ECMF02-2HSMX6

## **ECMF02-2HSMX6** 

## ESD protected common mode filter for USB3.0 interface 

**Datasheet** - **production data** 

- Save components count 

- Make the application robust against ESD strikes from external environment 

## **Description** 

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µQFN-6L 1.7 x 1.5 mm<br>**----- End of picture text -----**<br>


The ECMF02-2HSMX6 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like the USB3.0 transceiver. 

## **Figure 1. Pin out, top view** 

## **Applications** 

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D+ connector 1 6 D+ IC<br>D- connector 2 5 D- IC<br>GND 3 4 To be left floating<br>**----- End of picture text -----**<br>


Consumer and computer electronics featuring USB3.0 such as: 

- Personal computer 

- Notebook 

- Tablet 

- Set-top boxes 

- PC graphic cards 

## **Features** 

      - Telecom application 

- High common mode attenuation: 

   - -10 dB @ 300 MHz 

   - -20 dB @ 2.4 and 5 GHz 

   - -15 dB from 500 MHz to 6 GHz 

- Compliant with USB3.0 eye diagram 

- Small and thin package 1.5 x 1.7 x 0.5 mm 

- RoHS compliant. 

- High reduction of parasitic elements through integration. 

- ESD protection compliant with IEC 61000-4-2 level 4 standards (8 kV contact) 

## **Benefits** 

- Suppress the common mode noise but keep signal integrity 

- Low PCB space consumption. 

December 2017 

DocID025079 Rev 3 

1/17 

This is information on a product in full production. 

_www.st.com_ 

**ECMF02-2HSMX6** 

**Functional description** 

## **1 Functional description** 

The ECMF02-2HSMX6 is an ESD protected common mode filter especially designed for USB3.0 Tx/Rx differential pair, for host and device. The USB3.0 is actually made of 3 differential pairs. The first differential pair supports the high speed USB mode (also called USB2.0 mode). The 2 other differential pairs are used to support the super speed USB mode in full duplex. Bit rate on super speed USB can reach 5 Gbps. The ECMF02-2HSMX6 is able to filter the common mode noise from 300 MHz to 6 GHz, helping to make the application compliant with the electromagnetic interference emission standard such as CISPR22 or FCC part 15, or EN55022 and avoiding antenna desense on mobile phones, WiFi/Bluetooth, GPS,/GNSS frequencies. At the same time, the ECMF02-2HSMX6 keeps the high speed signal integrity and provides an efficient ESD protection. 

More application information available in following AN: 

- Application Note AN4356: "Antenna desense on handheld equipment" 

- Application Note AN4511: "Common Mode filters" 

- Application Note AN4540: "MHL link filtering and protection" 

**Figure 2. Functional diagram** 

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D+ connector 1 6 D+ IC<br>D- connector 2 5 D- IC<br>GND 3 4 To be left floating<br>**----- End of picture text -----**<br>


A typical application diagram is shown in _Figure 3_ . ST offers a global approach to USB3.0 interface by providing a comprehensive range of dedicated products. 

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**Functional description** 

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Figure 3. Typical application diagram<br>Host Hub/device<br>USB 3.0 cable<br>USB 2.0 VBUS VBUS GND VBUS GND VBUS USB 2.0<br>D+ D- D- D- D- D+<br>High High<br>Speed D- D+ D+ D+ D+ D- Speed<br>Driver GND GND ID ID GND GND Driver<br>ECMF02-4CMX8 ECMF02-4CMX8<br>+ SSTX+ D-6 D-1 1 6 SSTX+ +<br>USB 3.0 SSTX- IDD+45 GNDD+32 32 45 SSTX- USB 3.0<br>. z iz :<br>ECMF02-2HSMX6 ECMF02-2HSMX6<br>Super Super<br>Speed Speed<br>Driver Driver<br>+ SSRX+ D-6 D-1 1 6 SSRX+ +<br>SSRX- IDD+45 GNDD+32 32 45 SSRX-<br>ECMF02-2HSMX6 ECMF02-2HSMX6<br>L L<br>CONNECTOR CONNECTOR<br>D- D-<br>D+ D+<br>GND ID<br>D- D-<br>D+ D+<br>GND ID<br>**----- End of picture text -----**<br>


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**ECMF02-2HSMX6** 

**Electrical characteristics** 

## **2 Electrical characteristics** 

**Table 1. Absolute maximum ratings (limiting values)** 

|**Symbol**|**Parameter**|**Test conditions**|**Value.**|**Unit**|
|---|---|---|---|---|
|VPP|ESD discharge (pins 1 and 2)<br>IEC 61000-4-2 level 4|Contact discharge|±8|kV|
|||Air discharge|±15|kV|
|IDC|Maximum DC current||100|mA|
|TOP|Operating temperature range||-55 to +125|°C|
|TJ|Maximum junction temperature||125|°C|
|Tstg|Storage temperature range||-55 to +150|°C|



## **Figure 4. Electrical characteristics (definitions)** 

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I<br>Symbol     Parameter<br>VBR =        Breakdown voltage IF<br>IRM =        Leakage current @ VRM<br>VRM =        Stand-off voltage<br>VCL =        Clamping voltage at IPP VCL VBR VRM VF<br>IPP =        Peak pulse current V<br>IF =        Forward current IRM<br>VF =        Forward voltage IR<br>IPP<br>**----- End of picture text -----**<br>


**Table 2. Electrical characteristics (Tamb = 25 °C)** 

|**Symbol**|**Parameter**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|
|VBR|Breakdown voltage|IR= 1 mA|6|||V|
|IRM|Reverse leakage|VRM= 3 V|||100|nA|
|RDC|DC serial resistance|||7|9|Ω|



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**Electrical characteristics** 

_Figure 5_ shows that USB3.0 devices and cables can interfere with radio frequency devices operating between 700 MHz and 5 GHz. 

**Figure 5. USB3.0 frequency radiation measured with current loop** 

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dB<br>-70<br>Skew<br>-75<br>-80<br>-85<br>-90<br>-95<br>Frequency (GHz)<br>-100<br>0 0,5 1 1,5 2 2,5 3 3,5 4 4,5 5 5,5 6<br>**----- End of picture text -----**<br>


**Figure 6. Differential attenuation versus frequency** 

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SDD21 (dB)<br>0<br>F0 @-3 dB = 3.2 GHz<br>-1<br>-2<br>-3<br>-4<br>F (Hz)<br>-5<br>10M 30M 100M 300M 1G 3G<br>**----- End of picture text -----**<br>


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**ECMF02-2HSMX6** 

**Electrical characteristics** 

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Figure 7. Common mode attenuation versus frequency<br>SCC21 (dB)<br>0<br>USB3.0 S21CC template<br>-5<br>-10<br>-15<br>-20<br>-25<br>-30<br>-35<br>F (Hz)<br>-40<br>10M 30M 100M 300M 1G 3G<br>**----- End of picture text -----**<br>


_Note: STMicroelectronics has defined the USB3.0 SCC21 template to prevent antenna desense between 700 MHz and 5 GHz._ 

**Figure 8. Return loss versus frequency (Z0 COM = 50** Ω **- SDD11)** 

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SDD11 (dB)<br>0<br>-5<br>-10<br>-15<br>-20<br>-25<br>-30<br>-35<br>F (Hz)<br>40-<br>10M 30M 100M 300M 1G 3G<br>**----- End of picture text -----**<br>


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**ECMF02-2HSMX6** 

**Electrical characteristics** 

## **Figure 9. Return loss versus frequency (Z0 COM = 50** Ω **- SDD22)** 

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SDD22 (dB)<br>0 a|<br>-5 a|<br>-10 a a<br>-15 IE ETI ZT<br>-20<br>-25<br>aete|IIL ET  IT<br>-30 a ||<br>-35<br>F (Hz)<br>a | |<br>-40<br>10M 30M 100M 300M 1G 3G<br>ure 10. Differential (ZDD21) and common mode (ZCC21) impedance versus frequenc(ZDD21) and common mode (ZCC21) impedance versus frequencZDD21) and common mode (ZCC21) impedance versus frequencDD21) and common mode (ZCC21) impedance versus frequenc) and common mode (ZCC21) impedance versus frequenc and common mode (ZCC21) impedance versus frequenc(ZCC21) impedance versus frequencZCC21) impedance versus frequencCC21) impedance versus frequenc) impedance versus frequenc impedance versus frequencpedance versus frequencedance versus frequencquencuency<br>ZDD21<br>1E4<br>ZCC21<br>(Ω)<br>1E3<br>|<br>|<br>1E2<br>1E1 |<br>ie Sea<br>F<br>(Hz)<br>TT TTF<br>1E7 1E8 1E9 6E9<br>**----- End of picture text -----**<br>


## **Figure 10. Differential (ZDD21) and common mode (ZCC21) impedance versus frequenc(ZDD21) and common mode (ZCC21) impedance versus frequencZDD21) and common mode (ZCC21) impedance versus frequencDD21) and common mode (ZCC21) impedance versus frequenc) and common mode (ZCC21) impedance versus frequenc and common mode (ZCC21) impedance versus frequenc(ZCC21) impedance versus frequencZCC21) impedance versus frequencCC21) impedance versus frequenc) impedance versus frequenc impedance versus frequencpedance versus frequencedance versus frequencquencuency** 

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**ECMF02-2HSMX6** 

**Electrical characteristics** 

## **Figure 11. Typical ESD response to IEC 61000-4-2 +8kV contact** 

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10 V/div<br>[ T\ t' I| ‘e\ 1 VPP: ESD peak voltage ]<br>2 VCL :clamping voltage @ 30 ns<br>e 1 56.4 V | \ | '$ 3 VCL :clamping voltage @ 60 ns<br>4 VCL :clamping voltage @ 100 ns<br>OUTPUT \ Il| t \|<br>\1i!<br>|I | i |<br>2 26.8 V<br>i @ i e 3 19.0 V i<br>4 12.5 V<br>eeeenare | ( Step .eel'et ieeei‘ ee<br>\i !<br>‘sialon ‘imineam im Vida aa alia Veale iahteaceal |iim<br>Se eee ee pe ee Ee eee SS oe ne ead een<br>|iLi<br>HH | H 4<br>\ 1 t i<br>' ‘ + fy<br>It<br>i\ T \<br>20 ns/div<br>t Piimax(C2) P22)1 PRNG(C2)I Paix| 1 | !<br>2) PS. PB. + PT: = PB. ==<br>56.4V¥ 2A¥ 19.9Vv 125Vv<br>10.0 Vidiv 20.0 nsJdiv |Normal 5oVv<br>-30.00 V ofst 400ks 20 GSvs J [Edge] Positive<br>Figure 12. Typical ESD response to IEC 61000-4-2 -8kV contact<br>[ 10 V/div<br>| It |<br>| | | |<br>I | |<br> eciemcaacee) (Are ecient EDN CS meen, ROR F ag fny iii Sie Se ie ee aa |<br>—|SY|[yom - — ———— ee<br>I i |<br>ji:| if i| | [(eeneens] i nhte wes eeenneenI H beeen wr Gebeeeens meeenenes pean le|<br>\ || e 3 -9.9 V || e 4 -6.4 V<br>2 -16.0 V<br>OUTPUT \ | 1<br>| | if | e@ 1 VPP: ESD peak voltage<br>||||@ 2 VCL :clamping voltage @ 30 ns<br>\| | | @ 3 VCL :clamping voltage @ 60 ns<br>‘H|:@ 4 VCL :clamping voltage @ 100 ns<br>|| + |<br>| | T | min<br>1 -60.2 V<br>| | | |<br>20 ns/div<br>**----- End of picture text -----**<br>


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**ECMF02-2HSMX6** 

**Electrical characteristics** 

**Figure 13. USB2.0 (480 Mbps) eye diagram without device** 

**Figure 15. USB3.0 (5 Gbps) eye diagram without device** 

**Figure 17. USB3.1 (10 Gbps) eye diagram without device** 

**Figure 14. USB2.0 (480 Mbps) eye diagram with device** 

**Figure 16. USB3.0 (5 Gbps) eye diagram with device** 

**Figure 18. USB3.1 (10 Gbps) eye diagram with device** 

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**Electrical characteristics** 

**Figure 19. MHL (4.5 Gbps) eye diagram without device** 

**Figure 21. MHL (6 Gbps) eye diagram without device** 

**Figure 23. Display Port HBR2 (5.4 Gbps) eye diagram without device** 

**Figure 20. MHL (4.5 Gbps) eye diagram with device** 

**Figure 22. MHL (6 Gbps) eye diagram with device** 

**Figure 24. Display Port HBR2 (5.4 Gbps) eye diagram with device** 

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**ECMF02-2HSMX6** 

**Package information** 

## **3 Package information** 

- Epoxy meets UL94, V0 

- Lead-free package 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _www.st.com_ . ECOPACK[®] is an ST trademark. 

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Figure 25. µQFN-6L dimension definitions<br>**----- End of picture text -----**<br>


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Top view<br>D<br>Index area<br>E<br>Side view<br>A1<br>A<br>Bottom view<br>e b<br>1 3<br>L1<br>PIN # 1 ID<br>L2<br>6 4<br>**----- End of picture text -----**<br>


**Table 3. µQFN-6L dimension values** 

||**Table 3.µQFN-6L dimension values**|**Table 3.µQFN-6L dimension values**|**Table 3.µQFN-6L dimension values**|**Table 3.µQFN-6L dimension values**|**Table 3.µQFN-6L dimension values**|**Table 3.µQFN-6L dimension values**|
|---|---|---|---|---|---|---|
|**Ref.**|**Dimensions**||||||
||**Millimeters**|||**Inches**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.45|0.50|0.55|0.018|0.020|0.022|
|A1|0.00|0.02|0.05|0.000|0.001|0.002|
|b|0.15|0.20|0.25|0.006|0.008|0.010|
|D|1.55|1.60|1.65|0.061|0.063|0.065|
|E|1.30|1.35|1.40|0.051|0.053|0.055|
|e|0.45|0.50|0.55|0.018|0.020|0.022|
|L1|0.35|0.45|0.55|0.014|0.018|0.022|
|L2|0.65|0.75|0.85|0.026|0.030|0.034|



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**ECMF02-2HSMX6** 

**Package information** 

**Figure 26. Footprint, dimensions in mm Figure 27. Marking (inches)** 

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0.25 0.50<br>(0.0098) (0.0197)<br>Dot,<br>xx = marking<br>z = manufacturing location<br>yww = datecode x x z<br>(y = year<br>ww = week)<br>y w w<br>Figure 28. Tape and reel specifications<br>Dot identifying Pin A1 location Ø 1.55<br>2.0 4.0<br>0.22<br>xxx xxx xxx<br>yww yww yww<br>0.75 1.63 4.0<br>All dimensions are typical values in mm User direction of unreeling<br>1.75<br>1.85<br>3.5<br>8.0<br>0.65<br>(0.0256)<br>0.30<br>(0.0118)<br>0.95<br>(0.0374)<br>**----- End of picture text -----**<br>


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**ECMF02-2HSMX6** 

**Recommendation on PCB assembly** 

## **4 Recommendation on PCB assembly** 

## **4.1 Stencil opening design** 

1. General recommendation on stencil opening design 

   - a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). 

## **Figure 29. Stencil opening dimensions** 

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L<br>T<br>W<br>b)  General design rule<br>Stencil thickness (T) = 75 ~ 125 µm<br>W<br>Aspect Ratio =  1.5<br>[-----] T<br>Aspect Area = --------------------------L  W -  0.66<br>2TL + W<br>**----- End of picture text -----**<br>


2. Reference design 

   - a) Stencil opening thickness: 100 µm 

   - b) Stencil opening for leads: Opening to footprint ratio is 90%. 

## **4.2 Solder paste** 

1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004. 

2. “No clean” solder paste recommended. 

3. Offers a high tack force to resist component displacement during PCB movement. 

4. Use solder paste with fine particles: powder particle size 20-45 µm. 

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**Recommendation on PCB assembly** 

**ECMF02-2HSMX6** 

## **Figure 30. Recommended stencil window position** 

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0.25 0.50<br>(0.0098) (0.0197)<br>Stencil window<br>Footprint<br>0.24 0.50 mm<br>(0.0095) (0.0197) (inches)<br>0.62 0.65<br>(0.0244) (0.0256)<br>0.34 0.30<br>(0.0134) (0.0118)<br>0.90 0.95<br>(0.0354) (0.0374)<br>**----- End of picture text -----**<br>


## **4.3 Placement** 

1. Manual positioning is not recommended. 

2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering. 

3. Standard tolerance of ± 0.05 mm is recommended. 

4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 

5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 

6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 

## **4.4 PCB design preference** 

1. To control the solder paste amount, the closed via is recommended instead of open vias. 

2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 

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**Recommendation on PCB assembly** 

## **4.5 Reflow profile** 

**Figure 31. ST ECOPACK[®] recommended soldering reflow profile for PCB mounting** 

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240-245 °C<br>250 Temperature (°C) -2  ° C/s<br>2 - 3 °C/s<br>200 60 sec<br>(90 max) -3 °C/s<br>150<br>-6 °C/s<br>100<br>0.9 °C/s<br>50<br>Time (s)<br>0 30 60 90 120 150 180 210 240 270 300<br>**----- End of picture text -----**<br>


_Note: Minimize air convection currents in the reflow oven to avoid component movement._ 

## **4.6 PCB layout recommendation** 

## **Figure 32. PCB footprint recommendation** 

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Zdiff according to the application<br>Via to GND plane<br>**----- End of picture text -----**<br>


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**Ordering information** 

**ECMF02-2HSMX6** 

## **5 Ordering information** 

## **Figure 33. Ordering information scheme** 

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ECMF   02 - 2     HS   MX6<br>Function<br>ESD common mode filter<br>Number of lines<br>02 = 2 lines<br>Number of ESD protected lines<br>2 = 2 ESD protected lines<br>Version<br>HS = High speed lines<br>Package<br>Mx6 = µQFN-6L<br>**----- End of picture text -----**<br>


**Table 4. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|ECMF02-2HSMX6|KR|µQFN-6L|3.4 mg|3000|Tape and reel|



## **6 Revision history** 

**Table 5. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|13-Nov-2013|1|Initial release.|
|25-Aug-2014|2|Inserted Figure 10: Differential (ZDD21) and common<br>mode (ZCC21) impedance versus frequency.|
|13-Dec-2017|3|Updated_Table 1_.|



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**ECMF02-2HSMX6** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2017 STMicroelectronics – All rights reserved 

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