ECMF4-20A42N10

## **ECMF4-20A42N10** 

## Common mode filter with ESD protection for high speed serial interface 

**Datasheet** - **production data** 

## **Features** 

- 5GHz differential bandwidth to comply with HDMI 2.0, HDMI 1.4, USB 3.1, MIPI, Display Port, etc. 

- High common mode attenuation on LTE, GSM, GPS and WLAN frequencies: 

   - -13 dB at 0.7 GHz 

   - -23 dB at 1.5 GHz 

   - -25 dB at 2.4 GHz 

   - -23 dB at 2.7 GHz 

   - -13 dB at 5.0 GHz 

- Very low PCB space consumption 

- Thin package: 0.5 mm max 

## **Figure 1. Pin configuration (top view)** 

- Lead free and RoHS package 

- High reduction of parasitic elements through integration 

## **Applications** 

- Notebook, laptop 

- Streaming box 

- Set top box 

- Portable devices 

## **Description** 

This device is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like HDMI 2.0, HDMI1.4, USB 3.1 Gen 1, Ethernet, MIPI, Display Port and other high speed serial interfaces. It has a very large differential bandwidth to comply with these standards and can also protect and filter 2 differential lanes. 

May 2016 

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This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**ECMF4-20A42N10** 

## **1 Characteristics** 

**Table 1. Absolute maximum ratings (Tamb = 25 °C)** 

||**Table 1. Absolute maximum ratings (Tamb = 25 °C)gs (Tamb = 25 °C)s (Tamb = 25 °C)(Tamb = 25 °C)Tamb = 25 °C)amb = 25 °C) = 25 °C))**|**Table 1. Absolute maximum ratings (Tamb = 25 °C)gs (Tamb = 25 °C)s (Tamb = 25 °C)(Tamb = 25 °C)Tamb = 25 °C)amb = 25 °C) = 25 °C))**|||
|---|---|---|---|---|
|**Symbol**|**Parameter**||**Value**|**Unit**|
|VPP|Peak pulse voltage|IEC 61000-4-2 Contact discharge<br>IEC 61000-4-2 Air discharge|8<br>15|kV|
|IRMS|Maximum RMS current||100|mA|
|Top|Operating temperature range||-40 to +85|°C|
|Tstg|Storage temperature range||-55 to +150|°C|
|TL|Maximum lead temperature for soldering during 10s||260|°C|



## **Figure 2. Electrical characteristics (definitions)** 

**Table 2. Electrical characteristics (Tamb = 25 °C)** 

|**Symbol**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|VBR|IR= 1 mA|4.5|5.5||V|
|IRM|VRM=3 V per line|||100|nA|
|RDC|DC serial resistance||5|||
|Fc|Differential mode cut-off frequency at -3 dB||5.0||GHz|
|VCL|IPP= 1 A - 8/20 µs|||10|V|
|VCL|Measured at 30 ns, IEC 61000-4-2 +8 kV contact||11||V|
|Cdiode (I/O-I/O)|VI/O= 0 V, f = 200 MHz to 3 GHz, VOSC= 30 mV||0.2|0.3|pF|
|Cdiode (I/O-GND)|VI/O= 0 V, f = 2.5 GHz to 6 GHz||0.35|0.45|pF|



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**Characteristics** 

**Table 3. Pin description** 

|**Pin number**|**Description**|**Pin number**|**Description**|
|---|---|---|---|
|1|D1+ to connector|6|D2- to IC|
|2|D1- to connector|7|D2+ to IC|
|3|GND|8|GND|
|4|D2+ to connector|9|D1- to IC|
|5|D2- to connector|10|D1+ to IC|



**Figure 3. Differential attenuation versus frequency (Z0 diff = 100**  **)** 

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**Characteristics** 

**ECMF4-20A42N10** 

**Figure 4. Common mode attenuation versus frequency (Z0 com = 50**  **)** 

**Figure 5. ESD response to IEC61000-4-2 (+8 kV contact discharge)** 

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**Characteristics** 

## **Figure 6. ESD response to IEC61000-4-2 (-8 kV contact discharge)** 

**Figure 7. USB3.1 Gen 1 5.0 Gbps eye diagram Figure 8. USB3.1 Gen 1 5.0 Gbps eye diagram without ECMF4-20A42N10 with ECMF4-20A42N10 (without cable and EQ) (without cable and EQ)** 

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**Characteristics** 

**ECMF4-20A42N10** 

**Figure 9. USB3.1 Gen 2 10.0 Gbps eye diagram Figure 10. USB3.1 Gen 2 10.0 Gbps eye diagram without ECMF4-20A42N10 with ECMF4-20A42N10 (without cable and EQ) (without cable and EQ)** 

- **Figure 11. HDMI2.0 5.94 Gbps eye diagram without ECMF4-20A42N10** 

**(without cable and EQ)** 

**Figure 12. HDMI2.0 5.94 Gbps eye diagram with ECMF4-20A42N10 (without cable and EQ)** 

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**Characteristics** 

**==> picture [445 x 21] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 13. HDMI1.4 3.35 Gbps eye diagram  Figure 14. HDMI1.4 3.35 Gbps eye diagram with<br>without ECMF4-20A42N10 ECMF4-20A42N10<br>**----- End of picture text -----**<br>


**Figure 15. TLP characteristic** 

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**ECMF4-20A42N10** 

**Package information** 

## **2 Package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _www.st.com._ ECOPACK[®] is an ST trademark. 

## **2.1 µQFN-10L package information** 

**==> picture [176 x 11] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 16. µQFN-10L package outline<br>**----- End of picture text -----**<br>


**==> picture [398 x 341] intentionally omitted <==**

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**Package information** 

**Table 4. µQFN-10L package mechanical data** 

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|---|---|---|---|---|---|---|
|**Ref.**|**Dimensions**||||||
||**Millimeters**|||**Inches**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.41|0.45|0.50|0.183|0.201|0.223|
|A1||0.02|0.05||0.009|0.022|
|A3||0.127|||0.057||
|b|0.15|0.2|0.25|0.067|0.089|0.112|
|D|2.15|2.2|2.25|0.96|0.982|1.004|
|E|1.3|1.35|1.4|0.58|0.603|0.625|
|e||0.4|||0.179||
|L|0.4|0.5|0.6|0.179|0.223|0.268|



**Figure 17. Footprint** 

**Figure 18. Marking** 

_Note: Product marking may be rotated by 180° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose._ 

## **Figure 19. Tape and reel specifications** 

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**Recommendation on PCB assembly** 

**ECMF4-20A42N10** 

## **3 Recommendation on PCB assembly** 

## **3.1 Solder paste** 

1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 

2. "No clean" solder paste is recommended. 

3. Offers a high tack force to resist component movement during high speed 

4. Solder paste with fine particles: powder particle size is 20-45 µm. 

## **3.2 Placement** 

1. Manual positioning is not recommended. 

2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 

3. Standard tolerance of ±0.05 mm is recommended. 

4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 

5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 

6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 

## **3.3 PCB design** 

1. To control the solder paste amount, the closed via is recommended instead of open vias. 

2. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. 

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**Recommendation on PCB assembly** 

## **3.4 Reflow profiles** 

**Figure 20. ST ECOPACK** ® **recommended soldering reflow profile for PCB mounting** 

_Note: Minimize air convection currents in the reflow oven to avoid component movement.Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020_ 

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**Ordering information** 

**ECMF4-20A42N10** 

## **4 Ordering information** 

## **Figure 21. Ordering information scheme** 

**Table 5. Ordering information** 

|**Order code**|**Marking(1)**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|ECMF4-20A42N10|MF|µQFN-10L|5.00 mg|3000|Tape and reel|



1. The marking can be rotated by multiples of 90° to differentiate assembly location 

## **5 Revision history** 

**Table 6. Document revision history** 

|**Date**|**Revision**||**Changes**|
|---|---|---|---|
|16-May-2016|1|Initial release.||



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