EB2532JA12-18.432M TR

Crystal, EB2532 Series

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Manufacturer: ECLIPTEK
Product type: Resonators
SVHC: No SVHC (25-Jun-2025)
Frequency: 18.432MHz
No. of Pins: 4Pins
Product Range: EB2532 Series
Frequency Stability: ± 30ppm
Frequency Tolerance: ± 15ppm
Oscillator Mounting: SMD
Operating Temperature Max: 85°C
Operating Temperature Min: -40°C

Delivery and price
Units per pack	500
Price	0.358 €
Current stock	10+
Lead time	30 days

Datasheet

## **EB2532JA12-18.432M TR** PART NUMBER DATA SHEET 

## **REGULATORY COMPLIANCE** 

## **(Data Sheet downloaded on Jan 8, 2020)** 

2011/65 + 2015/863 iy 191 SVHC 

## **ITEM DESCRIPTION** 

Automotive Grade Quartz Crystal Resonator 2.5mm x 3.2mm x 0.8mm 4 Pad Ceramic Surface Mount (SMD) 18.432MHz ±15ppm at 25°C, ±30ppm over -40°C to +85°C 12pF Parallel Resonant 

## **ELECTRICAL SPECIFICATIONS** 

|**Nominal Frequency**|18.432MHz|
|---|---|
|**Frequency Tolerance/Stability**|±15ppm at 25°C, ±30ppm over -40°C to +85°C|
|**Aging at 25°C**|±3ppm/Year Maximum|
|**Load Capacitance**|12pF Parallel Resonant|
|**Shunt Capacitance (C0)**|3pF Maximum|
|**Equivalent Series Resistance**|70 Ohms Maximum|
|**Mode of Operation**|AT-Cut Fundamental|
|**Drive Level**|200µWatts Maximum|
|**Crystal Cut**|AT-Cut|
|**Spurious Response**|-3dB Minimum (Measured from Fo to Fo +5000ppm)|
|**Storage Temperature Range**|-50°C to +150°C|
|**Insulation Resistance**|500 Megaohms Minimum(Measured at 100Vdc)|



|**ENVIRONMENTAL & MECHANICAL SPECIFICATIONS**|**ENVIRONMENTAL & MECHANICAL SPECIFICATIONS**|
|---|---|
|**ESD Susceptibility**|MIL-STD-883, Method 3015, Class 1, HBM: 1500V|
|**Fine Leak Test**|MIL-STD-883, Method 1014, Condition A|
|**Flammability**|UL94-V0|
|**Gross Leak Test**|MIL-STD-883, Method 1014, Condition C|
|**Mechanical Shock**|MIL-STD-883, Method 2002, Condition B|
|**Moisture Resistance**|MIL-STD-883, Method 1004|
|**Moisture Sensitivity**|J-STD-020, MSL 1|
|**Resistance to Soldering Heat**|MIL-STD-202, Method 210, Condition K|
|**Resistance to Solvents**|MIL-STD-202, Method 215|
|**Solderability**|MIL-STD-883, Method 2003|
|**Temperature Cycling**|MIL-STD-883, Method 1010, Condition B|
|**Vibration**|MIL-STD-883, Method 2007, Condition A|



~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision A 05/18/2018 |  Page 1 of 5**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## **EB2532JA12-18.432M TR** 

**==> picture [535 x 153] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS (all dimensions in millimeters)<br>PIN CONNECTION<br>2.50<br>±0.10 0.70 ±0.10 1.00 1  Crystal<br>±0.10 2  Cover/Ground<br>(X4)<br>4 1 3  Crystal<br>4  No Connect<br>— - — ——<br>3.20 1.20<br>±0.10 ±0.10 LINE MARKING<br>1<br>3 2 2 XXX<br>El XXX=Ecliptek<br>tl 0.80 MAX 0.90 ±0.10 (X4) ao = Manufacturing Identifier<br>MARKING<br>ORIENTATION<br>**----- End of picture text -----**<br>


**Note:** Chamfer not shown. 

## **Seam Sealed** 

**Terminal Plating Thickness:** Gold (0.3 to 1.0µm) over Nickel (1.27 to 8.89µm). 

## **Suggested Solder Pad Layout** 

All Dimensions in Millimeters 

**==> picture [157 x 147] intentionally omitted <==**

**----- Start of picture text -----**<br>
1.30 (X4)<br>1.30 (X4)<br>0.80 O e . Solder Land<br>i oo (X4)<br>0.40 J L<br>**----- End of picture text -----**<br>


All Tolerances are ±0.1 

~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision A 05/18/2018 |  Page 2 of 5** Ld~~ **Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 

PART NUMBER DATA SHEET 

## **EB2532JA12-18.432M TR** 

**==> picture [191 x 48] intentionally omitted <==**

## **Tape & Reel Dimensions** 

Quantity Per Reel: 3,000 units 

**==> picture [513 x 609] intentionally omitted <==**

**----- Start of picture text -----**<br>
All Dimensions in Millimeters<br>Compliant to EIA-481<br>4.00 ±0.10 0.60 MAX<br>Ø1.55 +0.10/-0.00<br>2.00 ±0.05 0.10 MAX<br>1.75 ±0.10<br>3.50 ±0.05<br>8.00 ±0.30 B0<br>Ø0.60 ±0.10<br>4.00 ±0.10 A0 K0<br>Direction of Unreeling<br>1.50 MIN 14.40 MAX<br>DIA 40 MIN<br>Access Hole at<br>Slot Location<br>180 MAX<br>DIA 50 MIN<br>2.50 MIN Width<br>10 MIN Depth<br>DIA 20.20 MIN<br>Tape slot in Core<br>for Tape Start<br>8.40 +1.50/-0.00<br>DIA 13.00 ±0.20<br>MARKING<br>ORIENTATION<br>**----- End of picture text -----**<br>


~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision A 05/18/2018 |  Page 3 of 5**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## PART NUMBER DATA SHEET **EB2532JA12-18.432M TR** 

## **Recommended Solder Reflow Methods** 

## **High Temperature Infrared/Convection** 

|**TS MAX to TL (Ramp-up Rate)**|3°C/Second Maximum|
|---|---|
|**Preheat**||
|**- Temperature Minimum (TS MIN)**|150°C|
|**- Temperature Typical (TS TYP)**|175°C|
|**- Temperature Maximum (TS MAX)**|200°C|
|**- Time(tS MIN)**|60 - 180 Seconds|
|**Ramp-up Rate(TL to TP)**|3°C/Second Maximum|
|**Time Maintained Above:**||
|**- Temperature (TL)**|217°C|
|**- Time(tL)**|60 - 150 Seconds|
|**Peak Temperature(TP)**|260°C Maximum for 10 Seconds Maximum|
|**Target Peak Temperature(TP Target)**|250°C +0/-5°C|
|**Time within 5°C of actualpeak(tp)**|20 - 40 Seconds|
|**Ramp-down Rate**|6°C/Second Maximum|
|**Time 25°C to Peak Temperature(t)**|8 Minutes Maximum|
|**Moisture Sensitivity Level**|Level 1|
|**Additional Notes**|Temperatures shown are applied to bodyof device.|



~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision A 05/18/2018 |  Page 4 of 5**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## PART NUMBER DATA SHEET **EB2532JA12-18.432M TR** 

## **Recommended Solder Reflow Methods** 

## **Low Temperature Infrared/Convection 245°C** 

|**TS MAX to TL (Ramp-up Rate)**|5°C/Second Maximum|
|---|---|
|**Preheat**||
|**- Temperature Minimum (TS MIN)**|N/A|
|**- Temperature Typical (TS TYP)**|150°C|
|**- Temperature Maximum (TS MAX)**|N/A|
|**- Time(tS MIN)**|30 - 60 Seconds|
|**Ramp-up Rate(TL to TP)**|5°C/Second Maximum|
|**Time Maintained Above:**||
|**- Temperature (TL)**|150°C|
|**- Time(tL)**|200 Seconds Maximum|
|**Peak Temperature(TP)**|245°C Maximum|
|**Target Peak Temperature(TP Target)**|245°C Maximum 2 Times / 230°C Maximum 1 Time|
|**Time within 5°C of actualpeak(tp)**|10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time|
|**Ramp-down Rate**|5°C/Second Maximum|
|**Time 25°C to Peak Temperature(t)**|N/A|
|**Moisture Sensitivity Level**|Level 1|
|**Additional Notes**|Temperatures shown are applied to bodyof device.|



## **Low Temperature Manual Soldering** 

185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) 

## **High Temperature Manual Soldering** 

260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) 

~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision A 05/18/2018 |  Page 5 of 5**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200

Updated at March 21, 2026

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