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EPM12V2-05R5-12R0N
NON ISOLATED POINT OF LOAD POL
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: EATON / PARTNER STOCK
- Product type: DC / DC Non Isolated Board Mount Converters - Adjustable Output
- SVHC: No SVHC (25-Jun-2025)
| Delivery and price | |
|---|---|
| Units per pack | 30 |
| Price | 10.1 € |
| Current stock | 25+ |
| Lead time | 30 days |
Effective May 2021 Supersedes October 2020
Technical Data **11183**
## EPM12V2 Non-isolated DC-DC converter
## **Applications**
- Industrial
- Automation & testing equipment
- Displays
- Lighting
- IoT
- Power Supply
- Energy
## **Product features**
- Non-isolated DC-DC converter
- 3 - 14.4 Vdc input voltage range
- Efficiency up to 91%
- Operating ambient temperature from -40 °C to +90 °C
- Short circuit protection and remote ON/OFF function
- Programmable output voltage from 0.6 - 5.5 Vdc
- Solar and wind inverters
- Battery management
- Medical
- Hospital & home care equipment
- Inventory tracking
- Diagnostics
- Telecom
- Networking and telecommunications
- Infrastructure
- EN62368 safety approval
## **Environmental compliance**
## **Engineering tools**
- EPM12V2 Evaluation kit available (2 options)
- PN: EPM12V2-P-EVK (Positive logic version) Includes evaluation board with EPM12V2 sample
- PN: EPM12V2-N-EVK (Negative logic version) Includes evaluation board with EPM12V2 sample
- EPM12V2 Evaluation kit user guide
## **Ordering part number**
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**----- Start of picture text -----**<br>
EPM 12 Vx- 05R5- 12R0 P<br>Eaton converter<br>Package type/size code<br>Vx= Version code<br>Output voltage maximum (R = decimal point)<br>Output current maximum (R = decimal point)<br>R=Standard, P=Positive logic, N= Negative logic<br>**----- End of picture text -----**<br>
EPM12V2 Non-isolated DC-DC converter
Technical Data 11183 Effective May 2021
## **Specifications**
||**Parameter**|**Conditions**<br>**Minimum**<br>**Typical**<br>**Maximum**<br>**Unit**|
|---|---|---|
|**Input**|Input voltage range|3<br>12<br>14.4<br>Vdc|
||Start-up voltage|0%~100% load<br>3<br>Vdc|
||VULO|2.6<br>V|
||Remote ON/OFF|Positive<br>DC-DC ON<br>DC-DC OFF<br>Open or 1.6 V ≤ Von/off ≤ 5.5 V<br>Short to Gnd or 0 V ≤ Von/off ≤ 0.6 V|
|||Negative<br>DC-DC ON<br>DC-DC OFF<br>Short to Gnd or 0 V ≤ Von/off ≤ 0.6 V<br>1 V ≤ Von/off ≤ 5.5 V|
|**Output**|Efficiency|Vo = 5 Vdc<br>91<br>%|
|||Vo = 3.3 Vdc<br>88<br>%|
|||Vo = 2.5 Vdc<br>86<br>%|
|||Vo = 1.8 Vdc<br>82.5<br>%|
|||Vo = 1.2 Vdc<br>77<br>%|
|||Vo = 0.6 Vdc<br>65<br>%|
||Output voltage trim1|0.6<br>5.5<br>Vdc|
||Minimum load|0<br>%|
||Line regulation|LL-HL<br>±0.4<br>%|
||Load regulation|10-100% Load<br>±0.2<br>%|
||Voltage accuracy|±0.3<br>%|
||Operating frequency|100% Load at nominal Vin<br>800<br>kHz|
||Ripple & noise2|Vo ≤ 1.2 Vdc<br>30<br>mVp-p|
|||Vo > 1.2 Vdc<br>3% Vo<br>mVp-p|
||Power good|Overvoltage threshold for PGOOD ON<br>116.5<br>%|
|||Overvoltage threshold for PGOOD OFF<br>120<br>%|
|||Undervoltage threshold for PGOOD ON<br>91<br>%|
|||Undervoltage threshold for PGOOD OFF<br>87<br>%|
|||PGOOD low sink current @VPGOOD = 0.2 V<br>100<br>µA|
|**Environment**|Operating temperature|With derating<br>-40<br>+90<br>°C|
||Storage temperature|-55<br>+125<br>°C|
||Relative humidity|95<br>%RH|
||Vibration|MIL-STD-202G|
|**Function**|Short circuit protection|Continuous, automatic recovery|
||Safety|EN 62368-1|
||MTBF|MIL-HDBK217F<br>1132<br>khours|
|**Frequency**<br>**synchronization**|Synchronization frequency range3<br>800<br>840<br>kHZ||
||High-level input voltage<br>2<br>V||
||Low-level input voltage<br>0.8<br>V||
||Input current, SYNC<br>1<br>µ A||
|**Physical**|Dimension<br>0.480 (L) x 0.480 (W) x 0.122 (H)<br>inches||
||Weight<br>0.8<br>g||
||Case material<br>Open frame||
||Cooling method<br>Free air convention||
|**EMC**|EMI<br>EN 55032<br>Class A||
||ESD<br>EN61000-4-2<br>Air ± 8 kV<br>Contact ± 8 kV<br>Criteria B||
||Fast transient<br>EN 61000-4-4, ±2 kV<br>Criteria B||
||Surge<br>EN 61000-4-5, ±2 kV<br>Criteria A||
1. The output voltage range is limited by Vin. (Vout ≤ Vin – 2 Vdc)
2. The ripple & noise are measured with 47 µF + 47 µF + 0.1 µF capacitor at 20 MHz BW.
3. SYNC frequency must be greater than operating frequency, externally tie SYNC to GND if synchronization functionality not required.
4. All specifications valid at nominal input voltage, full load and +25 ˚C after warm-up time unless otherwise stated.
5. The product information and specifications are subject to change without prior notice.
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Technical Data 11183 Effective May 2021
EPM12V2 Non-isolated DC-DC converter
## **Selection guide**
|**Selection guide**||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|**Part number**||**Input voltage**||**Output voltage**|**Output current**<br>**@ full load**||**Input current**<br>**@ no load**||**Efficiency1**<br>**typical**||**Capacitive load2**<br>**maximum**||**ON/OFF**<br>**Logic**|
|EPM12V2-05R5-12R0P||3 - 14.4 Vdc||0.6 - 5.5 Vdc|12 A||30 mA||91%||200 μF||Positive|
|EPM12V2-05R5-12R0N||3 - 14.4 Vdc||0.6 - 5.5 Vdc|12 A||30 mA||91%||200 μF||Negative|
1. The no load input current is test by 0.6 V output.
2. The efficiency is test by nominal input, 5 Vout and full load @ +25 °C.
3. The capacitive load is test by minimum input and constant resistive load
4. All specifications valid at 12 V input, full load and +25 °C after warm-up time unless otherwise stated.
## **Measure method**
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47uF 47uF 0.1uF<br>DC/DC<br>C onve rt e r<br>-Vin -Vout<br>**----- End of picture text -----**<br>
## **Derating curve**
**==> picture [282 x 92] intentionally omitted <==**
**----- Start of picture text -----**<br>
20 LFM (0.1 m/s)*<br>100 LFM(0.5 m/s)<br>pi tt | AY | UNAM TO<br>atti} 300 LFM (1.5 m/s)<br>2lLi Pt i tT| i| At|TE| ANAL TO)Tt 500 LFM (2.5 m/s)<br>| |] | iN | TVW I<br>Ltt |} | | TV | AY<br>oL LittTt NIT | AY TL<br>-40 Oo 20 40 60 80 100<br>Temperature (°C)<br>(%)<br>Load<br>**----- End of picture text -----**<br>
- The derating curve was measured at 12 V input and 5 V output. * The derating curve is at 7 V input and 5 V output
## **Output voltage vs. input voltage**
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EPM12V2 Non-isolated DC-DC converter
Technical Data 11183 Effective May 2021
## **Application information**
## **Output voltage trim**
## **Output voltage sequencing**
The SEQ pin can be used when master-slave power-supply tracking is required.
Trim resistor equation
Rtrim (k Ω ) = 12K
Vo−0.6
|**Output voltage**||**Calculated Rtrim (kΩ)**|
|---|---|---|
|5.0 V||2.727|
|3.3 V||4.444|
|2.5 V||6.316|
|1.8 V||10|
|1.5 V||13.3|
|1.2 V||20|
|0.6 V||∞ (Open)|
The voltage applied to the SEQ pin should be scaled down by the same ratio as used to scale the output voltage down to the reference voltage of the module. This is accomplished by an external resistive divider connected across the sequencing voltage before it is fed to the SEQ pin. The minimum recommended delay between the ON/OFF signal and the sequencing signal is 10 ms to ensure that the module output is ramped up according to the sequencing signal. This ensures that the module soft-start routine is completed before the sequencing signal is allowed to ramp up.
When an analog voltage is applied to the SEQ pin, the output voltage tracks this voltage until the output reaches the set-point voltage. The final value of the SEQ voltage must be set higher than the set-point voltage of the module. The output voltage follows the voltage on the SEQ pin on a one-to-one basis. By connecting multiple modules together, multiple modules can track their output voltages to the voltage applied on the SEQ pin.
To initiate simultaneous shutdown of the modules, the SEQ pin voltage is lowered in a controlled manner. The output voltage of the modules tracks the voltages below their setpoint voltages on a one-to-one basis. A valid input voltage must be maintained until the tracking and output voltages reach ground potential.
## **Power good**
Power good monitor output. This open-drain output goes low during overcurrent, short-circuit, UVLO, overvoltage and undervoltage, overtemperature, or when the output is not regulated (such as a pre-bias output). An external pullup resistor to VDD or to an external rail is required. Included is a 20-μs deglitch filter. PGOOD pin can be connected through a pullup resistor suggested value 100 k Ω ) to a source of 5 Vdc or lower.
## **Synchronization**
The SEQ pin can be used when master-slave power-supply tracking is required
## **Remote ON/OFF**
The module switching frequency can be synchronized to a signal with an external frequency within a specified range. Synchronization can be done by using the external signal applied to the SYNC pin of the module, with the converter being synchronized by the rising edge of the external signal. The electrical specifications table specifies the requirements of the external SYNC signal. If the SYNC pin is not used, the module should free run at the default switching frequency. If synchronization is not being used, connect the SYNC pin to GND.
Logic type active mode Positive Logic DC/DC ON : Q1 OFF DC/DC OFF : Q1 ON
Negative Logic
DC/DC ON : Q1 ON DC/DC OFF: Q1 OFF
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Technical Data 11183 Effective May 2021
EPM12V2 Non-isolated DC-DC converter
## **EMC filtering circuit**
**==> picture [261 x 97] intentionally omitted <==**
**----- Start of picture text -----**<br>
L1 L2 L3<br>— ——— i<br>+Vin Vin Vo<br>C1 C2 C3 DC/DCConverter Load<br>GND G G<br>o—— o—— —e<br>Class C1 L1 C2 L2 C3 L3<br>Class A 100 µF/ 25 V 8 mH 100 µF/ 25 V 12 mH 470 µF/ 25 V 35 µH<br>**----- End of picture text -----**<br>
## **ETF and surge circuit**
**==> picture [190 x 78] intentionally omitted <==**
**----- Start of picture text -----**<br>
DC/DC<br>Load<br>TVS C1 Converter<br>TVS C1<br>Eaton P4SMA13CA 10000 µF 25 V<br>**----- End of picture text -----**<br>
## **Mechanical dimension and pinning - inches**
## Recommended pad layout
Pad 1 & 5~17 = 0.041” x 0.041” Pad 2&4 = 0.165” x 0.074”
## **Marking**
Projection: Third angle projection Tolerance: ± 0.01 Pad 1&5~12 = 0.04 x 0.04 Pad 2~4 = 0.07 x 0.157
xxx= lot code
|**Pin**||**Function**||**Pin**||**Function**|
|---|---|---|---|---|---|---|
|1||On/Off||10||PGOOD|
|2||Vin||11||SYNC|
|3||GND||12||VS-|
|4||Vout||13||SIG_GND|
|5||VS+ (Sense)||14||NC|
|6||TRIM||15||NC|
|7||GND||16||NC|
|8||NC||17||NC|
|9||SEQ|||||
NC = no connection
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EPM12V2 Non-isolated DC-DC converter
Technical Data 11183 Effective May 2021
## **Packaging- Inches**
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EPM12V2 Non-isolated DC-DC converter
Technical Data 11183 Effective May 2021
## **General information**
## **Pick and place**
The 12 A open frame modules use an open frame construction and are designed for a fully automated pick and place assembly process.
## **MSL rating**
The 12 A Open frame modules have a MSL rating of 3.
## **Storage and handling**
## **Lead-free reflow profile**
Power systems will comply with J-STD-020 (Moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package. The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown. Soldering outside of the recommended profile requires testing to verify results and performance.
The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 (Handling, packing, shipping and use of moisture/reflow sensitive surface mount devices).
Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 3 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of 30 °C and 60% relative humidity 168 hours varies according to the MSL rating (see J-STD-033). The shelf life for dry packed SMT packages will be a maximum of 12 months from the bag seal date, when stored at the following conditions: < 40 °C, < 90% relative humidity.
## **Post solder cleaning and drying considerations**
To avoid contamination on the soldering pads extra care has to be taken when handling the boards. Clean soldering surfaces do not generate as many gases when the flux reduce the metal oxides or react with contaminants during the soldering process.
## **Nozzle**
The module weight has been kept to a minimum by using open frame construction. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process.
|**Profile**||**Pb-free assembly**|
|---|---|---|
|Average ramp-up rate<br>(Tsmaxto Tp)||3 °C/s max.|
|Preheat|||
|Temperature Min. (Tsmin)<br>Temperature Max. (Tsmax)<br>Ts(Tsminto Tsmax)||150 °C<br>200 °C<br>60-120 s|
|Temperature (TP)||245°C|
|Time maintained above|||
|Temperature (TL)<br>Time (tI)||217°C<br>60-150 s|
|Time within 5°C of the specified<br>Peak temperature (TP)||20-40 s|
|Ramp down rate (TPto TL)||6 °C/s max|
|Time 25 °C to peak temperature||8 minutes max.|
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin.
**Eaton Electronics Division** 1000 Eaton Boulevard Cleveland, OH 44122 United States Eaton.com/electronics © 2021 Eaton All Rights Reserved Printed in USA Publication No. 11183 May 2021
Eaton is a registered trademark. All other trademarks are property of their respective owners.
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Updated at April 10, 2026
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