EC2620TS-24.576M TR

## **EC2620TS-24.576M TR** 

```
EC2620
```

## **Series** 

RoHS Compliant (Pb-free) 3.3V 4 Pad 5mm x 7mm Ceramic SMD LVCMOS Oscillator 

**Frequency Tolerance/Stability** ±20ppm Maximum 

**Operating Temperature Range** -10°C to +70°C 

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```
TS-24.576MTR
```

**Packaging Options** Tape & Reel 

**Nominal Frequency** 24.576MHz 

**Pin 1 Connection** Tri-State (High Impedance) 

**Duty Cycle** 50 ±10(%) 

## **ELECTRICAL SPECIFICATIONS** 

|**ELECTRICAL SPECIFICATIONS**|**ELECTRICAL SPECIFICATIONS**|
|---|---|
|**Nominal Frequency**|24.576MHz|
|**Frequency Tolerance/Stability**|±20ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the<br>Operating Temperature Range, Supply Voltage Change, Ouput Load Change, First Year Aging at 25°C,<br>Shock, and Vibration)|
|**Operating Temperature Range**|-10°C to +70°C|
|**Supply Voltage**|3.3Vdc ±10%|
|**Input Current**|10mA Maximum|
|**Output Voltage Logic High (Voh)**|90% of Vdd Minimum (IOH=-8mA)|
|**Output Voltage Logic Low (Vol)**|10% of Vdd Maximum (IOL=+8mA)|
|**Rise/Fall Time**|5nSec Maximum (w/15pF Load), 7nSec Maximum (w/30pF Load) (Measured at 20% to 80% of waveform)|
|**Duty Cycle**|50 ±10(%) (Measured at 50% of waveform)|
|**Load Drive Capability**|30pF Maximum|
|**Output Logic Type**|CMOS|
|**Pin 1 Connection**|Tri-State (High Impedance)|
|**Tri-State Input Voltage (Vih and Vil)**|+0.7Vdd Minimum or No Connect to Enable Output, +0.3Vdd Maximum to Disable Output (High<br>Impedance)|
|**Standby Current**|10µA Maximum (Disabled Output: High Impedance)|
|**RMS Phase Jitter**|1pSec Maximum (12kHz to 20MHz offset frequency)|
|**Start Up Time**|10mSec Maximum|
|**Storage Temperature Range**|-55°C to +125°C|
|**ENVIRONMENTAL & MECHANICAL SPECIFICATIONS**||
|**ESD Susceptibility**|MIL-STD-883, Method 3015, Class 1, HBM: 1500V|
|**Fine Leak Test**|MIL-STD-883, Method 1014, Condition A|
|**Flammability**|UL94-V0|
|**Gross Leak Test**|MIL-STD-883, Method 1014, Condition C|
|**Mechanical Shock**|MIL-STD-883, Method 2002, Condition B|
|**Moisture Resistance**|MIL-STD-883, Method 1004|
|**Moisture Sensitivity**|J-STD-020, MSL 1|
|**Resistance to Soldering Heat**|MIL-STD-202, Method 210, Condition K|
|**Resistance to Solvents**|MIL-STD-202, Method 215|
|**Solderability**|MIL-STD-883, Method 2003|
|**Temperature Cycling**|MIL-STD-883, Method 1010, Condition B|
|**Vibration**|MIL-STD-883, Method 2007, Condition A|



**www.ecliptek.com | Specification Subject to Change Without Notice  |  Rev U 8/12/2010 |  Page 1 of 6** 

## **EC2620TS-24.576M TR** 

## **MECHANICAL DIMENSIONS (all dimensions in millimeters)** 

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7.00 5.08<br>±0.15 ±0.15<br>3 4<br>5.00 MARKING 2.60<br>±0.15 ORIENTATION ±0.15<br>2 1<br>1.2 ±0.2<br>1.4 ±01<br>3.68<br>±0.15<br>1.6 +0.2/-0.5<br>**----- End of picture text -----**<br>


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PIN CONNECTION<br>1  Tri-State<br>2  Ground/Case Ground<br>3  Output<br>4  Supply Voltage<br>LINE MARKING<br>1 ECLIPTEK<br>2 24.576M<br>3 XXYZZ<br>XX=Ecliptek Manufacturing<br>Code<br>Y=Last Digit of the Year<br>ZZ=Week of the Year<br>**----- End of picture text -----**<br>


## **Suggested Solder Pad Layout** 

All Dimensions in Millimeters 

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2.0 (X4)<br>2.2 (X4)<br>2.88 Solder Land<br>(X4)<br>1.81<br>**----- End of picture text -----**<br>


All Tolerances are ±0.1 

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## **EC2620TS-24.576M TR** 

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## **OUTPUT WAVEFORM & TIMING DIAGRAM** 

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VIH<br>VIL<br>VOH<br>80% of Waveform<br>OUTPUT DISABLE<br>50% of Waveform<br>(HIGH IMPEDANCE<br>STATE)<br>20% of Waveform<br>VOL<br>tPLZ tPZL<br>Fall Rise�<br>Time Time TW<br>T<br>Duty Cycle (%) = TW/T x 100<br>TRI-STATE INPUT<br>CLOCK OUTPUT<br>**----- End of picture text -----**<br>


## **Test Circuit for CMOS Output** 

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Frequency<br>Oscilloscope<br>Counter<br>Probe<br>Supply  (Note 2)<br>Voltage<br>+ Current _ (VDD) Output<br>Meter<br>+ +<br>Power Voltage 0.01µF 0.1µF CL<br>Supply Meter (Note 1) (Note 1) (Note 3)<br>Ground<br>_ _<br>No Connect<br>or Tri-State<br>**----- End of picture text -----**<br>


Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. 

Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. 

**www.ecliptek.com | Specification Subject to Change Without Notice  |  Rev U 8/12/2010 |  Page 3 of 6** 

## **EC2620TS-24.576M TR** 

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## **Tape & Reel Dimensions** 

Quantity Per Reel: 1,000 units 

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4.0 ±0.1<br>2.0 ±0.1 DIA 1.5 +0.1/-0.0 0.3 ±0.05<br>7.5 ±0.1<br>16 +0.3/-0.1 A0*<br>6.75 ±0.1<br>8.0 ±0.1 B0* K0*<br>*Compliant to EIA 481A<br>1.5 MIN 22.4 MAX<br>DIA 40 MIN<br>Access Hole at<br>Slot Location<br>360 MAX<br>DIA 50 MIN<br>2.5 MIN Width<br>10.0 MIN Depth<br>DIA 20.2 MIN<br>Tape slot in Core<br>for Tape Start<br>DIA 13.0 ±0.2 16.4 +2/-0<br>**----- End of picture text -----**<br>


**www.ecliptek.com | Specification Subject to Change Without Notice  |  Rev U 8/12/2010 |  Page 4 of 6** 

## **EC2620TS-24.576M TR** 

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Recommended Solder Reflow Methods<br>Critical Zone<br>T  to TL P<br>TP<br>Ramp-up<br>Ramp-down<br>TL<br>T  MaxS<br>T  MinS<br>t  Preheat S t L<br>t 25°C to Peak<br>t P<br>Time (t)<br>Temperature (T)<br>**----- End of picture text -----**<br>


## **High Temperature Infrared/Convection** 

|**TS MAX to TL (Ramp-up Rate)**|3°C/second Maximum|
|---|---|
|**Preheat**||
|**- Temperature Minimum (TS MIN)**|150°C|
|**- Temperature Typical (TS TYP)**|175°C|
|**- Temperature Maximum (TS MAX)**|200°C|
|**- Time(tS MIN)**|60 - 180 Seconds|
|**Ramp-up Rate(TL to TP)**|3°C/second Maximum|
|**Time Maintained Above:**||
|**- Temperature (TL)**|217°C|
|**- Time(tL)**|60 - 150 Seconds|
|**Peak Temperature(TP)**|260°C Maximum for 10 Seconds Maximum|
|**Target Peak Temperature(TP Target)**|250°C +0/-5°C|
|**Time within 5°C of actualpeak(tp)**|20 - 40 seconds|
|**Ramp-down Rate**|6°C/second Maximum|
|**Time 25°C to Peak Temperature(t)**|8 minutes Maximum|
|**Moisture Sensitivity Level**|Level 1|
|**Additional Notes**|Temperatures shown are applied to bodyof device.|



**www.ecliptek.com | Specification Subject to Change Without Notice  |  Rev U 8/12/2010 |  Page 5 of 6** 

## **EC2620TS-24.576M TR** 

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Recommended Solder Reflow Methods<br>Critical Zone<br>T  to TL P<br>TP<br>Ramp-up<br>Ramp-down<br>TL<br>T  MaxS<br>T  MinS<br>t  Preheat S t L<br>t 25°C to Peak<br>t P<br>Time (t)<br>Temperature (T)<br>**----- End of picture text -----**<br>


## **Low Temperature Infrared/Convection 240°C** 

|**TS MAX to TL (Ramp-up Rate)**|5°C/second Maximum|
|---|---|
|**Preheat**||
|**- Temperature Minimum (TS MIN)**|N/A|
|**- Temperature Typical (TS TYP)**|150°C|
|**- Temperature Maximum (TS MAX)**|N/A|
|**- Time(tS MIN)**|60 - 120 Seconds|
|**Ramp-up Rate(TL to TP)**|5°C/second Maximum|
|**Time Maintained Above:**||
|**- Temperature (TL)**|150°C|
|**- Time(tL)**|200 Seconds Maximum|
|**Peak Temperature(TP)**|240°C Maximum|
|**Target Peak Temperature(TP Target)**|240°C Maximum 1 Time / 230°C Maximum 2 Times|
|**Time within 5°C of actualpeak(tp)**|10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time|
|**Ramp-down Rate**|5°C/second Maximum|
|**Time 25°C to Peak Temperature(t)**|N/A|
|**Moisture Sensitivity Level**|Level 1|
|**Additional Notes**|Temperatures shown are applied to bodyof device.|



## **Low Temperature Manual Soldering** 

185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) 

## **High Temperature Manual Soldering** 

260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) 

**www.ecliptek.com | Specification Subject to Change Without Notice  |  Rev U 8/12/2010 |  Page 6 of 6**