ECMF02-4CMX8
Common Mode Filter, USB 2.0, µQFN-8
- Manufacturer: STMICROELECTRONICS
- Product type: Integrated Passive Filters
- EMI Filter Type:Common Mode Filter with ESD Protection; No. of Data Lines:4 Data Lines; Filter Circuit:Common-Mode; Filter Case Style:µQFN; No. of Pins:8Pins; Product Range:-; SV
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 8Pins
- Product Range: ECMF Series
- Filter Circuit: Common-Mode
- EMI Filter Type: Common Mode Filter with ESD Protection
- No. of Data Lines: 4 Data Lines
- Filter Case / Package: µQFN
| Delivery and price | |
|---|---|
| Units per pack | 1500 |
| Price | 0.222 € |
| Current stock | 1000+ |
| Lead time | 30 days |
## **ECMF02-4CMX8** ## Common mode filter with ESD protection for USB 2.0 interface **Datasheet production data** ## **Applications** Where transient overvoltage protection in ESD sensitive equipment is required, such as: - Computers - Printers - Communication systems - Cellular phone handsets and accessories - Video equipment ## **Description** ## **Features** - Integrated common mode filter - Differential pair ESD protection - 16 V VBUS ESD and EOS protection The ECMF02-4CMX8 affords key component integration such as common mode filter D+ and D- lines and ESD protection on all lines. This device offers an optimized flow-through footprint for USB 2.0 applications. ## **Figure 1. Pin configuration (top view)** - ID pin ESD protection - Low profile micro QFN-8L package - High bandwidth: > 6 GHz - Optimized for high speed USB 2.0 - High common mode attenuation at 900 MHz and 1.8 GHz - Support for audio over USB 2.0 thanks to bidirectional ESD protection - Ultra compact, low board space - Low height: < 0.55 mm ## **Complies with the following standards:** - IEC 61000-4-2 level 4: - 15 kV (air discharge) - 8 kV (contact discharge) - RoHS2 compliant May 2015 DocID022286 Rev 3 1/16 This is information on a product in full production. _www.st.com_ **Characteristics** **ECMF02-4CMX8** ## **1 Characteristics** **Table 1. Absolute maximum ratings (Tamb = 25 °C)** |**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**| |---|---|---|---|---| |VPP|Peak pulse voltage(1)|ESD discharge IEC 61000-4-2, level 4<br>Contact discharge on D+/D- pins<br>Contact discharge on VBUSand IDpins<br>Air discharge on all pins|10<br>20<br>30|kV| |PPP|Peak pulse power (8/20µs) on VBUS||150|W| |IPP|Peak pulse current (8/20µs) on VBUS||4.8|A| |Tj|Maximum operating junction temperature||-40 to +125|°C| |Tstg|Storage temperature range||-55 to +150|°C| 1. Measurements done on IEC 61000-4-2 test bench. For further details see Application note AN3353. **Figure 2. Electrical characteristics - definitions** 2/16 DocID022286 Rev 3 **ECMF02-4CMX8** **Characteristics** **Table 2. Electrical characteristics (values, Tamb = 25 °C)** |**Symbol**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**| |---|---|---|---|---|---| |**Data lines**|||||| |VBR|IR= 1 mA|6|||V| |IRM|VRM= 5.5 V per line|||100|nA| |RDC|DC serial resistance on data line||3|4|Ω| |**VBUS**|||||| |VBR|IR= 1 mA|15|16.5|18|V| |IRM|VRM= 12 V|||50|nA| |VCL|Clamping voltage. IPP= 1 A, tp= 8/20 µs|||20|V| |VCL|Clamping voltage. IPP= 2.5 A, tp= 8/20 µs|||24|V| |**ID**|||||| |VBR|IR= 1 mA|6|||V| |IRM|VRM= 1.5 V per line|||100|nA| DocID022286 Rev 3 3/16 **Characteristics** **ECMF02-4CMX8** **Figure 3. SDD21 differential attenuation measurement (Z0 diff = 90** Ω **) for data lines D+ and D-** **Figure 4. SCC21 common mode attenuation measurement (Z0 com = 45** Ω **)** 4/16 DocID022286 Rev 3 **ECMF02-4CMX8** **Characteristics** **Figure 5. ID frequency response measurement (Z0 = 75** Ω **)** **Figure 6. Differential (ZDD21) and common mode (ZCC21) impedance versus frequency** DocID022286 Rev 3 5/16 **Characteristics** **ECMF02-4CMX8** ## **Figure 7. ESD test conditions** ## **Figure 8. ESD response to IEC 61000-4-2 (+8 kV contact discharge) on VBUS** 6/16 DocID022286 Rev 3 **ECMF02-4CMX8** **Characteristics** **Figure 9. ESD response to IEC 61000-4-2 (-8 kV contact discharge) on VBUS** ## **Figure 10. ESD response to IEC 61000-4-2 (+8 kV contact discharge) on ID** DocID022286 Rev 3 7/16 **Characteristics** **ECMF02-4CMX8** **==> picture [346 x 11] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 11. ESD response to IEC 61000-4-2 (-8 kV contact discharge) on ID<br>**----- End of picture text -----**<br> ## **Figure 12. ESD response to IEC 61000-4-2 (+8 kV contact discharge) on differential lane** 8/16 DocID022286 Rev 3 **ECMF02-4CMX8** **Characteristics** **Figure 13. ESD response to IEC 61000-4-2 (-8 kV contact discharge) on differential lane** **Figure 14. Eye diagram (loaded by Zdiff = 90** **) Figure 15. Eye diagram (loaded by Zdiff = 90** **) with USB2.0 [mask 1] board only with USB2.0 [mask 1] board with ECM02-4CMX8** DocID022286 Rev 3 9/16 **Characteristics** **ECMF02-4CMX8** **Figure 16. TDR measurement (loaded by Zdiff = 90** **), rise time 400 ps** ## **Figure 17. HS sync** 10/16 DocID022286 Rev 3 **ECMF02-4CMX8** **Characteristics** ## **Figure 18. Total harmonic distortion on differential lanes** ## **Figure 19. Crosstalk on differential lanes** DocID022286 Rev 3 11/16 **ECMF02-4CMX8** **Application schematic** ## **2 Application schematic** ## **Figure 20. Application schematic** 12/16 DocID022286 Rev 3 **ECMF02-4CMX8** **Package information** ## **3 Package information** - Epoxy meets UL94, V0 - Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at _: www.st.com._ ECOPACK[®] is an ST trademark. ## **3.1 Micro QFN-8L package information** ## **Figure 21. Micro QFN-8L package outline** **==> picture [405 x 257] intentionally omitted <==** **----- Start of picture text -----**<br> �<br>�<br>� ����<br>�<br>�����<br>�<br>��<br>���� �<br>**----- End of picture text -----**<br> **Table 3. Micro QFN-8L package mechanical data** ||**Table 3. Micro QFN-8Lpackage mechanical data**|**Table 3. Micro QFN-8Lpackage mechanical data**|**Table 3. Micro QFN-8Lpackage mechanical data**|**Table 3. Micro QFN-8Lpackage mechanical data**|**Table 3. Micro QFN-8Lpackage mechanical data**|**Table 3. Micro QFN-8Lpackage mechanical data**| |---|---|---|---|---|---|---| |**Ref.**|**Dimensions**|||||| ||**Millimeters**|||**Inches(1)**||| ||**Typ.**|**Min.**|**Max.**|**Typ.**|**Min.**|**Max.**| |A|0.50|0.45|0.55|0.020|0.018|0.022| |A1|0.02|0.00|0.05|0.0008|0.00|0.002| |b|0.20|0.15|0.25|0.008|0.006|0.010| |D|2.50|2.45|2.55|0.098|0.096|0.100| |E|1.20|1.15|1.25|0.047|0.045|0.049| DocID022286 Rev 3 13/16 **ECMF02-4CMX8** **Package information** **Table 3. Micro QFN-8L package mechanical data (continued)** ||**Table 3. Micro QFN-8L package mechanical data (continued)package mechanical data (continued)ackage mechanical data (continued)ge mechanical data (continued)e mechanical data (continued)(continued)continued))**|**Table 3. Micro QFN-8L package mechanical data (continued)package mechanical data (continued)ackage mechanical data (continued)ge mechanical data (continued)e mechanical data (continued)(continued)continued))**|**Table 3. Micro QFN-8L package mechanical data (continued)package mechanical data (continued)ackage mechanical data (continued)ge mechanical data (continued)e mechanical data (continued)(continued)continued))**|**Table 3. Micro QFN-8L package mechanical data (continued)package mechanical data (continued)ackage mechanical data (continued)ge mechanical data (continued)e mechanical data (continued)(continued)continued))**|**Table 3. Micro QFN-8L package mechanical data (continued)package mechanical data (continued)ackage mechanical data (continued)ge mechanical data (continued)e mechanical data (continued)(continued)continued))**|**Table 3. Micro QFN-8L package mechanical data (continued)package mechanical data (continued)ackage mechanical data (continued)ge mechanical data (continued)e mechanical data (continued)(continued)continued))**| |---|---|---|---|---|---|---| |**Ref.**|**Dimensions**|||||| ||**Millimeters**|||**Inches(1)**||| ||**Typ.**|**Min.**|**Max.**|**Typ.**|**Min.**|**Max.**| |e|0.50|0.45|0.55|0.020|0.018|0.022| |L|0.40|0.30|0.50|0.016|0.012|0.020| 1. Values in inches are converted from mm and rounded to 4 decimal digits. **Figure 22. Footprint Figure 23. Marking** ## **Figure 24. Tape and reel specifications** _Note: More packing information is available in the application notes: AN1751: “EMI Filters: Recommendations and measurements”_ 14/16 DocID022286 Rev 3 **ECMF02-4CMX8** **Ordering information** ## **4 Ordering information** ## **Figure 25. Ordering information scheme** **Table 4. Ordering information** |**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**| |---|---|---|---|---|---| |ECMF02-4CMX8|KG|Micro QFN-8L|3.7 mg|3000|Tape and reel| For the latest information on available order codes see the product pages on: _www.st.com._ ## **5 Revision history** **Table 5. Document revision history** |**Date**|**Revision**|**Changes**| |---|---|---| |19-Sep-2012|1|Initial release.| |27-May-2014|2|Updated_Figure 24_,_Figure 25_and reformatted the document.| |05-May-2015|3|Added_Figure 6_.<br>Updated_Table 1_.<br>Format updated to current standard.| DocID022286 Rev 3 15/16 **ECMF02-4CMX8** ## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2015 STMicroelectronics – All rights reserved 16/16 DocID022286 Rev 3
Updated at March 31, 2026
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