ECS-271.2-18-33-JGN-TR

## Rois 

The sub miniature ECX-32 is a compact SMD Crystal.  The 3.2 x 2.5 x 0.8 mm ceramic package is ideal for LoRa WAN, wireless, and high density applications. 

## **ECX-32 SMD CRYSTAL** 

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## **ECX-32 SMD CRYSTAL** 

- Low Profile 

- 3.2 x 2.5 mm Footprint 

- Extended Temp. Range Option 

- RoHS Compliant 

## **DIMENSIONS (mm)** 

## **OPERATING CONDITIONS / ELECTRICAL CHARACTERISTICS** 

|**PARAMETERS**|**CONDITIONS**|**ECX-32**|**ECX-32**|**ECX-32**|**UNITS**|
|---|---|---|---|---|---|
|||**MIN**|**TYP**|**MAX**||
|Frequency<br>~~a~~|~~a~~|8.000<br>~~a~~|~~a~~|54.000<br>~~a~~|MHz<br>~~a~~|
|Mode of Oscillation<br>~~a~~|Fundamental<br>~~a~~|~~a~~|~~a~~|~~a~~|~~a~~|
|FrequencyTolerance*|@ +25°C|||± 50|ppm|
|Frequency Stability*<br>~~a~~|-20 ~ +70°C<br>~~a~~<br>~~A~~|~~a~~|~~a~~|± 50<br>~~a~~|ppm<br>~~a~~|
|Shunt Capacitance<br>~~a~~|Co|||5|pF|
|Load Capacitance<br>~~a~~|Specifyin P/N|4|20|Series|pF|
|Drive Level<br>~~LO~~|DL<br>~~LO~~|~~LO~~|~~LO~~|100<br>~~LO~~|μW<br>~~LO~~|
|Operating Temperature*<br>~~LO~~|Topr<br>~~LO~~|-20<br>~~LO~~|~~LO~~|+70<br>~~LO~~|°C<br>~~LO~~|
|Storage Temperature<br>~~SO~~|Tstg<br>~~SO~~|-55<br>~~SO~~|~~SO~~|+125<br>~~SO~~|°C<br>~~SO~~|
|Aging (First Year)<br>~~a~~|@ +25°C ±3°C|||±5|ppm|



## **Equivalent Series Resistance** 

|**Frequency (MHz)         ESR Ω Max.**|**Frequency (MHz)         ESR Ω Max.**|
|---|---|
|8.000 ~ 9.999|400|
|10.000 ~ 15.999|100|
|16.000 ~ 19.999|80|
|20.000 ~ 23.999|60|
|24.000 ~ 54.000|40|



_**Figure 1)** Top, Side, and Bottom_ 

Crystal is symmetrical, pad 1 & 3 are interchangeable. Chamfer on the bottom can be on pad 4 or pad 1 and has no electrical significance. 

|**Pad Connections**|**Pad Connections**|
|---|---|
|1|In/Out|
|2|Gnd|
|3|Out/In|
|4|Gnd|



_**Figure 2)** Suggested land_ 

## **PART NUMBERING GUIDE:  Example ECS-200-20-33-TR** 

|**ECS -  FREQUENCY ABBREVIATION**|**ECS -  FREQUENCY ABBREVIATION**|**ECS -  FREQUENCY ABBREVIATION**|**LOAD**|||**PACKAGE**|**PACKAGE**|||**AVAILABLE OPTIONS**<br>**PACKAGING**||
|---|---|---|---|---|---|---|---|---|---|---|---|
||||**CAPACITANCE**|||||Tolerance           Stability                 Temp Range||||
|200 = 20.000  MHz<br>See P/N Guide<br>20 = 20 pF<br>S = Series<br>33 =<br>ECX-32<br>Blank = Std<br>A = ± 25ppm<br>J = ± 20ppm<br>R = ± 15ppm<br>C = ± 10ppm<br>TR =<br>Tape<br>& Reel<br>1K/Reel<br>Rev.2019<br>ECS<br>* Specify available options in P/N.<br>† Contact ECS for availability over extended temp range.<br>Blank= Std<br>D= ±100 ppm<br>E = ± 50 ppm<br>G = ± 30 ppm<br>H = ± 25 ppm<br>T = ± 20 ppm †<br>W = ±15 ppm †<br>K = ± 10 ppm †<br>Blank= Std<br>L =   -10 ~ +70°C<br>M = -20 ~ +70°C<br>Y  =  -30 ~ +85°C<br>N =  -40 ~ +85°C<br>P =  -40 ~ +105°C<br>S =  -40 ~ +125°C<br>U =  -55 ~ +125°C<br>~~TIOye~~||||||||||||



## **ECX-32 SMD CRYSTAL** COMPLIANT 

## **POCKET TAPE DIMENSIONS (mm)** 

**SOLDER PROFILE** Peak solder Temp +260°C Max 10 sec Max. 2 Cycles Max. MSL 1, Lead Finish Au (°c) #260 °CPeak_—— +220 °C e +170410 °C : | | —~ 

_**Figure 1)** Suggested Reflow Profile_ 

|**DEVELOPED FREQUENCIES**|**DEVELOPED FREQUENCIES**|
|---|---|
|Abbreviation|Frequency (MHZ)|
|80|8.000|
|100|10.000|
|120|12.000|
|122.8|12.288|
|143|14.31818|
|147.4|14.7456|
|160|16.000|
|184|18.432|
|192|19.200|
|196|19.6608|
|200|20.000|
|240|24.000|
|245.7|24.576|
|250|25.000|
|260|26.000|
|270|27.000|
|300|30.000|
|320|32.000|
|360|36.000|
|400|40.000|
|480|48.000|