EBDM-6-08-2.0-S-RA-1-G-S
EXAMAX 2.00 DIRECT MATE ORTHOGONAL HEAD
- Manufacturer: SAMTEC
- Product type:
- SVHC: No SVHC (04-Feb-2026)
| Delivery and price | |
|---|---|
| Units per pack | 5 |
| Price | 59.29 € |
| Current stock | 10+ |
| Lead time | 19 days |
## **HIGH-SPEED BACKPLANE CONNECTOR & CABLE SYSTEMS** (2.00 mm) .0787" PITCH **==> picture [39 x 25] intentionally omitted <==** **----- Start of picture text -----**<br> 64<br>**----- End of picture text -----**<br> ## **FEATURES & BENEFITS** ## **ExaMAX[®] High-Speed Backplane System** - Meets a variety of industry specifications - Traditional, coplanar and direct mate orthogonal - 24 - 72 pair designs (4 and 6 pairs; 6, 8, 10 and 12 columns) - Shielded wafer design reduces crosstalk and includes one sideband signal per column - Press-fit tails provide a reliable electrical connection - PCIe[®] 6.0/CXL[®] 3.2 capable **ExaMAX[®] High-Speed Backplane Cable Assemblies** - 30 & 34 AWG Eye Speed[®] ultra low skew twinax cable - 34 AWG Eye Speed Thinax[™] ultra low skew twinax cable - Offers improved signal integrity, increased flexibility and routability - Highly customizable with modular flexibility - Reduce costs due to lower layer counts - PCIe[®] 6.0/CXL[®] 3.2 capable **==> picture [489 x 34] intentionally omitted <==** **----- Start of picture text -----**<br> Staggered Two Reliable Points In Development: In Development: In Development:<br>Differential of Contact with Open-Pin-Field, 2 Pair Design for ExaMAX2 [® ] 8 Pairs<br>Pair Design a 2.4 mm Wipe Coplaner Configuration a Lower Profile for 112 Gbps PAM4<br>Performance<br>**----- End of picture text -----**<br> ## **KEY SPECIFICATIONS** |**SERIES**<br>EBTM/EBTF/EBDM<br>ee|**INSULATOR**<br>**MATERIAL**<br>Liquid Crystal Polymer<br>ee|**CONTACT**<br>**MATERIAL**<br>Copper<br>Alloy<br>ee|**CONTACT**<br>**PLATING**<br>Sn or Au over 50 µ"<br>(1.27µm)Ni<br>ee|**OPERATING**<br>**TEMP RANGE**<br>-55 °C to +105 °C<br>ee<br>ee|**CURRENT**<br>**RATING**<br>4 A per pin<br>ee<br> eee|**VOLTAGE**<br>**RATING**<br>150 VAC/212 VDC<br>ee<br>eee|**LEAD-FREE**<br>**SOLDERABLE**<br>Yes<br>ee<br>eee| |---|---|---|---|---|---|---|---| |EPTT/EPTS|High Temperature<br>Thermoplastic|Copper<br>Alloy|Sn or Au over 50 µ"<br>(1.27µm)Ni|-55 °C to +105 °C|14.1 A per pin|150 VAC/212 VDC|Yes| |EBCM/EBCF|Liquid Crystal Polymer|Copper<br>Alloy|Au over 50 µ"<br>(1.27µm)Ni|-40 °C to +105 °C|2.6 A per pin|125 VAC/177 VDC|N/A| PCI-SIG[®] , PCI Express[®] and the PCIe[®] design marks are registered trademarks and/or service marks of PCI-SIG. F-226 (Rev 12DEC25) **samtec.com/ExaMAX** Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. 64 ## **(2.00 mm) .0787" PITCH • RIGHT-ANGLE SOCKET & DIRECT-MATE ORTHOGONAL** **==> picture [532 x 291] intentionally omitted <==** **----- Start of picture text -----**<br> EBTF - NO. OF PAIRS PER COLUMN - [COLUMNS] - COLUMN PITCH - [PLATING] - [RA] - CONFIGURATIONPIN - GUIDANCE - KEYING<br>–4 –06, –08, –2.0 –S –1 (Leave Blank for (Only with –L or –R<br>= 4 Pairs= 6 Pairs –6 only available –10, –12 (-12 column in -6 pairs) = (2.0 mm).0787" area, Matte (0.76 µm) Gold on contact = 30 µ" = Open Pin Field (only available = Standard –5 = Left Guidanceno Guidance) –L –A thru –H for no Keying)Leave Blank Guidance;<br>Tin on tails in-6 pairs) –R = Position of<br>= Right Guidance Flat on Key<br>(See Table)<br>EBTF-RA /+——_ A —— ~ ———— D —_ -<br>Board Mates:<br>EBTM, (3.95)<br>EBDM-RA .156DIA<br>uae) E<br>Cable Mates: Aaa aEals B | O e eeea .<br>(10.40)<br>EBCM .409<br>(4.60)<br>.181<br>(7.30)<br>C .287<br>KEYING (-RA) NO. OF NO. OF<br>COLUMNS A C PAIRS B D E<br>–A –B –C –D –E –F –G –H PER<br>COLUMN<br>–L / –R B A H B A H B A H B A H B A H B A H B A H B A H –06 (12.90) .508 (18.85) .742<br>ig C D E F GIOLOIS G C D E F G C D E F G C D E F G C D E F G C I [OOl©] D E F G C D E F G C D E F G –08 (16.90) .665 (22.85) .900 –4 (22.50) .886 (28.40) 1.118 (17.90) .705<br>–10 (20.90) .823 (26.85) 1.057<br>(29.70) (35.60) (25.10)<br>–12 (24.90) .980 (30.85) 1.215 –6 1.169 1.402 .988<br>**----- End of picture text -----**<br> **samtec.com?EBTF-RA** View complete specifications at: **==> picture [529 x 299] intentionally omitted <==** **----- Start of picture text -----**<br> EBDM - PAIRS - COLUMNS - 2.0 - PLATING - RA - CONFIGURATIONPIN - GUIDANCE - MOUNTSCREW<br>–6 –06, –08, –S –1 (Leave Blank (Leave Blank for<br>= 6 Pairs –10, –12 = 30 µ" (0.76 µm) Gold on contact area, Matte = Standard for no Pin) –G no Screw Mount) –S<br>Tin on tails = Guide Pin = Screw Mount<br>EBDM-RA<br>Board Mates: EBTF-RA a (32.40) 1.276 (15.00) .591 A<br>Cable Mates:<br>EBCF<br>(4.00)<br>(2.20) .157<br>.087 E D<br>C<br>S e (2.60) n<br>.102<br>(10.00)<br>.394 an B<br>(39.30) 1.547<br>COLUMNS A B C (without –G) D (with –G) E<br>Notes: –06 (16.15) .636 (10.00) .394 (15.00) .591 (20.65) .813 (8.00) .315<br>Some lengths, styles and options –08 (20.15) .793 (14.00) .551 (19.00) .748 (24.65) .970 (12.00) .472<br>are non-standard, non-returnable. –10 (24.15) .951 (18.00) .709 (23.00) .906 (28.65) 1.128 (16.00) .630<br>ExaMAX [®] is a registered trademark –12 (28.15) 1.108 (22.00) .866 (27.00) 1.063 (32.65) 1.285 (20.00) .787<br>of Amphenol FCI Asia Pte. Ltd.<br>Used with permission. View complete specifications at: samtec.com?EBDM-RA<br>samtec.com/ExaMAX F-226 (Rev 12DEC25)<br>**----- End of picture text -----**<br> Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. F-226 (Rev 12DEC25)
Updated at June 7, 2026
Founded in 1976 and headquartered in New Albany, Indiana, Samtec is a globally recognized manufacturer of electronic interconnect solutions. With over 40 locations worldwide, the company is celebrated for its commitment to exceptional customer service, product quality, and innovative technologies. Samtec has consistently been recognized as an industry leader, earning the prestigious Bishop Report award for top-tier customer service and product reliability numerous times. Our selection of Samtec components focuses on delivering dependable connectivity for demanding applications, primarily featuring their robust backplane connectors. Engineered to support complex, high-performance designs, these connectors provide the critical infrastructure needed for high-speed data transmission and reliable performance across various environments, ensuring your interconnectivity requirements are met with precision. Complementing their industry-leading board-level solutions, our inventory also includes Samtec's versatile cable assemblies. This selection features high-quality USB and Lightning cables built to the company's rigorous standards, offering durable and efficient data and power transmission to streamline your electronic design process.
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