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ECMF2-40A100M6Y
Common Mode Filter, ESD Protection, 2 Data Lines, QFN-6
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- Manufacturer: STMICROELECTRONICS
- Product type:
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 6Pins
- Filter Circuit: Common-Mode
- EMI Filter Type: Common Mode Filter with ESD Protection
- No. of Data Lines: 2 Data Lines
| Delivery and price | |
|---|---|
| Units per pack | 1000 |
| Price | 0.156 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
**ECMF2-40A100M6Y**
Datasheet
## Automotive common mode filter for differential channels with integrated ESD protection
## **Features**
- AEC-Q101 qualified
• 12.5 GHz differential bandwidth to comply with MIPI, FPD-link, GMSL, APIX, HDMI 2.0, HDMI 2.1, USB3.2 gen1/gen2 and USB4
- Common mode attenuation on LTE, BLE, Wi-Fi and V2x frequencies:
- -15 dB at 2.4 GHz
- -15 dB at 5.9 GHZ
- Low leakage current at VRM (IR < 70 nA)
- Wettable flank for automatic optical inspection
- Low PCB space consumption: 1.89 mm²
- ECOPACK2 RoHS compliant component
- Complies with ISO 10605 - C = 150 pF, R = 330 Ω
- ±9 kV (contact discharge)
- – ±20 kV (air discharge)
- Complies with the following standards:
- UL94, V0
## **Product label**
- J-STD-020 MSL level 1
– IPC7531 footprint and JEDEC registered package
## **Application**
High speed applications where common mode noise and electrostatic discharges must be suppressed such as:
- In-vehicle high speed network: SerDes, MIPI, LVDS
- Advanced driver assistance systems (ADAS), cameras, radar
- In-vehicle infotainment (IVI)
- Digital cluster
## **Product status link**
ECMF2-40A100M6Y
## **Description**
The ECMF2-40A100M6Y is an integrated common mode filter designed to effectively suppress EMI/RFI common mode noise on high-speed data lines including MIPI A- PHY, FPD-link III, GMSL, APIX, USB2.0 USB3.2, USB4, HDMI2.0, HDMI2.1.
Engineered to replace traditional discrete common mode chokes or LTCC, this device integrates robust ESD protections on connector side to comply with ISO 10605 standards, making it an ideal choice for enhancing signal integrity. With this 2-in-1 combination, the ECMF2-40A100M6Y offers superior RF performance compared to discrete filters with external ESD protection.
Its packaging in a QFN-6L (DFN1414) with wettable flanks guarantees compatibility with automatic visual inspection (AOI) systems. This component is perfect for designers looking to improve their products' EMI/RFI suppression capabilities with a space-efficient and reliable solution.
**DS14492** - **Rev 2** - **June 2024** For further information contact your local STMicroelectronics sales office.
www.st.com
**ECMF2-40A100M6Y Pin configuration and function**
## **1 Pin configuration and function**
**Table 1. Table 1. ECMF2-40A100M6Y pin description**
|**Pin #**|**Type**|**Description**|
|---|---|---|
|1|I/O|D+ to connector|
|2|I/O|D- to connector|
|3|GND|Ground|
|4|GND|Ground|
|5|I/O|D- to IC|
|6|I/O|D+ to IC|
**Figure 1. ECMF2-40A100M6Y pinout (top view)**
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**ECMF2-40A100M6Y Characteristics**
## **2**
## **Characteristics**
**Table 2. Absolute maximum ratings (Tamb = 25 °C)**
|**Symbol**||**Parameter**|**Pins**|**Value**|**Unit**|
|---|---|---|---|---|---|
|VESD|Electrostatic<br>discharge|ISO 10605 - C = 150 pF, R = 330 Ω:<br>Contact discharge<br>Air discharge|pin 1, pin 2|±9<br>±20|kV|
|||Human body model (HBM),<br>per ANSI/ESDA/JEDEC JS-001|All pins|±8||
|IRMS|RMS current|||100|mA|
|Tj|Operating junction|temperature range||-55 to +150|°C|
|Tstg|Storage temperature range|||-65 to +175||
|TL|Maximum lead temperature for soldering during 10 s|||260||
**Figure 2. Electrical characteristics (definitions)**
**==> picture [302 x 125] intentionally omitted <==**
**----- Start of picture text -----**<br>
I<br>VRM Maximum stand-off voltage<br>VCL Clamping voltage at peak pulse current IPP IPP<br>IRM Leakage current at VRM<br>IPP Peak pulse current<br>VBR Breakdown voltage IIRMR V<br>RDC DC serial resistance VRM VBR VCL<br>fC Differential cut off frequency<br>**----- End of picture text -----**<br>
**Table 3. Electrical characteristics (Tamb = 25 °C)**
|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|VRM|Reverse Stand-Off voltage||||5|V|
|VBR|Reverse breakdown voltage|IR= 1 mA|5.3|5.8||V|
|IR|Reverse leakage current at VR|VR= 3.6 V|||50|nA|
|IRM|Reverse leakage current at VRM|VRM= 5 V|||70|nA|
|RDC|DC serial resistance|IDC= 20 mA||2.9|4|Ω|
|fc(1)(2)|Differential mode cut-off frequency|SDD21= -3 dB||12.5||GHz|
|VCL(1)|ESD clamping voltage|ISO 10605 (150 pF – 330 Ω),<br>8 kV contact discharge after 30 ns||20||V|
_1. Specified by design – Not tested in production._
_2. Normalized to attenuation at 10 MHz._
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**ECMF2-40A100M6Y Characteristics**
## **2.1 Characteristics (curves)**
**==> picture [483 x 21] intentionally omitted <==**
**----- Start of picture text -----**<br>
Figure 3. Differential attenuation versus frequency Figure 4. Common mode attenuation versus frequency<br> (Z0_diff = 100 Ω) (Z0_com = 50 Ω)<br>**----- End of picture text -----**<br>
**Figure 5. Differential mode return losses on connector Figure 6. Differential mode return losses on IC side side versus frequency (Z0_diff = 100 Ω) versus frequency (Z0_diff = 100 Ω)**
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**ECMF2-40A100M6Y Characteristics**
**Figure 7. HDMI2.0 – 5.94 Gbps eye diagram without device (with worst cable and equaliser)**
**Figure 9. HDMI2.1 – 12 Gbps eye diagram without device (with worst cable model WCM3), EQ with 8 dB CTLE and one-tap DFE**
**Figure 11. USB3.2 Gen1 – 5 Gbps Type-C eye diagram without device (with type C connector, reference cable and equalizer)**
**Figure 8. HDMI2.0 – 5.94 Gbps eye diagram with device (with worst cable and equaliser)**
**Figure 10. HDMI2.1 – 12 Gbps eye diagram with device (with worst cable model WCM3), EQ with 8 dB CTLE and one-tap DFE**
**Figure 12. USB3.2 Gen1 – 5 Gbps Type-C eye diagram with device (with type C connector, reference cable and equalizer)**
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**ECMF2-40A100M6Y Characteristics**
**Figure 13. USB3.2 Gen2 – 10 Gbps eye diagram without device (with type C connector, reference cable, equalizer with ADC = 6 dB and DFE)**
**Figure 15. USB4 – 20 Gbps eye diagram without device (with type C connector, preset 0, reference cable 0.8m, equalizer with ADC = 0dB and DFE)**
**Figure 17. FPD LinkIII – 4.16 Gbps eye diagram – without device**
**Figure 14. USB3.2 Gen2 – 10 Gbps eye diagram with device (with type C connector, reference cable, equalizer with ADC = 6 dB and DFE)**
**Figure 16. USB4 – 20 Gbps eye diagram with device (with type C connector, preset 0, reference cable 0.8m, equalizer with ADC = 0dB and DFE)**
**Figure 18. FPD LinkIII – 4.16 Gbps eye diagram – with device**
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**ECMF2-40A100M6Y Characteristics**
**Figure 19. GMSL – 3.12 Gbps eye diagram without device**
**Figure 21. MIPI A-PHY G2 4 Gbps eye diagram – without device**
**Figure 23. MIPI A-PHY G3 8 Gbps eye diagram – without device**
**Figure 20. GMSL – 3.12 Gbps eye diagram with device**
**Figure 22. MIPI A-PHY G2 4 Gbps eye diagram – with device**
**Figure 24. MIPI A-PHY G3 8 Gbps eye diagram – with device**
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**ECMF2-40A100M6Y Characteristics**
**==> picture [190 x 20] intentionally omitted <==**
**----- Start of picture text -----**<br>
Figure 25. ISO 10605 - C = 150 pF, R = 330 Ω<br>(+8 kV contact)<br>**----- End of picture text -----**<br>
**Figure 26. ISO 10605 - C = 150 pF, R = 330 Ω (-8 kV contact)**
**==> picture [464 x 141] intentionally omitted <==**
**----- Start of picture text -----**<br>
20 V/div<br>20 V/div<br>i i<br>100.8 V ee t {| i' ’ :<br>@ 1 |i || || @e 123 Pea k clampingClampingClamping voltage at 30 nsvoltage at 60 nsvoltage 4 j ve, (i 1 4<br>J}!i|i\||i |i\@ 4 Clamping voltage at 100 ns | av a -16.0 V2 ’ b a -10.5 V3 i -6.9 V<br>\i | i H '<br>i ti } ti av i .: |'<br>19.6 V 12.8 V<br>| e 2 ° 3 t @|| 10.4 V4 i | av -78.3 V é 1 1 i]|| -1'@ 123 PeakClampingClampingclampingvoltagevoltagevoltageatat 6030 nsns<br>[Pape 1 Peden | ' ie 4 Clamping voltage at 100 ns<br>pet |i | |i | | oy i* \+ \<br>iii|i 20 ns/div 20 ns/div<br>**----- End of picture text -----**<br>
## **Figure 27. TLP characteristic**
**==> picture [228 x 156] intentionally omitted <==**
**----- Start of picture text -----**<br>
I(A) 25<br>Tj initial = 25 °C 20<br>Tp = 100 ns<br>15<br>10<br>5<br>0<br>-35 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 30 35<br>-5<br>-10<br>-15<br>-20<br>V(V)<br>-25<br>**----- End of picture text -----**<br>
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**ECMF2-40A100M6Y Package information**
## **3 Package information**
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
## **3.1 Package information**
**Figure 28. Package outline**
**Table 4. Mechanical data**
|**Symbol**|**Dimesions (milimeters)**<br>~~ee~~<br>ee|**Dimesions (milimeters)**<br>~~ee~~<br>ee|**Dimesions (milimeters)**<br>~~ee~~<br>ee|
|---|---|---|---|
||**Min.**<br>~~ee~~|**Typ.**<br>~~ee~~<br>ee|**Max.**<br>~~ee~~|
|A|0.70|0.75<br>ee|0.80|
|A1|0.00|0.02|0.05|
|b|0.16|0.23|0.28|
|D|1.35|1.40|1.45|
|E|1.30|1.35|1.40|
|e||0.50||
|L|0.40|0.50|0.60|
|CD|0.10|||
|CW|0.01|0.05|0.09|
|WF|0.10|||
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**ECMF2-40A100M6Y Package information**
## **3.2 Packing information**
**==> picture [80 x 9] intentionally omitted <==**
**----- Start of picture text -----**<br>
Figure 29. Marking<br>**----- End of picture text -----**<br>
**Figure 30. Package orientation in reel**
**Figure 32. Reel dimensions (mm)**
**Figure 31. Tape and reel orientation**
**==> picture [155 x 103] intentionally omitted <==**
**----- Start of picture text -----**<br>
Ø 180 max<br>14.4<br>2±0.5<br>Ø 13<br>(i<br>\<br>Ø 60 Ø 20.2 min<br>**----- End of picture text -----**<br>
**Figure 33. Inner box dimensions (mm)**
**==> picture [106 x 144] intentionally omitted <==**
**----- Start of picture text -----**<br>
30<br>205<br>205<br>**----- End of picture text -----**<br>
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**ECMF2-40A100M6Y Package information**
**Figure 34. Tape and reel outline**
**Table 5. Tape and reel mechanical data**
|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|
||**Millimeters**|||
||**Min.**|**Typ.**|**Max.**|
|ØD0|1.45|1.50|1.60|
|ØD1|0.45|0.50|0.55|
|F|3.45|3.50|3.55|
|K0|0.70|0.75|0.80|
|P0|3.90|4.00|4.10|
|P1|3.90|4.00|4.10|
|P2|1.95|2.00|2.05|
|W|7.90|8.00|8.10|
**Figure 35. Tape leader and trailer dimensions**
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**ECMF2-40A100M6Y Recommendations on PCB assembly**
## **4 Recommendations on PCB assembly**
## **4.1 Recommended footprint**
**Figure 36. Recommended footprint in mm**
_Note: Solder Mask Defined (SMD) recommended._
## **4.2 Stencil opening design**
- Stencil opening thickness: 75 μm / 3 mils
- Stencil opening ratio : 90%
**Figure 37. Stencil opening recommendations**
**Figure 38. Wettable flank profile**
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**ECMF2-40A100M6Y Recommendations on PCB assembly**
## **4.3 Solder paste**
1. Halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste recommended.
3. Tack force high enough to resist component displacement during PCB movement.
4. Particles size 20-38 µm per IPCJ STD-005.
## **4.4**
## **Placement**
1. It is recommended to use leads recognition instead of package outline for accurate placement on footprint with adequate resolution tool.
2. Tolerance of ±50 µm is recommended.
3. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages.
4. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.
## **4.5**
## **PCB design preference**
1. Any via around or inside the footprint area must be closed to avoid solderpaste migration in the via.
2. Position and dimensions of the tracks should be well balanced. A symmetrical layout is recommended to prevent assembly troubles.
## **4.6**
## **Reflow profile**
## **Figure 39. ST ECOPACK recommended soldering reflow profile for PCB mounting**
**==> picture [289 x 164] intentionally omitted <==**
**----- Start of picture text -----**<br>
240-245 °C<br>Temperature (°C)<br>250 -2 °C/s<br>2 - 3 °C/s<br>200 60 sec<br>(90 max) -3 °C/s<br>150<br>-6 °C/s<br>100<br>0.9 °C/s<br>50<br>Time (s)<br>0 30 60 90 120 150 180 210 240 270 300<br>**----- End of picture text -----**<br>
_Note:_
_Minimize air convection currents in the reflow oven to avoid component movement. O2 rate inside the oven must be below 500 ppm. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020._
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**ECMF2-40A100M6Y Ordering information**
## **5 Ordering information**
**Figure 40. Ordering information scheme**
|**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**|
|---|---|---|---|---|---|
|ECMF2-40A100M6Y|DY(1)|QFN-6L|4.1 mg|3000|Tape and reel|
_1. The marking can be rotated by multiples of 90° to differentiate assembly locations._
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**ECMF2-40A100M6Y**
## **Revision history**
## **Table 6. Document revision history**
|**Date**|**Revision**|**Changes**|
|---|---|---|
|10-Nov-2023|1|Initial release.|
|03-Jun-2024|2|Updated_Features_,_Applications_,_Description_, andTable 3. Added<br>Section 1: Pin configuration and function, andFigure 40.|
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**ECMF2-40A100M6Y**
## **IMPORTANT NOTICE – READ CAREFULLY**
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
- © 2024 STMicroelectronics – All rights reserved
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Updated at March 31, 2026
STMicroelectronics is a global leader in the semiconductor industry, recognized for developing highly integrated, energy-efficient solutions that power modern electronics. With a strong focus on innovation, ST provides a comprehensive portfolio of microelectronics that address the demanding requirements of industrial, automotive, communications, and consumer applications. Our extensive selection of STMicroelectronics components is built around a robust lineup of discrete semiconductors and circuit protection devices. We offer a wide variety of single MOSFETs, Schottky diodes, and fast and ultrafast recovery rectifier diodes, designed to deliver exceptional efficiency and thermal performance in power management and conversion systems. For robust circuit protection, our inventory features hundreds of transient voltage suppressors and TVS diodes that safeguard sensitive electronic components against destructive voltage spikes. In addition to core power discretes like TRIACs, SCRs, bipolar transistors, and single IGBTs, our STMicroelectronics range includes specialized integrated passive filters and MEMS sensors. Furthermore, ST offers advanced integrated passive devices, such as baluns and RF filters, which utilize high-quality monolithic RF IPD processes on glass or high-resistance silicon substrates. These components provide competitive cost structures, reduced power losses, and simplified RFIC-to-antenna matching, ensuring optimal system performance and delivering the reliability required for next-generation wireless and power designs.
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