EA3250FA18-25.000M TR

Resonator, 25 MHz, SMD, 4 Pin, ± 30ppm, EA3250

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Manufacturer: ECLIPTEK
Product type: Resonators
Frequency: 25MHz
No. of Pins: 4 Pin
Product Range: EA3250
Frequency Stability: ± 50ppm
Frequency Tolerance: ± 30ppm
Oscillator Mounting: SMD
Operating Temperature Max: 85°C
Operating Temperature Min: -40°C

Delivery and price
Units per pack	10000
Price	0.496 €
Current stock	10+
Lead time	30 days

Datasheet

## **EA3250FA18-25.000M TR** PART NUMBER DATA SHEET 

## **REGULATORY COMPLIANCE** 

## **(Data Sheet downloaded on Dec 15, 2019)** 

2011/65 + 2015/863 iy 191 SVHC 

## **ITEM DESCRIPTION** 

Quartz Crystal Resonator 3.2mm x 5.0mm x 1.0mm 4 Pad Ceramic Surface Mount (SMD) 25.000MHz ±30ppm at 25°C, ±50ppm over -40°C to +85°C 18pF Parallel Resonant 

## **ELECTRICAL SPECIFICATIONS** 

|**Nominal Frequency**|25.000MHz|
|---|---|
|**Frequency Tolerance/Stability**|±30ppm at 25°C, ±50ppm over -40°C to +85°C|
|**Aging at 25°C**|±3ppm/Year Maximum|
|**Load Capacitance**|18pF Parallel Resonant|
|**Shunt Capacitance**|5pF Maximum|
|**Equivalent Series Resistance**|40 Ohms Maximum|
|**Mode of Operation**|AT-Cut Fundamental|
|**Drive Level**|100µWatts Maximum|
|**Spurious Response**|-3dB Minimum (Measured from Fo to Fo+5000ppm)|
|**Storage Temperature Range**|-40°C to +125°C|
|**Insulation Resistance**|500 Megaohms Minimum(Measured at 100Vdc)|
|||
|**ENVIRONMENTAL & MECHANICAL SPECIFICATIONS**||
|**ESD Susceptibility**|MIL-STD-883, Method 3015, Class 1, HBM: 1500V|
|**Fine Leak Test**|MIL-STD-883, Method 1014, Condition A|
|**Flammability**|UL94-V0|
|**Gross Leak Test**|MIL-STD-883, Method 1014, Condition C|
|**Mechanical Shock**|MIL-STD-883, Method 2002, Condition B|
|**Moisture Resistance**|MIL-STD-883, Method 1004|
|**Moisture Sensitivity**|J-STD-020, MSL 1|
|**Resistance to Soldering Heat**|MIL-STD-202, Method 210, Condition K|
|**Resistance to Solvents**|MIL-STD-202, Method 215|
|**Solderability**|MIL-STD-883, Method 2003|
|**Temperature Cycling**|MIL-STD-883, Method 1010, Condition B|
|**Vibration**|MIL-STD-883, Method 2007, Condition A|



~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision D 04/24/2018 |  Page 1 of 5**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## **EA3250FA18-25.000M TR** 

**==> picture [532 x 186] intentionally omitted <==**

**----- Start of picture text -----**<br>
MECHANICAL DIMENSIONS (all dimensions in millimeters)<br>3.2 PIN CONNECTION<br>1.4 ±0.1<br>±0.2 1  Crystal<br>2  Cover/Ground<br>2 3 3  Crystal<br>4  Cover/Ground<br>See<br>±0.2 Note 1 LINE MARKING<br>1 E25.00<br>E=Ecliptek Designator<br>1 4<br>2 XXXXX<br>L— rs<br>XXXXX=Ecliptek<br>Manufacturing Identifier<br>Note: Chamfer not shown<br>1.0<br>| [- L O +—<br>MAX Note 1: 2.6 ±0.1 (<=10MHz)<br>2.4 ±0.1 (>10MHz)<br>MARKING<br>ORIENTATION<br>**----- End of picture text -----**<br>


## Seam Sealed 

Terminal Plating Thickness: Gold (0.3 to 1.0µm) over Nickel (1.27 to 8.89µm) 

## **Suggested Solder Pad Layout** 

All Dimensions in Millimeters 

**==> picture [157 x 149] intentionally omitted <==**

**----- Start of picture text -----**<br>
t 1.20 (X4) p<br>1.50 (X4)<br>2.30 O e . Solder Land<br>“ Eo (X4)<br>1.00 4 h<br>**----- End of picture text -----**<br>


All Tolerances are ±0.1 

~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision D 04/24/2018 |  Page 2 of 5** Co~~ **Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 

PART NUMBER DATA SHEET 

## **EA3250FA18-25.000M TR** 

**==> picture [112 x 38] intentionally omitted <==**

## Tape & Reel Dimensions 

Quantity Per Reel: 1,000 units 

All Dimensions in Millimeters Compliant to EIA-481 

**==> picture [495 x 590] intentionally omitted <==**

**----- Start of picture text -----**<br>
4.00 ±0.10 0.60 MAX<br>DIA 1.50 +0.10/-0.00<br>2.00 ±0.05 0.10 MAX<br>1.75 ±0.10<br>5.50 ±0.05<br>12.00 ±0.30 B0<br>DIA 1.50 MIN<br>8.00 ±0.10 A0 K0<br>Direction of Unreeling<br>1.50 MIN 18.40 MAX<br>DIA 40 MIN<br>Access Hole at<br>Slot Location<br>180 MAX<br>DIA 50 MIN<br>2.50 MIN Width<br>10 MIN Depth<br>DIA 20.20 MIN<br>Tape slot in Core<br>for Tape Start<br>12.40 +2.00/-0.00<br>DIA 13.00 ±0.20<br>ORIEN<br>T<br>AT I<br>MARKING<br>ON<br>**----- End of picture text -----**<br>


~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision D 04/24/2018 |  Page 3 of 5**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## PART NUMBER DATA SHEET **EA3250FA18-25.000M TR** 

## **Recommended Solder Reflow Methods** 

## **High Temperature Infrared/Convection** 

|**TS MAX to TL (Ramp-up Rate)**|3°C/Second Maximum|
|---|---|
|**Preheat**||
|**- Temperature Minimum (TS MIN)**|150°C|
|**- Temperature Typical (TS TYP)**|175°C|
|**- Temperature Maximum (TS MAX)**|200°C|
|**- Time(tS MIN)**|60 - 180 Seconds|
|**Ramp-up Rate(TL to TP)**|3°C/Second Maximum|
|**Time Maintained Above:**||
|**- Temperature (TL)**|217°C|
|**- Time(tL)**|60 - 150 Seconds|
|**Peak Temperature(TP)**|260°C Maximum for 10 Seconds Maximum|
|**Target Peak Temperature(TP Target)**|250°C +0/-5°C|
|**Time within 5°C of actualpeak(tp)**|20 - 40 Seconds|
|**Ramp-down Rate**|6°C/Second Maximum|
|**Time 25°C to Peak Temperature(t)**|8 Minutes Maximum|
|**Moisture Sensitivity Level**|Level 1|
|**Additional Notes**|Temperature shown are applied to bodyof device.|



~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision D 04/24/2018 |  Page 4 of 5**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## PART NUMBER DATA SHEET **EA3250FA18-25.000M TR** 

## **Recommended Solder Reflow Methods** 

## **Low Temperature Infrared/Convection 245°C** 

|**TS MAX to TL (Ramp-up Rate)**|5°C/Second Maximum|
|---|---|
|**Preheat**||
|**- Temperature Minimum (TS MIN)**|N/A|
|**- Temperature Typical (TS TYP)**|150°C|
|**- Temperature Maximum (TS MAX)**|N/A|
|**- Time(tS MIN)**|30 - 60 Seconds|
|**Ramp-up Rate(TL to TP)**|5°C/Second Maximum|
|**Time Maintained Above:**||
|**- Temperature (TL)**|150°C|
|**- Time(tL)**|200 Seconds Maximum|
|**Peak Temperature(TP)**|245°C Maximum|
|**Target Peak Temperature(TP Target)**|245°C Maximum 2 Times / 230°C Maximum 1 Time|
|**Time within 5°C of actualpeak(tp)**|10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time|
|**Ramp-down Rate**|5°C/Second Maximum|
|**Time 25°C to Peak Temperature(t)**|N/A|
|**Moisture Sensitivity Level**|Level 1|
|**Additional Notes**|Temperature shown are applied to bodyof device.|



## **Low Temperature Manual Soldering** 

185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperature shown are applied to body of device.) 

## **High Temperature Manual Soldering** 

260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperature shown are applied to body of device.) 

~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision D 04/24/2018 |  Page 5 of 5**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200

Updated at February 9, 2023

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