EE-SX4350

**Photomicrosensor (Transmissive) EE-SX3350/EE-SX4350** 

## **Compact Slot / SMD Type (Slot width: 5 mm)** 

- Unique 5 mm Slot width. 

- PCB surface mounting type. 

- High resolution with a 0.5-mm-wide aperture. 

- Choice of 2 types of Photo-IC output (EE-SX3350: Dark ON, EE-SX4350: Light ON). 

**Be sure to read** _**Safety Precautions**_ **on page 3.** 

## **Ordering Information** 

## **Photomicrosensor** 

|**Appearance**|**Sensing**<br>**method**|**Connecting**<br>**method**|**Sensing distance**|**Aperture size (H**×**W)**<br>**(mm)**|**Output type**|**Model**|
|---|---|---|---|---|---|---|
|9<br>4<br>9|Transmissive<br>(slot type)|SMT|**5 mm** (Slot width)|Emitter 1.4×1.4<br>Detector 1.4×0.5|Photo IC|**EE-SX3350**<br>(Dark-ON)<br>**EE-SX4350**<br>(Light-ON)|



## **Ratings, Characteristics and Exterior Specifications** 

**Electrical and Optical Characteristics (Ta = 25°C)** 

## **Absolute Maximum Ratings  (Ta = 25** °C **)** 

|**Item**<br>**Symbol**<br>**Rated value**<br>**Emitter**<br>**Forward current**<br>IF<br>30<br>**Reverse voltage**<br>VR<br>4|**Item**<br>**Symbol**<br>**Rated value**<br>**Emitter**<br>**Forward current**<br>IF<br>30<br>**Reverse voltage**<br>VR<br>4|**Unit**<br>**Remarks**<br>mA<br>---*1<br>V<br>---||**Item**<br>**Symbol**<br>**Value**<br>**Unit**<br>**MIN.**<br>**TYP.**<br>**MAX.**<br>**Emitter**<br>**Forward voltage**<br>VF<br>---<br>1.2<br>1.5<br>V<br>**Reverse current**<br>IR<br>---<br>0.01<br>10<br>μA<br>~~=~~|**Item**<br>**Symbol**<br>**Value**<br>**Unit**<br>**MIN.**<br>**TYP.**<br>**MAX.**<br>**Emitter**<br>**Forward voltage**<br>VF<br>---<br>1.2<br>1.5<br>V<br>**Reverse current**<br>IR<br>---<br>0.01<br>10<br>μA<br>~~=~~|**Item**<br>**Symbol**<br>**Value**<br>**Unit**<br>**MIN.**<br>**TYP.**<br>**MAX.**<br>**Emitter**<br>**Forward voltage**<br>VF<br>---<br>1.2<br>1.5<br>V<br>**Reverse current**<br>IR<br>---<br>0.01<br>10<br>μA<br>~~=~~|**Item**<br>**Symbol**<br>**Value**<br>**Unit**<br>**MIN.**<br>**TYP.**<br>**MAX.**<br>**Emitter**<br>**Forward voltage**<br>VF<br>---<br>1.2<br>1.5<br>V<br>**Reverse current**<br>IR<br>---<br>0.01<br>10<br>μA<br>~~=~~|**Item**<br>**Symbol**<br>**Value**<br>**Unit**<br>**MIN.**<br>**TYP.**<br>**MAX.**<br>**Emitter**<br>**Forward voltage**<br>VF<br>---<br>1.2<br>1.5<br>V<br>**Reverse current**<br>IR<br>---<br>0.01<br>10<br>μA<br>~~=~~|**Item**<br>**Symbol**<br>**Value**<br>**Unit**<br>**MIN.**<br>**TYP.**<br>**MAX.**<br>**Emitter**<br>**Forward voltage**<br>VF<br>---<br>1.2<br>1.5<br>V<br>**Reverse current**<br>IR<br>---<br>0.01<br>10<br>μA<br>~~=~~|**Condition**<br>IF= 20 mA<br>VR= 4 V|
|---|---|---|---|---|---|---|---|---|---|---|
|**Detector**||||**Peak emission**<br>**wavelength**|λP|---|940|---|nm|IF= 20 mA|
|**Power supply**<br>**voltage**<br>VCC<br>16<br>**Output voltage**<br>VOUT<br>28||V<br>---<br>V<br>---||**Detector**<br>**Power supply**<br>**voltage**|VCC|4.5|---|16|V|---|
|**Output current**<br>IOUT<br>16||mA<br>---||||||||VCC=4.5 to 16 V<br>IF= 0 mA|
|**Permissible**<br>**output**<br>**dissipation**<br>POUT<br>80||mW<br>---*1||**Low-level output**<br>**voltage**|VOL|---|0.12|0.4|V|(EE-SX3350)<br>IF= 10 mA<br>(EE-SX4350)<br>IOL=16 mA|
|*1.Continuous Forward Current and Collector Power Dissipation<br>must be derated complying. The product should be used without<br>freezing or condensation.<br>**Operating**<br>**temperature**<br>Topr<br>-30 to +85<br>°C<br>---*1<br>**Storage**<br>**temperature**<br>Tstg<br>-40 to +100<br>°C<br>---*1<br>**Reflow soldering**<br>**temperature**<br>Tsol<br>255<br>°C<br>10 sec.<br>max.*2|||must be derated complying. The product should be used without|**High-level output**<br>**voltage**<br>IOH<br>---<br>---<br>100<br>μA<br>**Current**<br>**consumption**<br>ICC<br>---<br>4<br>10<br>mA<br>**Peak spectral**<br>**sensitivity**<br>λP<br>---<br>870<br>---<br>nm<br>~~an~~||||||VCC=4.5 to 16 V<br>IF= 10 mA<br>(EE-SX3350)<br>IF= 0 mA<br>(EE-SX4350)<br>VOH= 28 V<br>VCC= 4.5 to 16 V<br>VCC= 4.5 to 16 V|
|*2.In case of reflow soldering, conditions which are shown at the||||**wavelength**|||||||
|temperature profile should be kept.||||**LED current when**|||||||
|||||**output is OFF**|||||||
|**Exterior Specifications**<br>**Connecting method**<br>**Weight (g)**<br>**SMT**<br>0.3<br>~~ee~~|~~ee~~|**Material**<br>**Case**<br>PPS<br>~~ee~~||**(EE-SX3350)**<br>**LED current when**<br>**output is ON**<br>**(EE-SX4350)**<br>**Hysteresis**<br>**Response frequency**<br>**Response delay time**|IFT<br>---<br>---<br>10<br>mA<br>H<br>---<br>15<br>---<br>%<br>f<br>3<br>---<br>---<br>kHz<br>tPLH<br>---<br>6<br>---<br>μs<br>~~Ht~~|||||VCC= 4.5 to 16 V<br>VCC= 4.5 to 16 V*1<br>VCC= 4.5 to 16 V<br>IF= 20 mA<br>IOL= 16 mA*2<br>VCC= 4.5 to 16 V<br>IF= 20 mA<br>IOL= 16 mA*3|
|||||**Response delay time**|tPHL<br>---<br>10<br>---<br>μs<br>~~ptt~~|||||VCC= 4.5 to 16 V<br>IF= 20 mA<br>IOL=16 mA*3|



- *1. Continuous Forward Current and Collector Power Dissipation must be derated complying. The product should be used without freezing or condensation. 

- *2. In case of reflow soldering, conditions which are shown at the temperature profile should be kept. 

|**Exterior Specifications**|
|---|
|**Connecting method**<br>**Weight (g)**<br>**Material**<br>**Case**<br>**SMT**<br>0.3<br>PPS<br>~~ee~~|



**1** 

**EE-SX3350/EE-SX4350** 

- *1. Hysteresis denotes the difference in forward LED current value, expressed in percentage, calculated from the respective forward LED currents when the photo IC in turned from ON to OFF and when the photo IC in turned from OFF to ON. 

- *3. The following illustrations show the definition of response delay time. The value in the parentheses applies to the EE-SX4350. 

**==> picture [464 x 72] intentionally omitted <==**

**----- Start of picture text -----**<br>
 The value of the response frequency is measured by rotating the  0 Input 0 Input<br>t Output t<br>Output t t<br>0 0<br>tPLH tPHL tPHL tPLH<br>2.1 mm<br>EE-SX3350 EE-SX 4 350<br>0.5 mm 0.5 mm Disk<br>**----- End of picture text -----**<br>


- *2. The value of the response frequency is measured by rotating the disk as shown below. 

## **Engineering Data (Reference value)** 

**Fig 1. Forward Current vs. Collector Dissipation Temperature Rating** 

**Fig 2. Forward Current vs. Forward Voltage Characteristics (Typical)** 

## **Fig 3. LED Current vs. Supply Voltage (Typical)** 

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60 120 60 7<br>Ta = 25°C<br>IFT OFF (IFT ON) RL = 1 kΩ<br>50 100 50 6<br>To oo, Ta = -30°C oo o<br>POUT 5<br>40 80 40 Ta = +25°C<br>IF Ta = +85°C 4<br>30 S|TNE 60 30 ES IFT ON (IFT OFF) ——<br>3<br>20 40 20<br>2<br>10 PN 20 10 oeeeee<br>1<br>NG ees|e<br>0-40 PSS) -20 Ambient temperature Ta (°C)0 20 40 60 80 1000 0 0 G2] 0.2 0.4 Forward voltage V0.6 0.8 1 F1.2 (V) 1.4 1.6 1.8 0 0 EO 2 4 Supply voltage V6 8 CC10 (V) 12 14 16<br> (mW)<br>OUT<br> (mA)F  (mA)F<br> (mA)<br>FT<br>Forward current I<br>Forward current I LED current I<br>Output allowable dissipation P<br>**----- End of picture text -----**<br>


**Fig 4.LED Current vs. Ambient Temperature Characteristics (Typical)** 

**Fig 5. Low-level Output Voltage vs. Output Current (Typical)** 

**Fig 6. Low-level Output Voltage vs. Ambient Temperature Characteristics (Typical)** 

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76 IFT OFF (IFT ON) TaVRCCL＝ = 330  = 5 V25℃ Ω 1 VTa = 25IFCC = 0 mA (15 mA) = 5 V°C 0.180.2 VIFCC = 0 mA (15 mA) = 5 V<br>0.16<br>5<br>IF＝10mA 0.1 0.14<br>4 IFT ON (IFT OFF) 0.12 IOL = 16 mA<br>> 0.1 pr er<br>3<br>0.08<br>0.01<br>2 0.06<br>0.04<br>1<br>0.02 IOL = 5 mA<br>0-60 -40 -20 0 20 40 60 80 0.001 1 10 100 0-50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80<br>Ambient temperature Ta (°C) Output current IC (mA)<br>Ambient temperature Ta (°C)<br> (V)<br>OL  (V)<br>OL<br> (mA)<br>FT<br>LED current I<br>Low level output voltage V<br>Low level output voltage V<br>**----- End of picture text -----**<br>


**Fig 7. Current Consumption vs. Supply Voltage (Typical)** 

**Fig 8. Response Delay Time vs. Forward Current (Typical)** 

## **Fig 9. Repeat Sensing Position Characteristics (Typical)** 

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4 40<br>3.5 Ta = 25 °CIF = 0 mA (15 mA)  35 Ta = 25°C VRCCL = 330  = 5 V Ω V(EE-SX3VOUTOUT @@ )tPLHIF tPHL tt (Center of optical axis) Ta = 25°CIRVFCCL = 10 mA = 4.7 k = 5 VΩ<br>3 30 (EE-SX4 @@ ) t n = repeat 20 times<br>2.5 25 tPHL tPLH OFFON Light baffle d1 = 0.004mm<br>2 Heer 20 a ie<br>1.5 15<br>1 10 tPHL (tPLH)<br>0.5 a 5 ie<br>pet | debs<br>0 0 Heep 2 4 6 8 10 Be 12 14 16 ) 0 0 SSS 10 20tPLH (tPHL)30 40 OFFON -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6<br>Supply voltage VCC (V) Forward current IF (mA) Distance d (mm)<br> (µs)<br> (mA)CC , tPLHPHL ()<br>Output transistor<br>Current consumption I<br>Response delay time t<br>(<br>)<br>**----- End of picture text -----**<br>


**2** omRON ~~a~~ 

**EE-SX3350/EE-SX4350** 

## **Safety Precautions** 

**To ensure safe operation, be sure to read and follow the Instruction Manual provided with the Sensor.** 

~~eS~~ **CAUTION This product is not designed or rated for ensuring safety of persons either directly or indirectly. Do not use it for such purposes.** 

~~CT~~ **Precautions for Safe Use** 

## **Do not use the product with a voltage or current that exceeds the rated range.** 

## **Precautions for Correct Use** 

**Do not use the product in atmospheres or environments that exceed product ratings. This product is for surface mounting. Refer to Soldering Information, Storage and Baking for details.** 

**Dispose of this product as industrial waste.** 

Applying a voltage or current that is higher than the rated range may result in explosion or fire. 

**Do not miswire such as the polarity of the power** 

## **supply voltage.** 

Otherwise the product may be damaged or it may burn. 

## **Do not short-circuit the load.** 

Otherwise explosion or burning may occur. 

**This product does not resist water. Do not use the product in places where water or oil may be sprayed onto the product.** 

## **Dimensions and Internal Circuit** 

**(Unit: mm)** 

## **Photomicrosensor** 

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EE-SX3350<br>EE-SX4350 Ejector pin or gate mark<br>2.0 mm dia. / 0.5 mm recess (MAX)<br>(1) (6)<br>(2 ) (5)<br>(3) (4)<br> 9<br>Marking(Upper: model,<br>Terminals are exposed in the Lower: lot number)<br> end face of the board<br>Optical axis  5 ±0.2  2   end face of the boardTerminals are exposed in the<br> 1.4 A B  0.5 ±0.15<br>Aperture size (H  ×  W)<br>Emitter Detector<br>@@@@<br>@@@@<br>1.4  ×  1.4 1.4  ×  0.5<br>R0.3  R0.3<br>( ih) || i<br>Cross sectional view B-B  1   1 (0.4) A B (0.4)  1   1  Cross sectional view A-A<br> 1   1<br> 2.8  ui  2.8  ]<br>Internal circuit<br>Top view<br>(1) (6)<br>(2)<br>(5)  2   7   2<br>(3) MY 5 (4) | | i<br>Terminal No. Name<br>(1) Anode<br>(2) Not connected.<br>(3) Cathode<br>Power supply<br>(4)<br>voltage<br>(5) Output<br>Unless otherwise specified, the tolerances are ±0.15 mm.<br>(6) ground<br>(6xC0.3)<br> 4<br> 1.4   1.5   1.5   1.5   1.4<br> 7<br> 9<br> 1   1<br> 0.4<br> 1<br> 1<br> 1<br> 0.4<br>**----- End of picture text -----**<br>


**3** 

**EE-SX3350/EE-SX4350** 

**Tape and Reel** 

## **Reel (Unit: mm)** 

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21 [±0.8 dia. ]<br>2 [±0.5]<br>13 [±0.2 dia.]<br>80 [±1dia.] 330 [±2 dia.]<br>LX =<br>Y<br>Product name<br>C4 PHOTO MICROSENSOR  i<br>Lot number Quantity<br>Country of origin<br>Fomron — | W1 = 17.5 [±1] 4|Y<br>W2 = 21.5 [±1] H U<br>W1<br>W2<br>**----- End of picture text -----**<br>


**Tape (Unit: mm)** 

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1.5 dia.<br>4 2 16<br>\_ 0.4 oa<br>A<br>To<br>(9.1) (9.3)<br>|<br>V K<br>O<br>G A Tape Pull-out direction<br>1.75<br>7.5<br>16 (4.3)<br>**----- End of picture text -----**<br>


**Note:** Direction of product packing is upper figure. 

**4** 

**EE-SX3350/EE-SX4350** 

## **Soldering Information** 

## **Reflow soldering : Temperature profile** 

The reflow soldering can be implemented in two times complying with the following diagram. All the temperatures in the product must be within the diagram. 

**==> picture [234 x 138] intentionally omitted <==**

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260°C max.<br>255°C<br>1 to 4°C/s<br>230°C<br>10 sec max. 1 to 4°C/sec<br>150 to 180°C max.<br>40 sec max.<br>1 to 4°C/s<br>120 sec max.<br>Time (s)<br>Temperature (°C)<br>**----- End of picture text -----**<br>


## **Manual soldering** 

The manual soldering should not be applied to the products, otherwise the housing may be deformed and/or the Au plating may be peeled off by heat. 

## **Other notes** 

The use of infrared lamp causes the temperature at the resin to rise particularly too high. 

All the temperatures in the product must be within the above diagram. Do not immerse the resin part into the solder. Even if within the above temperature diagram, there is a possibility that the gold wire in the products is broken in case that the deformation of PC board gives stress to the products. 

Please confirm the conditions (including material and method of flux and cleaning) of the reflow soldering fully by actual solder reflow machine prior to the mass production use. 

## **Storage** 

## **Storage conditions** 

To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended. If this is not possible, store the product under the following conditions: 

- Temperature: 10 to 30 °C Humidity: 60% RH max. 

## **Treatment after open** 

**1.** Reflow soldering must be done within 48 hours stored at the conditions of humidity 60% RH or less and temperature 10 to 30°C. 

**2.** If the product must be stored after it is unpacked, store it in a dry box or reseal it in a moisture-proof package with desiccant at a temperature of 10 to 30°C and a humidity of 60% RH or less. Even then, mount the product within one week. 

## **Baking** 

In case that it could not carry out the above treatment, it is able to mount by the following baking treatment. However baking treatment shall be limited only 1 time. 

- Recommended conditions: 60°C for 24 to 48 hours (reeled one) 100°C for 8 to 24 hours (loose one) 

**5** 

- Application examples provided in this document are for reference only. In actual applications, confirm equipment functions and safety before using the product. 

- Consult your OMRON representative before using the product under conditions which are not described in the manual or applying the product to nuclear control systems, railroad systems, aviation systems, vehicles, combustion systems, medical equipment, amusement machines, safety equipment, and other systems or equipment that may have a serious influence on lives and property if used improperly. Make sure that the ratings and performance characteristics of the product provide a margin of safety for the system or equipment, and be sure to provide the system or equipment with double safety mechanisms. 

**Note: Do not use this document to operate the Unit.** 

**OMRON Corporation Electronic and Mechanical Components Company** 

**Contact:  www.omron.com/ecb** 

**Cat. No. E458-E1-02** 1016(0816)(O)