EPTS-2-P-D-VT-01

## **HIGH-SPEED BACKPLANE CONNECTOR & CABLE SYSTEMS** 

(2.00 mm) .0787" PITCH 

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## **FEATURES & BENEFITS** 

## **ExaMAX[®] High-Speed Backplane System** 

- Meets a variety of industry specifications 

- Traditional, coplanar and direct mate orthogonal 

- 24 - 72 pair designs (4 and 6 pairs; 6, 8, 10 and 12 columns) 

- Shielded wafer design reduces crosstalk and includes one sideband signal per column 

- Press-fit tails provide a reliable electrical connection 

- PCIe[®] 6.0/CXL[®] 3.2 capable 

**ExaMAX[®] High-Speed Backplane Cable Assemblies** 

- 30 & 34 AWG Eye Speed[®] ultra low skew twinax cable 

- 34 AWG Eye Speed Thinax[™] ultra low skew twinax cable 

- Offers improved signal integrity, increased flexibility and routability 

- Highly customizable with modular flexibility 

- Reduce costs due to lower layer counts 

- PCIe[®] 6.0/CXL[®] 3.2 capable 

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Staggered   Two Reliable Points  In Development:  In Development:  In Development:<br>Differential  of Contact with  Open-Pin-Field,  2 Pair Design for   ExaMAX2 [® ] 8 Pairs<br>Pair Design a 2.4 mm Wipe Coplaner Configuration a Lower Profile for 112 Gbps PAM4<br>Performance<br>**----- End of picture text -----**<br>


## **KEY SPECIFICATIONS** 

|**SERIES**<br>EBTM/EBTF/EBDM<br>ee|**INSULATOR**<br>**MATERIAL**<br>Liquid Crystal Polymer<br>ee|**CONTACT**<br>**MATERIAL**<br>Copper<br>Alloy<br>ee|**CONTACT**<br>**PLATING**<br>Sn or Au over 50 µ"<br>(1.27µm)Ni<br>ee|**OPERATING**<br>**TEMP RANGE**<br>-55 °C to +105 °C<br>ee<br>ee|**CURRENT**<br>**RATING**<br>4 A per pin<br>ee<br> eee|**VOLTAGE**<br>**RATING**<br>150 VAC/212 VDC<br>ee<br>eee|**LEAD-FREE**<br>**SOLDERABLE**<br>Yes<br>ee<br>eee|
|---|---|---|---|---|---|---|---|
|EPTT/EPTS|High Temperature<br>Thermoplastic|Copper<br>Alloy|Sn or Au over 50 µ"<br>(1.27µm)Ni|-55 °C to +105 °C|14.1 A per pin|150 VAC/212 VDC|Yes|
|EBCM/EBCF|Liquid Crystal Polymer|Copper<br>Alloy|Au over 50 µ"<br>(1.27µm)Ni|-40 °C to +105 °C|2.6 A per pin|125 VAC/177 VDC|N/A|



PCI-SIG[®] , PCI Express[®] and the PCIe[®] design marks are registered trademarks and/or service marks of PCI-SIG. 

F-226 WEB 

**samtec.com/ExaMAX** 

Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. 

## **ExaMAX[®] POWER MODULES** 

**(2.00 mm) .0787" PITCH TERMINAL POWER MODULES** 

**EPTT EPTT - POSITIONSPER ROW - PLATING - HEIGHT - D - ORIENTATION Mates with:** EPTS **–2 –P –11.5 –RA** _f______jq__ = 4 Positions = Palladium with flash Gold on = (11.50 mm) .453" = Right-Angle contacts, Matte Tin on tails **EPTS EPTS - POSITIONSPER ROW - PLATING - D -[ORIENTATION] - PIN STAGING Mates with:** EPTT **–2 –P –VT** Visit website for _f____§ = 4 Positions = Palladium with flash Gold on qj ___ = Vertical dimensions. contacts, Matte Tin on tails **–RA –01 thru –06** = Right-Angle (Vertical) **-04 & -08** (Right-Angle) **samtec.com?EPTT & samtec.com?EPTS** View complete specifications at: 

**(2.00 mm) .0787" PITCH SOCKET POWER MODULES** 

## **ExaMAX[®] GUIDE MODULES** 

## **TERMINAL GUIDE MODULES** 

**EGBM EGBM - ORIENTATION - THREADING - LENGTH - SPACINGCARD Mates with:** EGBF **Insulator Material: –VT** Leave Blank for -RA Leave Blank for -RA **–20** = Vertical = 20 mm (.787") 4 Zinc Alloy _§____j___}__ **–1 –18.3 –RA** = External = 18.30 mm (.720") = Right-Angle **–2 –25.3** = Internal (25.3 Length only) = 25.30 mm (.996") **SOCKET GUIDE MODULES** 

**EGBF EGBF - ORIENTATION - CARD SPACING Mates with:** EGBM **Insulator Material: –RA –20** Zinc Alloy = Right-Angle = 20 mm (.787") 

## **Notes:** 

Some lengths, styles and options are non-standard, non-returnable. 

**samtec.com?EGBM & samtec.com?EGBF** View complete specifications at: 

ExaMAX[®] is a registered trademark of AFCI. 

## **samtec.com/ExaMAX** 

F-226 WEB 

Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice.