EMK33H2H-32.768M TR

## **EMK33H2H-32.768M** PART NUMBER DATA SHEET 

## **REGULATORY COMPLIANCE** 

## **(Data Sheet downloaded on Sep 22, 2020)** 

2011/65 + 2015/863 iy 191 SVHC 

## **ITEM DESCRIPTION** 

MEMS Clock Oscillators LVCMOS (CMOS) 3.3Vdc 4 Pad 2.5mm x 3.2mm Plastic Surface Mount (SMD) 32.768MHz ±50ppm over -40°C to +85°C 

## **ELECTRICAL SPECIFICATIONS** 

|**ELECTRICAL SPECIFICATIONS**|**ELECTRICAL SPECIFICATIONS**|
|---|---|
|**Nominal Frequency**|32.768MHz|
|**Frequency Tolerance/Stability**|±50ppm Maximum over -40°C to +85°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability<br>over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,<br>260°C Reflow, Shock, and Vibration)|
|**Aging at 25°C**|±1ppm Maximum First Year|
|**Supply Voltage**|3.3Vdc ±10%|
|**Input Current**|25mA Maximum|
|**Output Voltage Logic High (Voh)**|90% of Vdd Minimum (IOH=-8mA)|
|**Output Voltage Logic Low (Vol)**|10% of Vdd Maximum (IOL=+8mA)|
|**Rise/Fall Time**|2nSec Maximum (Measured from 20% to 80% of waveform)|
|**Duty Cycle**|50 ±5(%) (Measured at 50% of waveform)|
|**Load Drive Capability**|15pF Maximum|
|**Output Logic Type**|CMOS|
|**Output Control Function**|Tri-State (Disabled Output: High Impedance)|
|**Output Control Input Voltage**|+0.7Vdd Minimum or No Connect to Enable Output, +0.3Vdd Maximum to Disable Output|
|**Peak to Peak Jitter (tPK)**|250pSec Maximum, 100pSec Typical|
|**Start Up Time**|50mSec Maximum|
|**Storage Temperature Range**|-55°C to +125°C|



## **ENVIRONMENTAL & MECHANICAL SPECIFICATIONS** 

|**ESD Susceptibility**|MIL-STD-883, Method 3015, Class 2, HBM 2000V|
|---|---|
|**Flammability**|UL94-V0|
|**Mechanical Shock**|MIL-STD-883, Method 2002, Condition G, 30,000G|
|**Moisture Resistance**|MIL-STD-883, Method 1004|
|**Moisture Sensitivity Level**|J-STD-020, MSL 1|
|**Resistance to Soldering Heat**|MIL-STD-202, Method 210, Condition K|
|**Resistance to Solvents**|MIL-STD-202, Method 215|
|**Solderability**|MIL-STD-883, Method 2003 (Pads on Bottom of Package Only)|
|**Temperature Cycling**|MIL-STD-883, Method 1010, Condition B|
|**Thermal Shock**|MIL-STD-883, Method 1011, Condition B|
|**Vibration**|MIL-STD-883, Method 2007, Condition A, 20G|



~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision L 09/10/2014 |  Page 1 of 6**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## **EMK33H2H-32.768M** 

## **MECHANICAL DIMENSIONS (all dimensions in millimeters)** 

**==> picture [377 x 143] intentionally omitted <==**

**----- Start of picture text -----**<br>
0.85<br>2.50 ±0.15<br>±0.15 0.08 0.80 ±0.10 (x4)<br>MAX<br>2 3 R0.45<br>±0.10<br>3.20 2.10<br>0.90<br>±0.15 ±0.10<br>±0.10<br>1 (x4)<br>4<br>R0.35<br>L bi de<br>±0.10<br>0.90<br>±0.15<br>**----- End of picture text -----**<br>


**PIN CONNECTION** 1 Tri-State 2 Ground 3 Output 4 Supply Voltage **LINE MARKING** 1 **XXXX or XXXXX** _XXXX or XXXXX=Ecliptek Manufacturing Lot Code_ 

## **Suggested Solder Pad Layout** 

All Dimensions in Millimeters 

**==> picture [157 x 149] intentionally omitted <==**

**----- Start of picture text -----**<br>
tr 1.20 (X4) o<br>1.40 (X4)<br>0.80 Oa Solder Land<br>_  LW] (X4)<br>0.50 + L<br>**----- End of picture text -----**<br>


All Tolerances are ±0.1 

~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision L 09/10/2014 |  Page 2 of 6** aml)~~ **Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 

## PART NUMBER DATA SHEET **EMK33H2H-32.768M** 

## **OUTPUT WAVEFORM & TIMING DIAGRAM** 

**==> picture [459 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
VIH<br>VIL<br>VOH<br>80% of Waveform<br>OUTPUT DISABLE<br>50% of Waveform<br>(HIGH IMPEDANCE<br>STATE)<br>20% of Waveform<br>VOL<br>7wae! _<br>Fall T —_— Rise| — _— | —_— tPLZ — | —— tPZL<br>Time Time i TW<br>T<br>Duty Cycle (%) = TW/T x 100<br>TRI-STATE INPUT<br>CLOCK OUTPUT<br>**----- End of picture text -----**<br>


~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision L 09/10/2014 |  Page 3 of 6**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## **EMK33H2H-32.768M** 

## **Test Circuit for CMOS Output** 

**==> picture [438 x 174] intentionally omitted <==**

**----- Start of picture text -----**<br>
Frequency<br>Oscilloscope<br>Counter<br>Probe<br>Supply  (Note 2)<br>Voltage<br>+ Current _ (VDD) Output<br>Meter<br>+ +<br>Power Voltage 0.01µF 0.1µF CL<br>Supply Meter (Note 1) (Note 1) (Note 3)<br>Ground<br>_ _<br>Tri-State or<br>Power Down<br>**----- End of picture text -----**<br>


Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and High bandwidth (>300MHz) passive probe is recommended. 

Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet for ‘Load Drive Capability’. 

~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision L 09/10/2014 |  Page 4 of 6** Oe~~ **Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 

## PART NUMBER DATA SHEET **EMK33H2H-32.768M** 

## **Recommended Solder Reflow Methods** 

## **High Temperature Infrared/Convection** 

|**TS MAX to TL (Ramp-up Rate)**|3°C/Second Maximum|
|---|---|
|**Preheat**||
|**- Temperature Minimum (TS MIN)**|150°C|
|**- Temperature Typical (TS TYP)**|175°C|
|**- Temperature Maximum (TS MAX)**|200°C|
|**- Time(tS MIN)**|60 - 180 Seconds|
|**Ramp-up Rate(TL to TP)**|3°C/Second Maximum|
|**Time Maintained Above:**||
|**- Temperature (TL)**|217°C|
|**- Time(tL)**|60 - 150 Seconds|
|**Peak Temperature(TP)**|260°C Maximum for 10 Seconds Maximum|
|**Target Peak Temperature(TP Target)**|250°C +0/-5°C|
|**Time within 5°C of actualpeak(tp)**|20 - 40 Seconds|
|**Ramp-down Rate**|6°C/Second Maximum|
|**Time 25°C to Peak Temperature(t)**|8 Minutes Maximum|
|**Moisture Sensitivity Level**|Level 1|



~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision L 09/10/2014 |  Page 5 of 6**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## PART NUMBER DATA SHEET **EMK33H2H-32.768M** 

## **Recommended Solder Reflow Methods** 

## **Low Temperature Infrared/Convection 240°C** 

|**TS MAX to TL (Ramp-up Rate)**|5°C/Second Maximum|
|---|---|
|**Preheat**||
|**- Temperature Minimum (TS MIN)**|N/A|
|**- Temperature Typical (TS TYP)**|150°C|
|**- Temperature Maximum (TS MAX)**|N/A|
|**- Time(tS MIN)**|60 - 120 Seconds|
|**Ramp-up Rate(TL to TP)**|5°C/Second Maximum|
|**Time Maintained Above:**||
|**- Temperature (TL)**|150°C|
|**- Time(tL)**|200 Seconds Maximum|
|**Peak Temperature(TP)**|240°C Maximum|
|**Target Peak Temperature(TP Target)**|240°C Maximum 2 Times / 230°C Maximum 1 Time|
|**Time within 5°C of actualpeak(tp)**|10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time|
|**Ramp-down Rate**|5°C/Second Maximum|
|**Time 25°C to Peak Temperature(t)**|N/A|
|**Moisture Sensitivity Level**|Level 1|



## **Low Temperature Manual Soldering** 

185°C Maximum for 10 Seconds Maximum, 2 times Maximum. 

## **High Temperature Manual Soldering** 

260°C Maximum for 5 Seconds Maximum, 2 times Maximum. 

~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision L 09/10/2014 |  Page 6 of 6**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200