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EMI8041BMUTAG
INTEGRATED PASSIVE
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- Manufacturer: ONSEMI
- Product type: Integrated Passive Filters
- SVHC: No SVHC (25-Jun-2025)
- Product Range: -
| Delivery and price | |
|---|---|
| Units per pack | 3000 |
| Price | 0.173 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
**Share Feedback DATA SHEET** Your Opinion Matters **www.onsemi.com** ## Common Mode Filter with ESD Protection ## **> 900 MHz Common Mode Stop Band Attenuation for HDMI Interfaces** ## EMI804x Series ## **Functional Description** The EMI804x is a family of Common Mode Filters (CMF) with integrated ESD protection, a first in the industry. Differential signaling I/Os can now have both common mode filtering and ESD protection in one package. The EMI804x protects against ESD pulses up to 15 kV contact per the IEC61000-4-2 standard. The EMI804x is well-suited for protecting systems using high-speed differential ports such as USB 3.0, HDMI 1.3/1.4/2.0; corresponding ports in removable storage and other applications. The EMI804x is available in a RoHS-compliant, XDFN6 for one Differential Pair, XDFN10 for two Differential Pair and XDFN16 package for three Differential Pair. **==> picture [177 x 73] intentionally omitted <==** **----- Start of picture text -----**<br> XDFN6 XDFN10 XDFN16<br>CASE 711AY CASE 711AX CASE 711AZ<br>1<br>UDFN6<br>CASE 517DG<br>**----- End of picture text -----**<br> ## **MARKING DIAGRAMS** **==> picture [167 x 77] intentionally omitted <==** **----- Start of picture text -----**<br> XX M W2 M W3 M<br>1 1 1<br>XX = Specific Device Code<br>XXXM M = Date Code<br>= Pb-Free Package<br>1<br>**----- End of picture text -----**<br> ## **ELECTRICAL SCHEMATICS** ## **Features** - Total Insertion Loss DMLOSS < 2.5 dB at 2.5 GHz - Large Differential Mode Cutoff Frequency f3dB > 5 GHz - High Common Mode Stop Band Attenuation: 15 dB at 700 MHz, 30 dB at 2.4 GHz - Low Channel Resistance 6.0 - Provides ESD Protection to IEC61000-4-2 Level 4, 15 kV Contact **==> picture [33 x 7] intentionally omitted <==** **----- Start of picture text -----**<br> EMI8042<br>**----- End of picture text -----**<br> - SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable - These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant ## **Applications** - USB 3.0 - HDMI 1.3/1.4/2.0 - MHL 2.0 **==> picture [33 x 7] intentionally omitted <==** **----- Start of picture text -----**<br> EMI8043<br>**----- End of picture text -----**<br> - ESATA - Automotive Cameras ## **ORDERING INFORMATION** See detailed ordering and shipping information on page 7 of this data sheet. NOTE: Some of the devices on this data sheet have been **DISCONTINUED** . Please refer to the table on page 7. **Figure 1. EMI8041 Electrical Schematic** Publication Order Number: **EMI8041/D** **1** Semiconductor Components Industries, LLC, 2015 **June, 2025 − Rev. 1** **EMI804x Series** ## **PIN FUNCTION DESCRIPTION** |**Pin Name**|**Device Pin**|**Device Pin**|**Device Pin**|**Type**|**Description**| |---|---|---|---|---|---| ||**EMI8041**|**EMI8042**|**EMI8043**||| |In_1+|1|1|1|I/O|CMF Channel 1+ to Connector (External)| |In_1−|2|2|2|I/O|CMF Channel 1− to Connector (External)| |Out_1+|6|10|16|I/O|CMF Channel 1+ to ASIC (Internal)| |Out_1−|5|9|15|I/O|CMF Channel 1− to ASIC (Internal)| |In_2+|NA|4|4|I/O|CMF Channel 2+ to Connector (External)| |In_2−|NA|5|5|I/O|CMF Channel 2− to Connector (External)| |Out_2+|NA|7|13|I/O|CMF Channel 2+ to ASIC (Internal)| |Out_2−|NA|6|12|I/O|CMF Channel 2− to ASIC (Internal)| |In_3+|NA|NA|7|I/O|CMF Channel 3+ to Connector (External)| |In_3−|NA|NA|8|I/O|CMF Channel 3− to Connector (External)| |Out_3+<br>~~BE~~|NA|NA|10|I/O|CMF Channel 3+ to ASIC (Internal)| |Out_3−<br>~~BE~~|NA|NA|9|I/O|CMF Channel 3− to ASIC (Internal)| |VN<br>~~BE~~|3,4|3, 8|3,6,14,11|GND|Ground| ## **ABSOLUTE MAXIMUM RATINGS** (TA = 25 C unless otherwise noted) |**ABSOLUTE MAXIMUM RATINGS**(TA = 25 C unless otherwise noted)A = 25 C unless otherwise noted)= 25 C unless otherwise noted)C unless otherwise noted)C unless otherwise noted)|||| |---|---|---|---| |**Parameter**|**Symbol**|**Value**|**Unit**| |Operating Temperature Range|TOP|−40 to +85|C| |Storage Temperature Range|TSTG|−65 to +150|C| |Maximum Lead Temperature for Soldering Purposes<br>(1/8” from Case for 10 seconds)|TL|260|C| |DC Current per Line|ILINE|100|mA| Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. **www.onsemi.com** **Share Feedback** Your Opinion Matters **2** **EMI804x Series** ## **ELECTRICAL CHARACTERISTICS** (TA = 25 C unless otherwise noted) |**ELECTRICAL CHARACTERISTICS**<br>~~eS~~|**ELECTRICAL CHARACTERISTICS**(TA = 25 C unless otherwise noted)A = 25 C unless otherwise noted)= 25 C unless otherwise noted)C unless otherwise noted)C unless otherwise noted)<br>|(TA = 25 C unless otherwise noted)A = 25 C unless otherwise noted)= 25 C unless otherwise noted)C unless otherwise noted)C unless otherwise noted)<br>||||| |---|---|---|---|---|---|---| |**Symbol**<br>~~eS~~|**Parameter**<br>|**Test Conditions**<br>|**Min**<br>|**Typ**<br>|**Max**<br>|**Unit**<br>| |VRWM<br>~~eSa~~|Reverse Working Voltage<br>~~a~~|(Note 3)<br>~~a~~|~~a~~|3.3<br>~~a~~|~~a~~|V<br>~~a~~| |VBR<br>~~a~~|Breakdown Voltage<br>~~a~~|IT= 1 mA; (Note 4)<br>~~a~~|4.0<br>~~a~~|~~a~~|9.0<br>~~a~~|V<br>~~a~~| |ILEAK<br>~~a~~|Channel Leakage Current<br>~~a~~<br>~~ee~~|TA= 25C, VIN= 3.3 V,<br>GND = 0 V<br>~~a~~<br>~~ee~~|~~a~~<br>~~ee~~|~~a~~<br>~~ee~~|1.0<br>~~a~~<br>~~ee~~|A<br>~~a~~<br>~~ee~~| |RCH|Channel Resistance<br>(Pins 1−6, 2−5) − EMI8041<br>(Pins 1−10, 2−9, 4−7 and 5−6) − EMI8042<br>(Pins 1−16, 2−15, 4−13, 5−12, 7−10 and 8−9) − EMI8043|||6.0||| |DMLOSS<br>~~a~~|Differential Mode Insertion Loss<br>~~a~~|@ 2.5 GHz<br>~~a~~|~~a~~|2.5<br>~~a~~|~~a~~|dB<br>~~a~~| |f3dB<br>~~a~~|Differential Mode Cut-off Frequency<br>~~a~~<br>~~ee~~|50 Source and Load<br>Termination<br>~~a~~<br>~~ee~~|~~a~~<br>~~ee~~|5.0<br>~~a~~<br>~~ee~~|~~a~~<br>~~ee~~|GHz<br>~~a~~<br>~~ee~~| |Fatten|Common Mode Stop Band Attenuation|@ 700 MHz||15||dB| |VESD|In‐system ESD Withstand Voltage<br>a) Contact discharge per IEC 61000‐4‐2 standard, Level<br>4**(External Pins)**<br>b) Contact discharge per IEC 61000‐4‐2 standard, Level<br>1**(Internal Pins)**|(Notes 1 and 2)|15<br>2|||kV| |VCL|TLP Clamping Voltage|Forward IPP= 8 A<br>Forward IPP= 16 A<br>Forward IPP= −8 A<br>Forward IPP= −16 A||7.26<br>11.8<br>−3.5<br>−6.7||V| Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Standard IEC61000-4-2 with CDischarge = 150 pF, RDischarge = 330, GND grounded. 2. These measurements performed with no external capacitor. 3. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal to or greater than the DC or continuous peak operating voltage level. 4. VBR is measured at pulse test current IT. **www.onsemi.com** **Share Feedback** Your Opinion Matters **3** **EMI804x Series** ## **TYPICAL CHARACTERISTICS** **==> picture [490 x 173] intentionally omitted <==** **----- Start of picture text -----**<br> 0 0<br>m1<br>−1 −5<br>eee teers 8 || | PT TTI TTT TAI TT<br>m2<br>−2 TAIT PETTITT TTTTTTIN m3 TT −10 PTI<br>−3−4 |TI TTT ETT ETN −15−20 |TITTITTI INTEETN EENTT<br>−5 TTI TEENIE PETTITT PTT −25 LAI<br>−6 | −30 P|PETIT ETN, PTE<br>−7 | −35 |<br>−8 a | −40 |<br>−9 a | −45 |<br>−10 −50<br>| LUTTE TTT TCI PL |<br>1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10<br>FREQUENCY (Hz) FREQUENCY (Hz)<br>dB (SDD21) dB (SCC21)<br>**----- End of picture text -----**<br> **Figure 2. Typical Differential Mode Attenuation vs. Frequency** **Figure 3. Typical Common Mode Attenuation vs. Frequency** |**Interface**|**Data Rate (Gb/s)**|**Fundamental Frequency (GHz)**|**EMI804x Insertion Loss (dB)**| |---|---|---|---| |HDMI 1.3/1.4|3.4|1.7 (m1)<br>2.5 (m2)<br>3.0 (m3)|m1 = 1.65<br>m2 = 2.13<br>m3 = 2.41| |USB 3.0|5.0||| |HDMI 2.0|6.0||| **www.onsemi.com** ~~—~~ **www.onsemi.com** **Share Feedback** Your Opinion Matters **4** **EMI804x Series** ## **TRANSMISSION LINE PULSE (TLP) MEASUREMENTS** Transmission Line Pulse (TLP) provides current versus voltage (I-V) curves in which each data point is obtained from a 100 ns long rectangular pulse from a charged transmission line. A simplified schematic of a typical TLP system is shown in Figure 4. TLP I-V curves of ESD protection devices accurately demonstrate the product’s ESD capability because the 10 s of amps current levels and under 100 ns time scale match those of an ESD event. This is illustrated in Figure 5 where an 8 kV IEC61000-4-2 current waveform is compared with TLP current pulses at 8 A and 16 A. A TLP curve shows the voltage at which the device turns on as well as how well the device clamps voltage over a range of current levels. Typical TLP I-V curves for the EMI804x are shown in Figure 4. **==> picture [232 x 102] intentionally omitted <==** **----- Start of picture text -----**<br> Attenuator<br>—— L — —| SW 50 Coax Cable Q<br><br>50 Coax Cable<br>IM VM<br>10 MQ<br>VC DUT<br>Oscilloscope<br>**----- End of picture text -----**<br> **Figure 4. Simplified Schematic of a Typical TLP System** **Figure 5. Comparison Between 8 kV IEC6100 0‐ 4 ‐ 2 and 8 A and 16 A TLP Waveforms** **==> picture [486 x 171] intentionally omitted <==** **----- Start of picture text -----**<br> 18 −18<br>16 | | | | | | oe −16 ee eee<br>14 | | | | | lg] | ld −14 P| | ff} |ty<br>12 | | | | | lr | Td −12 eee<br>10 | | | | te | Tt −10 | | yi | | | Tllt<br>8 −8<br>6 pf −6 pp<br>4 | | | TAL | | ff −4 | if} | | | | ff<br>2 | | | Yt | | | ff −2 | fy | | | | | dT dt<br>0 0<br>| | Tg tT | | Tl PA, Tt | tT | TT<br>0 2 4 6 8 10 12 14 16 18 0 −2 −4 −6 −8 −10 −12 −14 −16 −18<br>Vclamp (V) Vclamp (V)<br>I (A) I (A)<br>**----- End of picture text -----**<br> **Figure 6. Positive and Negative TLP Waveforms** **www.onsemi.com** **Share Feedback** Your Opinion Matters **5** **EMI804x Series** **==> picture [123 x 23] intentionally omitted <==** **----- Start of picture text -----**<br> Pattern Generator<br>(5 Gbps, PRBS31 Pattern)<br>**----- End of picture text -----**<br> **==> picture [313 x 51] intentionally omitted <==** **----- Start of picture text -----**<br> 50 GHz Sampling Oscilloscope<br>ONsemi high speed test board<br>(Rogers 4003 Material, Southwest<br>Microwave 2.4mm Connectors)<br>**----- End of picture text -----**<br> **Figure 7. Eye Diagram Test Setup for 5Gbps Data Rate** **Figure 8. Eye Diagram 5Gbps with and without EMI804x** ||**Eye Height (mVppd)**|**Rise Time (ps)**|**Fall Time (ps)**|**Jrms (ps)**|**Jpp (ps)**| |---|---|---|---|---|---| |Reference (No Device)-Left Figure|724|30.4|29.6|1.997|9.6| |EMI804x Right Figure|405|60|60.8|3.484|16| **www.onsemi.com** **Share Feedback** Your Opinion Matters **6** **EMI804x Series** ## **ORDERING INFORMATION** |**ORDERING INFORMATION**|||| |---|---|---|---| |**Orderable Part Number**|**Marking**|**Package**|**Shipping**†| |EMI8041MUTAG|WA|XDFN6<br>(Pb-Free)|3000 / Tape & Reel| |EMI8042MUTAG|W2|XDFN10<br>(Pb-Free)|3000 / Tape & Reel| |EMI8043MUTAG|W3|XDFN16<br>(Pb-Free)|3000 / Tape & Reel| |EMI8041BMUTAG|MA|UDFN6<br>(Pb-Free)|3000 / Tape & Reel| |**DISCONTINUED**(Note 5)|||| |SZEMI8041MUTAG*|WA|XDFN6<br>(Pb-Free)|3000 / Tape & Reel| |SZEMI8042MUTAG*|W2|XDFN10<br>(Pb-Free)|3000 / Tape & Reel| |SZEMI8043MUTAG*|W3|XDFN16<br>(Pb-Free)|3000 / Tape & Reel| † For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. * SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable. 5. **DISCONTINUED:** These devices are not available. Please contact your **onsemi** representative for information. The most current information on these devices may be available on www.onsemi.com. **www.onsemi.com** **Share Feedback** Your Opinion Matters **7** **EMI804x Series** ## **REVISION HISTORY** |**Revision**|**Description of Changes**|**Date**| |---|---|---| |1|Rebranded the Data Sheet to**onsemi**format.<br>SZEMI8041MUTAG, SZEMI8042MUTAG, SZEMI8043MUTAG OPNs Marked as Discontinued.|06/30/2025| This document has undergone updates prior to the inclusion of this revision history table. The changes tracked here only reflect updates made on the noted approval dates. **www.onsemi.com** **Share Feedback** Your Opinion Matters **8** # MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** **==> picture [484 x 39] intentionally omitted <==** **----- Start of picture text -----**<br> UDFN6 1.6x1.35, 0.5P<br>CASE 517DG<br>1 ISSUE O<br>SCALE 4:1 DATE 21 SEP 2015<br>**----- End of picture text -----**<br> **==> picture [237 x 281] intentionally omitted <==** **----- Start of picture text -----**<br> D A B<br>PIN ONE<br>REFERENCE<br>E<br>ÉÉ<br>2X 0.10 C ÉÉ<br>2X 0.10 C<br>TOP VIEW<br>A<br>0.10 C<br>A1<br>DETAIL A<br>6X 0.08 C<br>SIDE VIEW C [SEATING] PLANE<br>DETAIL A<br>1 3<br>3X L2<br>3X L<br>6 4<br>6X b<br>e 0.10 C A B<br>0.05 C NOTE 3<br>BOTTOM VIEW<br>RECOMMENDED<br>MOUNTING FOOTPRINT<br>**----- End of picture text -----**<br> # NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND **==> picture [101 x 5] intentionally omitted <==** **----- Start of picture text -----**<br> 0.30 mm FROM THE TERMINAL TIP.<br>**----- End of picture text -----**<br> **==> picture [59 x 76] intentionally omitted <==** **----- Start of picture text -----**<br> MILLIMETERS<br>DIM MIN MAX<br>A 0.45 0.55<br>A1 0.00 0.05<br>b 0.15 0.25<br>D 1.60 BSC<br>E 1.35 BSC<br>e 0.50 BSC<br>L 0.35 0.55<br>L2 0.65 0.85<br>**----- End of picture text -----**<br> **==> picture [102 x 92] intentionally omitted <==** **----- Start of picture text -----**<br> GENERIC<br>MARKING DIAGRAM*<br>XXXM �<br>�<br>1<br>XXX = Specific Device Code<br>M = Date Code<br>� = Pb−Free Package<br>**----- End of picture text -----**<br> (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ � ”, may or may not be present. **==> picture [125 x 100] intentionally omitted <==** **----- Start of picture text -----**<br> 0.50 3X<br>PITCH 0.86<br>1.55<br>3X 1 6X<br>0.32<br>0.56<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br> - *For additional information on our Pb−Free strategy and soldering details, please download the **onsemi** Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. **==> picture [492 x 37] intentionally omitted <==** **----- Start of picture text -----**<br> Electronic versions are uncontrolled except when accessed directly from the Document Repository.<br>DOCUMENT NUMBER: 98AON05041G Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.<br>DESCRIPTION: UDFN6, 1.6X1.35, 0.5P PAGE 1 OF 1<br>**----- End of picture text -----**<br> **onsemi** and are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. www.onsemi.com © Semiconductor Components Industries, LLC, 2015 # MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS XDFN10 2.50x1.35, 0.5P** CASE 711AX ISSUE A **SCALE 4:1** DATE 12 APR 2016 - NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. **==> picture [481 x 267] intentionally omitted <==** **----- Start of picture text -----**<br> NOTES:<br>D A B L L 1. DIMENSIONING AND TOLERANCING PER<br>ASME Y14.5M, 1994.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>REFERENCEPIN ONE L1 3. TERMINAL AND IS MEASURED BETWEENDIMENSIONS b APPLIES TO PLATED<br>E 0.15 AND 0.30 MM FROM THE TERMINAL TIP.<br>ÇÇÇ<br>2X 0.10 C<br>DETAIL A MILLIMETERS<br>ÇÇÇ ALTERNATE DIM MIN MAX<br>CONSTRUCTIONS A 0.40 0.50<br>2X 0.10 C<br>TOP VIEW A1 0.00 0.05<br>A3 0.15 REF<br>b 0.15 0.25<br>DETAIL B A EXPOSED Cu MOLD CMPD D 2.50 BSC<br>0.10 C (A3) ÉÉÉ E 1.35 BSC<br>e 0.50 BSC<br>L 0.40 0.60<br>ÉÉÉÇÇÇ L1 --- 0.15<br>0.08 C DETAIL B<br>SIDE VIEW A1 C SEATINGPLANE CONSTRUCTIONALTERNATE MARKING DIAGRAM*GENERIC<br>e DETAIL A XX M<br>1 5 �<br>10X L<br>XX = Specific Device Code<br>M = Date Code<br>10 6 � = Pb−Free Package<br>10X b *This information is generic. Please refer to<br>0.10 M C A B device data sheet for actual part marking.<br>0.05 M C NOTE 3 Pb−Free indicator, “G” or microdot “ � ”,<br>BOTTOM VIEW<br>**----- End of picture text -----**<br> *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ � ”, may or may not be present. ## **RECOMMENDED MOUNTING FOOTPRINT** **==> picture [149 x 86] intentionally omitted <==** **----- Start of picture text -----**<br> 10X 0.259X OUTLINEPACKAGE<br>0.65<br>1.55<br>1<br>0.47 0.50 PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br> **==> picture [492 x 37] intentionally omitted <==** **----- Start of picture text -----**<br> Electronic versions are uncontrolled except when accessed directly from the Document Repository.<br>DOCUMENT NUMBER: 98AON90283F Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.<br>DESCRIPTION: XDFN10 2.50X1.35, 0.5P PAGE 1 OF 1<br>**----- End of picture text -----**<br> **onsemi** and are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. www.onsemi.com © Semiconductor Components Industries, LLC, 2014 MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** DATE 09 SEP 2014 **XDFN6 1.50x1.35, 0.5P** CASE 711AY ISSUE O **SCALE 4:1** **==> picture [467 x 295] intentionally omitted <==** **----- Start of picture text -----**<br> D A B L L NOTES:1. DIMENSIONING AND TOLERANCING PER<br>ASME Y14.5M, 1994.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>PIN 1<br>L1 3. DIMENSIONS b APPLIES TO PLATED<br>REFERENCE ÇÇ E TERMINAL AND IS MEASURED BETWEEN<br>0.15 AND 0.30 MM FROM TERMINAL TIP.<br>2X 0.10 C<br>ÇÇ DETAIL A MILLIMETERS<br>ALTERNATE DIM MIN MAX<br>2X 0.10 C CONSTRUCTIONS A 0.40 0.50<br>A1 0.00 0.05<br>TOP VIEW A3 0.15 REF<br>b 0.15 0.25<br>0.10 C DETAIL B A (A3)A1 EXPOSED Cu ÉÉÉÇÇÇ MOLD CMPD DELe 0.351.35 BSC1.50 BSC0.50 BSC0.55<br>6X L1 --- 0.15<br>ÇÇÇ DETAIL B<br>0.08 C ALTERNATE L2 0.65 0.85<br>SIDE VIEW C SEATINGPLANE CONSTRUCTION L3 0.15 REF<br>GENERIC<br>MARKING DIAGRAM*<br>DETAIL A e<br>3X L<br>1 3 XXM �<br>3X L2 �<br>L3<br>XX = Specific Device Code<br>6 4 M = Date Code<br>6X b � = Pb−Free Package<br>0.10 M C A B<br>0.05 M C NOTE 3<br>BOTTOM VIEW *This information is generic. Please refer to<br>device data sheet for actual part marking.<br>Pb−Free indicator, “G” or microdot “ � ”,<br>may or may not be present.<br>**----- End of picture text -----**<br> ## **RECOMMENDED MOUNTING FOOTPRINT** **==> picture [112 x 101] intentionally omitted <==** **----- Start of picture text -----**<br> 0.50<br>PITCH 3X<br>0.86<br>3X<br>0.56<br>1.55<br>1<br>0.51 5X<br>0.32<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br> Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98AON90322F** Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. **DESCRIPTION: XDFN6 1.50X1.35, 0.5P PAGE 1 OF 1 onsemi** and are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. www.onsemi.com © Semiconductor Components Industries, LLC, 2014 MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** **==> picture [96 x 29] intentionally omitted <==** **----- Start of picture text -----**<br> XDFN16 4.0x1.35, 0.5P<br>CASE 711AZ<br>ISSUE O<br>**----- End of picture text -----**<br> **==> picture [483 x 467] intentionally omitted <==** **----- Start of picture text -----**<br> XDFN16 4.0x1.35, 0.5P<br>CASE 711AZ<br>16<br>ISSUE O<br>1 DATE 09 SEP 2014<br>SCALE 4:1<br>D A L L NOTES:<br>2X B 1. DIMENSIONING AND TOLERANCING PERASME Y14.5M, 1994.<br>0.10 C L1 2. CONTROLLING DIMENSION: MILLIMETERS.<br>3. DIMENSION b APPLIES TO PLATED TERMINAL<br>REFERENCEPIN ONE E ALTERNATE TERMINALDETAIL A AND IS MEASURED BETWEEN 0.15 AND0.30 mm FROM THE TERMINAL TIP.<br>ÉÉÉÉ CONSTRUCTIONS MILLIMETERS<br>2X DIM MIN MAX<br>ÉÉÉÉ A 0.40 0.50<br>0.10 C TOP VIEW A1 0.00 0.05<br>EXPOSED Cu MOLD CMPD A3 0.15 REF<br>b 0.15 0.25<br>DETAIL B (A3) A ÉÉÉ D 4.00 BSC<br>0.10 C E 1.35 BSC<br>ÇÇÇ e 0.50 BSC<br>DETAIL B L 0.40 0.60<br>16X 0.08 C ALTERNATE L1 −−− 0.15<br>CONSTRUCTION L2 0.20 REF<br>SIDE VIEW A1 C [SEATING] PLANE<br>GENERIC<br>MARKING DIAGRAM*<br>DETAIL A e/2<br>e 16X L XXXM<br>1 8 �<br>1<br>L2<br>XXX = Specific Device Code<br>16 9 16X b M = Month Code<br>0.10 C A B � = Pb−Free Package<br>BOTTOM VIEW 0.05 C NOTE 3 *This information is generic. Please refer to<br>device data sheet for actual part marking.<br>Pb−Free indicator, “G” or microdot “ � ”,<br>RECOMMENDED may or may not be present.<br>SOLDERING FOOTPRINT*<br>0.50 16X<br>PITCH 0.65<br>1.55<br>1<br>0.48 15X<br>0.25<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br> **==> picture [80 x 8] intentionally omitted <==** **----- Start of picture text -----**<br> DATE 09 SEP 2014<br>**----- End of picture text -----**<br> *For additional information on our Pb−Free strategy and soldering details, please download the **onsemi** Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. |**DOCUMENT NUMBER:**|**98AON90324F**| |---|---| |**DESCRIPTION:**|**XDFN16 4.0X1.35, 0.5P**| Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. **PAGE 1 OF 1** **onsemi** and are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. www.onsemi.com © Semiconductor Components Industries, LLC, 2014 **onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. ## **ADDITIONAL INFORMATION** **TECHNICAL PUBLICATIONS** : **ONLINE SUPPORT** : www.onsemi.com/support **Technical Library:** www.onsemi.com/design/resources/technical−documentation **For additional information, please contact your local Sales Representative at onsemi Website:** www.onsemi.com www.onsemi.com/support/sales **==> picture [232 x 43] intentionally omitted <==**
Updated at April 28, 2026
onsemi is a premier global supplier of intelligent power and sensing technologies, driving disruptive innovations across the automotive, industrial, and cloud infrastructure markets. Recognized for their commitment to sustainability and reliable supply chains, the company accelerates advancements in vehicle electrification, industrial automation, and 5G networks by solving the industry's most complex design challenges. At the core of their portfolio is an industry-leading selection of discrete semiconductors. This extensive range features thousands of high-performance bipolar transistors, single and dual MOSFETs, and a comprehensive array of diodes, including Zener, Schottky, and fast-recovery rectifiers. Engineered for superior thermal performance and energy efficiency, these foundational components are critical for demanding power conversion, switching, and signal conditioning applications. Beyond essential discretes, onsemi provides a robust suite of advanced power management and circuit protection solutions. Their lineup includes intelligent power modules, single IGBTs, and transient voltage suppression (TVS) diodes designed to safeguard sensitive circuitry. Complimented by integrated passive filters, AC/DC LED driver ICs, and specialized sub-2.4GHz RF transceivers, onsemi equips engineers with the scalable, high-quality technologies needed to build a cleaner, smarter, and more connected world.
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