EMI8141MUTAG

## EMI8141, EMI8142, EMI8143 

## Common Mode Filter with ESD Protection 

## **Functional Description** 

The EMI814x is a family of Common Mode Filters (CMF) with integrated ESD protection, a first in the industry. Differential signaling I/Os can now have both common mode filtering and ESD protection in one package. The EMI814x protects against ESD pulses up to ±15 kV contact per the IEC61000−4−2 standard. 

The EMI814x is well−suited for protecting systems using high−speed differential ports such as USB 3.0, MIPI D−PHY; corresponding ports in removable storage, and other applications where ESD protection are required in a small footprint package. 

The EMI814x is available in a RoHS−compliant, XDFN6 for 1 Differential Pair, XDFN−10 for 2 Differential Pair and XDFN−16 package for 3 Differential Pair. 

## **Features** 

## **http://onsemi.com** 

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XDFN6 XDFN10 XDFN16<br>CASE 711AV CASE 711AU CASE 711AW<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAMS** 

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4A M 42 M 43 M<br>1 1 1<br>XX = Specific Device Code<br>M = Date Code<br>a = Pb−Free Package<br>**----- End of picture text -----**<br>


- Total Insertion Loss DMLOSS < 2.5 dB at 2.5 GHz 

- Large Differential Mode Cutoff Frequency f3dB > 5 GHz 

## **ELECTRICAL SCHEMATICS** 

- High Common Mode Stop Band Attenuation: 

   - 10 dB at 500 MHz , 15 dB at 700 MHz Low Channel Resistance 6.0 Q 

- Low Channel Resistance 6.0 

- Provides ESD Protection to IEC61000−4−2 Level 4, ±15 kV Contact 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **Applications** 

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EMI8142<br>**----- End of picture text -----**<br>


- USB 3.0 

- MHL 2.0 

- SD Card 

- eSATA 

- HDMI/DVI Display in Mobile Phones 

- MIPI D−PHY (CSI−2, DSI, etc) in Mobile Phones and Digital Still Cameras 

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EMI8143<br>**----- End of picture text -----**<br>


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ORDERING INFORMATION<br>**----- End of picture text -----**<br>


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Figure 1. EMI8141 Electrical Schematic<br>:<br>**----- End of picture text -----**<br>


|~~—~~|||
|---|---|---|
|**Device**<br>**Package**<br>~~—~~|**Package**|**Shipping**†|
|EMI8141MUTAG<br>XDFN6<br>~~—~~|XDFN6|3000 / Tape & Reel|
|EMI8142MUTAG<br>XDFN10<br>~~—~~|XDFN10|3000 / Tape & Reel|
|EMI8143MUTAG<br>XDFN16<br>~~—~~|XDFN16|3000 / Tape & Reel|



Publication Order Number: **EMI8141/D** 

**1** 

© Semiconductor Components Industries, LLC, 2014 **June, 2014 − Rev. 0** 

**EMI8141, EMI8142, EMI8143** 

## **PIN FUNCTION DESCRIPTION** 

|**Pin Name**||**Device Pin**||**Type**|**Description**|
|---|---|---|---|---|---|
||**EMI8141**|**EMI8142**|**EMI8143**|||
|In_1+|1|1|1|I/O|CMF Channel 1+ to Connector (External)|
|In_1−|2|2|2|I/O|CMF Channel 1− to Connector (External)|
|Out_1+|6|10|16|I/O|CMF Channel 1+ to ASIC (Internal)|
|Out_1−|5|9|15|I/O|CMF Channel 1− to ASIC (Internal)|
|In_2+|NA|4|4|I/O|CMF Channel 2+ to Connector (External)|
|In_2−|NA|5|5|I/O|CMF Channel 2− to Connector (External)|
|Out_2+|NA|7|13|I/O|CMF Channel 2+ to ASIC (Internal)|
|Out_2−|NA|6|12|I/O|CMF Channel 2− to ASIC (Internal)|
|In_3+|NA|NA|7|I/O|CMF Channel 3+ to Connector (External)|
|In_3−|NA|NA|8|I/O|CMF Channel 3− to Connector (External)|
|Out_3+|NA|NA|10|I/O|CMF Channel 3+ to ASIC (Internal)|
|Out_3−|NA|NA|9|I/O|CMF Channel 3− to ASIC (Internal)|
|VN|3,4|3, 8|3,6,14,11|GND|Ground|



## **ABSOLUTE MAXIMUM RATINGS** (TA = 25 ° C unless otherwise noted) 

|**ABSOLUTE MAXIMUM RATINGS**(TA= 25°C unless otherwise noted)||||
|---|---|---|---|
|**Parameter**|**Symbol**|**Value**|**Unit**|
|Operating Temperature Range|TOP|−40 to +85|°C|
|Storage Temperature Range|TSTG|−65 to +150|°C|
|Maximum Lead Temperature for Soldering Purposes<br>(1/8” from Case for 10 seconds)|TL|260|°C|
|DC Current per Line|ILINE|100|mA|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

**http://onsemi.com** 

**2** 

**EMI8141, EMI8142, EMI8143** 

**ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTR**|**ICAL CHARACTERISTICS**(TA= 25°C unless otherwise n|oted)|||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|VRWM|Reverse Working Voltage|(Note 3)||3.3||V|
|VBR|Breakdown Voltage|IT= 1 mA; (Note 4)|4.0||9.0|V|
|ILEAK|Channel Leakage Current|TA= 25°C, VIN= 3.3 V,GND = 0 V|||1.0|�A|
|RCH|Channel Resistance<br>(Pins 1−6, 2−5) − EMI8141<br>(Pins 1−10, 2−9, 4−7 and 5−6) − EMI8142<br>(Pins 1−16, 2−15, 4−13, 5−12, 7−10 and 8−9) − EMI8143|||6.0||�|
|DMLOSS|Differential Mode Insertion Loss|@ 2.5 GHz||2.5||dB|
|f3dB|Differential Mode Cut-off Frequency|50�Source and Load<br>Termination||5.0||GHz|
|Fatten|Common Mode Stop Band Attenuation|@ 700 MHz||15||dB|
|VESD|In-system ESD Withstand Voltage<br>a) Contact discharge per IEC 61000-4-2 standard, Level 4<br>**(External Pins)**<br>b) Contact discharge per IEC 61000-4-2 standard, Level 1<br>**(Internal Pins)**|(Notes 1 and 2)|±15<br>±2|||kV|
|VCL|TLP Clamping Voltage|Forward IPP= 8 A<br>Forward IPP= 16 A<br>Forward IPP= −8 A<br>Forward IPP= −16 A||7.26<br>11.8<br>−3.5<br>−6.7||V|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

1. Standard IEC61000−4−2 with CDischarge = 150 pF, RDischarge = 330, GND grounded. 

2. These measurements performed with no external capacitor . 

3. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the DC or continuous peak operating voltage level. 

4. VBR is measured at pulse test current IT . 

**http://onsemi.com** 

**3** 

**EMI8141, EMI8142, EMI8143** 

## **TYPICAL CHARACTERISTICS** 

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0 0<br>−1 m1 −5<br>−2 −10<br>−3 −15<br>−4 −20<br>−5 −25<br>−6 −30<br>−7 −35<br>−8 −40<br>−9 −45<br>−10 −50<br>1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10<br>FREQUENCY (Hz) FREQUENCY (Hz)<br>Figure 2. Typical Differential Mode Attenuation Figure 3. Typical Common Mode Attenuation<br>vs. Frequency vs. Frequency<br>Interface Data Rate (Gb/s) Fundamental Frequency (GHz) ESD814x Insertion Loss (dB)<br>USB 3.0 5 2.5 (m1) m1 = 2.13<br>dB (SDD21) dB (SCC21)<br>**----- End of picture text -----**<br>


**http://onsemi.com** 

**4** 

**EMI8141, EMI8142, EMI8143** 

## **TRANSMISSION LINE PULSE (TLP) MEASUREMENTS** 

Transmission Line Pulse (TLP) provides current versus voltage (I−V) curves in which each data point is obtained from a 100 ns long rectangular pulse from a charged transmission line. A simplified schematic of a typical TLP system is shown in Figure 4. TLP I−V curves of ESD protection devices accurately demonstrate the product’s ESD capability because the 10 s of amps current levels and under 100 ns time scale match those of an ESD event. This is illustrated in Figure 5 where an 8 kV IEC61000−4−2 current waveform is compared with TLP current pulses at 8 A and 16 A. A TLP curve shows the voltage at which the device turns on as well as how well the device clamps voltage over a range of current levels. Typical TLP I−V curves for the EMI814x are shown in Figure 4. 

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Attenuator<br>—— —— L —| SW 50  Coax Cable Q<br>÷<br>50  Coax Cable<br>IM VM<br>10 MQ<br>VC DUT<br>Oscilloscope<br>**----- End of picture text -----**<br>


**Figure 4. Simplified Schematic of a Typical TLP System** 

**Figure 5. Comparison Between 8 kV IEC6100 0- 4 - 2 and 8 A and 16 A TLP Waveforms** 

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18 −18<br>16 PF | | | rT rT −16 PF | | Eg |<br>14 | | | | | fg] | ld −14 | | | ft | | ft<br>12 PF | | | cP rT −12 P| TA | | et<br>10 PF | | | cee | ct −10 | | Yt | | ft ft<br>8 FP | | | vt −8 | | f | | | tt<br>6 | | | fT sf | −6 | tft | | | | lel<br>4 | | | [Al | | | ld −4 | if) | | | TT<br>2 | | | Yt | | | ff −2 | yy] | | | rT rT<br>0 ee ae 0 FA, | | | vT | TT<br>0 2 4 6 8 10 12 14 16 18 0 −2 −4 −6 −8 −10 −12 −14 −16 −18<br>Vclamp (V) Vclamp (V)<br>I (A) I (A)<br>**----- End of picture text -----**<br>


**Figure 6. Positive and Negative TLP Waveforms** 

**http://onsemi.com** 

**5** 

**EMI8141, EMI8142, EMI8143** 

Pattern Generator (5 Gbps, PRBS31 Pattern) 50 GHz Sampling Oscilloscope ONsemi high speed test board (Rogers 4003 Material, Southwest Microwave 2.4mm Connectors) ~~a~~ **Figure 7. Eye Diagram Test Setup for 5Gbps Data Rate** 5ag <at>» +] **Figure 8. Eye Diagram 5Gbps with and without EMI814x** 

||**Eye Height (mVppd)**|**Rise Time (ps)**|**Fall Time (ps)**|**Jrms (ps)**|**Jpp (ps)**|
|---|---|---|---|---|---|
|Reference (No Device)-Left Figure|724|30.4|29.6|1.997|9.6|
|EMI814x Right Figure|405|60|60.8|3.484|16|



**http://onsemi.com** 

**6** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

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XDFN10 2.2x1.35, 0.4P<br>CASE 711AU<br>ISSUE B<br>**----- End of picture text -----**<br>


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SCALE 4:1<br>**----- End of picture text -----**<br>


DATE 17 JUN 2014 

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NOTES:<br>D A B L L 1. DIMENSIONING AND TOLERANCING PER<br>ASME Y14.5M, 1994.<br>Ho o ps 2. CONTROLLING DIMENSION: MILLIMETERS.<br>REFERENCEPIN ONE L1 3. TERMINAL AND IS MEASURED BETWEENDIMENSIONS b APPLIES TO PLATED<br>ÇÇÇ E 0.15 AND 0.30 MM FROM THE TERMINAL TIP.<br>2X 0.10 C<br>at ÇÇÇ t ‘ o f DETAIL AALTERNATE uf DIM MILLIMETERSMIN MAX<br>2X 0.10 C CONSTRUCTIONS A 0.40 0.50<br>TOP VIEW A1 0.00 0.05<br>A3 0.15 REF<br>b 0.15 0.25<br>DETAIL B A EXPOSED Cu MOLD CMPD D 2.20 BSC<br>0.10 C (A3) ÉÉÉ E 1.35 BSC<br>e 0.40 BSC<br>OS ÉÉÉÇÇÇ L 0.40 0.60<br>on = L1 --- 0.15<br>0.08 C DETAIL B<br>SIDE VIEW ey A1 C SEATINGPLANE CONSTRUCTIONALTERNATE MARKING DIAGRAM*GENERIC<br>e DETAIL A XX M<br>1 5<br>8X L<br>XX = Specific Device Code<br>M = Date Code<br>10 6 = Pb−Free Package<br>10X b *This information is generic. Please refer to<br>0.10 M C A B device data sheet for actual part marking.<br>0.05 M C NOTE 3 Pb−Free indicator, “G” or microdot “ ”,<br>BOTTOM VIEW may or may not be present.<br>one | ,<br>**----- End of picture text -----**<br>


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XX = Specific Device Code<br>M = Date Code<br>= Pb−Free Package<br>*This information is generic. Please refer to<br>device data sheet for actual part marking.<br>Pb−Free indicator, “G” or microdot “ ”,<br>may or may not be present.<br>| ,<br>RECOMMENDED<br>MOUNTING FOOTPRINT<br>9X<br>8X 0.25 PACKAGEOUTLINE<br>0.65<br>1.55<br>1<br>0.50 0.40 PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98AON83517F** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: XDFN10 2.2X1.35, 0.4P PAGE 1 OF 1** ~~——~~ ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

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XDFN6 1.40x1.35, 0.4P<br>CASE 711AV<br>ISSUE A<br>**----- End of picture text -----**<br>


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SCALE 4:1<br>DATE 04 JUN 2014<br>D A B L L NOTES:1. DIMENSIONING AND TOLERANCING PER<br>ASME Y14.5M, 1994.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>PIN 1<br>REFERENCE or} E 3. TERMINAL AND IS MEASURED BETWEENDIMENSIONS b APPLIES TO PLATED<br>2X 0.10 C ÇÇÇ L1 0.15 AND 0.30 MM FROM TERMINAL TIP.<br>ÇÇÇ DETAIL A DIM MILLIMETERSMIN MAX<br>ALTERNATE TERMINAL<br>2X 0.10 C CONSTRUCTIONS A 0.40 0.50<br>A1 0.00 0.05<br>TOP VIEW A3 0.15 REF<br>b 0.15 0.25<br>0.10 C DETAIL B A (A3) EXPOSED Cu ÉÉ MOLD CMPD DEe 1.40 BSC1.35 BSC0.40 BSC<br>6X _sorts r f ¢ A1 SS DETAIL B ÉÉÇÇ = L1L 0.40--- 0.150.60<br>0.08 C SIDE VIEW C SEATINGPLANE CONSTRUCTIONALTERNATE MARKING DIAGRAM*GENERIC<br>XXM<br>e 6X L<br>1 3<br>DETAIL A r f XX = Specific Device Code<br>M = Date Code<br>6 —> | |~— 4 6X b | = Pb−Free Package<br>(Note: Microdot may be in either location)<br>0.10 M C A B<br>BOTTOM VIEW 0.05 M C NOTE 3 *This information is generic. Please refer to<br>**----- End of picture text -----**<br>


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DATE 04 JUN 2014<br>**----- End of picture text -----**<br>


*This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present. 

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RECOMMENDED<br>MOUNTING FOOTPRINT<br>0.40 6X<br>PITCH an 0.65<br>ano 1.55<br>+<br>1<br>LIMO:<br>0.50 5X<br>4a 0.25 4<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


|**DOCUMENT NUMBER:**|**98AON83554F**|
|---|---|
|**DESCRIPTION:**|**XDFN6 1.40X1.35, 0.4P**|



Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

**PAGE 1 OF 1** 

ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

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XDFN16 3.5x1.35, 0.4P<br>16 CASE 711AW<br>ISSUE A<br>zy<br>1 DATE 17 JUN 2014<br>SCALE 4:1<br>D A L L NOTES:<br>2X B 1. DIMENSIONING AND TOLERANCING PERASME Y14.5M, 1994.<br>0.10 C "To L1 a n f uf 2.3. CONTROLLING DIMENSION: MILLIMETERS.DIMENSION b APPLIES TO PLATED TERMINAL<br>REFERENCEPIN ONE ÉÉÉÉ E ALTERNATE TERMINALDETAIL A AND IS MEASURED BETWEEN 0.15 AND0.30 mm FROM THE TERMINAL TIP.<br>CONSTRUCTIONS MILLIMETERS<br>Se 2X ÉÉÉÉ t DIM MIN MAX<br>A 0.40 0.50<br>0.10 C TOP VIEW A1 0.00 0.05<br>EXPOSED Cu MOLD CMPD A3 0.15 REF<br>DETAIL B (A3) A ÉÉÉ Db 0.153.50 BSC0.25<br>0.10 C ÉÉÉÇÇÇ E 1.35 BSC<br>e 0.40 BSC<br>DETAIL B L 0.40 0.60<br>16X - 0.08 C ALTERNATE = L1 −−− 0.15<br>CONSTRUCTION<br>cote NOTE 4 SIDE VIEW A1 ty C [SEATING] PLANE =<br>GENERIC<br>MARKING DIAGRAM*<br>DETAIL A e/2<br>e 12X L XXXM<br>1 8<br>\ Fo<br>1<br>XXX = Specific Device Code<br>16 9 16X b M = Month Code<br>alaalo g!<br>= Pb−Free Package<br>0.10 C A B<br>BOTTOM VIEW 0.05 C NOTE 3 *This information is generic. Please refer todevice data sheet for actual part marking.<br>Pb−Free indicator, “G” or microdot “ ”,<br>RECOMMENDED may or may not be present.<br>SOLDERING FOOTPRINT*<br>**----- End of picture text -----**<br>


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0.40 12X<br>PITCH 0.65<br>1.55<br>1<br>0.55 15X<br>0.25<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98AON83555F** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: XDFN16 3.5X1.35, 0.4P PAGE 1 OF 1** ~~_ 1~~ ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

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**1**