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ECMF2-40A100N6
Passive Filter, Common Mode with ESD Protection, 2 Data Lines, µQFN-6
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: STMICROELECTRONICS
- Product type: Integrated Passive Filters
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 6Pins
- Product Range: ECMF Series
- Filter Circuit: Common-Mode
- EMI Filter Type: Common Mode Filter with ESD Protection
- No. of Data Lines: 0
- Filter Case / Package: µQFN
| Delivery and price | |
|---|---|
| Units per pack | 500 |
| Price | 0.236 € |
| Current stock | 200+ |
| Lead time | 30 days |
Datasheet
**ECMF2-40A100N6, ECMF4-40A100N10**
Datasheet
## Common mode filter with ESD protection for high speed serial interface
## **Features**
• 10.7 GHz differential bandwidth to comply with HDMI 2.1, HDMI 2.0, HDMI 1.4, USB4, USB 3.2 Gen2, USB 2.0, MIPI, Display port 2.0, etc.
- High common mode attenuation on WLAN frequencies:
- -15 dB at 2.4 GHz
- -21 dB at 5.0 GHz
- -17 dB at 6.0 GHz
**==> picture [153 x 97] intentionally omitted <==**
**----- Start of picture text -----**<br>
Functional schematic<br>D+ to connector I 1 e) ~ 6 D+ to IC D1+ to connector i 1 - 10 D1+ to IC<br>D- to connector 2 5 D- to IC D1- to connector 2 9 D1- to IC<br>GND 3 4 GND GND 3 8 GND<br>D2+ to connector 4 7 D2+ to IC<br>D2- to connector 5 6 D2- to IC<br>μQFN-6L μQFN-10L<br>**----- End of picture text -----**<br>
- Low serial resistance: 3.0 Ω
- Very low PCB space consumption
- Thin package: 0.5 mm max.
- High reduction of parasitic elements through integration
- Lead free and RoHS package
- Exceeds IEC 61000-4-2 level 4 standard:
- Contact discharge:
- ±9 kV (contact discharge, ECMF2-40A100N6)
- ±10 kV (contact discharge, ECMF4-40A100N10)
- Air discharge:
- ±20 kV (air discharge, ECMF2-40A100N6)
- ±25 kV (air discharge, ECMF4-40A100N10)
|**Product status**|**Product status**||||
|---|---|---|---|---|
|**Part number**||**Package**|**Applications**||
|ECMF2-40A100N6||μQFN-6L|||
|ECMF4-40A100N10||μQFN-10L|•|Notebook, laptop<br>Streaming box, HDMI stick|
- Streaming box, HDMI stick
- • Game console, Set top box • Tablet • Portable devices
## **Description**
The ECMF2-40A100N6 and ECMF4-40A100N10 are highly integrated common mode filters designed to suppress EMI/RFI common mode noise on high speed differential serial buses like HDMI 2.1, HDMI 2.0, HDMI1.4, USB4, USB 3.2 Gen 2, USB 2.0, ethernet, MIPI, Display Port and other high speed serial interfaces.
They have a very large differential bandwidth to comply with these standards and can also protect and filter one or two differential lanes.
**DS13913** - **Rev 2** - **May 2022** For further information contact your local STMicroelectronics sales office.
www.st.com
**ECMF2-40A100N6, ECMF4-40A100N10 Characteristics**
## **1**
## **Characteristics**
**Table 1. Absolute maximum ratings (Tamb = 25 °C)**
|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VPP|Peak pulse voltage|IEC 61000-4-2 contact discharge:<br>ECMF2-40A100N6<br>ECMF4-40A100N10|±9<br>±10|kV|
|||IEC 61000-4-2 air discharge:<br>ECMF2-40A100N6<br>ECMF4-40A100N10|±20<br>±25|kV|
|IRMS|Maximum RMS current||100|mA|
|Top|Maximum operating temperature range||-55 to +125|°C|
|Tstg|Storage temperature range||-55 to +150||
|TL|Maximum temperature for soldering during 10 s||260||
**Figure 1. Electrical characteristics (definitions)**
**==> picture [280 x 116] intentionally omitted <==**
**----- Start of picture text -----**<br>
I<br>VRM Maximum stand-off voltage<br>VCL Clamping voltage at peak pulse current IPP IPP<br>IRM Leakage current at VRM<br>IPP Peak pulse current<br>VBR CDIODE ESD diode capacitanceBreakdown voltage IIRMR VRM VBR VCLV<br>RDC DC serial resistance<br>fC Differential cut off frequency<br>**----- End of picture text -----**<br>
**Table 2. Electrical characteristics (Tamb = 25 °C)**
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|VBR|Breakdown voltage|IR= 1 mA|5.3|5.8||V|
|IRM|Leakage current|VRM= 3.6 V per line||< 1|50|nA|
|||VRM= 5 V per line||3|70||
|VRM|Reverse working voltage||||5|V|
|RDC|DC serial resistance, IDC= 20 mA|||3.0||Ω|
|fc|Differential mode cut-off frequency(1)|||10.7||GHz|
|VCL|Reverse clamping voltage|TLP measurement (pulse duration<br>100 ns), 16 A IPP||20.5||V|
|||8 kV contact discharge after 30 ns,<br>IEC 61000-4-2||18|||
|CDIODE|Capacitance|VBIAS= 0 V, F = 2.5 GHz to 9 GHz,<br>VOSC= 30 mV||0.25|0.40|pF|
|RD|Dynamic resistance, TLP measurement (pulse duration 100 ns)|||0.8||Ω|
_1. Attenuation at 10 MHz as reference._
**DS13913** - **Rev 2**
**page 2/17**
**ECMF2-40A100N6, ECMF4-40A100N10 Characteristics**
**Table 3. ECMF2-40A100N6 pin discription**
|**Pin number**|**Description**|**Pin number**|**Description**|
|---|---|---|---|
|1|D+ to connector|4|GND|
|2|D- to connector|5|D- to IC|
|3|GND|6|D+ to IC|
**Table 4. ECMF4-40A100N10 pin description**
|**Pin number**|**Description**|**Pin number**|**Description**|
|---|---|---|---|
|1|D1+ to connector|6|D2- to IC|
|2|D1- to connector|7|D2+ to IC|
|3|GND|8|GND|
|4|D2+ to connector|9|D1- to IC|
|5|D2- to connector|10|D1+ to IC|
**DS13913** - **Rev 2**
**page 3/17**
**ECMF2-40A100N6, ECMF4-40A100N10 Characteristics (curves)**
## **1.1 Characteristics (curves)**
**Figure 2. Differential attenuation versus frequency (Z0 DIFF = 100 Ω)**
**Figure 4. HDMI2.1 12 Gbps eye diagram without ECMFx-40A100Nx (with worst cable model (WCM3), EQ with 8 dB CTLE and One-tap DFE)**
**Figure 6. HDMI2.0 5.94 Gbps eye diagram without ECMFx-40A100Nx (with worst cable model and equalizer)**
**Figure 3. Common mode attenuation versus frequency (Z0 COM = 50 Ω)**
**Figure 5. HDMI2.1 12 Gbps eye diagram with ECMFx-40A100Nx (with worst cable model (WCM3), EQ with 8 dB CTLE and One-tap DFE)**
**Figure 7. HDMI2.0 5.94 Gbps eye diagram with ECMFx-40A100Nx (with worst cable model and equalizer)**
**DS13913** - **Rev 2**
**page 4/17**
**ECMF2-40A100N6, ECMF4-40A100N10 Characteristics (curves)**
**Figure 8. USB4 20.0 Gbps eye diagram without ECMFx-40A100Nx (with Preset 0, reference cable 0.8m, equalizer with ADC = 0dB and DFE)**
**Figure 10. USB3.2 Gen 2 10.0 Gbps eye diagram without ECMFx-40A100Nx (with type C connector, reference cable, equalizer with ADC = 5 dB and DFE)**
**Figure 12. USB3.2 Gen 1 5.0 Gbps eye diagram without ECMFx-40A100Nx (with type C connector, reference cable and equalizer)**
**Figure 9. USB4 20.0 Gbps eye diagram with ECMFx-40A100Nx (with Preset 0, reference cable 0.8m, equalizer with ADC = 0dB and DFE)**
**Figure 11. USB3.2 Gen 2 10.0 Gbps eye diagram with ECMFx-40A100Nx (with type C connector, reference cable, equalizer with ADC = 5 dB and DFE)**
**Figure 13. USB3.2 Gen 1 5.0 Gbps eye diagram with ECMFx-40A100Nx (with type C connector, reference cable and equalizer)**
**DS13913** - **Rev 2**
**page 5/17**
**ECMF2-40A100N6, ECMF4-40A100N10 Characteristics (curves)**
**Figure 14. USB 2.0 High Speed 480 Mbps eye diagram, Template 1, without ECMFx-40A100Nx**
**Figure 16. MIPI M-PHY – Gear 3 at 5.83 Gbps eye diagram without ECMFx-40A100Nx**
**Figure 18. MIPI M-PHY – Gear 4 at 11.66 Gbps eye diagram without ECMFx-40A100Nx**
**Figure 15. USB 2.0 High Speed 480 Mbps eye diagram, Template 1, with ECMFx-40A100Nx**
**Figure 17. MIPI M-PHY – Gear 3 at 5.83 Gbps eye diagram with ECMFx-40A100Nx**
**Figure 19. MIPI M-PHY – Gear 4 at 11.66 Gbps eye diagram with ECMFx-40A100Nx**
**DS13913** - **Rev 2**
**page 6/17**
**ECMF2-40A100N6, ECMF4-40A100N10 Characteristics (curves)**
**==> picture [176 x 20] intentionally omitted <==**
**----- Start of picture text -----**<br>
Figure 20. ESD response to IEC61000-4-2<br>(+8 kV contact discharge)<br>**----- End of picture text -----**<br>
**Figure 21. ESD response to IEC61000-4-2 (-8 kV contact discharge)**
**Figure 22. TLP characteristic**
**==> picture [259 x 208] intentionally omitted <==**
**----- Start of picture text -----**<br>
I-V TLP<br>25<br>20<br>15<br>10<br>5<br>0<br>-30 -20 -10 0 10 20 30<br>-5<br>-10<br>-15<br>-20<br>-25<br>Voltage (V)<br>Current (A)<br>**----- End of picture text -----**<br>
**DS13913** - **Rev 2**
**page 7/17**
**ECMF2-40A100N6, ECMF4-40A100N10 Package information**
## **2 Package information**
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
## **2.1 µQFN6L package information**
**Figure 23. µQFN6L package outline**
**Table 5. µQFN6L package mechanical data**
|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|
||**Millimeters**|||
||**Min.**|**Typ.**|**Max.**|
|A|0.41|0.45|0.50|
|A1|0.00|0.02|0.05|
|A3||0.127||
|b|0.15|0.20|0.25|
|D|1.35|1.40|1.45|
|E|1.30|1.35|1.40|
|e||0.40||
|L|0.40|0.50|0.60|
|N||6||
**DS13913** - **Rev 2**
**page 8/17**
**ECMF2-40A100N6, ECMF4-40A100N10 µQFN10L package information**
## **2.2 µQFN10L package information**
## **Figure 24. µQFN10L package outline**
**==> picture [225 x 228] intentionally omitted <==**
**----- Start of picture text -----**<br>
Top view<br>D<br>Idex area<br>E<br>Side view<br>A3<br>A1<br>A seating<br>plane<br>Bottom view<br>e b<br>1 5<br>PIN # 1 ID<br>L<br>10 6<br>**----- End of picture text -----**<br>
**Table 6. µQFN10L package mechanical data**
||**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|
|**Ref.**|**Millimeters**|||
||**Min.**|**Typ.**|**Max.**|
|A|0.41|0.45|0.50|
|A1|0.00|0.02|0.05|
|A3||0.127||
|b|0.15|0.20|0.25|
|D|2.15|2.20|2.25|
|E|1.30|1.35|1.40|
|e||0.40||
|L|0.40|0.50|0.60|
**DS13913** - **Rev 2**
**page 9/17**
**ECMF2-40A100N6, ECMF4-40A100N10 Packing information**
## **2.3 Packing information**
**Figure 25. ECMF2-40A100N6 marking Figure 26. ECMF4-40A100N10 marking** ML MK
_Note: The marking codes can be rotated by 90 ° or 180° to differentiate assembly location. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose._
**Figure 27. Tape and reel outline**
**==> picture [268 x 150] intentionally omitted <==**
**----- Start of picture text -----**<br>
Pin 1 located according to EIA-481<br>P0 Ø D0<br>E1<br>F<br>W<br>B0<br>P1 P2 A0 Ø D1<br>K0<br>User direction of unreeling<br>Note: Pocket dimensions are not on scale<br>Pocket shape may vary depending on package<br>**----- End of picture text -----**<br>
**Table 7. Tape and reel mechanical data**
|**Rf**|**Dimensions (millimeters)**|**Dimensions (millimeters)**|**Dimensions (millimeters)**|
|---|---|---|---|
|**e.**|**Min.**|**Typ.**|**Max.**|
|P1|3.90|4.00|4.10|
|P0|3.90|4.00|4.10|
|Ø D0|1.40|1.50|1.60|
|Ø D1 (ECMF2-40A100N6)|0.45|0.50|0.55|
|Ø D1 (ECMF4-40A100N10)|0.8|||
|F|3.45|3.50|3.55|
|E1|1.65|1.75|1.85|
|K0 (ECMF2-40A100N6)|0.70|0.75|0.80|
|K0 (ECMF4-40A100N10)|0.60|0.65|0.70|
|P2|1.95|2.00|2.05|
|W|7.90|8.00|8.10|
|A0 (ECMF2-40A100N6)|1.43|1.48|1.53|
|A0 (ECMF4-40A100N10)|1.50|1.55|1.60|
|B0 (ECMF2-40A100N6)|1.75|1.80|1.85|
**DS13913** - **Rev 2**
**page 10/17**
**ECMF2-40A100N6, ECMF4-40A100N10 Packing information**
|**Rf**|**Dimensions (millimeters)**|**Dimensions (millimeters)**|**Dimensions (millimeters)**|
|---|---|---|---|
|**e.**|**Min.**|**Typ.**|**Max.**|
|B0 (ECMF4-40A100N10)|2.35|2.40|2.45|
**DS13913** - **Rev 2**
**page 11/17**
**ECMF2-40A100N6, ECMF4-40A100N10 Recommendation on PCB assembly**
## **3 Recommendation on PCB assembly**
## **3.1 Footprint**
**Figure 28. ECMF2-40A100N6 footprint in mm**
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**----- Start of picture text -----**<br>
Figure 29.<br>0 .20<br>0 .40<br>1.00<br>0 .70<br>0.35 1.75<br>**----- End of picture text -----**<br>
**ECMF4-40A100N10 footprint in mm**
**==> picture [209 x 146] intentionally omitted <==**
**----- Start of picture text -----**<br>
0.200<br>0.400<br>0.700<br>1.750<br>**----- End of picture text -----**<br>
SMD footprint design is recommended.
**DS13913** - **Rev 2**
**page 12/17**
**ECMF2-40A100N6, ECMF4-40A100N10 Stencil opening design**
## **3.2 Stencil opening design**
Recommended design reference: stencil opening thickness: 100 μm
## **Figure 30. ECMF2-40A100N6 stencil opening recommendations**
**==> picture [114 x 160] intentionally omitted <==**
**----- Start of picture text -----**<br>
0 .190<br>0 .400<br>0.990<br>0 .664<br>0.386 1.714<br>**----- End of picture text -----**<br>
**Figure 31. ECMF4-40A100N10 stencil opening recommendations**
**==> picture [150 x 145] intentionally omitted <==**
**----- Start of picture text -----**<br>
0.190<br>0.400<br>0.660<br>1.710<br>**----- End of picture text -----**<br>
**DS13913** - **Rev 2**
**page 13/17**
**ECMF2-40A100N6, ECMF4-40A100N10 Solder paste**
## **3.3 Solder paste**
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during PCB movement.
4. Solder paste with fine particles: powder particle size is 20-38 μm.
## **3.4 Placement**
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering
3. Standard tolerance of ±0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.
## **3.5 PCB design preference**
1. To control the solder paste amount, the closed via is recommended instead of open vias.
2. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away.
## **3.6 Reflow profile**
**Figure 32. ST ECOPACK[®] recommended soldering reflow profile for PCB mounting**
**==> picture [290 x 158] intentionally omitted <==**
**----- Start of picture text -----**<br>
240-245 °C<br>Temperature (°C)<br>250 -2 °C/s<br>2 - 3 °C/s<br>200 60 sec<br>(90m ax) -3 °C/s<br>150<br>-6° C/s<br>100<br>0.9 °C/s<br>50<br>Time (s)<br>0 30 60 90 120 150 180 210 240 270 300<br>**----- End of picture text -----**<br>
_Note:_
_Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020._
**DS13913** - **Rev 2**
**page 14/17**
**ECMF2-40A100N6, ECMF4-40A100N10 Ordering information**
## **4**
## **Ordering information**
**Figure 33. Ordering information scheme**
**==> picture [265 x 15] intentionally omitted <==**
**----- Start of picture text -----**<br>
-<br>ECMF X 40 A 100 NX<br>**----- End of picture text -----**<br>
**==> picture [126 x 9] intentionally omitted <==**
**----- Start of picture text -----**<br>
ESD common mode filter<br>**----- End of picture text -----**<br>
2: 2 filtered lines with ESD protection 4: 4 filtered lines with ESD protection Common mode peak rejection: 4.0 GHz Version
## Differential bandwidth > 10.0 GHz
## Package
N6: μQFN-6L 400 μm pitch N10: μQFN-10L 400 μm pitch
**Table 8. Ordering information**
|**Order code**|**Marking(1)**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|ECMF2-40A100N6|ML|µQFN-6L|2.4 mg|3000|Tape and reel|
|ECMF4-40A100N10|MK|µQFN-10L|3.9 mg|3000|Tape and reel|
_1. The marking can be rotated by 90° to differentiate assembly location_
**DS13913** - **Rev 2**
**page 15/17**
**ECMF2-40A100N6, ECMF4-40A100N10**
## **Revision history**
**Table 9. Document revision history**
|**Date**|**Revision**|**Changes**|
|---|---|---|
|14-Feb-2022|1|Initial release.|
|19-May-2022|2|Added fromFigure 15toFigure 20.|
**DS13913** - **Rev 2**
**page 16/17**
**ECMF2-40A100N6, ECMF4-40A100N10**
## **IMPORTANT NOTICE – READ CAREFULLY**
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
- © 2022 STMicroelectronics – All rights reserved
**DS13913** - **Rev 2**
**page 17/17**
Updated at March 31, 2026
STMicroelectronics is a global leader in the semiconductor industry, recognized for developing highly integrated, energy-efficient solutions that power modern electronics. With a strong focus on innovation, ST provides a comprehensive portfolio of microelectronics that address the demanding requirements of industrial, automotive, communications, and consumer applications. Our extensive selection of STMicroelectronics components is built around a robust lineup of discrete semiconductors and circuit protection devices. We offer a wide variety of single MOSFETs, Schottky diodes, and fast and ultrafast recovery rectifier diodes, designed to deliver exceptional efficiency and thermal performance in power management and conversion systems. For robust circuit protection, our inventory features hundreds of transient voltage suppressors and TVS diodes that safeguard sensitive electronic components against destructive voltage spikes. In addition to core power discretes like TRIACs, SCRs, bipolar transistors, and single IGBTs, our STMicroelectronics range includes specialized integrated passive filters and MEMS sensors. Furthermore, ST offers advanced integrated passive devices, such as baluns and RF filters, which utilize high-quality monolithic RF IPD processes on glass or high-resistance silicon substrates. These components provide competitive cost structures, reduced power losses, and simplified RFIC-to-antenna matching, ensuring optimal system performance and delivering the reliability required for next-generation wireless and power designs.
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