ECMT1V1717S-300-R

RADIAL LEADED COMMON MODE CHOKES

⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.

Manufacturer: EATON / PARTNER STOCK
Product type: Radial Leaded Common Mode Chokes / Filters
SVHC: No SVHC (21-Jan-2025)
DC Resistance Max: 1.6ohm
Operating Temperature Max: 125°C
Operating Temperature Min: -40°C

Delivery and price
Units per pack	120
Price	1.36 €
Current stock	1000+
Lead time	30 days

Datasheet

Technical Data **ELX1086** 

Effective July 2021 

## EXL1V1010 High current molded inductor 

## **Applications** 

- Voltage Regulator Module (VRM) 

- Multi-phase regulators 

- Point-of-load (POL) converters 

- Desktop and server VRMs and EVRDs 

- Base station equipment 

- Battery power systems 

- Data networking and storage systems 

## **Product features** 

- High current carrying capacity 

- Low DCR, high efficiency 

- Magnetically shielded, low EMI 

- Soft saturation 

- Inductance range from 3.3 μH to 15 μH 

- Current range from 9.9 A to 25 A 

- 12.2 mm x 11.3 mm footprint surface mount package in a 10 mm height 

- Alloy powder core material 

- Moisture Sensitivity Level (MSL) 1 

## **Environmental compliance and general specifications** 

- Storage temperature range (Component): -40 °C to +125 °C 

- Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) 

- Solder reflow temperature: J-STD-020 (latest revision) compliant 

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HALOGEN<br>Pb HF<br>FREE<br>SO<br>**----- End of picture text -----**<br>


EXL1V1010 High current molded inductor 

Technical Data ELX1086 Effective July 2021 

## **Product specifications** 

|**Part number5**||**OCL1**<br>**(μH) ± 20%**||**FLL2 (μH)**<br>**minimum**||**Irms**<br>**3 (A) typical**<br>**+20 °C rise**<br>**+40 °C rise**|**Irms**<br>**3 (A) typical**<br>**+20 °C rise**<br>**+40 °C rise**|**Irms**<br>**3 (A) typical**<br>**+20 °C rise**<br>**+40 °C rise**||**Isat**<br>**4**<br>**(A)**||**DCR (mΩ)**<br>**typical @ +25 °C**||**DCR (mΩ)**<br>**maximum @ +25 °C**||**SRF (MHz)**<br>**typical**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|EXL1V1010-3R3-R||3.3||1.8||18.2||25||23.4||3.7||4.1||20|
|EXL1V1010-4R7-R||4.7||2.6||17.5||24||21.4||5.2||5.7||18|
|EXL1V1010-5R6-R||5.6||3.1||15.7||21.2||19.6||6.5||7.2||16|
|EXL1V1010-6R8-R||6.8||3.8||14||18.5||18.5||8.1||8.9||15|
|EXL1V1010-8R2-R||8.2||4.6||12.9||17.1||16.3||10.8||12.4||11|
|EXL1V1010-100-R||10||5.6||11.5||15.5||14.6||12.5||13.75||10|
|EXL1V1010-150-R||15||8.4||9.9||13.8||12.5||17.5||19.30||9|



1. Open circuit inductance (OCL) Test parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C 

2. Full load inductance (FLL) Test parameters: 100 kHz, 0.1 Vrms, Isat, , +25 °C 

3. Irms: Heat rated current (Irms) will cause the part temperature rise approximately ΔT of 40 °C. Circuit design, component, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. The part temperature (ambient + temp rise) should not exceed +125 °C under worst case operating conditions. 

4. Isat: Peak current for approximately 30% rolloff @ +25 °C 

5. Part number definition: EXL1V1010-xxx-R 

- EXL1V1010 = Product code and size 

- xxx= inductance value in μH, R= decimal point, If no R is present then third digit equals the number of zeros 

- -R suffix = RoHS compliant 

6. Rated operating voltage: 40 V typical 

## **Mechanical parameters, schematic, pad layout (mm)** 

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Schematic<br>**----- End of picture text -----**<br>


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Recommended pad layout Schematic<br>oy f<br>Figure 1.   DCR test<br>**----- End of picture text -----**<br>


|**Part number**|**A**||**B**||**C**||**D**||**D**||**E**||**F**|**G**|**H**|**L**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|EXL1V1010-xxx-R|11.9±0.3||11.0±0.3||9.7±0.3||9.0 ± 0.5||9.3 ± 0.5||2.4±0.2||4.4 ± 0.3|3.7 ref|11 ref|10.5 ref|
||||||||(6R8, 8R2,||(3R3, 4R7,||||||||
||||||||100,150,)||5R6)||||||||



Part marking: 1010, xxx= Inductance value in μH (R= Decimal point, if no R is present then last digit equals number of zeros), yyyy= Lot code All soldering surfaces to be coplanar within 0.1 millimeters Tolerances are ± 0.3 millimeters unless stated otherwise Dimensions of recommended PCB layout are reference only. Pad layout tolerances are ± 0.1 millimeters unless stated otherwise Four terminal kelvin-clip recommended for DCR testing as shown in Figure 1. Traces or vias underneath the inductor is not recommended. 

2 

www.eaton.com/electronics 

Technical Data ELX1086 Effective July 2021 

EXL1V1010 High current molded inductor 

## **Packaging information (mm)** 

Drawing not to scale 

Supplied in tape and reel packaging, 300 parts per 13” diameter reel (EIA-481 compliant) 

|KO|W ± 0.30<br>24<br>F ± 0.1<br>11.5<br>E1 ± 0.1<br>1.75<br>P0 ± 0.1<br>4.0<br>P ± 0.1<br>16<br>P2 ± 0.1<br>2.0<br>~~OO~~<br>~~oe~~<br> ~~3~~|
|---|---|
|A0|D0 + 0.1/-0<br>1.5<br>D1 + 0.1/-0<br>1.5|
||A0 ± 0.1<br>12.4|
||B0 ± 0.1<br>11.5|
||K0 ± 0.1<br>10.3|
||T ± 0.05<br>0.5|



## **Qualification testing** 

|**No.**||**Test item**||**Reference standards**||**Test condition**||**Acceptable value/range**|
|---|---|---|---|---|---|---|---|---|
|1||Life||MIL-STD-202<br>Method 108||+125 °C + Irmsfor 1000 hours||a. Appearance<br>b. ΔL/L<±10%|
|||||||||d. ΔR/R<±15%|
|2||Load humidity||MIL-STD-202<br>Method 103||+85 °C/85% RH +Irmsfor 1000 hours||a. Appearance<br>b. ΔL/L<±10%|
|||||||||d. ΔR/R<±15%|
|3||Moisture resistance||MIL-STD-202||7a & 7b included||a. Appearance|
|||||Method 106||||b. ΔL/L<±10%|
|||||||||d. ΔR/R<±15%|
|4||Thermal shock||MIL-STD-202||Step 1: -40 ± 2 °C 30 ± 5 minutes||a. Appearance|
|||||Method 107||Step 2: 25 ± 2 °C ≤ 0.5 minutes||b. ΔL/L<±10%|
|||||||Step 3: 125 ± 2 °C 30 ± 5 minutes||d. ΔR/R<±15%|
|||||||Number of cycles: 500|||
|5||Vibration||MIL-STD-202||10 g, 12 hours (10 Hz ~ 2 kHz ~ 10 Hz for 20 minutes, 12||a. Appearance|
|||||Method 204||cycles each of 3 orientations)||b. ΔL/L<±10%|
|||||||||d. ΔR/R<±15%|
|6||Shock||MIL-STD-202||Half-sine||a. Appearance|
|||||Method 213||50 g’s, 11 ms||b. ΔL/L<±10%|
|||||||||d. ΔR/R<±15%|
|7||Bending||IEC 68-2-21||1.2 mm for 10 s||a. Appearance|
|||||||||b. ΔL/L<±10%|
|||||||||d. ΔR/R<±15%|
|8||Solderability||J-STD-002D||B1: Preheat:  +155 °C, 4 hours||Method B1: ≥95% of the ter-|
|||||Method B1 & D||245 ± 5, Dip time: 5 +0/-0.5 s||minal covered with solder|
|||||||D: Preheat: steam aging 8 hours ± 15 min +260 °C ±5||Method D: ≤5% solderable|
|||||||°C, Dip time: 30 +0/-0.5 s||metallization exhibiting|
|||||||Depth: completely cover the termination||exposed underlying|
|9||Resistance to soldering heat||MIL-STD-202||+260 ± 5 °C; 10 ± 1 s||a. Appearance|
|||||Method 210||||b. ΔL/L<±10%|
|||||||||d. ΔR/R<±15%|
|10||Terminal strength||AEC-Q200-006||1 kg for 60 + 1 s||a. Appearance|
|||||||||b. ΔL/L<±10%|
|||||||||d. ΔR/R<±15%|



3 

www.eaton.com/electronics 

EXL1V1010 High current molded inductor 

Technical Data ELX1086 Effective July 2021 

## **Inductance and temperature rise vs. current** 

4 www.eaton.com/electronics 

Technical Data ELX1086 Effective July 2021 

EXL1V1010 High current molded inductor 

## **Inductance and temperature rise vs. current** 

## **Inductance and impedance vs. frequency curve** 

5 

www.eaton.com/electronics 

EXL1V1010 High current molded inductor 

Technical Data ELX1086 Effective July 2021 

## **Inductance and impedance vs. frequency curve** 

6 

www.eaton.com/electronics 

EXL1V1010 High current molded inductor 

Technical Data ELX1086 Effective July 2021 

## **Solder reflow profile** 

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TP<br>TC -5°C<br>Max. Ramp Up Rate = 3°C/s tP<br>Max. Ramp Down Rate = 6°C/s<br>TL<br>Preheat t<br>Se A  H*—Ee<br>Tsmax<br>Tsmin<br>   ts<br>25°C<br>Time 25°C to Peak  Time<br>Temperature<br>**----- End of picture text -----**<br>


## **Table 1 - Standard SnPb solder (Tc)** 

|**Package**<br>**thickness**||**Volume**<br>**mm3**<br>**<350**||**Volume**<br>**mm3**<br>**≥350**|
|---|---|---|---|---|
|<2.5 mm<br>≥2.5 mm||235 °C<br>220 °C||220 °C<br>220 °C|



## **Table 2 - Lead (Pb) free solder (Tc)** 

|**Package**<br>**thickness**||**Volume**<br>**mm3**<br>**<350**||**Volume**<br>**mm3**<br>**350 - 2000**||**Volume**<br>**mm3**<br>**>2000**|
|---|---|---|---|---|---|---|
|<1.6 mm||260 °C||260 °C||260 °C|
|1.6 – 2.5 mm||260 °C||250 °C||245 °C|
|>2.5 mm||250 °C||245 °C||245 °C|



## **Reference J-STD-020** 

|**Profile feature**||**Standard SnPb solder**||**Lead (Pb) free solder**|
|---|---|---|---|---|
|Preheat and soak     • Temperature min. (Tsmin)||100 °C||150 °C|
|• Temperature max. (Tsmax)||150 °C||200 °C|
|• Time (Tsmin to Tsmax) (ts)||60-120 seconds||60-120 seconds|
|Ramp up rate TL to Tp||3 °C/ second max.||3 °C/ second max.|
|Liquidous temperature (Tl)||183 °C||217 °C|
|Time (tL) maintained above TL||60-150 seconds||60-150 seconds|
|Peak package body temperature (TP)*||Table 1||Table 2|
|Time (tp)* within 5 °C of the specified classification temperature (Tc)||20 seconds*||30 seconds*|
|Ramp-down rate (Tpto TL)||6 °C/ second max.||6 °C/ second max.|
|Time 25 °C to peak temperature||6 minutes max.||8 minutes max.|



* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. 

Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 

Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. 

**Eaton Electronics Division** 1000 Eaton Boulevard Cleveland, OH 44122 United States Eaton.com/electronics © 2021 Eaton All Rights Reserved Printed in USA Publication No. ELX1086  BU-ELX21096 July 2021 

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Updated at June 10, 2026

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