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ECMF04-4HSM10Y
Common Mode Filter, 0.1A, AEC-Q101, 2.6mm x 1.35mm x 0.75mm
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- Manufacturer: STMICROELECTRONICS
- Product type: SMD Common Mode Chokes / Filters
- SVHC: No SVHC (25-Jun-2025)
- Impedance: -
- Inductance: -
- Product Range: ECMF Series
- Product Width: 1.35mm
- Qualification: AEC-Q101
- Product Height: 0.75mm
- Product Length: 2.6mm
- DC Current Rating: 100mA
- DC Resistance Max: 5.5ohm
- Common Mode Filter Case: 2.6mm x 1.35mm x 0.75mm
- Inductor Case / Package: -
- Operating Temperature Max: 125°C
- Operating Temperature Min: -55°C
| Delivery and price | |
|---|---|
| Units per pack | 100 |
| Price | 0.309 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
**ECMF04-4HSM10Y** Datasheet Automotive common mode filter with ESD protection ## **Features** - AEC-Q101 qualified - • 2.2 GHz differential bandwidth to comply with HDMI 1.4, USB 3.1, MIPI, display port - • ~ - Common mode attenuation on LTE, GSM, and GPS frequencies: - -20 dB at 0.7 GHz - -25 dB from 0.8 to 0.9 GHz **==> picture [157 x 233] intentionally omitted <==** **----- Start of picture text -----**<br> D1+ Con 1 10 D1+ IC<br>D1- Con 2 9 D1- IC<br>GND 3 8 GND<br>D2+ Con 4 7 D2+ IC<br>D2- Con 5 6 D2- IC<br>Product status link<br>[Lo<br>ECMF04-4HSM10Y<br>Product summary<br>[oT<br>Order code ECMF04-4HSM10Y<br>**----- End of picture text -----**<br> - -14 dB at 1.5 GHz - Wettable flank for automatic optical inspection - Low PCB space consumption: 3.5 mm² - Thin package for compact applications: 0.75 mm - RoHS package ## **Complies with the following standards** - UL94, V0 - J-STD-020 MSL level 1 - J-STD-002 - IPC7531 footprint and JEDEC registered package - ISO 10605, IEC 61000-4-2, C = 150 pF – R = 330 Ω level 4: - 8 kV (contact discharge) - 15 kV (air discharge) - ISO 10605, C = 330 pF – R = 330 Ω level 4: - 8 kV (contact discharge) - 15 kV (air discharge) ## **Description** The ECMF04-4HSM10Y is an integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed buses HDMI 1.4, USB 3.1 and MIPI. It is designed to replace discrete common mode chokes or LTCC. The device embeds ESD protections on connector side to meets ISO 10605 requirements. Packaged in QFN-10L with wettable flank, it is compatible with automatic visual inspection. **DS12743** - **Rev 2** - **December 2019** For further information contact your local STMicroelectronics sales office. www.st.com **ECMF04-4HSM10Y Characteristics** ## **1 Characteristics** **Table 1. Absolute maximum ratings (Tamb = 25 °C)** |**Symbol**|**Parameter**||**Value**|**Unit**| |---|---|---|---|---| |VPP|Peak pulse voltage|ISO 10605 (C = 330 pF, R = 330 Ω):<br>Contact discharge<br>Air discharge|8<br>15|kV| |||ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω):<br>Contact discharge<br>Air discharge|8<br>15|| |IRMS|RMS current||100|mA| |Top|Operating ambient temperature range||-55 to +125|°C| |Tstg|Storage temperature range||-55 to +150|| **Figure 1. Electrical characteristics (definitions)** **I** VRM Maximum stand-off voltage VCL Clamping voltage at peak pulse current IPP **IPP** IRM Leakage current at VRM IPP Peak pulse current VBR Breakdown voltage **IIRMR V** RDC DC serial resistance **VRM VBR VCL** fC Differential cut off frequency **Table 2. Electrical characteristics (Tamb = 25 °C)** |**Symbol**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**| |---|---|---|---|---|---| |VBR|IR= 1 mA|6|7||V| |IRM|VRM= 3 V|||100|nA| |RDC|IDC= 20 mA||5.5||Ω| |fc|SDD21= -3 dB||2.2||GHz| |VCL|8 kV contact discharge after 30 ns, ISO 10605 (150 pF – 330 Ω)||27||V| **DS12743** - **Rev 2** **page 2/11** **ECMF04-4HSM10Y Characteristics (curves)** ## **1.1 Characteristics (curves)** **==> picture [480 x 184] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 2. Differential attenuation versus frequency Figure 3. Common mode attenuation versus frequency<br> (Z0_diff = 100 Ω) (Z0_com = 50 Ω)<br>0 SDD21 (dB) 0 SCC21 (dB)<br>-5<br>-1 Pon Hi \ al<br>-10<br>IN . J<br>-15<br>-2<br>-20<br>-3 -25<br>-30<br>-4<br>-35<br>F (Hz)<br>F (Hz)<br>-5 -40<br>10M 30M 100M 300M 1G 3G 10M 30M 100M 300M 1G 3G<br>**----- End of picture text -----**<br> **Figure 4. ISO 10605 - C = 150 pF, R = 330 Ω (+8 kV contact) Figure 5. ISO 10605 - C = 150 pF, R = 330 Ω (-8 kV contact)** **Figure 6. TLP characteristic** **==> picture [222 x 160] intentionally omitted <==** **----- Start of picture text -----**<br> 20 a I(A)<br>a<br>a<br>aa a<br>15 aaPrerrypyrryrrprry a yyy ey ype eee eee<br>10 7a<br>a<br>><br>a<br>5 A<br>a 2<br>2<br>0 a a<br>a<br>YA<br>-5 7a”<br>a<br>aA<br>7A<br>-10 aa<br>a<br>a<br>-15 a<br>oe |<br>a V(V) [ |<br>-20 aCJ<br>-40 -30 -20 -10 0 10 20 30 40<br>**----- End of picture text -----**<br> **DS12743** - **Rev 2** **page 3/11** **ECMF04-4HSM10Y Characteristics (curves)** **Figure 7. HDMI1.4 – 1.485 Gbps eye diagram without device** **Figure 9. MIPI - 5.83 Gbps eye diagram without device** **Figure 11. USB3.1 – 5 Gbps eye diagram without device (with worst cable and equalizer)** **Figure 8. HDMI1.4 – 1.485 Gbps eye diagram with device** **Figure 10. MIPI - 5.83 Gbps eye diagram with device** **Figure 12. USB3.1 – 5 Gbps eye diagram with device (with worst cable and equalizer)** **DS12743** - **Rev 2** **page 4/11** **ECMF04-4HSM10Y Package information** ## **2 Package information** In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. ## **2.1 QFN-10L package information** **Figure 13. QFN-10L package outline** **==> picture [248 x 206] intentionally omitted <==** **----- Start of picture text -----**<br> L A<br>D<br>e<br>b A1<br>A3 E<br>CD<br>CW<br>1 1<br>10(N)<br>6 5<br>plane Seatin<br>g<br>**----- End of picture text -----**<br> **Table 3. QFN-10L mechanical data** ||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---|---|---| |**Ref.**|**Millimeters**|||**Inches(1)**||| ||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**| |A|0.70|0.75|0.80|0.0275|0.0295|0.0315| |A1|0.00|0.02|0.05|0.0000|0.0008|0.0020| |A3||0.20|||0.0079|| |b|0.15|0.20|0.25|0.0059|0.0079|0.0099| |D|2.55|2.60|2.65|0.1003|0.1024|0.1044| |E|1.30|1.35|1.40|0.0511|0.0531|0.0552| |e||0.50|||0.0197|| |L|0.45|0.50|0.55|0.0177|0.0197|0.0217| |CW|0.01|0.05|0.09|0.0003|0.0020|0.0032| |CD|0.10|||0.0039||| _1. Value in inches are converted from mm and rounded to 4 decimal digits_ **DS12743** - **Rev 2** **page 5/11** **ECMF04-4HSM10Y PCB assembly recommendations** ~~ow~~ ## **3** ## **PCB assembly recommendation** **Figure 14. Recommended PCB layout** **==> picture [287 x 6] intentionally omitted <==** **----- Start of picture text -----**<br> Connector Host<br>**----- End of picture text -----**<br> **Figure 15. Recommended PCB stack-up** **==> picture [204 x 136] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 16. Recommended stencil opening (mm)<br>0.190 0.500<br>aa<br>2.190<br>ont<br>Stencil opening thickness: 100 µm<br>0.660<br>1.710<br>**----- End of picture text -----**<br> **Figure 17. Wettable flank profile** ## **3.1 Solder paste** 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Use solder paste with fine particles: powder particle size is 20-38 μm. **DS12743** - **Rev 2** **page 6/11** **ECMF04-4HSM10Y QFN-10L packing information** ## **3.2 QFN-10L packing information** **Figure 18. Footprint recommendations (mm)** **==> picture [149 x 123] intentionally omitted <==** **----- Start of picture text -----**<br> 0.200 0.500<br>—| F a<br>aa d<br>vacua<br>lin<br>|_______. 2.200<br>00<br>.7<br>0<br>1.750<br>**----- End of picture text -----**<br> **Figure 20. Package orientation in reel** **Figure 19. Marking** **==> picture [127 x 127] intentionally omitted <==** **----- Start of picture text -----**<br> XXYM<br>a<br>Dot indicates pin 1<br>XX: Marking<br>Y: Year<br>M: Month<br>**----- End of picture text -----**<br> **Figure 21. Tape and reel orientation** **==> picture [183 x 30] intentionally omitted <==** **----- Start of picture text -----**<br> Pin 1 located according to EIA-481<br>Note: Pocket dimensions are not on scale<br>Pocket shape may vary depending on package<br>**----- End of picture text -----**<br> **Figure 22. Reel dimensions (mm)** **==> picture [155 x 103] intentionally omitted <==** **----- Start of picture text -----**<br> Ø 180 max<br>14.4<br>2±0.5<br>Ø 13<br>Ø 60 Ø 20.2 min<br>**----- End of picture text -----**<br> **Figure 23. Inner box dimensions (mm)** **==> picture [106 x 144] intentionally omitted <==** **----- Start of picture text -----**<br> 30<br>205<br>205<br>**----- End of picture text -----**<br> **DS12743** - **Rev 2** **page 7/11** **ECMF04-4HSM10Y Solder reflow** ## **Figure 24. Tape and reel outline** **Table 4. Tape and reel mechanical data** |**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---| ||**Millimeters**||| ||**Min.**|**Typ.**|**Max.**| |ØD0|1.40|1.50|1.50| |ØD1|0.80||| |F|1.65|1.75|1.85| |K0|0.85|0.95|1.05| |P0|3.9|4.0|4.1| |P1|3.9|4.0|4.1| |P2|1.95|2.00|2.05| |W|7.9|8.0|8.3| ## **3.3** ## **Solder reflow** **Figure 25. ST ECOPACK[®] recommended soldering reflow profile for PCB mounting** **==> picture [244 x 130] intentionally omitted <==** **----- Start of picture text -----**<br> [| 240-245 °C<br>Temperature (°C)<br>250 -2 °C/s<br>2 - 3 °C/s<br>200 60 sec<br>pense teeta reffa i<br>(90m ax) -3 °C/s<br>150 PT || /<br>er [LN] [G] Ld -6° C/s<br>100<br>Ploeg| | Tt EN<br>0.9 °C/s<br>50 Z a<br>Time (s)<br>A C EC<br>0 30 60 90 120 150 180 210 240 270 300<br>**----- End of picture text -----**<br> _Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020._ **DS12743** - **Rev 2** **page 8/11** **ECMF04-4HSM10Y Ordering information** ## **4 Ordering information** |**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**| |---|---|---|---|---|---| |ECMF04-4HSM10Y|AY(1)|QFN-10L|7 mg|3000|Tape and reel| _1. The marking can be rotated by 90° to differentiate assembly location_ **DS12743** - **Rev 2** **page 9/11** **ECMF04-4HSM10Y** ## **Revision history** **Table 5. Document revision history** |**Date**|**Version**|**Changes**| |---|---|---| |06-Sep-2018|1|Initial release.| |09-Dec-2019|2|Added Stencil opening design andSection 3.1.| **DS12743** - **Rev 2** **page 10/11** **ECMF04-4HSM10Y** ## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved **DS12743** - **Rev 2** **page 11/11**
Updated at June 5, 2026
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