)||50|||||||| |Category Temp. Range<br>(°C)||−40 to +125|||||||| ✽ The thin type is available about 1005 (0402 inch) size. Please contact us for details. ✽ Please contact us when another rated current is needed. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 06 Jan. 2019 **Micro Chip Fuse** ## **Fusing Characteristics (25 °C typical)** **==> picture [491 x 352] intentionally omitted <==** **----- Start of picture text -----**<br> ● 0402 inch / 1005 mm size ● 0603 inch / 1608 mm size<br> (Type ERBRD) (Type ERBRE)<br>10 10<br>1 1<br>0.1 0.1<br>0.01 0.01<br>0.001 0.001<br>✽ Reference Only<br>✽ Reference Only<br>0.0001 0.0001<br>0.1 1 Fusing Current (A)10 100 0.1 1 Fusing Current (A)10 100<br>● 1206 inch /3216 mm size<br> (Type ERBRG)<br>10<br>1<br>0.1<br>0.01<br>0.001<br>✽ Reference Only<br>0.0001<br>0.1 1 10 100<br>Fusing Current (A)<br>0.25 A 0.315 A 0.375 A 0.5 A 0.63 A 0.75 A 1.0 A 1.25 A 1.5 A 2.0 A 2.5 A 3.0 A 4.0 A 5.0 A 0.5 A 0.75 A 1.0 A 1.25 A 1.4 A 1.5 A 2.0 A 2.5 A 3.0 A 3.15 A 4.0 A 5.0 A<br>Fusing Time (s) Fusing Time (s)<br>0.5 A 0.75 A 1.0 A 1.25 A 1.5 A 2.0 A 2.5 A 3.0 A 4.0 A<br>Fusing Time (s)<br>**----- End of picture text -----**<br> ## **Perfomance** **==> picture [492 x 38] intentionally omitted <==** **----- Start of picture text -----**<br> Performance<br>Test Item Test Conditions<br>Requirements<br>Within Specifi ed<br>Resistance 25 °C<br>**----- End of picture text -----**<br> ||Performance<br>Requirements|Test Conditions| |---|---|---| ||Within Specif ed<br>|25 °C| ||Tolerance|| |Resistance to Soldering Heat|±10 %|260 °C±5 °C, 10 s| |Rapid Change of Temperature|±10 %|–40 °C (30 min.) / +125 °C (30 min.), 5 cycles| |Damp Heat, Steady State|±10 %|60 °C, 90 % to 95 %RH, 1000 h (no load)| |Load Life in Humidity|±10 %|60 °C, 90 % to 95 %RH, Load: 70 % rated current, 1000 h| |Endurance at 70 °C|±10 %|70 °C , Load: 70 % rated current, 1000 h| ## **Recommended Soldering Conditions** ||A<br>B|C||Dimensions (mm)<br>A<br>B<br>C<br>0.5 to 0.6<br>1.4 to 1.6<br>0.4 to 0.6<br>0.7 to 0.9<br>2.0 to 2.2<br>0.8 to 1.0<br>2.0 to 2.4<br>4.4 to 5.0<br>1.2 to 1.8|Dimensions (mm)<br>A<br>B<br>C<br>0.5 to 0.6<br>1.4 to 1.6<br>0.4 to 0.6<br>0.7 to 0.9<br>2.0 to 2.2<br>0.8 to 1.0<br>2.0 to 2.4<br>4.4 to 5.0<br>1.2 to 1.8| |---|---|---|---|---|---| ||||Part No.<br>(inch size)||| |||||A|B| ||||ERBRD(0402)|0.5 to 0.6<br>1|.4 to 1.6| ||||ERBRE(0603)|0.7 to 0.9<br>2|.0 to 2.2| ||||ERBRG(1206)|2.0 to 2.4<br>4|.4 to 5.0| ||||||| ||||||| Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 06 Jan. 2019 **Micro Chip Fuse** ## **Packaging Methods** ## ● Standard Quantity **==> picture [491 x 228] intentionally omitted <==** **----- Start of picture text -----**<br> Part No. inch size Kind of Taping Pitch (P1) Quantity<br>ERBRD 0402 Pressed Carrier Taping 2 mm 10,000 pcs./ reel<br>ERBRE 0603<br>Punched Carrier Taping 4 mm 5,000 pcs./ reel<br>ERBRG 1206<br>● Carrier Taping (Unit : mm) ● Taping Reel (Unit : mm)<br>Pressed Punched P1 P2 P0<br>Carrier Carrier fD0<br>fC<br>T T A P1 (2 mm pitch) W1<br>fA W2<br>Part No. A B W F E Part No. 0A 0N 0C W1 W2<br>ERBRD 0.68±0.10 1.20±0.10 ERBRD<br>0 +1.0 ±0.2 +1.0 ±1.0<br>ERBRE 1.10±0.10 1.90±0.10 8.00±0.20 3.50±0.05 1.75±0.10 ERBRE 180.0–1.5 60 0 13.0 9.0 0 11.4<br>ERBRG<br>E<br>F W Nf<br>B<br>**----- End of picture text -----**<br> |● Carrier Taping|● Carrier Taping|● Carrier Taping|● Carrier Taping|● Carrier Taping|||(Unit : mm)|(Unit : mm)|(Unit : mm)|(Unit : mm)|(Unit : mm)| |---|---|---|---|---|---|---|---|---|---|---|---| |T<br>T<br>Pressed<br>Carrier<br>Punched<br>Carrier|||||fD0||P0<br>P2<br>P1||||F<br>W<br>E| ||||||||||||| ||||||||||||F| ||T<br>T||||B||||||| ||||||A||P1<br>(2 mm pitch)||||| ||||||||||||| |Part No.|||A||B||W||F||E| |ERBRD|||0.68<br>±0.10||1.20<br>±0.10||8.00<br>±0.20||3.50<br>±0.05|1.75<br>±0.10|| |ERBRE|||1.10<br>±0.10||1.90<br>±0.10||||||| |ERBRG|||2.00<br>±0.15||3.60<br>±0.20||||||| ||||||||||||| |Part No.|||P1||P2||P0||0D0|T|| |ERBRD|||2.00<br>±0.10||2.00<br>±0.05||4.00<br>±0.10||1.50<br>+0.10<br>0|0.67<br>±0.07|| |ERBRE|||4.00<br>±0.10|||||||0.78<br>±0.07|| |ERBRG||||||||||0.84<br>±0.07|| ## **Recommended Soldering Conditions** Recommendations and precautions are described below. - Recommended soldering conditions for reflow - Reflow soldering shall be performed a maximum of two times. **==> picture [470 x 228] intentionally omitted <==** **----- Start of picture text -----**<br> · Please contact us for additional information when<br>For soldering (Example : Sn/Pb)<br>used in conditions other than those specified.<br> · Please measure the temperature of the terminals Temperature Time<br>and study every kind of solder and printed circuit Preheating 140 °C to 160 °C 60 s to 120 s<br>board for solderability be fore ac tu al use.<br>Main heating Above 200 °C 30 s to 40 s<br>Peak 235 ± 5 °C max. 10 s<br>Peak<br>Preheating For lead-free soldering (Example : Sn/Ag/Cu)<br>Temperature Time<br>Heating Preheating 150 °C to 180 °C 60 s to 120 s<br>Main heating Above 230 °C 30 s to 40 s<br>Peak max. 260 °C max. 10 s<br>Time<br>● Recommended soldering conditions for fl ow<br>For soldering For lead-free soldering<br>Temperature Time Temperature Time<br>Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s<br>Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s<br>Temperature<br>**----- End of picture text -----**<br> <Repair with hand soldering> - Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder each electrode for 3 seconds or less. - Never touch this product with the tip of a soldering iron. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 06 Jan. 2019 ~~es~~ Guidelines and precautions regarding the technical information and use of our products described in this online catalog. m= If you want to use our products described in this online catalog for applications requiring special qualities or reliability, or for applications where the failure or malfunction of the products may directly jeopardize human life or potentially cause personal injury (e.g. aircraft and aerospace equipment, traffic and transportation equipment, combustion equipment, medical equipment, accident prevention, anti-crime equipment, and/or safety equipment), it is necessary to verify whether the specifications of our products fit to such applications. Please ensure that you will ask and check with our inquiry desk as to whether the specifications of our products fit to such applications use before you use our products. m The quality and performance of our products as described in this online catalog only apply to our products when used in isolation. Therefore, please ensure you evaluate and verify our products under the specific circumstances in which our products are assembled in your own products and in which our products will actually be used. m@ If you use our products in equipment that requires a high degree of reliability, regardless of the application, it is recommended that you set up protection circuits and redundancy circuits in order to ensure safety of your equipment. m The products and product specifications described in this online catalog are subject to change for improvement without prior notice. Therefore, please be sure to request and confirm the latest product specifications which explain the specifications of our products in detail, before you finalize the design of your applications, purchase, or use our products. m@ The technical information in this online catalog provides examples of our products' typical operations and application circuits. We do not guarantee the non-infringement of third party's intellectual property rights and we do not grant any license, right, or interest in our intellectual property. m@ If any of our products, product specifications and/or technical information in this online catalog is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially with regard to security and export control, shall be observed. <Regarding the Certificate of Compliance with the EU RoHS Directive/REACH Regulations> m The switchover date for compliance with the RoHS Directive/REACH Regulations varies depending on the part number or series of our products. m When you use the inventory of our products for which it is unclear whether those products are compliant with the RoHS Directive/REACH Regulation, please select "Sales Inquiry" in the website inquiry form and contact us. We do not take any responsibility for the use of our products outside the scope of the specifications, descriptions, guidelines and precautions described in this online catalog. 01-Apr-19 **Micro Chip Fuse** ## Safety Precautions The following are precautions for individual products. Please also refer to the common precautions for fuses in this catalog. 1. Set the rated current so that the current passing through the Micro Chip Fuses (hereafter called the fuses) under normal conditions is within 70% of the rated current. 2. Do not continuously pass a current exceeding the rated current through the fuses. 3. If a pulse exceeding the rated current is applied, such as a rush current or surge current at power-on, take care not to cause unwanted fusing. Calculate the I[2] t value of the pulse and check the tolerance to the number of pulses according to the I[2] t-t characteristic curve before deciding to use the fuses. Before checking the tolerance, consult our sales staff in advance. 4. The fuses are designed to be blown out by a current that is double or greater than the rated current. Ensure that the abnormal current generated when a circuit abnormality occurs in your product is at least double or greater than the rated current of the fuses. In addition, ensure that the abnormal cur rent of your product does not exceed the maximum interrupting current of the fuses. 5. The fuses are designed to be used on the secondary side of a power supply. Do not use them on the primary side. 6. Ensure that the voltage applied to the fuses are within their rated voltage. 7. The fusing characteristics of the fuses are affected by the ambient temperature. Before use, mount the fuses on your products and carefully check and evaluate their category temperature range. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 06 Jan. 2019 **Fuses** ## **Safety Precautions (Common precautions for Fuses)** - When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. - Do not use the products beyond the specifications described in this catalog. - This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products under the actual conditions for use. - Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. - ✽ Systems equipped with a protection circuit and a protection device. - ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault. - ✽ Systems equipped with an arresting the spread of fire or preventing glitch. ## **(1) Precautions for use** - These products are designed and manufactured for general and standard use in general elec tron ic equipment. (e.g. AV equipment, home electric appliances, office equipment, information and communication equipment) For applications in which special quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or cause threat of personal injury (such as for aircraft and aerospace equipment, traffic and transport equipment, combustion equipment, medical equipment, accident prevention and anti-theft devices, and safety equipment), please be sure to consult with our sales representative in advance and to exchange product specifications which conform to such applications. - These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent. 2. In direct sunlight, outdoors, or in dust. 3. In salty air or air with a high concentration of corrosive gas, such as Cl2,H2S,NH3,SO2,or NO3 . 4. Electric Static Discharge (ESD) Environment. - These components are sensitive to static electricity and can be damaged under static shock (ESD). - Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic and Radioactive Environment. - Avoid any environment where strong electromagnetic waves and radiation exist. 6. In an environment where these products cause dew condensation. 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials. - These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. - Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products. - Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the performance or reliability of the products. - Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. - Do not apply flux to these products after soldering. The activity of flux may be a cause of failures in these products. - Refer to the recommended soldering conditions and set the soldering condition. High peak temperature or long heating time may impair the performance or the reliability of these products. - Recommended soldering condition is for the guideline for ensuring the basic characteristics of the products, not for the stable soldering conditions. Conditions for proper soldering should be set up according to individual conditions. 01. Oct. 2019 **Fuses** - Do not reuse any products after removal from mounting boards. - Do not drop these products. If these products are dropped, do not use them. Such products may have received mechanical or electrical damage. - If any doubt or concern to the safety on these products arise, make sure to inform us immediately and conduct technical examinations at your side. ## **(2) Precautions for storage** The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. The performance of Thermal Cutoffs is guaranteed for a year after our delivery, provided that they are stored at a temperature of -10 °C to +40 °C and a relative humidity of 30 % to 75 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2,H2S,NH3,SO2,or NO2 . 2. In direct sunlight. ## <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. 01. Oct. 2019
Updated at June 7, 2026
Panasonic Industry is a global leader in the design and manufacture of high-quality electronic components. Renowned for a commitment to continuous innovation, the company provides the essential building blocks that empower modern engineering. From industrial automation to consumer electronics, Panasonic's components are trusted worldwide for their outstanding reliability, efficiency, and long-term performance. The extensive portfolio is anchored by a massive selection of passive components, featuring an industry-leading range of aluminium electrolytic, film, and polymer capacitors. Alongside these advanced capacitance solutions, engineers rely on Panasonic's robust power inductors and a highly versatile array of electromechanical devices, including solid-state, power, and signal relays engineered to excel in demanding environments. Beyond core passives and switching solutions, the offering encompasses critical circuit protection devices such as TVS varistors and NTC thermistors, as well as sophisticated thermal management materials. Panasonic also delivers precision light and motion sensors, highly reliable batteries, and advanced Bluetooth and WLAN connectivity modules, providing a comprehensive ecosystem of components to support next-generation technological design.
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