EESX-498

**Photomicrosensor (Transmissive) EE-SX1320** 

## **Ultra-Compact Slot / SMD Type (Slot width: 2 mm)** 

- PCB surface mounting type. 

- High resolution with a 0.3-mm-wide aperture. 

**Be sure to read** _**Safety Precautions**_ **on page 3.** 

## **Ordering Information** 

## **Photomicrosensor** 

|**Appearance**|**Sensing**<br>**method**|**Connecting**<br>**method**|**Sensing distance**|**Aperture size (H× W)**<br>**(mm)**|**Output type**|**Model**|
|---|---|---|---|---|---|---|
|4<br>5.1<br>4|Transmissive<br>(slot type)|SMT|**2 mm**(slot width)|Emitter<br>1.4×1.4<br>Detector<br>1×0.3|Phototransistor|**EE-SX1320**|



## **Ratings, Characteristics and Exterior Specifications** 

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Absolute Maximum Ratings (Ta = 25°C)<br>Item Symbol Rated value Unit<br>Emitter<br>Forward current IF 25 *1 mA<br>Pulse forward current IFP 100 *2 mA<br>Reverse voltage VR 5 V<br>Detector<br>Collector-Emitter<br>voltage VCEO 12 V<br>Emitter-Collector<br>VECO 5 V<br>voltage<br>Collector current IC 20 mA<br>Collector dissipation PC 75 *1 mW<br>Operating temperature Topr -30 to +85 *1 °C<br>Storage temperature Tstg -40 to +90 *1 °C<br>Reflow soldering Tsol 255  *3 °C<br>temperature<br>=<br>*1. Refer to the temperature rating chart if the ambient temperature<br>exceeds 25°C.<br>**----- End of picture text -----**<br>


- *2. Duty ratio: 1%, Pulse width: 0.1 ms 

- *3. Complete soldering within 10 seconds for reflow soldering. 

## **Exterior Specifications** 

|**Connecting method**|**Weight (g)**|**Material**|
|---|---|---|
|||**Case**|
|SMT|0.1|PPS|



## **Electrical and Optical Characteristics (Ta = 25°C)** 

|**Item**<br>||**Item**<br>||**Symbol**<br>||**Value**<br>~~Ero~~|**Value**<br>~~Ero~~|**Value**<br>~~Ero~~|**Unit**<br>~~Ero~~<br>~~|~~|**Condition**|
|---|---|---|---|---|---|---|---|
||||**MIN.**<br> ~~Ero~~|**TYP.**<br>~~Ero~~|**TYP.**<br>**MAX.**<br>~~Ero~~|||
|**Emitter**<br>**Forward voltage**<br>**Reverse current**<br>**Peak emission**<br>**wavelength**||~~|~~||||||
||**Forward voltage**|VF|---|1.1|1.3|V<br>~~|~~|IF= 5 mA|
||**Reverse current**|IR|---|---|10|A<br>~~|~~|VR= 5 V|
||**Peak emission**<br>**wavelength**|P|---|940|---|nm<br>~~|~~|IF= 20 mA|
|**Detector**<br>**Light current**<br>**Dark current**<br>**Collector-Emitter**<br>**saturated voltage**<br>**Peak spectral**<br>**sensitivity**<br>**wavelength**<br>~~PT~~<br>~~eee~~<br>~~tt~~||~~|~~<br>~~PT~~<br>~~ET~~||||||
||**Light current**<br>~~PT~~<br>~~eee~~|IL<br>~~PT~~<br>~~ET~~<br>~~eee~~|150<br>~~PT~~<br>~~ET~~<br>~~eee~~|---<br>~~PT~~<br>~~ET~~<br>~~eee~~|1500<br>~~PT~~<br>~~eee~~|A<br>~~|~~<br>~~PT~~<br>~~eee~~|IF= 5 mA,<br>VCE= 5 V|
||**Dark current**<br>~~eee~~|ID<br>~~ET~~<br>~~eee~~|---<br>~~ET~~<br>~~eee~~|10<br>~~ET~~<br>~~eee~~|100<br>~~eee~~|nA<br>~~|~~<br>~~eee~~|VCE= 10 V,<br>0lx|
||**Collector-Emitter**<br>**saturated voltage**<br>~~eee~~<br>~~tt~~|VCE<br>(sat)<br>~~eee~~<br>~~tt~~|---<br>~~eee~~<br>~~tt~~|0.1<br>~~eee~~<br>~~tt~~|0.4<br>~~eee~~<br>~~tt~~|V<br>~~|~~<br>~~eee~~<br>~~tt~~|IF= 20 mA,<br>IL= 50A|
||**Peak spectral**<br>**sensitivity**<br>**wavelength**<br>~~tt~~|P<br>~~tt~~|---<br>~~tt~~|900<br>~~tt~~|---<br>~~tt~~|nm<br>~~|~~<br>~~tt~~|VCE= 5 V|
|**Rising time**<br>~~ae~~||tr<br>~~ae~~|---<br>~~ae~~|19<br>~~ae~~|---<br>~~ae~~|s<br>~~|~~<br>~~ae~~|VCC= 5 V,<br>RL= 100,<br>IL= 500A|
|**Falling time**<br>~~Bae~~||tf<br>~~Bae~~|---<br>~~Bae~~|26<br>~~Bae~~|---<br>~~Bae~~|s<br>~~Bae~~|VCC= 5 V,<br>RL= 100,<br>IL= 500A|



**Note:** Refer to the following timing diagram for tr and tf. 

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I L<br>Input Vcc<br>Input<br>0<br>t<br>Output<br>Output 90% R L<br>0 10%<br>t<br>tr tf<br>**----- End of picture text -----**<br>


**1** 

**EE-SX1320** 

## **Engineering Data (Reference value)** 

**Fig 1. Forward Current vs. Collector Dissipation Temperature Rating** 

**Fig 2. Forward Current vs. Forward Voltage Characteristics (Typical)** 

**Fig 3. Light Current vs. Forward Current Characteristics (Typical)** 

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60 120 60 3,500<br>Ta = 25°C Ta = 25°C<br>VCE = 5V<br>50 100 50 3,000<br>2,500<br>40 P C 80 40<br>2,000<br>30 60 30<br>IF 1,500<br>20 40 20<br>1,000<br>10 20 10 500<br>0 0  0 0<br>-40 -20 0 20 40 60 80 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 0 10 20 30 40 50<br>Ambient temperature Ta (ºC) Forward voltage VF (V) Forward current IF (mA)<br>Fig 4. Light Current vs. Collector- Fig 5. Relative Light Current vs. Ambient Fig 6. Dark Current vs. Ambient<br>Emitter Voltage Characteristics (Typical) Temperature Characteristics (Typical) Temperature Characteristics (Typical)<br>2,500 120 1,000<br>Ta = 25ºC  IF = 5 mA 0 l x<br>VCE = 5 V<br>110<br>2,000<br>100 VCE  = 10 V<br>100<br>1,500<br>IF = 10 mA<br>90 10<br>1,000 VCE  = 2 V<br>80<br>IF = 5 mA 1<br>500<br>70<br>0 60 0.1<br>0 2 4 6 8 10 12 14 −40 −20 0 20 40 60 80 100 −30 −20 −10 0 10 20 30 40 50 60 70 80 90<br>Collector-Emitter voltage VCE (V) Ambient temperature Ta (°C) Ambient temperature Ta (ºC)<br>Fig 7. Response Time vs. Load Fig 8. Sensing Position Characteristics Fig 9. Sensing Position Characteristics<br>Resistance Characteristics (Typical) (Typical) (Typical)<br>  10,000 120 120<br>I V L  CC  =0.5 mA = 5 V IVF CE= 5 mA = 5 V IVFCE  = 5 mA= 5 V<br>Ta = 25°C    100 Ta = 25ºC   100 Ta = 25ºC<br>1,000 (Center ofoptical axis) (Center ofoptical axis)<br>80 80 d<br>d<br>tf<br>100 60 60<br>40 40<br>10<br>tr 20 20<br>10.1 1 10 100 0-0.6 -0.4 -0.2 0 0.2 0.4 0.6 0-1.2 -0.9  -0.6  -0.3  0  0.3  0.6  0.9  1.2<br>Load resistance RL (kΩ) Distance d (mm) Distance d (mm)<br> (mA)F  (mW)C  (mA)F  (µA)Light current IL<br>Forward current I Forward current I<br>Collector dissipation P<br> (%)L<br> (µA)L  (nA)D<br>Relative light current I Dark current I<br>Light current I<br>(%)<br>L<br>s)μ  (%)L<br>Response time tr, tf ( Relative light current I Relative light current I<br>**----- End of picture text -----**<br>


**Fig 4. Light Current vs. CollectorEmitter Voltage Characteristics (Typical)** 

**Fig 6. Dark Current vs. Ambient Temperature Characteristics (Typical)** 

**Fig 9. Sensing Position Characteristics (Typical)** 

**Fig 7. Response Time vs. Load Resistance Characteristics (Typical)** 

**2** 

**EE-SX1320** 

## **Safety Precautions** 

**To ensure safe operation, be sure to read and follow the Instruction Manual provided with the Sensor.** 

~~ef~~ **CAUTION This product is not designed or rated for ensuring safety of persons either directly or indirectly. Do not use it for such purposes.** 

## ~~Pt~~ **Precautions for Safe Use Do not use the product with a voltage or current that exceeds the rated range.** 

## **Precautions for Correct Use** 

**Do not use the product in atmospheres or environments that exceed product ratings. This product is for surface mounting. Refer to Soldering Information, Storage and Baking for details.** 

**Dispose of this product as industrial waste.** 

Applying a voltage or current that is higher than the rated range may result in explosion or fire. 

**Do not miswire such as the polarity of the power** 

## **supply voltage.** 

Otherwise the product may be damaged or it may burn. 

**This product does not resist water. Do not use the product in places where water or oil may be sprayed onto the product.** 

## **Dimensions and Internal Circuit** 

**(Unit: mm)** 

## **Photomicrosensor** 

**EE-SX1320** 

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Ejector pin, gate mark, or flat surface<br>2.0 mm dia. or 0.5 mm recess (MAX)<br>Emitter side Detector side<br>(1) (4)<br>wee (2) fl (3)<br>3 7 cau<br>[|  5.1<br>Aperture size (H x W)<br>Emitter Detector Terminals are exposed Terminals are exposedin the end face of the board<br>in the end face of the board<br>1.4×1.4 1×0.3  2 ±0.2  1.55  Marking<br> 1.4  Optical axis AB (upper: model, lower: lot No.) 0.3 ±0.15<br>eS /\ TL T a A<br> R0.3<br> R0.3<br>EF Ot) 2<br>Cross section view B-B  1.6   1.6  AB Cross section view A-A<br>(Emitter side) oe  2.2   (0.4)  I  (0.4)   1.6  1.6  (Detector side)<br> 2.2<br>Internal circuit<br>(1) (4)<br>(2) (3) fel<br>|  2   3.1  ||  2<br>Terminal No. Name<br>(1) Anode<br>(2) Cathode<br>(3) Emitter<br>(4) Collector Unless otherwise specified, the tolerances are ±0.2 mm.<br>(6xC0.2)<br> 4<br> 1.4   1   1<br> 1   1<br> 2.8<br> 4<br> 1   1<br> 0.6   1.6<br> 1.6<br>**----- End of picture text -----**<br>


**3** omrROoNn ~~a~~ 

**EE-SX1320** 

## **Tape and Reel** 

**Reel (Unit: mm)** * 

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21 [±0.8 dia. ]<br>2 [±0.5]<br>13 [±0.2 dia.]<br>80 [±1dia.]<br>330 [±2 dia.]<br>as =<br>Y<br>Product name<br>CJ PHOTO MICROSENSOR  4<br>Lot number Quantity<br>Country of origin<br>[omron Cc]i<br>W1 = 13.5 [±1]<br>W2 = 17.5 [±1] W1<br>W2<br>**----- End of picture text -----**<br>


## **Tape (Unit: mm)** 

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2 1.5 dia.<br>:tt8 x~<br>i pld pla Ya |<br>bhoh ds<br>HL<br>+<br>| | 6.2)<br>E K<br>C A Tape Pull-out direction<br>**----- End of picture text -----**<br>


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Note:  Direction of product packing is upper figure.<br>**----- End of picture text -----**<br>


## **Tape quantity** 

- 2,000 pcs./reel 

100 pcs./pack * 

- EE-SX1320-1 (100 pcs./pack) has no reel, only tape is attached. 

**4** 

**EE-SX1320** 

## **Soldering Information** 

## **Reflow soldering: Temperature profile** 

**1.** The reflow soldering can be implemented in two times complying with the following diagram. All the temperatures in the product must be within the diagram. 

**2.** The recommended thickness of the metal mask for screen printing is between 0.2 and 0.25 mm. 

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260°C max.<br>255°C<br>1 to 4°C/s<br>230°C<br>10 sec max. 1 to 4°C/sec<br>150 to 180°C max.<br>40 sec max.<br>1 to 4°C/s<br>120 sec max.<br>Temperature (°C)<br>**----- End of picture text -----**<br>


## **Manual soldering** 

The manual soldering should not be applied to the products, otherwise the housing may be deformed and/or the Au plating may be peeled off by heat. 

## **Other notes** 

The use of infrared lamp causes the temperature at the resin to rise particularly too high. 

All the temperatures in the product must be within the above diagram. Do not immerse the resin part into the solder. Even if within the above temperature diagram, there is a possibility that the gold wire in the products is broken in case that the deformation of PC board gives stress to the products. 

Please confirm the conditions (including material and method of flux and cleaning) of the reflow soldering fully by actual solder reflow machine prior to the mass production use. 

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Time (s)<br>**----- End of picture text -----**<br>


## **Storage** 

## **Storage conditions** 

- To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions: Temperature: 10 to 30 °C Humidity: 60% RH max. 

## **Treatment after open** 

**1.** Reflow soldering must be done within 48 hours stored at the conditions of humidity 60% RH or less and temperature 10 to 30°C. 

**2.** If the product must be stored after it is unpacked, store it in a dry box or reseal it in a moisture-proof package with desiccant at a temperature of 10 to 30°C and a humidity of 60% RH or less. Even then, mount the product within one week. 

## **Baking** 

In case that it could not carry out the above treatment, it is able to mount by the following baking treatment. However baking treatment shall be limited only 1 time. 

Recommended conditions: 60°C for 24 to 48 hours (reeled one) 100°C for 8 to 24 hours (loose one) 

**5** 

- Application examples provided in this document are for reference only. In actual applications, confirm equipment functions and safety before using the product. 

- Consult your OMRON representative before using the product under conditions which are not described in the manual or applying the product to nuclear control systems, railroad systems, aviation systems, vehicles, combustion systems, medical equipment, amusement machines, safety equipment, and other systems or equipment that may have a serious influence on lives and property if used improperly. Make sure that the ratings and performance characteristics of the product provide a margin of safety for the system or equipment, and be sure to provide the system or equipment with double safety mechanisms. 

**Note: Do not use this document to operate the Unit.** 

**OMRON Corporation Electronic and Mechanical Components Company** 

**Contact:  www.omron.com/ecb** 

**Cat. No. E454-E1-05** 0417(0816)(O)