ECMF02-2BF3

## **ECMF02-2BF3** 

## Dual line IPAD™, common mode filter with ESD protection for high speed serial interface 

**Datasheet** - **production data** 

## **Description** 

The ECMF02-2BF3 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like MIPI D-PHY, MDDI, USB 2.0 and HDMI. 

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Flip Chip<br>5 bumps<br>**----- End of picture text -----**<br>


The ECMF02-2BF3 can protect and filter one differential lane. 

## **Figure 1. Pin configuration (bump side)** 

## **Features** 

- Very large differential bandwidth above 5 GHz 

- High common mode attenuation: 

   - - 23 dB at 900 MHz. 

- High common mode attenuation: 

   - - 20 dB between 800 MHz and 2.2 GHz. 

- Very low PCB space consumption: <1.1mm[2] 

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2 1<br>IN1 OUT1 A<br>IN2 OUT2 B<br>OO<br>GND C<br>©<br>**----- End of picture text -----**<br>


- Thin package: 0.50 mm max. after reflow 

- Lead-free package 

- High reduction of parasitic elements through integration 

## **Complies with the following standard:** 

- IEC 61000-4-2 level 4 input and output pins: 

   - ± 15 kV (air discharge) 

   - ± 8 kV (contact discharge) 

## **Application** 

## **Figure 2. Schematic** 

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GND<br>OUT1 IN1<br>OUT2 IN2<br>or GND<br>**----- End of picture text -----**<br>


High speed serial interfaces such as USB 2.0, MIPI D-PHY, MDDI and HDMI. 

**TM** : IPAD is a trademark of STMicroelectronics. 

March 2014 

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This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**ECMF02-2BF3** 

## **1 Characteristics** 

**Table 1. Absolute maximum ratings (Tamb = 25 °C)** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VPP|Peak pulse voltage(1)|IEC 61000-4-2 contact discharge<br>IEC 61000-4-2 air discharge|10<br>20|kV|
|Tj|Maximum junction temperature||125|°C|
|Top|Operating temperature range||- 30 to + 85|°C|
|Tstg|Storage temperature range||- 55 to 150|°C|



1. Measurements done on IEC 61000-4-2 test bench. For further details see Application note AN3353. 

## **Figure 3. Electrical characteristics (definitions)** 

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I<br>Symbol     Parameter<br>VBR =        Breakdown voltage<br>IR =        Leakage current @ VBR<br>VIRMRM =        Stand-off voltage=        Leakage current @ VRM VBR VRM IIRRM IRM VRM VBR V<br>IR<br>**----- End of picture text -----**<br>


**Table 2. Electrical characteristics (values, Tamb = 25 °C)** 

|**Symbol**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|VBR|IR= 1 mA|6|||V|
|IRM|VRM= 3 V per line|||100|nA|
|RDC|DC serial resistance||3|4|Ω|



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**Application schematics** 

## **2 Application schematics** 

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Figure 4. USB2.0 application<br>**----- End of picture text -----**<br>


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VBUS<br>D-<br>OUT1 IN1<br>D+<br>OUT2 IN2<br>ID<br>GND<br>GND<br>ECMF02-2BF3<br>Figure 5. MIPI D-PHY application<br>OUT1 IN1 D0+<br>OUT2 IN2 D0-<br>GND GND<br>OUT1 IN1 D1+<br>OUT2 IN2 D1-<br>GND GND<br>OUT1 IN1 D2+<br>OUT2 IN2 D2-<br>GND GND<br>OUT1 IN1 CLK+<br>OUT2 IN2 CLK-<br>GND GND<br>To USB transceiver<br>MIPI D-PHY<br>To display and camera<br>**----- End of picture text -----**<br>


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**Measurement curves** 

## **3 Measurement curves** 

**Figure 6. SDD21 differential attenuation measurement (Z0 diff = 100** Ω) 

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SDD21 (dB)<br>0.00<br>-0.50<br>-1.00<br>-1.50<br>-2.00<br>-2.50<br>F (Hz)<br>-3.00<br>100.0k 1.0M 10.0M 100.0M 1.0G<br>**----- End of picture text -----**<br>


**Figure 7. SCC21 common mode attenuation measurement (Z0 com = 50** Ω) 

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SCC21 (dB)<br>0.00<br>-5.00<br>-10.00<br>-15.00<br>-20.00<br>-25.00<br>-30.00<br>-35.00<br>F (Hz)<br>-40.00<br>100.0k 1.0M 10.0M 100.0M 1.0G<br>**----- End of picture text -----**<br>


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**Measurement curves** 

**Figure 8. SDD11 and SDD22 differential return loss measurement (Z0 diff = 100** Ω) 

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SDD1 and SDD22 (dB)<br>0.00<br>-5.00<br>-10.00<br>-15.00<br>-20.00<br>-25.00<br>-30.00<br>-35.00<br>F (Hz)<br>-40.00<br>100.0k 1.0M 10.0M 100.0M 1.0G<br>SDD11 SDD22<br>**----- End of picture text -----**<br>


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**Measurement curves** 

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Figure 9. ESD response to IEC 61000-4-2 (+8 kV contact discharge)<br>1 VPP: ESD peak voltage<br>2 VCL :clamping voltage @ 30 ns<br>3 VCL :clamping voltage @ 60 ns<br>4 VCL :clamping voltage @ 100 ns<br>1 61.2 V<br>2 31.8 V<br>3 19.6 V 4 16.4 V<br>Pa smax(C2) P2lvl@ix(C2) PS lvl@x(C2) Pa lyl@x(C2) PS:- - - PE: - - PF: --<br>Bi2¥ aa ¥ 19.6 ¥ 164<br>7v 7v 7v 7v<br>imebase = -7o.0 ne!<br>20.0 navdiv | Normal<br>4.00k5 20 GSis | Edge<br>Figure 10. ESD response to IEC 61000-4-2 (-8 kV contact discharge)gure 10. ESD response to IEC 61000-4-2 (-8 kV contact discharge)ure 10. ESD response to IEC 61000-4-2 (-8 kV contact discharge)ponse to IEC 61000-4-2 (-8 kV contact discharge)onse to IEC 61000-4-2 (-8 kV contact discharge)(-8 kV contact discharge)-8 kV contact discharge)ge)e))<br>EAE a Se SOOi Pe hciats aa<br>3 -16.7 V 4 -13.7 V<br>2 -21.9 V<br>1 -60.6 V<br>1 VPP: ESD peak voltage<br>2 VCL :clamping voltage @ 30 ns<br>3 VCL :clamping voltage @ 60 ns<br> ees ee es ee ae orem e 4 VCL :clamping voltage @ 100 ns<br>**----- End of picture text -----**<br>


## **Figure 10. ESD response to IEC 61000-4-2 (-8 kV contact discharge)gure 10. ESD response to IEC 61000-4-2 (-8 kV contact discharge)ure 10. ESD response to IEC 61000-4-2 (-8 kV contact discharge)ponse to IEC 61000-4-2 (-8 kV contact discharge)onse to IEC 61000-4-2 (-8 kV contact discharge)(-8 kV contact discharge)-8 kV contact discharge)ge)e))** 

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**ECMF02-2BF3** 

**High speed differential standard compliance tests** 

## **4 High speed differential standard compliance tests** 

## **4.1 USB2.0 compliance tests** 

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Figure 11. TDR measurement (loaded by Zdiff = 90  Ω )<br>**----- End of picture text -----**<br>


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ZDIFF ( Ω )<br>110<br>tr = 400 ps (10% - 90%)<br>105<br>100<br>95<br>90<br>85<br>80<br>75<br>t(ns)<br>70<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5<br>Figure 12. Eye diagram with USB2.0 template<br>Through ISS* Board + ECMF02-2BF3<br>200 mV/div 200 mV/div<br>347.2 ps/div<br>347.2 ps/div<br>* Impedance standard substrate<br>**----- End of picture text -----**<br>


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**High speed differential standard compliance tests** 

## **4.2 HDMI1.4 compliance tests** 

**Figure 13. TDR measurement (loaded by Zdiff = 100** Ω **), tr = 194 ps (10% - 90%)** 

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**PCB layout recommendations** 

## **5 PCB layout recommendations** 

## **Figure 14. PCB layout recommendations** 

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90 Ω differential pairs<br>OUT2 OUT1<br>Pad layout recommendation<br>GND IN2 IN1<br>Copper pad Diameter:<br>220 µm recommended<br>260 µm maximum<br>Solder mask opening:<br>300 µm minimum<br>Solder stencil opening:<br>220 µm recommended<br>His<br>**----- End of picture text -----**<br>


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**Package information** 

## **6 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

## **Figure 15. Package dimensions** 

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400 µm ± 40<br>505 µm ± 55<br>255 µm ± 40<br>215 µm<br>830 µm ± 30 µm<br>400 µm ± 40<br>1230 µm ± 40 µm<br>215 µm<br>**----- End of picture text -----**<br>


**Figure 16. Marking** 

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Dot<br>ECOPACK grade<br>xx = marking<br>z = manufacturing location<br>yww = datecode<br>(y = year x x z<br>y w w<br>**----- End of picture text -----**<br>


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**Ordering information** 

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Figure 17. Flip Chip tape and reel specification<br>**----- End of picture text -----**<br>


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Dot identifying Pin A1 location Ø 1.55<br>2.0 4.0<br>0.22<br>ST ST ST<br>xxz xxz xxz<br>yww yww yww<br>0.93 4.0<br>0.59<br>All dimensions are typical values in mm User direction of unreeling<br>1.75<br>1.33<br>3.5<br>8.0<br>**----- End of picture text -----**<br>


_Note: More information is available in the application notes:_ 

_AN2348, “IPAD™ 400 µm Flip Chip: package description and recommendations for use” AN1751, “EMI filters: recommendations and measurements”_ 

## **7 Ordering information** 

**Figure 18. Ordering information scheme** 

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ECMF    02    -    2  B    F3<br>Function<br>ESD common mode filter<br>Number of lines<br>02 = 2 lines<br>Number of ESD protected lines<br>2 = 2 ESD protected lines<br>Version<br>Package<br>F3 = WLCSP 0.4 mm pirch<br>**----- End of picture text -----**<br>


**Table 3. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|ECMF02-2BF3|KE|Flip Chip|1.15 mg|5000|Tape and reel 7”|



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**Revision history** 

## **8 Revision history** 

**Table 4. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|09-Feb-2012|1|Initial release.|
|07-Mar-2014|2|Updated_Figure 13_.|



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