EB13E2E2H-50.000M TR

OSC, 50MHZ, LVCMOS, SMD, 3.2MM X 2.5MM

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Manufacturer: ECLIPTEK
Product type: Standard Oscillators
SVHC: No SVHC (25-Jun-2025)
Frequency Nom: 50MHz
Product Range: EB13E2 Series
Supply Voltage Nom: 3.3V
Frequency Stability + / -: 25ppm
Operating Temperature Max: 70°C
Operating Temperature Min: -20°C
Oscillator Case / Package: SMD, 3.2mm x 2.5mm
Oscillator Output Compatibility: LVCMOS

Delivery and price
Units per pack	500
Price	0.695 €
Current stock	10+
Lead time	30 days

Datasheet

## **EB13E2E2H-50.000M TR** PART NUMBER DATA SHEET 

## **REGULATORY COMPLIANCE** 

## **(Data Sheet downloaded on Jan 8, 2020)** 

2011/65 + 2015/863 iy 191 SVHC 

## **ITEM DESCRIPTION** 

Quartz Crystal Clock Oscillators XO (SPXO) LVCMOS (CMOS) 3.3Vdc 4 Pad 2.5mm x 3.2mm Ceramic Surface Mount (SMD) 50.000MHz ±25ppm over -20°C to +70°C 

## **ELECTRICAL SPECIFICATIONS** 

|**ELECTRICAL SPECIFICATIONS**|**ELECTRICAL SPECIFICATIONS**|
|---|---|
|**Nominal Frequency**|50.000MHz|
|**Frequency Tolerance/Stability**|±25ppm Maximum over -20°C to +70°C (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability<br>over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,<br>Shock, and Vibration)|
|**Supply Voltage**|3.3Vdc ±5%|
|**Input Current**|6mA Maximum|
|**Output Voltage Logic High (Voh)**|90% of Vdd Minimum (IOH= -4mA)|
|**Output Voltage Logic Low (Vol)**|10% of Vdd Maximum (IOL= +4mA)|
|**Rise/Fall Time**|4nSec Maximum (Measured at 20% to 80% of waveform)|
|**Duty Cycle**|50 ±5(%) (Measured at 50% of waveform)|
|**Load Drive Capability**|15pF Maximum|
|**Output Logic Type**|CMOS|
|**Pin 1 Connection**|Tri-State (High Impedance)|
|**Tri-State Input Voltage (Vih and Vil)**|80% of Vdd Minimum or No Connect to Enable Output, 20% of Vdd Maximum to Disable Output (High Impedance)|
|**Standby Current**|10µA Maximum (Disabled Output: High Impedance)|
|**RMS Phase Jitter**|1pSec Maximum (Fj = 12kHz to 20MHz)|
|**Start Up Time**|10mSec Maximum|
|**Storage Temperature Range**|-55°C to +125°C|



## **ENVIRONMENTAL & MECHANICAL SPECIFICATIONS** 

|**ESD Susceptibility**|MIL-STD-883, Method 3015, Class 1, HBM: 1500V|
|---|---|
|**Fine Leak Test**|MIL-STD-883, Method 1014, Condition A|
|**Flammability**|UL94-V0|
|**Gross Leak Test**|MIL-STD-883, Method 1014, Condition C|
|**Mechanical Shock**|MIL-STD-883, Method 2002, Condition B|
|**Moisture Resistance**|MIL-STD-883, Method 1004|
|**Moisture Sensitivity**|J-STD-020, MSL 1|
|**Resistance to Soldering Heat**|MIL-STD-202, Method 210, Condition K|
|**Resistance to Solvents**|MIL-STD-202, Method 215|
|**Solderability**|MIL-STD-883, Method 2003|
|**Temperature Cycling**|MIL-STD-883, Method 1010, Condition B|
|**Vibration**|MIL-STD-883, Method 2007, Condition A|



~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision O 12/05/2014 |  Page 1 of 7**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## **EB13E2E2H-50.000M TR** 

## **MECHANICAL DIMENSIONS (all dimensions in millimeters)** 

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**----- Start of picture text -----**<br>
2.50<br>0.75 ±0.10<br>±0.15<br>1.00<br>2 3 ±0.10<br>,<br>3.20 1.20<br>±0.15 ±0.10<br>1 4<br>L<br>0.90 ±0.20 1.00<br>a2<br>±0.10<br>MARKING<br>ORIENTATION<br>**----- End of picture text -----**<br>


|**PIN**|**CONNECTION**|
|---|---|
|1<br>2|Tri-State<br>Case/Ground|
|3<br>4<br>**LINE**<br>1<br>2|Output<br>Supply Voltage<br>**MARKING**<br>**E50.0**<br>_E=Ecliptek Designator_<br>**XXXXX**<br>_XXXXX=Ecliptek_<br>_Manufacturing Identifier_|



## **Suggested Solder Pad Layout** 

All Dimensions in Millimeters 

**==> picture [157 x 149] intentionally omitted <==**

**----- Start of picture text -----**<br>
tr 1.10 (X4) o<br>1.30 (X4)<br>1.00 UW Solder Land<br>“ Bo (X4)<br>0.80 I L<br>**----- End of picture text -----**<br>


All Tolerances are ±0.1 

~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision O 12/05/2014 |  Page 2 of 7** Co~~ **Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 

## PART NUMBER DATA SHEET **EB13E2E2H-50.000M TR** 

## **OUTPUT WAVEFORM & TIMING DIAGRAM** 

**==> picture [459 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
VIH<br>VIL<br>VOH<br>80% of Waveform<br>OUTPUT DISABLE<br>50% of Waveform<br>(HIGH IMPEDANCE<br>STATE)<br>20% of Waveform<br>VOL<br>7wae! _<br>Fall T —_— Rise| — _— | —_— tPLZ — | —— tPZL<br>Time Time i TW<br>T<br>Duty Cycle (%) = TW/T x 100<br>TRI-STATE INPUT<br>CLOCK OUTPUT<br>**----- End of picture text -----**<br>


~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision O 12/05/2014 |  Page 3 of 7**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## **EB13E2E2H-50.000M TR** 

## **Test Circuit for CMOS Output** 

**==> picture [438 x 165] intentionally omitted <==**

**----- Start of picture text -----**<br>
Frequency<br>Oscilloscope<br>Counter<br>Probe<br>Supply  (Note 2)<br>Voltage<br>+ Current _ (VDD) Output<br>Meter<br>+ +<br>Power Voltage 0.01µF 0.1µF CL<br>Supply Meter (Note 1) (Note 1) (Note 3)<br>Ground<br>_ _<br>Tri-State<br>**----- End of picture text -----**<br>


Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. 

Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. 

~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision O 12/05/2014 |  Page 4 of 7** a~~ **Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 

PART NUMBER DATA SHEET 

## **EB13E2E2H-50.000M TR** 

**==> picture [112 x 38] intentionally omitted <==**

## Tape & Reel Dimensions 

Quantity Per Reel: 1,000 units 

All Dimensions in Millimeters Compliant to EIA-481 

**==> picture [495 x 590] intentionally omitted <==**

**----- Start of picture text -----**<br>
4.00 ±0.10 0.60 MAX<br>DIA 1.50 +0.10/-0.00<br>2.00 ±0.05 0.10 MAX<br>1.75 ±0.10<br>3.50 ±0.05<br>8.00 ±0.30 B0<br>DIA 1.00 MIN<br>4.00 ±0.10 A0 K0<br>Direction of Unreeling<br>1.50 MIN 14.40 MAX<br>DIA 40 MIN<br>Access Hole at<br>Slot Location<br>180 MAX<br>DIA 50 MIN<br>2.50 MIN Width<br>10 MIN Depth<br>DIA 20.20 MIN<br>Tape slot in Core<br>for Tape Start<br>8.40 +1.50/-0.00<br>DIA 13.00 ±0.20<br>ORIEN<br>T<br>AT I<br>MARKING<br>ON<br>**----- End of picture text -----**<br>


~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision O 12/05/2014 |  Page 5 of 7**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## PART NUMBER DATA SHEET **EB13E2E2H-50.000M TR** 

## **Recommended Solder Reflow Methods** 

## **High Temperature Infrared/Convection** 

|**TS MAX to TL (Ramp-up Rate)**|3°C/Second Maximum|
|---|---|
|**Preheat**||
|**- Temperature Minimum (TS MIN)**|150°C|
|**- Temperature Typical (TS TYP)**|175°C|
|**- Temperature Maximum (TS MAX)**|200°C|
|**- Time(tS MIN)**|60 - 180 Seconds|
|**Ramp-up Rate(TL to TP)**|3°C/Second Maximum|
|**Time Maintained Above:**||
|**- Temperature (TL)**|217°C|
|**- Time(tL)**|60 - 150 Seconds|
|**Peak Temperature(TP)**|260°C Maximum for 10 Seconds Maximum|
|**Target Peak Temperature(TP Target)**|250°C +0/-5°C|
|**Time within 5°C of actualpeak(tp)**|20 - 40 Seconds|
|**Ramp-down Rate**|6°C/Second Maximum|
|**Time 25°C to Peak Temperature(t)**|8 Minutes Maximum|
|**Moisture Sensitivity Level**|Level 1|



~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision O 12/05/2014 |  Page 6 of 7**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## PART NUMBER DATA SHEET **EB13E2E2H-50.000M TR** 

## **Recommended Solder Reflow Methods** 

## **Low Temperature Infrared/Convection 240°C** 

|**TS MAX to TL (Ramp-up Rate)**|5°C/Second Maximum|
|---|---|
|**Preheat**||
|**- Temperature Minimum (TS MIN)**|N/A|
|**- Temperature Typical (TS TYP)**|150°C|
|**- Temperature Maximum (TS MAX)**|N/A|
|**- Time(tS MIN)**|60 - 120 Seconds|
|**Ramp-up Rate(TL to TP)**|5°C/Second Maximum|
|**Time Maintained Above:**||
|**- Temperature (TL)**|150°C|
|**- Time(tL)**|200 Seconds Maximum|
|**Peak Temperature(TP)**|240°C Maximum|
|**Target Peak Temperature(TP Target)**|240°C Maximum 2 Times / 230°C Maximum 1 Time|
|**Time within 5°C of actualpeak(tp)**|10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time|
|**Ramp-down Rate**|5°C/Second Maximum|
|**Time 25°C to Peak Temperature(t)**|N/A|
|**Moisture Sensitivity Level**|Level 1|



## **Low Temperature Manual Soldering** 

185°C Maximum for 10 Seconds Maximum, 2 times Maximum. 

## **High Temperature Manual Soldering** 

260°C Maximum for 5 Seconds Maximum, 2 times Maximum. 

~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision O 12/05/2014 |  Page 7 of 7**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200

Updated at April 28, 2026

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