ECMF04-4HSWM10
Filter, Common Mode, 2.6mm x 1.35mm x 0.5mm
- Manufacturer: STMICROELECTRONICS
- Product type:
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 10Pins
- Product Range: ECMF Series
- Filter Circuit: Common-Mode
- EMI Filter Type: Common Mode Filter with ESD Protection
- No. of Data Lines: 4 Data Lines
- Filter Case / Package: µQFN
| Delivery and price | |
|---|---|
| Units per pack | 9000 |
| Price | 0.288 € |
| Current stock | 10+ |
| Lead time | 30 days |
## **ECMF04-4HSWM10**
## Common-mode filter with ESD protection for high-speed serial interfaces
**Datasheet** - **production data**
## **Features**
- Very large differential bandwidth to comply with HDMI 2.0, USB3.0, MIPI, DisplayPort and other high speed serial interfaces
- High common mode attenuation on WLAN frequencies:
- 28 dB at 2.4 GHz and -16 dB at 5.0 GHz
- Very good attenuation at LTE, GSM and GPS frequencies
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µQFN-10L 2.60 x 1.35 mm<br>**----- End of picture text -----**<br>
- Large bandwidth: 4.2GHz
- Very low PCB space consumption
- Thin package: 0.55 mm max.
- Lead-free package
## **Figure 1. Pin configuration (top view)**
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D1+ 1 10 D1+<br>D1- 2 9 D1-<br>GND 3 8 GND<br>D2+ 4 7 D2+<br>D2- 5 6 D2-<br>**----- End of picture text -----**<br>
- High reduction of parasitic elements through integration
## **Complies with the following standards:**
- IEC 61000-4-2 level 4:
- ±15 kV (air discharge)
- ±8 kV (contact discharge)
## **Applications**
- Set top box
- Streaming box
- Game console
- Notebook, laptop
- Portable devices
## **Description**
The ECMF04-4HSWM10 is a highly integrated common-mode filter designed to suppress EMI/RFI common mode noise on high-speed differential serial buses like HDMI 2.0, USB3.0, Ethernet, MIPI, DisplayPort and other high-speed serial interfaces. The device has a very large differential bandwidth to comply with these standards and can also protect and filter 2 differential lanes.
June 2014
DocID026032 Rev 1
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This is information on a product in full production.
_www.st.com_
**Contents**
**ECMF04-4HSWM10**
|**Contents**|**Contents**|
|---|---|
|**1**|**Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3**|
|**2**|**Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8**|
|**3**|**PCB layout recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9**|
|**4**|**Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10**|
|**5**|**Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12**|
|**6**|**Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12**|
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**Characteristics**
## **1 Characteristics**
**Table 1. Absolute maximum ratings (Tamb = 25 °C)**
||**Table 1. Absolute maximum ratings (Tamb = 25 °C)**|**Table 1. Absolute maximum ratings (Tamb = 25 °C)**|||
|---|---|---|---|---|
|**Symbol**|**Parameter**||**Value**|**Unit**|
|VPP|Peak pulse voltage|IEC 61000-4-2<br>Contact discharge (connector side)<br>Air discharge (connector side)|8<br>15|kV|
|IRMS|Maximum RMS current||100|mA|
|Top|Operating temperature range||-40 to +85|°C|
|Tj|Maximum junction temperature||125|°C|
|Tstg|Storage temperature range||- 55 to +150|°C|
**Figure 2. Electrical characteristics (definitions)**
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I<br>Symbol Parameter<br>VBR = Breakdown voltage<br>IRM = Leakage current @ VRM<br>VRM = Stand-off voltage<br>IR = Breakdown current VBR VRM V<br>IRM<br>IR<br>**----- End of picture text -----**<br>
**Table 2. Electrical characteristics (Tamb = 25 °C)**
|**Symbol**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|VBR|IR= 1 mA|4.5|5.5||V|
|IRM|VRM= 3 V per line|||100|nA|
|RDC|DC serial resistance||5||Ω|
|FC|-3dB differential mode cut-off frequency||4.2||GHz|
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**Characteristics**
**ECMF04-4HSWM10**
**Table 3. Pin description**
|**Pin number**|**Description**|**Pin number**|**Description**|
|---|---|---|---|
|1|D1+ to connector|6|D2- to IC|
|2|D1- to connector|7|D2+ to IC|
|3|GND|8|GND|
|4|D2+ to connector|9|D1- to IC|
|5|D2- to connector|10|D1+ to IC|
## **Figure 3. Differential attenuation versus frequency (Z0 diff = 100** Ω **)**
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SDD21 (dB)<br>0<br>Serr<br>-1<br>CLIT ee |<br>-2<br>OI LUIS<br>-3<br>CE LAINEAM E<br>-4 STN TIN<br>-5<br>10M 30M 100M 300M 1G 3G<br>F/Hz<br>Lane #1 Lane #2<br>**----- End of picture text -----**<br>
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**ECMF04-4HSWM10**
**Characteristics**
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Figure 4. Common mode attenuation versus frequency (Z0 com = 50 Ω )<br>SCC21 (dB)<br>0<br>-5<br>-10<br>SN<br>-15 Iw<br>k<br>-20<br>-25<br>-30<br>-35<br>-40<br>10M 30M 100M 300M 1G 3G<br>Lane #1 F/Hz Lane #2<br>**----- End of picture text -----**<br>
## **Figure 5. ESD response to IEC61000-4-2 (+8 kV contact discharge)**
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20 V/di v<br>LOUTPUT l | l t max<br>I|<br>|| e 1 VPP: ESD peak voltage<br>a \ e@ 2 VCL :clamping voltage @ 30 ns<br>| | e@ 3 VCL :clamping voltage @ 60 ns<br>\|@ 4 VCL :clamping voltage @ 100 ns<br>|| j<br>| i I i<br>@ 1 72.1 V an i<br>| | { \<br>++|+{<br>I 2 13.1 V | 3 11.2 V \ 4 7.1 V<br>**----- End of picture text -----**<br>
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**Characteristics**
**ECMF04-4HSWM10**
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Figure 6. ESD response to IEC61000-4-2 (-8 kV contact discharge)<br>20 V/di v<br>TII<br>'‘ 1<br>| | |<br>5 ' ‘ ‘<br>= :' ‘ Pheecdinrlda<br>L-----4--- 5-5 perenne ni, ere<br>' ‘ 1<br>|meccitho eabeaeeee eS ce say vJtg Ss let OE RdSend cl c:c:c:cicisicicisis::<br>' 1<br>! |<br>'11<br>ii I<br>OUTPUT ' i | 4 -3.0 V<br>' 2 -10.3 V H‘<br>:‘ 3 -9.2 V ‘<br>|||<br>1 -65.4 V '‘ ‘<br>|||<br>4' i<br>||'<br>'1 @ 1 VPP: ESD peak voltage<br>nL1 2 VCL :clamping voltage @ 30 ns<br>'; ‘ @ 3 VCL :clamping voltage @ 60 ns<br>1 ! e 4 VCL :clamping voltage @ 100 ns<br>: ‘<br>ee EE SSnS: 1SS a ‘(nS SD<br>z 1 | | 20 ns/di v<br>**----- End of picture text -----**<br>
**Figure 7. HDMI2.0 5.94 Gbps eye diagram without ECMF04-4HSWM10 (evaluation board with SMA connector)**
**Figure 8. HDMI2.0 5.94 Gbps eye diagram with ECMF04-4HSWM10 (evaluation board with SMA connector)**
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**Characteristics**
**Figure 9. HDMI1.4 3.35 Gbps eye diagram Figure 10. HDMI1.4 3.35 Gbps eye diagram with without ECMF04-4HSWM10 ECMF04-4HSWM10**
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250mV/div 250mV/div<br>xenX.<br>49.8ps/div<br>49.8ps/div<br>**----- End of picture text -----**<br>
**Figure 11. TDR**
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**ECMF04-4HSWM10**
**Application information**
## **2 Application information**
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Figure 12. HDMI schematic<br>**----- End of picture text -----**<br>
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ECMF04<br>a D0 <>0)<br>D1<br>ECMF04<br>D2<br>eea ><br>Clock<br>SDA HDP_IC<br>SCL SDA_IC<br>GND GND SCL_IC<br>CEC CEC_IC<br>VDD_CEC FAULT<br>HDMI2C1-6C1<br>Figure 13. USB3.0 application<br>Connector ECMF02-4CMX8<br>| Lo ||<br>Vbus | Programmable en |) surerspeeo<br>USB2.0 OCP<br>D+ ——__-<br>Q0000 |<br>Q0000 |<br>| D-<br>|<br>ID | ars |<br>— i<br>USB 3.0<br>GND<br>transceiver<br>ECMF04-4HSWM10<br>USB3.0<br>Txp<br>| 14] ST<br>| Txn 12] E)||<br>|<br>i Rxp i<br>Rxn<br>HDMI ASIC<br>HDMI connector<br>HPD UTILITY HEAC+ HEAC-<br>5V_OUT VDD_5V VDD_CFC_IC VDD_IC<br>**----- End of picture text -----**<br>
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**PCB layout recommendations**
## **3 PCB layout recommendations**
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Figure 14. PCB layout recommendations<br>**----- End of picture text -----**<br>
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Connector Host<br>Pad layout 5000 µm<br>350 µm<br>150 µm<br>350 µm<br>Differential Differential<br>lanes lanes<br>(Z0 = 100 ) (Z0 = 100 )<br>330 µm<br>Figure 15. PCB stack dimensions<br>40 µm<br>105 µm<br>ε r [= 4.28]<br>170 µm<br>170 µm<br>**----- End of picture text -----**<br>
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**ECMF04-4HSWM10**
**Package information**
## **4 Package information**
- Epoxy meets UL94, V0
- Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _www.st.com._ ECOPACK[®] is an ST trademark.
## **Figure 16. µQFN-10L dimension definitions**
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Top view<br>D<br>Idex area<br>E<br>Side view<br>A1<br>A<br>Bottom view<br>e b<br>1 5<br>PIN # 1 ID<br>L<br>10 6<br>**----- End of picture text -----**<br>
**Table 4. µQFN-10L dimension values**
||**Table 4.µQFN-10L dimension values**|**Table 4.µQFN-10L dimension values**|**Table 4.µQFN-10L dimension values**|**Table 4.µQFN-10L dimension values**|**Table 4.µQFN-10L dimension values**|**Table 4.µQFN-10L dimension values**|
|---|---|---|---|---|---|---|
|**Ref.**|**Dimensions**||||||
||**Millimeters**|||**Inches**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.45|0.50|0.55|0.018|0.020|0.022|
|A1|0.00|0.02|0.05|0.00|0.0008|0.002|
|b|0.15|0.20|0.25|0.006|0.008|0.010|
|D|2.55|2.60|2.65|0.1|0.102|0.104|
|E|1.30|1.35|1.40|0.051|0.053|0.055|
|e||0.50|||0.020||
|L|0.40|0.50|0.60|0.016|0.020|0.024|
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**ECMF04-4HSWM10**
**Package information**
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Figure 17. Footprint Figure 18. Marking<br>0.20<br>0.70<br>1.75<br>KW<br>0.50<br>**----- End of picture text -----**<br>
_Note: Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose._
**Figure 19. Tape and reel specifications**
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Dot identifying Pin A1 location Ø 1.55±0.05<br>2.0±0.05 4.0±0.1<br>0.20±0.05<br>1.55±0.05 4.0<br>0.65±0.05<br>All dimensions are typical values in mm User direction of unreeling<br>1.75±0.1<br>2.8±0.05<br>3.5±0.05<br>8.0 +0.3 / -0.1<br>**----- End of picture text -----**<br>
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**Ordering information**
**ECMF04-4HSWM10**
## **5 Ordering information**
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Figure 20. Ordering information scheme<br>**----- End of picture text -----**<br>
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**----- Start of picture text -----**<br>
ECMF 04 – 4 HS W M10<br>Function<br> Common mode filter with ESD protection<br>Number if lines<br> 04 = 4 filtered lines<br>Number of ESD protected lines<br> 4 lines with ESD protection<br>Version<br> HS = High Speed<br>Application<br>WLAN 2.4 GHz<br>Package<br> M10: µQFN-10L<br>**----- End of picture text -----**<br>
**Table 5. Ordering information**
|**Order code**|**Marking(1)**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|ECMF04-4HSWM10|KW|µQFN-10L|5.00 mg|3000|Tape and reel|
1. The marking can be rotated by multiples of 90° to differentiate assembly location
## **6 Revision history**
**Table 6. Document revision history**
|**Date**|**Revision**||**Changes**|
|---|---|---|---|
|10-Jun-2014|1|Initial release.||
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