E1SEA18-12.000MTR

Crystal, E1S Series

⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.

Manufacturer: ECLIPTEK
Product type: Crystals
SVHC: 2-ethoxyethyl acetate (25-Jun-2025)
Frequency: 12MHz
No. of Pins: 2Pins
Product Range: E1S Series
Frequency Stability: ± 50ppm
Frequency Tolerance: ± 30ppm
Oscillator Mounting: SMD
Operating Temperature Max: 70°C
Operating Temperature Min: -20°C

Delivery and price
Units per pack	500
Price	0.143 €
Current stock	500+
Lead time	30 days

Datasheet

## **E1SEA18-12.000M** PART NUMBER DATA SHEET 

## **REGULATORY COMPLIANCE** 

## **(Data Sheet downloaded on Sep 22, 2020)** 

2011/65 + 2015/863 iy 191 SVHC 

## **ITEM DESCRIPTION** 

Quartz Crystal Resonator HC49/UP Short 2 Pad Surface Mount (SMD) 3.2mm Height Metal Resistance Weld Seal 12.000MHz ±30ppm at 25°C, ±50ppm over -20°C to +70°C 18pF Parallel Resonant 

## **ELECTRICAL SPECIFICATIONS** 

|**Nominal Frequency**|12.000MHz|
|---|---|
|**Frequency Tolerance/Stability**|±30ppm at 25°C, ±50ppm over -20°C to +70°C|
|**Aging at 25°C**|±5ppm/year Maximum|
|**Load Capacitance**|18pF Parallel Resonant|
|**Shunt Capacitance**|7pF Maximum|
|**Equivalent Series Resistance**|70 Ohms Maximum|
|**Mode of Operation**|AT-Cut Fundamental|
|**Drive Level**|1mWatt Maximum|
|**Storage Temperature Range**|-55°C to +125°C|
|**Insulation Resistance**|500 Megaohms Minimum(Measured at 100Vdc)|



|**ENVIRONMENTAL & MECHANICAL SPECIFICATIONS**|**ENVIRONMENTAL & MECHANICAL SPECIFICATIONS**|
|---|---|
|**ESD Susceptibility**|MIL-STD-883, Method 3015, Class 1, HBM: 1500V|
|**Fine Leak Test**|MIL-STD-883, Method 1014, Condition A|
|**Flammability**|UL94-V0|
|**Gross Leak Test**|MIL-STD-883, Method 1014, Condition C|
|**Mechanical Shock**|MIL-STD-202, Method 213, Condition C|
|**Moisture Resistance**|MIL-STD-883, Method 1004|
|**Moisture Sensitivity**|J-STD-020, MSL1|
|**Resistance to Soldering Heat**|MIL-STD-202, Method 210, Condition K|
|**Resistance to Solvents**|MIL-STD-202, Method 215|
|**Solderability**|MIL-STD-883, Method 2003|
|**Temperature Cycling**|MIL-STD-883, Method 1010, Condition B|
|**Vibration**|MIL-STD-883, Method 2007, Condition A|



~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision H 11/09/2015 |  Page 1 of 4**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## PART NUMBER DATA SHEET **E1SEA18-12.000M** a 

**MECHANICAL DIMENSIONS (all dimensions in millimeters) LINE MARKING** 1 **E12.000M** 3.20 _E=Ecliptek Designator_ MAX ~~“= g a~~ 13.30 MAX ~~t~~ o ~~k tt~~ 4.85 MAX 4.88 ±0.20 ~~e~~ a ~~l~~ 0.50 MIN (x2) 0.80 ±0.30 (x2) ~~FL~~ 11.60 MAX NOTE: Coplanarity 0.360 MAX 

## **Suggested Solder Pad Layout** 

All Dimensions in Millimeters 

5.5 (X2) 2.0 (X2) ~~—— el~~ 4.0 ~~r~~ e Solder Land (X2) 

All Tolerances are ±0.1 

~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision H 11/09/2015 |  Page 2 of 4** a~~ **Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 

## PART NUMBER DATA SHEET **E1SEA18-12.000M** 

## **Recommended Solder Reflow Methods** 

## **High Temperature Infrared/Convection** 

|**TS MAX to TL (Ramp-up Rate)**|3°C/Second Maximum|
|---|---|
|**Preheat**||
|**- Temperature Minimum (TS MIN)**|150°C|
|**- Temperature Typical (TS TYP)**|175°C|
|**- Temperature Maximum (TS MAX)**|200°C|
|**- Time(tS MIN)**|60 - 180 Seconds|
|**Ramp-up Rate(TL to TP)**|3°C/Second Maximum|
|**Time Maintained Above:**||
|**- Temperature (TL)**|217°C|
|**- Time(tL)**|60 - 150 Seconds|
|**Peak Temperature(TP)**|260°C Maximum for 10 Seconds Maximum|
|**Target Peak Temperature(TP Target)**|250°C +0/-5°C|
|**Time within 5°C of actualpeak(tp)**|20 - 40 Seconds|
|**Ramp-down Rate**|6°C/Second Maximum|
|**Time 25°C to Peak Temperature(t)**|8 Minutes Maximum|
|**Moisture Sensitivity Level**|Level 1|
|**Additional Notes**|Temperatures shown are applied to bodyof device.|



~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision H 11/09/2015 |  Page 3 of 4**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200 

## PART NUMBER DATA SHEET **E1SEA18-12.000M** 

## **Recommended Solder Reflow Methods** 

## **Low Temperature Infrared/Convection 245°C** 

|**TS MAX to TL (Ramp-up Rate)**|5°C/Second Maximum|
|---|---|
|**Preheat**||
|**- Temperature Minimum (TS MIN)**|N/A|
|**- Temperature Typical (TS TYP)**|150°C|
|**- Temperature Maximum (TS MAX)**|N/A|
|**- Time(tS MIN)**|30 - 60 Seconds|
|**Ramp-up Rate(TL to TP)**|5°C/Second Maximum|
|**Time Maintained Above:**||
|**- Temperature (TL)**|150°C|
|**- Time(tL)**|200 Seconds Maximum|
|**Peak Temperature(TP)**|245°C Maximum|
|**Target Peak Temperature(TP Target)**|245°C Maximum 2 Times / 230°C Maximum 1 Time|
|**Time within 5°C of actualpeak(tp)**|10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time|
|**Ramp-down Rate**|5°C/Second Maximum|
|**Time 25°C to Peak Temperature(t)**|N/A|
|**Moisture Sensitivity Level**|Level 1|
|**Additional Notes**|Temperatures shown are applied to bodyof device.|



## **Low Temperature Manual Soldering** 

185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) 

## **High Temperature Manual Soldering** 

260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) 

~~**www.ecliptek.com | Specification Subject to Change Without Notice  |  Revision H 11/09/2015 |  Page 4 of 4**~~ 

**Ecliptek, LLC** 5458 Louie Lane, Reno, NV 89511 

1-800-ECLIPTEK or 714.433.1200

Updated at April 23, 2026

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