EMI6316FCTBG

## EMI6316FCTBG 

## EMI Filter with ESD Protection for MicroSD Card Applications 

## **Product Description** 

## **http://onsemi.com** 

The EMI6316 is a 4 x 4, 15−bump EMI filter with ESD protection device for MicroSD card applications in a 0.4 mm pitch CSP form factor. It is fully compliant with IEC 61000−4−2. The EMI6316 is also RoHS II compliant. 

## **MARKING DIAGRAM** 

63 **WLCSP15** 

YW **CASE 567FX** A1 Corner **PACKAGE / PINOUT DIAGRAMS** 63 = Specific Device Code Y = Year Indicator 1 2 3 4 4 3 2 1 W = Work Week = Pb−Free Package A A B B 63 **ORDERING INFORMATION** YW C See detailed ordering, marking and shipping information in the C package dimensions section on page 3 of this data sheet. D D Top View Bottom View (Bumps Down View) (Bumps Up View) ea ~~—~~ © Semiconductor Components Industries, LLC, 2012 **1** Publication Order Number: **September, 2012 − Rev. 1 EMI6316/D** 

**EMI6316FCTBG** 

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**Figure 1. Electrical Schematic** 

**Table 1. PIN DESCRIPTIONS** 

|**Table 1. PIN DESCRIPTIONS**|**Table 1. PIN DESCRIPTIONS**|||||||
|---|---|---|---|---|---|---|---|
|**Pin**|**Description**|**Pin**|**Description**|**Pin**|**Description**|**Pin**|**Description**|
|A1|dat0 Internal|B1|clk Internal|C1|cmd Internal|D1|data3 Internal|
|A2|dat1 Internal|B2|VCCExternal|||D2|data2 Internal|
|A3|SDdat1 External|B3|GND|C3|GND|D3|SDdata2 External|
|A4|SDdat0 External|B4|SDclk External|C4|SDcmd External|D4|SDdata3 External|



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**2** 

**EMI6316FCTBG** 

**ELECTRICAL SPECIFICATIONS AND CONDITIONS** 

## **Table 2. PARAMETERS AND OPERATING CONDITIONS** 

|**Table 2. PARAMETERS AND OPERATING CONDITIONS**|||
|---|---|---|
|**Parameter**|**Rating**|**Unit**|
|Storage Temperature Range|−55 to +150|°C|
|Operating Temperature Range|−40 to +85|°C|



## **Table 3. ELECTRICAL OPERATING CHARACTERISTICS** (Note 1) 

|**Symbol**|**Parameter**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|R1R2R3<br>R4R5R6|Resistance||34|40|46|�|
|R9R10R11<br>R12|Resistance||42.5|50|57.5|k�|
|R13|Resistance||12.75|15|17.25|k�|
|ILEAK|Leakage Current per Channel|VIN= 3.0 V||10|100|nA|
|C|Line Capacitance|At 1 MHz, VIN= 0 V|9|11.5|14|pF|
|||At 1 MHz, VIN= 1.8 V<br>(Note 2)||8||pF|
|||At 1 MHz, VIN= 2.5 V||7||pF|
|VB|Breakdown Voltage (Positive)|IR= 1 mA|6|7|9|V|
|VESD|ESD Protection Peak Discharge Voltage at A3, A4, B2,<br>B4, C4, D3 and D4 pins<br>a) Contact Discharge per IEC 61000−4−2 standard<br>b) Air Discharge per IEC 61000−4−2 standard|(Note 3)|±8<br>±15|||kV|
||ESD Protection Peak Discharge Voltage at A1, A2, B1,<br>C1, D1 and D2 pins<br>a) Contact Discharge per IEC 61000−4−2 standard<br>b) Air Discharge per IEC 61000−4−2 standard|(Note 3)|±2<br>±2||||



1. All parameters specified at TA = 25 ° C unless otherwise noted. 

2. MicroSD version 3.0 SDR104 compliant . 

3. Standard IEC 61000−4−2 with CDischarge = 150 pF, RDischarge = 330 �. 

**Table 4. CSP TAPE AND REEL SPECIFICATIONS**[†] 

|**Part Number**|**Chip Size (mm)**|**Package**|**Shipping**†|
|---|---|---|---|
|EMI6316FCTBG|1.56 x 1.56 x 0.50|WLCSP15<br>(Pb−Free)|5000 / Tape & Reel|



- For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging 

- Specification Brochure, BRD8011/D. 

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**EMI6316FCTBG** 

## **RF CHARACTERISTICS** 

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**4** 

**EMI6316FCTBG** 

## **PACKAGE DIMENSIONS** 

**WLCSP15, 1.56x1.56** CASE 567FX ISSUE O 

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**----- Start of picture text -----**<br>
D A B NOTES:<br>PIN A1 1. DIMENSIONING AND TOLERANCING PER<br>REFERENCE ASME Y14.5M, 1994.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>ÈÈ 3. COPLANARITY APPLIES TO SPHERICAL<br>CROWNS OF SOLDER BALLS.<br>ÈÈ E MILLIMETERS<br>DIM MIN MAX<br>2X 0.10 C A 0.47 0.53<br>A1 0.185 0.205<br>A2 0.305 REF<br>2X 0.10 C b 0.24 0.29<br>el TOP VIEW D 1.56 BSC<br>E 1.56 BSC<br>we A2 e e 0.40 BSC<br>0.10 C<br>de<br>A<br>RECOMMENDED<br>0.05 C<br>SOLDERING FOOTPRINT*<br>NOTE 3 A1 P SIDE VIEW OS y C SEATINGPLANE<br>0.40<br>A1 PITCH<br>e/2<br>15X b e e PACKAGE<br>0.05 C A B “iE o s OUTLINE<br>0.03 C D e/2 15X<br>C 0.40 0.23<br>PITCH<br>B<br>DIMENSIONS: MILLIMETERS<br>A<br>*For additional information on our Pb−Free strategy and soldering<br>1 2 3 4 details, please download the ON Semiconductor Soldering and<br>BOTTOM VIEW Mounting Techniques Reference Manual, SOLDERRM/D.<br>**----- End of picture text -----**<br>


- *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf.  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

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## **LITERATURE FULFILLMENT** : 

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**Order Literature** : http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative 

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**EMI6316/D** 

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