ENW89846A1KF

# PAN1761 Bluetooth Low Energy & NFC Combo Module Product Specification Rev. 1.2 

PAN1761 Bluetooth & NFC Module 

##  

## **Overview** 

The PAN1761 is a short-range BLE and NFC single mode module used for the implementation of Bluetooth functionality into various electronic devices. 

## **Features** 

- [Small 15.6 mm x 8.7 mm x 1.9 mm SMD module  ] 

- [Same form factor and pinout as PAN1026, ] PAN1760, and PAN1760A 

- [Bluetooth Low Energy (BLE) 4.1 compliant  ] 

- [512 kbit EEPROM memory ] 

- [Host mode ] 

- [Standard SIG BLE profiles as well ] as SPPoverBLE profiles available in the SDK 

- [UART, I2C & SPI interface, PWM output (3x), ] ADC (3x), 10 programmable I/O 

## **NFC** 

- [Almost zero power consumption in standby mode ] by using NFC wake up 

## **Characteristics** 

- [Receiver sensitivity -91 dBm typ. ] 

- [Output power 0 dBm maximum setting ] 

- [Power supply 1.8 V to 3.6 V single operation ] voltage 

- [Transmit power consumption @0dBm 5.8 mA ] 

- [Low Power 5 µA Sleep mode ] 

- [NFC Forum Type 3 compliant NFC tag (external ] 

   - antenna) 

- [Operating temperature range -30 °C to +85 °C ] 

## **Bluetooth** 

   - [GAP central and peripheral support for LE ] 

   - [GATT, SMP, and SDB support for LE ] 

   - [Support for Over-the-Air update ] 

   - [Support for Scatternet/Mesh network ] 

   - [Frequent changing of device address (improved ] privacy, reduced tracking ability) 

   - [Larger packet sizes (more efficient application ] and network layer security) 

- [Dedicated Bluetooth partner selection by simple ] device approximation 

- [Support for true out-of-band Bluetooth pairing ] 

## **Block Diagram** 

**==> picture [375 x 236] intentionally omitted <==**

**----- Start of picture text -----**<br>
Vcc 3.3 V PAN1761<br>EEPROM Bluetooth 4.1 Module<br> 512 kbit<br>UART<br>Crystal<br>GPIOs 26 MHz<br>Chip NFC<br>Antenna Antenna<br>DC-DC<br>Toshiba Conversion<br>Host Wake up TC35670<br>Wake up<br>Reset<br>LPF<br>NFC I²C<br>NFC Wake up<br>**----- End of picture text -----**<br>


Product Specification Rev. 1.2 

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PAN1761 Bluetooth & NFC Module 

By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. 

© Panasonic Industrial Devices Europe GmbH 2017. 

This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. 

All rights reserved. 

This Product Specification does not lodge the claim to be complete and free of mistakes. 

## **Engineering Samples (ES)** 

If Engineering Samples are delivered to the customer, these samples have the status “Engineering Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. 

Engineering Samples are not qualified and they are not to be used for reliability testing or series production. 

## **Disclaimer** 

The customer acknowledges that samples may deviate from the Product Specification and may bear defects due to their status of development and the lack of qualification mentioned above. 

Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by: 

- The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer, 

- Deviation or lapse in function of the Engineering Sample, 

- Improper use of the Engineering Sample. 

Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager. 

Product Specification Rev. 1.2 

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PAN1761 Bluetooth & NFC Module 

##  

## **Table of Contents** 

|**1**|**About**|**This Document ......................................................................................................................... 5**|
|---|---|---|
||1.1|Purpose and Audience .............................................................................................................. 5|
||1.2|Revision History ......................................................................................................................... 5|
||1.3|Use of Symbols ......................................................................................................................... 5|
||1.4|Related Documents ................................................................................................................... 5|
|**2**|**Overview .............................................................................................................................................. 6**||
||2.1|Block Diagram ........................................................................................................................... 7|
||2.2|Bluetooth IC ............................................................................................................................... 7|
||2.3|Pin Configuration ....................................................................................................................... 8|
|**3**|**Detailed Description ......................................................................................................................... 11**||
||3.1|Dimensions .............................................................................................................................. 11|
||3.2|Footprint .................................................................................................................................. 12|
||3.3|Packaging ................................................................................................................................ 13|
||3.4|Case Marking .......................................................................................................................... 16|
|**4**|**Specification ..................................................................................................................................... 17**||
||4.1|Default Test Conditions ........................................................................................................... 17|
||4.2|Absolute Maximum Ratings ..................................................................................................... 17|
||4.3|Recommended Operating Conditions ...................................................................................... 18|
||4.4|Power Up Sequence ................................................................................................................ 18|
||4.5|Current Consumption............................................................................................................... 18|
||4.6|Bluetooth RF Performance ...................................................................................................... 19|
||4.7|Antenna Radiation Pattern ....................................................................................................... 21|
||4.8|Reliability Tests ....................................................................................................................... 22|
||4.9|Recommended Soldering Profile ............................................................................................. 23|
|**5**|**Cautions ............................................................................................................................................ 24**||
||5.1|Design Notes ........................................................................................................................... 24|
||5.2|Installation Notes ..................................................................................................................... 24|
||5.3|Usage Condition Notes ............................................................................................................ 25|
||5.4|Storage Notes .......................................................................................................................... 25|
||5.5|Safety Cautions ....................................................................................................................... 25|
||5.6|Other Cautions ........................................................................................................................ 26|
||5.7|Life Support Policy ................................................................................................................... 26|
|**6**|**Regulatory and Certification Information ....................................................................................... 27**||
||6.1|RoHS and REACH Declaration ............................................................................................... 27|
|**7**|**Appendix ........................................................................................................................................... 28**||
||7.1|Ordering Information ................................................................................................................ 28|
||7.2|Contact Details ........................................................................................................................ 29|



Product Specification Rev. 1.2 

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PAN1761 Bluetooth & NFC Module 

1 About This Document 

## **1 About This Document** 

## **1.1 Purpose and Audience** 

This Product Specification provides details on the functional, operational, and electrical characteristics of the Panasonic PAN1761 module. It is intended for hardware design, application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to as “the PAN1761” or “the module” within this document. 

## **1.2 Revision History** 

|**Revision**|**Date**|**Modifications/Remarks**|
|---|---|---|
|0.1|November 2015 1st preliminary version.|November 2015 1st preliminary version.|
|0.2|January 2016|PIN Table correction.|
|0.3|February 2016|Minor changes.|
|0.6|23.08.2016|Bluetooth 4.1|
|0.7|3.11.2016|Changes in power supply values and conditions during measurement of<br>outputpower and sensitivity|
|1.0|January 2017|Final version|
|1.1|March 2017|Updated temperature range|
|1.2|July 2017|New document structure and layout|



## **1.3 Use of Symbols** 

|**Symbol**|**Description**|
|---|---|
|@|**Note**<br>Indicates important information for the proper use of the product.<br>Non-observance can lead to errors.|
|A|**Attention**<br>Indicates important notes that, if not observed, can put the product’s functionality<br>at risk.|
|[chapter number]<br>[chapter title]|**Cross reference**<br>Indicates cross references within the document.<br>**Example:**<br>Description of the symbols used in this document1.3 Use of Symbols.|



Description of the symbols used in this document  1.3 Use of Symbols. 

## **1.4 Related Documents** 

Please refer to the Panasonic website for related documents  7.2.2 Product Information. 

Product Specification Rev. 1.2 

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PAN1761 Bluetooth & NFC Module 

2 Overview 

## **2 Overview** 

The PAN1761 is based on Toshiba's single chip TC35670 Bluetooth semiconductor device with embedded Toshiba Bluetooth 4.1 LE stack, GATT profile, and an NFC Forum Type 3 compliant NFC tag. Peak power consumption of only 5.8 mA in Tx mode allows advanced wireless functionalities in IoT, medical, and industrial applications without compromising battery life. Additionally, NFC allows products to wake up from zero standby power consumption to full Bluetooth operation. Highly secure Bluetooth connections are created using NFC to exchange link keys. 

The PAN1761 can be operated in Host mode for very simple integration of Bluetooth connectivity into existing products. The PAN1761 and the PAN1026 share the same footprint. 

Only minor code changes are required when migrating from PAN1026. Previously developed software (Bluetooth Low Energy profiles and applications) can be easily migrated with a minimal effort. 

FCC, IC, and CE approval are available. 

Please refer to the Panasonic website for related documents  7.2.2 Product Information. Further information on the variants and versions  7.1 Ordering Information. 

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PAN1761 Bluetooth & NFC Module 

2 Overview 

##  

## **2.1 Block Diagram** 

**==> picture [399 x 259] intentionally omitted <==**

**----- Start of picture text -----**<br>
Vcc 3.3 V PAN1761<br>EEPROM Bluetooth 4.1 Module<br> 512 kbit<br>UART<br>Crystal<br>GPIOs 26 MHz<br>Chip NFC<br>Antenna Antenna<br>DC-DC<br>Toshiba Conversion<br>Host Wake up TC35670<br>Wake up<br>Reset<br>LPF<br>NFC I²C<br>NFC Wake up<br>f ey<br>**----- End of picture text -----**<br>


## **2.2 Bluetooth IC** 

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PAN1761 Bluetooth & NFC Module 

2 Overview 

## **2.3 Pin Configuration** 

## **Pin Assignment** 

## Top View 

**==> picture [400 x 246] intentionally omitted <==**

**----- Start of picture text -----**<br>
15.6 mm<br>5.0<br>1.0 0.6 1.2 2.4 _ J<br>F1 F2 F3 F4 F5 F6 F7 F8 F9 F11 F12<br>bevoodsobdtoo<br>E1 E2 E3 E4 E5 E6 E7 E8 E9<br>©00000000<br>D1 D2 D3 D4 D5 D6 D7 D8 D9<br>C000000004<br>C1 C2 C3 C4 C5 C6 C7 C8 C9<br>0000000004<br>B1 B2 B3 B4 B5 B6 B7 B8 B9<br>©00000000<br>A1 A2 A3 A4 A5 A6 A7 A8 A9 A11 A12<br>H00000000;,00 0.6<br>1.35<br>1.2<br>8.70 mm<br>1.35<br>**----- End of picture text -----**<br>


## **Pin Functions** 

|**No**|**Pin Name**|**GPIO No**|**Pin Type**|**Description**|
|---|---|---|---|---|
|A1|GND||Ground pin|Connect to ground|
|A2|NC|||Not connected|
|A3|Reset||Digital input Reset, active-low|Digital input Reset, active-low|
|A4|VCC||Power|2 V – 3.6 V analog/digital power supply<br>connection|
|A5|VCC||Power|2 V – 3.6 V analog/digital power supply<br>connection|
|A6|VCC||Power|2 V – 3.6 V analog/digital power supply<br>connection|
|A7|GND||Ground pin|Connect to ground|
|A8|NC|||Not connected|



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PAN1761 Bluetooth & NFC Module 

2 Overview 

|**No**|**Pin Name**|**GPIO No**|**Pin Type**|**Description**|
|---|---|---|---|---|
||||||
|A9|GND|||Connect to ground|
|A11|GND|||Connect to ground|
|A12|GND|||Connect to ground|
|B1|NC|||Not connected|
|B2|TAG_L0||NFC_Anten<br>na||
|B3|TAG_SCL||NFC_I2C||
|B4|NC|||Not connected|
|B5|NC|||Not connected|
|B6|NC|||Not connected|
|B7|NC|||Not connected|
|B8|NC|||Not connected|
|B9|NC|||Not connected|
|C1|NC|||Not connected|
|C2|TAG_L1||NFC_Anten<br>na||
|C3|TAG_RFDET||Digital Out||
|C4|NC|||Not connected|
|C5|NC|||Not connected|
|C6|TAG_READYX||Digital Out||
|C7|TAG_SDA|PWM2|NFC_I2C||
|C8|GND||Ground Pin|Connect to ground|
|C9|GND||Ground Pin|Connect to ground|
|D1|NC|||Not connected|
|D2|NC|||Not connected|
|D3|GPIO1|AIN0|Digital I/O||
|D4|Wakeup|GPIO0|Digital I/O||
|D5|NC|||Not connected|
|D6|TAG_PONX||Digital In||
|D7|GND||Ground Pin|Connect to ground|
|D8|GND||Ground Pin|Connect to ground|
|D9|NC|||Not connected/placeholder for antenna|



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PAN1761 Bluetooth & NFC Module 

2 Overview 

|**No**|**Pin Name**|**GPIO No**|**Pin Type**|**Description**|
|---|---|---|---|---|
||||||
|E1|GPIO8|SDA|Digital I/O|Connected to internal EEPROM|
|E2|GPIO7|SCL|Digital I/O|Connected to internal EEPROM|
|E3|NC|||Not connected|
|E4|NC|||Not connected|
|E5|TAG_RECTOUT||||
|E6|UART_RXD|GPIO4|Digital In||
|E7|GPIO2|PWM0/AIN1|Digital I/O||
|E8|GND||Ground Pin|Connect to ground|
|E9|GND||Ground Pin|Connect to ground|
|F1|GND||Ground Pin|Connect to ground|
|F2|EEPROM_WP||Digital In|EEPROM write protect /active low|
|F3|NC|||Not connected|
|F4|NC|||Not connected|
|F5|GPIO6|UART_1-<br>CTS/<br>UART2-RX|Digital In|Can be configured to UART2_RXD|
|F6|SLEEPXCLKIN||Clock|32.768 KHz sleep clock input|
|F7|UART_TXD|GPIO3|Digital Out||
|F8|GPIO5|UART1_RT<br>S/ UART2-<br>TX|Digital I/O|Can be configured to UART2_TXD|
|F9|GND||Ground Pin|Connect to ground|
|F11|GND||Ground Pin|Connect to ground|
|F12|GND||Ground Pin|Connect to ground|



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PAN1761 Bluetooth & NFC Module 

3 Detailed Description 

## **3 Detailed Description** 

## **3.1 Dimensions** 

All dimensions are in millimeters. 

|**No.**|**Item**|**Dimension**|**Tolerance**|**Remark**|
|---|---|---|---|---|
|1 Width|1 Width|8.70|± 0.30|± 0.30|
|2 Length|2 Length|15.60|± 0.30|± 0.30|
|3 Height|3 Height|1.80|± 0.20 With case|± 0.20 With case|



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3 Detailed Description 

## **3.2 Footprint** 

The outer dimensions have a tolerance of 0.3 mm. 

## Top View 

**==> picture [400 x 229] intentionally omitted <==**

**----- Start of picture text -----**<br>
15.6 mm<br>5.0<br>1.0 0.6 1.2 2.4<br>F1 F2 F3 F4 F5 F6 F7 F8 F9 F11 F12<br>ber ooboootee__<br>E1 E2 E3 E4 E5 E6 E7 E8 E9<br>©C00000000<br>D1 D2 D3 D4 D5 D6 D7 D8 D9<br>C000000004<br>C1 C2 C3 C4 C5 C6 C7 C8 C9<br>000000000,<br>B1 B2 B3 B4 B5 B6 B7 B8 B9<br>©C0CO0000000<br>A1 A2 A3 A4 A5 A6 A7 A8 A9 A11 A12<br>O0000000;OO 0.6<br>1.35<br>1.2<br>8.70 mm<br>1.35<br>**----- End of picture text -----**<br>


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PAN1761 Bluetooth & NFC Module 

3 Detailed Description 

## **3.3 Packaging** 

The product is a mass production status product and will be delivered in the package described below. 

## **3.3.1 Tape Dimensions** 

## **3.3.2 Packing in Tape** 

## Direction of unreeling (for customer) 

**==> picture [381 x 58] intentionally omitted <==**

**----- Start of picture text -----**<br>
trailer (empty) component  leader (empty) Top cover tape more<br>1 x circumference / packed area minimum 10 pitch than 1 x<br>circumference plus<br>hub standard  100mm to avoid<br>(min 160mm) 1500pcs fixing of tape end on<br>sealed modules.<br>**----- End of picture text -----**<br>


Empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. 

The top cover tape shall not be found on reel holes and it shall not stick out from the reel. 

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PAN1761 Bluetooth & NFC Module 

3 Detailed Description 

## **3.3.3 Component Direction** 

## **3.3.4 Reel Dimension** 

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PAN1761 Bluetooth & NFC Module 

3 Detailed Description 

## **3.3.5 Package Label** 

## **Example** 

|AUANOOAEA UC|TET MAE TT|
|---|---|
|(1T)|Lot code|
|(1P)|Customer order number, if applicable|
|(2P)|Order number|
|(9D)|Date code|
|(Q)|Quantity|
|(HW/SW)|Hardware/software version|



## **3.3.6 Total Package** 

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PAN1761 Bluetooth & NFC Module 

##  

## 3 Detailed Description 

## **3.4 Case Marking** 

## **Example** 

- 1 2D barcode, for internal usage only 

- 2 Brand name 

- 3 Hardware/software version 

- 4 Order number 

- 5 Lot code 

- 6 FCC ID 7 IC ID 8 Marking for Pin 1 

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PAN1761 Bluetooth & NFC Module 

4 Specification 

## **4 Specification** 

All specifications are over temperature and process, unless indicated otherwise. 

## **4.1 Default Test Conditions** 

|Temperature:<br>Humidity:<br>Supply Voltage:|25 ± 10 °C<br>40 to 85 % RH<br>3.3 V|
|---|---|



## **4.2 Absolute Maximum Ratings** 

The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. 

|**Parameter**|**Condition**|**Min.**|**Typ.**|**Max.**|**Units**|
|---|---|---|---|---|---|
|Voltage on any digital pin||-0.3||VDD<br>+<br>0.3|V|
|Operating ambient temperature<br>range||-30||85|°C|
|Storage temperature range||-30||125|°C|
|Bluetooth RF inputs||10|10||dBm|
|ESD:<br>All pads, according to human-body<br>model, JEDEC STD 22, method<br>A114<br>According to charged-device<br>model, JEDEC STD 22, method<br>C101||1000|1000||V|



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4 Specification 

## **4.3 Recommended Operating Conditions** 

The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. 

|**Parameter**|**Condition**|**Min.**|**Typ.**|**Max.**|**Units**|
|---|---|---|---|---|---|
|Power supply voltage||2.0|3.3|3.6|V|
|Maximum ambient operating temperature|||-30|85|C|



## **4.4 Power Up Sequence** 

When the power is turned on, set reset signal to low (RESET=Low). After OSC is stable, release reset (RESET=High). 

Crystal oscillator stabilizing time is about 2 msec, so define release time after sufficient evaluation. 

When the power is turned off, set reset signal to low (RESET=Low). 

**==> picture [297 x 135] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDD power supply<br>Reset signal<br>DCDC / LDO output<br>Reference clock<br>Unstable  Stable<br>Power off  OSC boot timer  Operation<br>Power on<br>voltage<br>detection<br>RC delay<br>**----- End of picture text -----**<br>


## **4.5 Current Consumption** 

The current consumption depends on the user scenario and on the setup and timing in the power modes. 

Assume VDD = 3.3 V, Tamb = 25 °C, if nothing else stated. 

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PAN1761 Bluetooth & NFC Module 

4 Specification 

## **4.6 Bluetooth RF Performance** 

## **4.6.1 Bluetooth Characteristics** 

|**Parameter**|**Condition**|**Min.**|**Typ.**|**Max.**|**Units**|
|---|---|---|---|---|---|
|Operation<br>frequency<br>range||2 402||2 480|MHz|
|Channel<br>spacing|||2||MHz|
|Output power|Maximum setting, measured at single ended<br>50 Ohm.||0||dBm|
|Sensitivity,<br>High Gain<br>mode|High-gain mode, measured at single ended<br>50 Ohm.||-90.0||dBm|



## **4.6.2 NFC Tag Interface** 

PAN1761 has a built-in NFC Forum Type 3 Tag (NFC Tag) function. 

## **Features of the PAN1761 NFC interface** 

- Built-in contactless IC card technology. 

- Wireless interface: automatic detection of 212 kbps and 424 kbps transmission speed. 

- I2C interface: maximum operational clock 400 kHz. 

- Built-in EEPROM: general user area 1 520 bytes, protecting against defective data. 

- Writing time: 5 ms (typ.), 1 bit error automatic correction, CRC automatic addition, and error detection of read data. 

- Security: mutual authentication with Message Authentication Code (MAC), variety access attributes can be set. Writing prohibition, reading after authentication, writing after authentication, writing with MAC. 

The technology refers to the following standards: JIS X 6319-4, ISO/IEC 18092 

## **Basic technical characteristics** 

|**Item**|**Remarks**|
|---|---|
|Data transmission format|Half duplex, synchronization|
|Carrier frequency|13.56 MHz|
|Data transmission speed|212,424 Kbit/s (automatic detection)|
|Modulation|ASK|
|Coding|Manchester|
|Bit order|MSBF|



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4 Specification 

## **4.6.3 NFC Operational Sequence** 

If a wireless carrier is detected, TAG_RFDET pin outputs high level. If the wireless carrier disappears, TAG_RFDET pin turns back to low level due to pull-down resistance. Set VDDIO and VDD pin to output high (power supply). At Write without Encryption or Read without Encryption, if IDm stored in PAN1761 chip and iDm with command are consistent, 

TAG_READYX pin outputs high level. After that, during supply of internal power source, the high is kept. VDDIO and VDD pin need power supply for TAG_READYX pin to output high. 

By becoming high in TAG_READYX pin, HOST can get to know that wireless reader writer accesses the module. 

## **Sequence example of operation over the wireless TAG interface** 

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PAN1761 Bluetooth & NFC Module 

4 Specification 

## **4.7 Antenna Radiation Pattern** 

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4 Specification 

## **4.8 Reliability Tests** 

The measurement should be done after the test device has been exposed to room temperature and humidity for one hour. 

|**No.**|**Item**|**Limit**|**Condition**|
|---|---|---|---|
|1|Vibration test|Electrical parameter should be in<br>specification|•Freq.: 10~50 Hz; Amplitude:<br>1.5 mm; 20 min./cycle, 1 hrs. each<br>of XYZ axis<br>•Freq.: 30~100 Hz, 6G;<br>20 min./cycle, 1 hrs. each of XYZ<br>axis|
|2|Shock test|See above|Dropped onto hard wood from a<br>height of 50 cm for 3 times|
|3|Heat cycle test|See above|-40 °C for 30 min. and +85 °C for<br>30 min.; each temperature 300 cycles|
|4|Moisture test|See above|+60 °C, 90 % RH, 300 h|
|5|Low<br>temperature<br>test|See above|-40 °C, 300 h|
|6|High temp. test|See above|+85 °C, 300 h|



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4 Specification 

## **4.9 Recommended Soldering Profile** 

- Reflow permissible cycle: 2 

- Opposite side reflow is prohibited due to module weight 

- More than 75 percent of the soldering area shall be coated by solder 

- The soldering profiles should be adhered to in order to prevent electrical or mechanical damage 

- Soldering profile assumes lead-free soldering 

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PAN1761 Bluetooth & NFC Module 

5 Cautions 

## **5 Cautions** 

Failure to follow the guidelines set forth in this document may result in degrading of the product’s functions and damage to the product. 

## **5.1 Design Notes** 

1. Follow the conditions written in this specification, especially the control signals of this module. 

2. The supply voltage must be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47 µF directly at the module). 

3. This product should not be mechanically stressed when installed. 

4. Keep this product away from heat. Heat is the major cause of decreasing the life of these products. 

5. Avoid assembly and use of the target equipment in conditions where the product’s temperature may exceed the maximum tolerance. 

6. The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes. 

7. Keep this product away from other high frequency circuits. 

8. Refer to the recommended pattern when designing a board. 

## **5.2 Installation Notes** 

1. Reflow soldering is possible twice based on the conditions set forth in  4.9 Recommended Soldering Profile. Set up the temperature at the soldering portion of this product according to this reflow profile. 

2. Carefully position the products so that their heat will not burn into printed circuit boards or affect the other components that are susceptible to heat. 

3. Carefully locate these products so that their temperatures will not increase due to the effects of heat generated by neighboring components. 

4. If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. Never allow contact between the cover and these products to occur. 

5. This product should not be mechanically stressed or vibrated when reflowed. 

6. To repair the board by hand soldering, follow the conditions set forth in this chapter. 

7. Do not wash this product. 

8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the unit. 

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PAN1761 Bluetooth & NFC Module 

5 Cautions 

## **5.3 Usage Condition Notes** 

1. Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation befor assembly on the final products. 

2. Do not use dropped products. 

3. Do not touch, damage or soil the pins. 

4. Follow the recommended condition ratings about the power supply applied to this product. 

5. Electrode peeling strength: Do not add pressure of more than 4.9 N when soldered on PCB. 

6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage. 

7. These products are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, information, and communication equipment. 

## **5.4 Storage Notes** 

1. The module should not be stressed mechanically during storage. 

2. Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance will be adversely affected: 

- Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX, 

- Storage in direct sunlight, 

- Storage in an environment where the temperature may be outside the range of 5 °C to 35 °C, or where the humidity may be outside the 45 to 85 percent range, 

- Storage of the products for more than one year after the date of delivery storage period: Please check the adhesive strength of the embossed tape and soldering after 6 months of storage. 

3. Keep this product away from water, poisonous gas, and corrosive gas. 

4. This product should not be stressed or shocked when transported. 

5. Follow the specification when stacking packed crates (max. 10). 

## **5.5 Safety Cautions** 

These specifications are intended to preserve the quality assurance of products and individual components. 

Before use, check and evaluate the operation when mounted on your products. Abide by these specifications without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, provide the following failsafe functions as a minimum: 

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5 Cautions 

1. Ensure the safety of the whole system by installing a protection circuit and a protection device. 

2. Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status. 

## **5.6 Other Cautions** 

1. Do not use the products for other purposes than those listed. 

2. Be sure to provide an appropriate fail-safe function on your product to prevent any additional damage that may be caused by the abnormal function or the failure of the product. 

3. This product has been manufactured without any ozone chemical controlled under the Montreal Protocol. 

4. These products are not intended for uses other than under the special conditions shown below. Before using these products under such special conditions, carefully check their performance and reliability under the said special conditions to determine whether or not they can be used in such a manner: 

- In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash, 

- In direct sunlight, outdoors, or in a dusty environment, 

- In an environment where condensation occurs, 

- In an environment with a high concentration of harmful gas (e. g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOX). 

5. If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. 

6. When you have any question or uncertainty, contact Panasonic. 

## **5.7 Life Support Policy** 

This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 

Panasonic customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any damages resulting. 

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6 Regulatory and Certification Information 

## **6 Regulatory and Certification Information** 

## **6.1 RoHS and REACH Declaration** 

The latest declaration of environmental compatibility (Restriction of Hazardous Substances, RoHS and Registration, Evaluation, Authorisation and Restriction of Chemicals, REACH) for supplied products can be found on the Panasonic website in the “Downloads” section of the respective product  7.2.2 Product Information. 

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7 Appendix 

## **7 Appendix** 

## **7.1 Ordering Information** 

## **Variants and Versions** 

|**Order Number**|**Brand Name**|**Description**|**MOQ1**|
|---|---|---|---|
|ENW89848A1KF2|PAN1761|PAN1761 Bluetooth Low Energy & NFC Combo Module|1 500|



> 1 Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1 500 pieces, fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution channels. 

> 2 Samples are available on customer demand. 

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7 Appendix 

## **7.2 Contact Details** 

## **7.2.1 Contact Us** 

Please contact your local Panasonic Sales office for details on additional product options and services: 

For Panasonic Sales assistance in the **EU** , visit 

https://eu.industrial.panasonic.com/about-us/contact-us 

Email: wireless@eu.panasonic.com 

For Panasonic Sales assistance in **North America** , visit the Panasonic Sales & Support Tool to find assistance near you at 

https://na.industrial.panasonic.com/distributors 

Please visit the **Panasonic Wireless Technical Forum** to submit a question at 

https://forum.na.industrial.panasonic.com 

## **7.2.2 Product Information** 

Please refer to the Panasonic Wireless Connectivity website for further information on our products and related documents: 

For complete Panasonic product details in the **EU** , visit 

http://pideu.panasonic.de/products/wireless-modules.html 

For complete Panasonic product details in **North America** , visit 

http://www.panasonic.com/rfmodules 

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